JP7386714B2 - LED light emitting device and its manufacturing method - Google Patents

Description

The present invention relates to an LED light emitting device in which a first light emitting region that emits light in a first color and a second light emitting region that emits light in a second color are arranged in a checkerboard pattern on a single mounting board, and a method for manufacturing the same.

A plurality of fine first light emitting regions that emit light in a first color and a plurality of fine second light emitting regions that emit light in a second color are provided on a single mounting board to suppress color unevenness of illumination light. Therefore, an LED light emitting device in which these two types of light emitting areas are arranged in a checkered pattern is known.

For example, FIG. 1 of Patent Document 1 shows an LED light emitting device in which two types of fine light emitting regions are arranged in a checkered pattern to improve color unevenness.

Therefore, the LED light emitting device (LED module) will be described with reference to FIG. 1 of Patent Document 1 to FIG. 31 of the present application. FIG. 31 is a plan view of an LED light emitting device 200 shown as a conventional example. Note that () indicates terms used in Patent Document 1. When quoting, the sign has been changed.

As shown in FIG. 31, the LED light emitting device 200 includes a mounting board 207 (substrate), a plurality of LED dies 205 and 206 (LED chips), a dam 210 (frame), and a connector 213. On an insulating layer 208 formed on one surface 207a of the mounting board 207, there are a plurality of first LED rows 202 (first LED group) in which LED dies 205 that emit blue light are connected in series, and LED dies 206 that emit red light. A plurality of second LED rows 203 (second LED group) connected in series are mounted. Further, on the insulating layer 208, the LED dies 205 and 206 are surrounded by a dam 210 and covered with a fluorescent resin 209 (transparent resin) containing yellow phosphor. That is, the LED light emitting device 200 has a fine first light emitting area that emits white light by the LED die 205 and a fluorescent resin 209 containing a yellow phosphor as the first color, and a fine first light emitting area that emits red light by the LED die 206 as the second color. A large number of second light emitting regions are provided, and these are arranged in a checkerboard pattern.

Here, the LED light emitting device 200 includes a connection pattern 204 and wiring patterns 211 and 212 on an insulating layer 208. The anode of the first LED row 202 and the cathode of the second LED row 203 are connected to the connection pattern 204 by a wire 214 (bonding wire). The wiring pattern 211 is connected to the anode of the second LED column 203, and the wiring pattern 212 is connected to the cathode of the first LED column 202. The wiring patterns 211 and 212 are connected to a connector 213. That is, when power is supplied from the connector 213, a current flows in the order of the wiring pattern 211, the second LED row 203, the connection pattern 204, the first LED row 202, and the wiring pattern 212, and the LED dies 205 and 206 light up.

At this time, in the LED light emitting device 200, the wires 214 connecting the LED dies 205 and the wires 214 connecting the LED dies 206 have a zigzag shape. In this way, the LED light emitting device 200 arranges two types of fine light emitting regions in a checkerboard pattern while preventing the wires 214 from crossing each other, and combines the white light obtained by the LED die 205 and the yellow phosphor with , red light obtained from the LED die 206 are mixed uniformly and evenly.

JP2014-203569A (Figure 1)

In the LED light emitting device 200 shown in FIG. 31, an LED die 205 and an LED die 206 are mounted on a mounting board 207. In other words, when manufacturing the LED light emitting device 200, two types of LED dies must be prepared: an LED die 205 that emits blue light and an LED die 206 that emits red light.

Since preparing two types of LED dies 205 and 206 is a burden on manufacturing, it is desirable to configure the first light emitting region and the second light emitting region using only one type of LED die. For this purpose, a first fluorescent resin and a second fluorescent resin having different emission colors are prepared, and for one type of LED die arranged in a matrix on a mounting board, the LED die included in the first light emitting area is connected to the first fluorescent resin. The LED die included in the second light emitting region may be sealed with a second fluorescent resin.

However, in order to miniaturize LED light-emitting devices and improve color mixing, the closer LED dies are brought together, the more two adjacent LED dies are sealed with a first fluorescent resin and a second fluorescent resin. It becomes difficult to separate.

The present invention has been made in view of the above-mentioned problems, and includes a plurality of fine first light emitting regions that emit light in a first color and a plurality of fine light emitting regions that emit light in a second color on a single mounting board. In an LED light emitting device in which fine second light emitting regions are arranged in a checkerboard pattern, even if the same type of LED dies constituting the first light emitting region and the second light emitting region are close to each other, there is no difference in performance or quality. An object of the present invention is to provide an LED light emitting device that is easy to manufacture.

In order to solve the above problems, an LED light emitting device of the present invention includes a plurality of first light emitting regions that emit light in a first color and a plurality of second light emitting regions that emit light in a second color, the first light emitting region and the second light emitting region emitting light in a second color. The second light emitting region includes a first LED die and a second LED die, which are arranged in a checkerboard pattern on one mounting board, and the first LED die and the second LED die have upper surfaces that are connected to the first fluorescent resin layer and the second LED die, respectively. The LED die is coated with two fluorescent resin layers, and the first fluorescent resin layer individually covers the upper part of the first LED die in a dome shape.

The light emitting region of the LED light emitting device of the present invention is composed of a first light emitting region and a second light emitting region which are minute light emitting regions. In this light emitting region, the first light emitting region and the second light emitting region are adjacent to each other in the vertical direction and the horizontal direction when viewed from above, forming a checkered pattern arrangement. The first light emitting region includes one first LED die and emits light in a first color. Similarly, the second light emitting region includes one second LED die and emits light in a second color. The first fluorescent resin is potted on the upper surface of the first LED die and its vicinity by spot printing or the like. The first fluorescent resin layer has a curved top (dome shape) and covers the top of the first LED die.

The first LED die and the second LED die may have the same characteristics.

The second fluorescent resin layer may individually cover the upper part of the second LED die in a dome shape.

The first fluorescent resin layer and the second fluorescent resin layer may have different heights.

A white resin may be filled between the first LED die and the second LED die, and a top surface of the white resin may be higher than a top surface of the first LED die or the second LED die.

The second fluorescent resin layer may completely cover the upper surfaces of the plurality of second LED dies.

A dam surrounding the first LED die and the second LED die may be provided.

The height of the first LED die may be different from the height of the second LED die.

The bottom surfaces of the first LED die and the second LED die are each bonded to the surface of the mounting board by a die bonding material, and the die bonding material contains reflective particles and extends along the side surfaces of the first LED die and the second LED die, respectively. The side surface may be covered so as to rise.

The die bonding material may cover the surface of the mounting board in a gap between the first LED die and the second LED die.

The mounting board may include a silver layer on the surface, and the silver layer may be exposed from the die bonding material in a gap between the first LED die and the second LED die.

The height of the top surface of the die bonding material may match the height of the top surfaces of the first LED die and the second LED die.

The first fluorescent resin layer and the second fluorescent resin layer are each covered with a transparent resin layer, and the transparent resin layer may contain a filler.

The first fluorescent resin layer may cover a part of the slope of the die-bonding material.

The first fluorescent resin layer may form a fillet at a contact portion with the die bonding material.

The device may include a first wire that connects the first LEDs and a second wire that connects the second LEDs, and at least one of the first wire and the second wire may be reinforced with a coating. .

At least one of the first wire and the second wire may be provided with a protective resin film at the bottom.

When the first wire and the second wire intersect, one of the first wire and the second wire may be curved in side view, and the other may be trapezoidal in side view.

The mounting board has an area consisting of n ² blocks arranged in a matrix of n rows and n columns, where n is a natural number n expressed by n=t ² +3t+2 (t=1, 2, 3, ...). Each of the four corners has a light emitting region obtained by removing n/2 of the blocks, the block includes either the first light emitting region or the second light emitting region, and the light emitting region includes the first LED die. may include (n/2-1) first LED columns in which n pieces are connected in series, and the second LED die may include (n/2-1) second LED columns in which n pieces are connected in series.

The first LED dies and the second LED dies included in the first LED column and the second LED column may be connected obliquely by wires, respectively.

In order to solve the above problems, the method for manufacturing an LED light emitting device of the present invention includes a plurality of first light emitting regions that emit light in a first color and a plurality of second light emitting regions that emit light in a second color, The area and the second light emitting area each include a first LED die and a second LED die, and are arranged in a checkerboard pattern on one mounting board, and the first LED die and the second LED die each have an upper surface covered with the first fluorescent resin layer. and a second fluorescent resin layer, and the first fluorescent resin layer individually covers the upper part of the first LED die in a dome shape. a preparation step of preparing a die and the second LED die, a die bonding step of bonding the first LED die and the second LED die to the mounting board, and connecting the first LED dies and the second LED dies with wires. a wire bonding step of forming a dam around a set of the first LED die and the second LED die, a dam forming step of forming a dam around a set of the first LED die and the second LED die, pouring a modified silicon solution into the area surrounded by the dam, and volatilizing the solvent of the solution. , a protective resin film forming step of forming a protective resin film on the wire; a first fluorescent resin coating step of individually applying a first fluorescent resin on the upper part of the first LED die to form a first fluorescent resin layer; The method further comprises a second fluorescent resin coating step of coating the upper part of the second LED die with a second fluorescent resin to form a second fluorescent resin layer.

In the method for manufacturing an LED light emitting device of the present invention, first, a mounting board, a first LED die, and a second LED die are prepared. Next, after die bonding the first LED die and the second LED die to the mounting board, the first LED dies and the second LEDs are connected with wires. Next, a dam is formed, a modified silicone solution is poured into the space surrounded by the dam, and the solvent is evaporated. A protective resin film is formed on the surface of the wire, and a curtain-shaped protective resin film hangs from the wire. is formed.

The method may further include a white resin filling step of filling a gap between the first LED die and the second LED die with white resin.

The method may further include a transparent resin coating step of coating the upper surfaces of the first fluorescent resin layer and the second fluorescent resin layer and the wire with a transparent resin layer.

The first fluorescent resin coating step may be provided after the die bonding step, the dam forming step may be provided after the first fluorescent resin coating step, and the protective resin film forming step may be provided after the dam forming step.

In the preparation step, a large-sized board from which a large number of the mounted boards can be obtained when separated into pieces is prepared in place of the mounted board, and after the transparent resin coating step or the second fluorescent resin coating step, the large-sized board is cut. The method may further include a singulation step of obtaining the LED light emitting device.

As described above, in the LED light emitting device of the present invention, the dome-shaped first fluorescent resin layer is formed only at the tip of the first LED die by spot printing or the like in the first light emitting region. In this way, the second LED die, which should not be covered with the first fluorescent resin layer, can be brought close to the first LED die. Moreover, most of the light emitted from the first LED die and the second LED die passes through the first fluorescent resin layer and the second fluorescent resin layer, respectively, so that the luminous efficiency and wavelength conversion efficiency are not deteriorated.

Therefore, the LED light emitting device of the present invention has a plurality of fine first light emitting regions that emit light in a first color and a plurality of fine second light emitting regions that emit light in a second color on one mounting board. When arranging them in a checkered pattern, even if the same type of LED dies constituting the first light emitting region and the second light emitting region are placed close to each other, there is no inferiority in terms of performance and quality, and it is easy to manufacture because spot printing etc. can be applied.

Further, in the method for manufacturing an LED light emitting device of the present invention, when manufacturing the above-mentioned LED light emitting device, the wire is reinforced with silicone resin.

That is, the method for manufacturing an LED light emitting device of the present invention provides a plurality of fine first light emitting regions that emit light in a first color and a plurality of fine second light emitting regions that emit light in a second color on one mounting board. When arranging the areas in a checkered pattern, even if the same type of LED dies constituting the first light emitting area and the second light emitting area are placed close to each other, there is no inferiority in terms of performance and quality, and the crossed wires are reinforced to prevent shorts. It is easier to manufacture because it is difficult to do.

1 is a plan view of an LED light emitting device shown as a first embodiment of the present invention. 2 is a plan view of an LED die included in the LED light emitting device shown in FIG. 1. FIG. 2 is a plan view of the LED light emitting device shown in FIG. 1. FIG. 2 is a circuit diagram of the LED light emitting device shown in FIG. 1. FIG. 2 is a partial cross-sectional view of the LED light emitting device shown in FIG. 1. FIG. 2 is a flowchart of a method for manufacturing the LED light emitting device shown in FIG. 1. FIG. 7 is an explanatory diagram of each step shown in FIG. 6. FIG. It is a partial sectional view of the LED light emitting device shown as 2nd Embodiment of this invention. It is a partial sectional view of an LED light emitting device shown as a 3rd embodiment of the present invention. It is a partial sectional view of an LED light emitting device shown as a 4th embodiment of the present invention. It is a partial sectional view of an LED light emitting device shown as a 5th embodiment of the present invention. It is a partial sectional view of an LED light emitting device shown as a 6th embodiment of the present invention. It is a partial sectional view of an LED light emitting device shown as a 7th embodiment of the present invention. 14 is a flowchart of a method for manufacturing the LED light emitting device shown in FIG. 13. 15 is an explanatory diagram of each step shown in FIG. 14. FIG. It is a partial sectional view of an LED light emitting device shown as an 8th embodiment of the present invention. It is a partial sectional view of an LED light emitting device shown as a 9th embodiment of the present invention. It is a partial sectional view of an LED light emitting device shown as a 10th embodiment of the present invention. It is a partial sectional view of an LED light emitting device shown as an 11th embodiment of the present invention. 20 is a flowchart of a method for manufacturing the LED light emitting device shown in FIG. 19. 21 is an explanatory diagram of each step shown in the flowchart of FIG. 20. FIG. It is a partial sectional view of an LED light emitting device shown as a 12th embodiment of the present invention. 23 is a partial plan view of the LED light emitting device shown in FIG. 22. FIG. 23 is a partial perspective view of the LED light emitting device shown in FIG. 22. FIG. 23 is a partial cross-sectional view of the LED light emitting device shown in FIG. 22. FIG. 23 is a flowchart of a method for manufacturing the LED light emitting device shown in FIG. 22. FIG. 27 is an explanatory diagram of each step shown in the flowchart of FIG. 26. FIG. It is a schematic diagram of the LED light emitting device shown as 13th Embodiment of this invention. 29 is a circuit diagram of the LED light emitting device shown in FIG. 28. FIG. It is a schematic diagram of the LED light emitting device shown as 14th Embodiment of this invention. 1 is a plan view of an LED light emitting device shown as a conventional technique.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. 1 to 30. In the description of the drawings, the same or equivalent elements are given the same reference numerals, and redundant description will be omitted. For the sake of explanation, the scale of the members has been changed as appropriate. Items in parentheses indicate matters specifying the invention in the claims.

(First embodiment)
FIG. 1 is a plan view of an LED light emitting device 10 shown as a first embodiment of the present invention. As shown in FIG. 1, the LED light emitting device 10 is a so-called COB (chip on board) module, and includes a mounting board 13. Power supply electrodes 19a, 19b, 19c, and 19d are formed at two corners of the mounting board 13. Further, an annular dam 15 is formed in a region inside the power supply electrodes 19a to 19d. A circular region inside the dam 15 (hereinafter referred to as the "light emitting section 15a") is filled with a transparent resin layer 16, and the first light emitting region 11a and the second light emitting region 12a are arranged in a checkerboard pattern.

Here, in FIG. 1, the first light emitting region 11a and the second light emitting region 12a are illustrated as squares for convenience. That is, the first light emitting region 11a and the second light emitting region 12a shown in FIG. 12b (see Figure 5). As shown in FIG. 5, the first light emitting region 11a includes a first LED die 11b and a first fluorescent resin layer 11c, and the second light emitting region 12a includes a second LED die 12b and a second fluorescent resin layer 12c. When the LED light emitting device 10 is not lit, the first light emitting region 11a is recognized as the first fluorescent resin layer 11c, and the second light emitting region 12a is recognized as the second fluorescent resin layer 12c. On the other hand, when the LED light emitting device 10 is turned on, the first light emitting region 11a and the second light emitting region 12a are square with rounded corners, the peripheral portions are blurred and widened, and are visually recognized as rounded shapes. Note that the wires 14 (see FIG. 3) connecting the first LED dies 11b included in the first light emitting region 11a and the second LED dies 12b included in the second light emitting region 12a are visible but not shown.

FIG. 2 is a plan view of the first LED die 11b included in the first light emitting region 11a of the LED light emitting device 10. Note that the second LED die 12b included in the second light emitting region 12a is not shown because it has the same characteristics and the same structure as the first LED die 11b. The first LED die 11b is a blue light emitting diode with a planar size of 0.6 mm x 0.6 mm, and includes an anode 21 at the upper left corner in FIG. 4 and a cathode 22 at the lower right center. The anode 21 is formed on the upper surface of the P layer 23, and the cathode 22 is formed on the upper surface of the N layer 24 exposed from the P layer 23.

FIG. 3 is drawn with the transparent resin layer 16, the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, and the dam 15 removed so that the connection status of the first LED die 11b and the second LED die 12b can be visually observed. 2 is a plan view of an LED light emitting device 10. FIG. In FIG. 3, the first LED die 11b is filled with dots so that the first LED die 11b and the second LED die 12b, which are blue light emitting diodes of the same size and characteristics, can be distinguished. As shown in FIG. 3, the first LED die 11b and the second LED die 12b are arranged in a matrix so as to form a checkered pattern as a whole.

Further, as shown in FIG. 3, on the mounting board 13 included in the LED light emitting device 10, power supply electrodes 19a to 19d and wiring electrodes 19e to 19h extending in an arc shape from the power supply electrodes 19a to 19d, respectively, are formed. ing. Protective Zener diodes 18a and 18b are arranged between the wiring electrode 19e and the power supply electrode 19c, and between the power supply electrode 19b and the wiring electrode 19h, respectively. Zener diode 18a is connected to wiring electrode 19e and power supply electrode 19c with wire 14. Similarly, the Zener diode 18b is connected to the wiring electrode 19h and the power supply electrode 19b with the wire 14. A portion of the power supply electrodes 19a to 19d, the wiring electrodes 19e to 19h, the Zener diodes 18a and 18b, and a portion of the wire 14 are covered with a dam 15 (see FIG. 1).

In the light emitting section 15a, 60 first LED dies 11b and 60 second LED dies 12b are mounted. The 60 first LED dies 11b are connected in series, 12 at a time, to form five first LED rows 11d (see FIG. 4). Similarly, the 60 second LED dies 12b are connected in series, 12 at a time, to form five second LED rows 12d (see FIG. 4). The first LED die 11b belonging to the first LED row 11d is arranged in a diagonal manner while bending from the upper left to the lower right in the figure. Similarly, the second LED die 12b belonging to the second LED row 12d is also arranged in a diagonal manner while bending from the upper left to the lower right in the figure.

The first LED dies 11b and the second LED dies 12b are connected by wires 14, respectively. In FIG. 3, in order to make the connection by the wire 14 easy to understand, the wire 14 belonging to the first LED row 11d is shown as a dotted line, and the wire 14 belonging to the second LED row 12d is shown as a solid line. As shown in FIG. 3, the wire 14 belonging to the first LED row 11d and the wire 14 belonging to the second LED row 12d are visually recognized as intersecting at a portion when viewed from above. This limits the number of series stages of the first LED die 11b and the second LED die 12b included in the first LED column 11d and the second LED column 12d to 12, and connects the first LED column 11d and the second LED column 12d to a relatively low voltage (for example, , 2.7 (V) x 12 (stages) = 32.4 (V)), and this is a result of considering the ease of handling of the LED light emitting device 10.

In addition, in the first LED row 11d, the anode 21 (see FIG. 2) of the first LED die 11b arranged at the upper end in the figure is connected to the wiring electrode 19e, and the anode 21 (see FIG. 2) is arranged at the lower end in the figure. The cathode 22 (see FIG. 2) of the first LED die 11b is connected to the wiring electrode 19g. Similarly, in the second LED row 12d, the anode 21 of the second LED die 12b arranged at the upper end in the figure is connected to the wiring electrode 19f, and the anode 21 of the second LED die 12b arranged at the lower end in the figure is connected to the wiring electrode 19f. The cathode 22 is connected to the wiring electrode 19h.

FIG. 4 is a circuit diagram of the LED light emitting device 10. The LED light emitting device 10 includes a first circuit 11e that emits light at a low color temperature (for example, 3000°K) and a second circuit 12e that emits light at a high color temperature (for example, 5000°K).

As shown in FIG. 4, in the first circuit 11e, five first LED arrays 11d each having twelve first LED dies 11b connected in series are connected in parallel. The anode 21 (see FIG. 2) of the first LED die 11b in the first stage included in the first LED row 11d is connected to the power supply electrode 19a via the wiring electrode 19e. The cathode 22 (see FIG. 2) of the first LED die 11b in the final stage included in the first LED row 11d is connected to the power supply electrode 19c via the wiring electrode 19g. A protective Zener diode 18a is connected to the wiring electrodes 19e and 19g.

Similarly, in the second circuit 12e, five second LED rows 12d each having twelve second LED dies 12b connected in series are connected in parallel. The anode 21 (see FIG. 2) of the first-stage second LED die 12b included in the second LED row 12d is connected to the power supply electrode 19b via the wiring electrode 19f. The cathode 22 (see FIG. 2) of the second LED die 12b in the final stage included in the second LED row 12d is connected to the power supply electrode 19d via the wiring electrode 19h. A Zener diode 18b for protection is connected to the wiring electrodes 19f and 19h.

FIG. 5 is a partial cross-sectional view of the LED light emitting device 10, showing main parts along line AA' in FIG. FIG. 5 shows two first light emitting regions 11a and two second light emitting regions 12a. Note that the wire 14 (see FIG. 3) is not shown in FIG. 5 as well as in FIG. 1.

As shown in FIG. 5, the bottom surfaces of the first LED die 11b and the second LED die 12b are bonded to the top surface of the mounting board 13 with a die bonding material 17. Furthermore, the die bonding material 17 creeps up and covers the side surfaces of the first LED die 11b and the second LED die 12b, and also covers the surface of the mounting board 13 in the gap between the first LED die 11b and the second LED die 12b. The die bonding material 17 contains reflective fine particles, and can ensure a sufficient thickness (for example, 30 to 50 μm) for light shielding at a position of about half the height on the sides of the first LED die 11b and the second LED die 11b. do it like this.

The first fluorescent resin layer 11c covers the top and side surfaces of the first LED die 11b, forming a dome shape (bowl shape) with a curved top. Similarly, the second fluorescent resin layer 12c also covers the top and side surfaces of the second LED die 12b, forming a dome shape (bowl shape) with a curved top. The first fluorescent resin layer 11c and the die bonding material 17 that cover the side surface of the first LED die 11b suppress the light emitted from the first LED die 11b from the side surface of the first LED die 11b. Similarly, the second fluorescent resin layer 12c and the die bonding material 17 that cover the side surface of the second LED die 12b suppress the light emitted from the second LED die 12b from the side surface of the second LED die 12b. Note that the first fluorescent resin layer 11c is thicker in the vertical direction of the figure than the second fluorescent resin layer 12c.

The transparent resin layer 16 covers the die bonding material 17, the first fluorescent resin layer 11c, and the second fluorescent resin layer 12c from above, and seals them. Note that among the wires 14 (see FIG. 3) not shown, the wire 14 connected to the upper surface of the first LED die 11b exits the first fluorescent resin layer 11c and passes through the transparent resin layer 16, and other wires 14 (see FIG. 3) that are not shown The first fluorescent resin layer 11c is connected to the upper surface of another first LED die 11b (not shown). The same applies to the wires 14 connecting the second LED dies 12b.

The mounting board 13 is made of white ceramics whose base material is alumina. On the upper surface of the mounting board 13, wiring electrodes 19e to 19h and power supply electrodes 19a to 19d, which are made of a metal film in which Ni and Au are laminated on Cu, are formed (see FIG. 3). Note that the base material of the mounting board 13 may be aluminum nitride whose surface has been subjected to a reflection treatment, or aluminum whose surface is provided with an insulating layer. The die-bonding material 17 is an adhesive material in which reflective fine particles made of titanium oxide are kneaded into a resin. The dam 15 is made of white silicone resin kneaded with fine particles of titanium oxide, and has a thickness of 0.7 to 1.0 mm and a height of 0.5 to 0.8 mm.

The first fluorescent resin layer 11c has a thickness of about 0.5 mm and is made of a green-emitting phosphor (for example, Lu ₃ Al ₅ O ₁₂ :Ce) and a red-emitting phosphor (for example, CaAlSiN ₃ :Eu). Contains. The color of the emitted light from the first light emitting region 11a has a color temperature of about 3000°K due to the blue light emitted by the first LED die 11b and the light emitted from the first fluorescent resin layer 11c. The second fluorescent resin layer 12c has a thickness of about 0.3 mm and is made of a green-emitting phosphor (for example, Lu ₃ Al ₅ O ₁₂ :Ce) and a red-emitting phosphor (for example, CaAlSiN ₃ :Eu). However, the concentration and ratio of the phosphor is different from that of the first fluorescent resin layer 11c. The color of the light emitted from the second light emitting region 12a has a color temperature of approximately 5000°K due to the blue light emitted by the second LED die 12b and the light emitted by the second fluorescent resin layer 12c.

Next, a method for manufacturing the LED light emitting device 10 will be explained with reference to FIGS. 6 and 7. FIG. 6 is a flowchart showing manufacturing steps included in the method for manufacturing the LED light emitting device 10, and FIG. 7 is an explanatory diagram of the manufacturing steps shown in the flowchart of FIG. Note that the members shown in FIGS. 1 to 4 will be cited without special instructions.

As shown in FIG. 6, the manufacturing method of the LED light emitting device 10 includes a preparation step 31 of preparing a mounting board 13, a first LED die 11b, a second LED die 12b, etc.; A die bonding step 32 in which the first LED dies 11b and the second LED dies 12b are electrically connected with each other with a wire 14, a set of the first LED dies 11b and the second LED dies 12b is bonded together using a die bonding material 17. A dam forming step 34 of forming a dam 15 on the mounting board 13 so as to surround it; a first fluorescent resin coating step 35 of covering the upper part of the first LED die 11b with the first fluorescent resin layer 11c; The process includes a second fluorescent resin coating step 36 in which the second fluorescent resin layer 12c is coated, and a transparent resin coating step 37 in which the inner region of the dam 15 is coated with the transparent resin layer 16.

In FIG. 7, in order to explain each process shown in FIG. 6, a cross section of the LED light emitting device 10 in the process of being manufactured is schematically drawn. Note that the LED light emitting device 10 may be manufactured by a method in which the LED die 11 is mounted on an individually separated mounting board 13 and various electronic components and resins are placed on the top surface of the mounting board 13, or by individualization. Then, various electronic components and resins may be arranged on a large-sized board from which a large number of mounting boards 13 are obtained, and finally the large-sized board is cut into pieces to obtain the LED light emitting device 10, which is a so-called collective board method. Although the latter method is suitable for mass production, in FIG. 7, for simplicity, the method for manufacturing the LED light emitting device 10 will be described using the former method. Further, in FIGS. 7A to 7F, a set of 60 first LED dies 11b and 60 second LED dies 12b is representatively illustrated with only one each.

FIG. 7A is an explanatory diagram of the preparation step 31. In the preparation step 31, the mounting board 13, the first LED die 11b, the second LED die 12b, and the Zener diodes 18a and 18b are prepared. The mounting board 13 is made of white ceramics whose base material is alumina. On the upper surface of the mounting board 13, wiring electrodes 19e to 19h and power supply electrodes 19a to 19d, which are made of a metal film in which Ni and Au are laminated on Cu, are formed (see FIG. 3). Note that the base material of the mounting board 13 may be aluminum nitride whose surface has been subjected to a reflection treatment, or aluminum whose surface is provided with an insulating layer. The first LED die 11b and the second LED die 12b have a semiconductor layer on the top surface, and the Zener diodes 18a, 18b are smaller than the first LED die 11b and the second LED die 12b.

FIG. 7(b) is an explanatory diagram of the die bonding process 32. In the die bonding step 32, the first LED die 11b, the second LED die 12b, and the Zener diodes 18a, 18b are bonded to the mounting board 13 using the die bonding material 17. Note that before mounting the first LED die 11b, the second LED die 12b, and the Zener diodes 18a and 18b on the mounting board 13, a die bonding material 17 is applied in advance to the positions where each element is to be arranged. Thereafter, each element is placed in a predetermined position using a picker. At this time, the amount of the die bonding material 17 for bonding the first LED die 11b and the second LED die 12b is adjusted, and the die bonding material 17 is made to protrude around the first LED die 11b and the second LED die 12b during die bonding, so that some of the die bonding material 17 to climb up the sides of the first LED die 11b and the second LED die 12b. In parallel with this, the die bonding materials 17 are joined together between the adjacent first LED die 11b and second LED die 12b. Finally, the LED light emitting device 10 is heated to harden the die bonding material 17. Here, the distance between the first LED die 11b and the second LED die 12b is 0.1 to 0.4 mm.

FIG. 7C is an explanatory diagram of the wire bonding process 33. In the wire bonding step 33, the first LED dies 11b are bonded together, the second LED dies 12b are bonded together, the first LED die 11b and wiring electrodes 19e, 19c, the second LED die 12b and wiring electrodes 19f, 19h, the Zener diode 18a, the power supply electrode 19c, and the wiring electrode. 19e, and the Zener diode 18b, the power supply electrode 19b, and the wiring electrode 19h are electrically connected by a wire 14. As described above, if the first LED die 11b and the second LED die 12b are arranged with high area utilization efficiency in the area inside the annular dam 15 and connected with consideration to ease of handling, some of the wires 14 intersect (they appear to intersect when viewed two-dimensionally, but they are not connected three-dimensionally). In the figure, the tops of the wires 14 are crossed to symbolically show this crossing. Regarding the wire 14, only the vicinity of the first LED die 11b and the second LED die 12b is drawn, and other parts are omitted.

FIG. 7(d) is an explanatory diagram of the dam forming step 34. In the dam forming step 34, a dam 15 is formed on the mounting board 13 so as to surround the set of the first LED die 11b and the second LED die 12b. The dam 15 is made of white silicone resin, and has a thickness of 0.7 to 1.0 mm and a height of 0.5 to 0.8 mm. Further, the dam 15 is formed by discharging white silicone resin with high viscosity (or thixotropy) from the nozzle while moving the nozzle of the dispenser. At this time, the Zener diodes 18a and 18b are embedded in the dam 15. Similarly, the wiring electrodes 19e to 19h and a portion of the wire 14 connecting the wiring electrodes 19e to 19h with the first LED die 11b or the second LED die 12b are also embedded in the dam 15. Finally, the LED light emitting device 10 is heated to harden the dam 15.

FIG. 7E is an explanatory diagram of the first fluorescent resin coating step 35. In the first fluorescent resin coating step 35, a first fluorescent resin is applied to the upper part of the first LED die 11b to form a first fluorescent resin layer 11c. The first fluorescent resin is a silicone resin containing a phosphor that emits green light (for example, Lu ₃ Al ₅ O ₁₂ :Ce) and a phosphor that emits red light (for example, CaAlSiN ₃ :Eu). Spot printing is performed on the upper part of the first LED die 11b by the nozzle. The first fluorescent resin layer 11c produced by spot printing has a maximum thickness of about 0.5 mm and has a dome shape. The emitted light color of the first light emitting region 11a including the first fluorescent resin layer 11c is approximately 3000°K due to the blue light emitted by the first LED die 11b and the light emitted by the first fluorescent resin layer 11c.

FIG. 7(f) is an explanatory diagram of the second fluorescent resin coating step 36. In the second fluorescent resin coating step 36, a second fluorescent resin is applied to the upper part of the second LED die 12b to form a second fluorescent resin layer 12c. The second fluorescent resin is also a silicone resin containing a phosphor that emits green light (for example, Lu ₃ Al ₅ O ₁₂ :Ce) and a phosphor that emits red light (for example, CaAlSiN ₃ :Eu). Spot printing is performed on the upper part of the second LED die 12b by the nozzle. The second fluorescent resin layer 12c produced by spot printing has a maximum thickness of about 0.3 mm and has a dome shape. The emitted light color of the second light emitting region 12a including the second fluorescent resin layer 12c is approximately 5000°K due to the blue light emitted by the first LED die 11b and the light emitted by the first fluorescent resin layer 11c.

FIG. 7(g) is an explanatory diagram of the transparent resin coating step 37. In the transparent resin coating step 37, the inner region of the dam 15 is filled with transparent resin to form the transparent resin layer 16. The transparent resin is a transparent silicone resin that has low viscosity before hardening, and a dispenser is used for filling. After filling, the transparent resin is cured by heating.

In addition, in the first fluorescent resin coating step 35, the first fluorescent resin was applied by spot printing on the upper part of the first LED die 11b. Similarly, in the second fluorescent resin coating step 36, the second fluorescent resin was applied by spot printing on the upper surface of the second LED die 12b. However, the application method is not limited to spot printing; for example, spray printing may be used instead of spot printing. In either method, after coating, the first fluorescent resin and the second fluorescent resin are formed into a dome shape by surface tension.

The LED light emitting device 10 described with reference to FIGS. 1 to 7 is composed of an aggregate of a first light emitting region 11a and a second light emitting region 12a, which are minute light emitting regions. In the light emitting section 15a, the first light emitting region 11a and the second light emitting region 12a are adjacent to each other in the vertical and horizontal directions when viewed from above, and are arranged in a checkered pattern. The first light emitting region 11a includes one first LED die 11b and emits light at about 3000°K (first color). Similarly, the second light emitting region 12a includes one second LED die 12b and emits light at approximately 5000°K (second color). The top surface of the first LED die 11b and the side surface near the top surface are potted with the first fluorescent resin by spot printing or the like. The first fluorescent resin layer 11c thus formed has a dome shape with a curved top surface.

This LED light emitting device 10 can independently control the current flowing through the first circuit 11e and the current flowing through the second circuit 12e to adjust the color of the emitted light. In other words, the luminance of the first circuit 11e (the amount of light emitted from all the first light emitting regions 11a constituting the first circuit 11e) and the luminance of the second circuit 12e (the amount of light emitted from all the second light emitting regions 12a constituting the second circuit 12e) Since the amount of light emitted by the LED light emitting device 10 can be independently controlled, the LED light emitting device 10 can obtain a light emission color between 3000°K and 5000°K at any brightness.

As described above, in the LED light emitting device 10, the dome-shaped first fluorescent resin layer 11c is formed by spot printing only on the tip of the first LED die 11b, and the dome-shaped first fluorescent resin layer 11c must not be covered with the first fluorescent resin layer 11c. The second LED die 12b is placed close to the first LED die 11b. Moreover, since most of the light emitted from the first LED die 11b and the second LED die 12b passes through the first fluorescent resin layer 11c and the second fluorescent resin layer 12c, respectively, the luminous efficiency and wavelength conversion efficiency are not deteriorated. Therefore, the LED light emitting device 10 has a plurality of fine first light emitting regions 11a that emit light in the first color and a plurality of fine second light emitting regions 12a that emit light in the second color on one mounting board 13. When arranging the LEDs in a checkerboard pattern, even if the first LED die 11b and second LED die 12b of the same type constituting the first light emitting area 11a and the second light emitting area 12a are placed close to each other, the distance between the LED dies is large. Compared to conventional equipment, it is comparable in performance and quality and is easier to manufacture.

In addition, in the LED light emitting device 10, the first LED die 11b and the second LED die 12b are the same size and have the same characteristics, and the second LED die 12b is also individually covered with a second fluorescent resin layer 12c in a dome shape. In particular, the die bonding material 17 creeps up the side surfaces of the first LED die 11b and the second LED die 12b, and the die bonding material 17 covers the surface of the mounting board 13 between the first LED die 11b and the second LED die 12b. There is a characteristic that.

Specifically, the LED light emitting device 10 includes a first light emitting region 11a that emits light in a first color and a second light emitting region 12a that emits light in a second color on a mounting board 13, and the first light emitting region 11a and the second light emitting region 12a emit light in a second color. The light emitting regions 12a were arranged in a checkered pattern. Furthermore, this LED light emitting device 10 includes a plurality of first LED dies 11b and second LED dies 12b mounted on a mounting board 13, a dam 15 surrounding a set of the first LED dies 11b and second LED dies 12b, and a dam 15 surrounding the first LED dies 11b and a plurality of second LED dies 12b. It was provided with a wire 14 connecting the second LED dies 12b to each other or to each other, and a first fluorescent resin layer 11c and a second fluorescent resin layer 12c that cover the upper surfaces of the first LED die 11b and the second LED die 12b, respectively. At this time, the first LED die 11b and the second LED die 12b were the same blue light emitting diode. The second light emitting region 12a includes a first light emitting region 11a, a first LED die 11b, and a first fluorescent resin layer 11c, and a second light emitting region 12a includes a second LED die 12b and a second fluorescent resin layer 12c. Further, the side surfaces of the first LED die 11b and the second LED die 12b are shielded from light by the white die bonding material 17, and in the gap between the first LED die 11b and the second LED die 12b, the upper surface of the mounting board 13 is covered with the white die bonding material 17. was covered with.

The first LED die 11b and the second LED die 12b, which are one type of LED die, are arranged in a matrix on the mounting board 13 of the LED light emitting device 10. A fluorescent resin and a second fluorescent resin were separately applied to the tops of the first LED die 11b and the second LED die 12b. In this way, the LED light emitting device 10 has a plurality of fine first light emitting regions 11a that emit light in the first color and a plurality of fine second light emitting regions 12a that emit light in the second color on the mounting board 13. were arranged in a checkered pattern. Therefore, since the LED light emitting device 10 only needs to prepare one type of LED die in the preparation step 31 shown in FIG. 6, the manufacturing process can be further simplified. Furthermore, since there is only one type of LED die, it becomes easier to optimize the area utilization efficiency of the mounting board 13.

Note that the desired luminescent color may not be achieved only by adjusting the fluorescent resin. For example, the second color (spectrum) that is the emission color of the second light emitting region 12a may not be achieved only by adjusting the second fluorescent resin layer 12c. At this time, the second LED die 12b may be a near-ultraviolet light emitting LED, and its characteristics and size may be different from those of the first LED die 11b. In this way, the second fluorescent resin layer 12c comes to contain a blue-emitting phosphor, and the spectrum of blue light becomes thicker and approaches natural light.

Furthermore, if the second LED die 12b is individually covered with the second fluorescent resin layer 12c, the size of the second fluorescent resin layer 12c is reduced, so that part of the light emitted from the first LED die 11b passes through the first fluorescent resin layer 11c. This makes it difficult for the components to excite the phosphor in the second fluorescent resin layer 12c. In other words, the phosphor light emission in the second fluorescent resin layer 12c due to the emitted light from the first LED die 11b is unplanned light emission and becomes so-called noise, so the LED light emitting device 10 has a low level of this noise. Therefore, the LED light emitting device 10 can easily control and manage the emitted light color. In addition, in the LED light emitting device 10, the heights of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c were made different. This shows that the luminescent color of the first light emitting region 11a and the second light emitting region 12a can be adjusted not only by the concentration of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c but also by the height.

Further, the die bonding material 17 protrudes from the bottom surfaces of the first LED die 11b and the second LED die 12b included in the first light emitting region 11a and the second light emitting region 12a, respectively, and creeps up the side surfaces of the first LED die and the second LED die. This die-bonding material 17 blocks side-emitted light from the first LED die 11b and the second LED die 12b, and its surface functions as a reflective layer. Therefore, the LED light emitting device 10 can maintain high luminous efficiency while suppressing side emitted light with a simple structure without arranging additional light shielding members on the side surfaces of the first LED die 11b and the second LED die 12b. .

Further, the white die bonding material 17 that crawls up the side surfaces of the first LED die 11b and the second LED die 12b reduces noise. That is, by blocking the light (side emitted light) that is about to be emitted from the side surfaces of the first LED die 11b and the second LED die 12b by the die bonding material 17, unplanned excitation of the phosphor can be reduced. For example, if this die bonding material 17 were not present, light emitted from the side surface of the first LED die 11b would enter the second LED die 12b and excite the phosphor in the second fluorescent resin layer 12c. Therefore, when the side surfaces of the first LED die 11b and the second LED die 12b are shielded from light by the die bonding material 17, this noise is significantly reduced, making it easier to control and manage the emitted light color of the LED light emitting device 10.

Moreover, the die bonding material 17 covering the surface of the mounting board 13 in the gap between the first LED die 11b and the second LED die 12b improves the reflection efficiency of the light emitting part 15a, regardless of whether the surface of the mounting board 13 is subjected to reflection treatment. let Therefore, the LED light emitting device 10 has a high luminous efficiency due to the die bonding material 17.

Further, as shown in FIG. 3, in the LED light emitting device 10, the first LED die 11b and the second LED die 12b are mounted face-up (mounted with the light emitting layer on the top surface) on the mounting substrate 13. For this reason, the wires 14 had to cross at some parts when viewed from above. On the other hand, for example, by mounting the first LED die 11b face-up and mounting the second LED die 12b face-down (also referred to as flip-chip mounting), the wires 14 do not cross each other. Note that wiring electrodes are required on the upper surface of the mounting board 13 to connect the second LED dies 12b to each other.

(Second embodiment)
In the LED light emitting device 10 shown as the first embodiment, the upper surface of the mounting board 13 was covered with a white die bonding material 17 in the gap between the first LED die 11b and the second LED die 12b. However, if the reflectivity of the upper surface of the mounting board 13 is superior to that of the die bonding material 17, it is not necessary to cover the entire surface of the mounting board 13 with the white die bonding material 17. In other words, the 1st L
If the surface of the mounting board 13 is exposed in the gap between the ED die 11b and the second LED die 12b, the light emitting efficiency will be improved. Further, in the LED light emitting device 10, the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, the wire 14, etc. are integrally sealed with the transparent resin layer 16. However, as long as the transmittance does not decrease significantly, the transparent resin layer 16 can be made to have diffusivity and color mixing properties can be improved.

Therefore, as a second embodiment of the present invention, an LED light emitting device 20 including a reflective mounting board 13 and a diffusive transparent resin layer 16 will be described with reference to FIG. Note that the LED light emitting device 20 is different from the LED light emitting device 10 in that there is a reflective exposed portion 27 on the surface of the mounting board 13, in the gap between the first LED die 11b and the second LED die 12b, and that there is a reflective exposed portion 27 in the transparent resin layer 16. They have virtually the same members and the same structure, except for the fact that they have different characteristics. Therefore, when explaining the LED light emitting device 20, FIGS. 1 to 4 will be referred to, and common members in FIG. 8 will be denoted by common reference numerals.

FIG. 8 is a partial cross-sectional view of the LED light emitting device 20, showing main parts along line AA' in FIG. FIG. 8 shows two first light emitting regions 11a and two second light emitting regions 12a. Similarly to FIG. 5, the wire 14 (see FIG. 3) is not shown in FIG. 8 as well.

As shown in FIG. 8, a silver layer 28 is formed on the upper surface of the mounting board 13. The first LED die 11b and the second LED die 12b have their bottom surfaces bonded to the silver layer 28 with a die bonding material 17, and their side surfaces are covered. An exposed portion 27 of the silver layer 28 exists in the gap between the first LED die 11b and the second LED die 12b, and the silver layer 28 is exposed from the die bonding material 17 here.

Also in the LED light emitting device 20, similarly to the LED light emitting device 10, the upper portions of the first LED die 11b and the second LED die 12b are covered with the first fluorescent resin layer 11c and the second fluorescent resin layer 12c, respectively. Further, in the LED light emitting device 20, a protective layer 29 covers the exposed portion 27 of the silver layer 28, the surface of the die bonding material 17, and the surfaces of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c. The transparent resin layer 16 is made of a transparent resin 16a and a filler 16b, and seals the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, the wire 14 (not shown), etc. via a protective layer 29.

Among the wires 14 (not shown), the wire 14 connected to the upper surface of the first LED die 11b exits the first fluorescent resin layer 11c, passes through the transparent resin layer 16, and passes through the other first fluorescent resin layer 11c (not shown). The first LED die 11b is connected to the upper surface of another first LED die 11b (not shown). The same applies to the wires 14 connecting the second LED dies 12b. Since the material constituting the protective layer 29 is attached to the wire 14, the strength is increased compared to the case where the wire 14 is provided alone.

The mounting board 13 includes a flat base material on which a silver layer 28 is formed on the upper surface, and power supply electrodes 19a to 19d and wiring electrodes 19e to 19h on the upper surface, in order to insulate the silver layer 28 and the power supply electrode 19a. A printed circuit board with openings for mounting the first LED die 11b and the second LED die 12b is prepared, and the printed circuit board is bonded to a flat base material. For the protective layer 29, SiO ₂ or silicone resin can be used. When the protective layer 29 is made of SiO ₂ , after the wire bonding step 33, the dam forming step 34, the first fluorescent resin coating step 35, and the second fluorescent resin coating step 36, the protective film 29 is formed with a thickness of several tens of nanometers by sputtering. Then, a SiO ₂ film is formed. When the protective layer 29 is made of silicone resin, the protective film is formed by spraying or coating after the wire bonding step 33, the dam forming step 34, the first fluorescent resin coating step 35, and the second fluorescent resin coating step 36 shown in FIG. As No. 29, a silicon film is formed to a thickness of 10 μm. The filler 16b is, for example, spherical titanium oxide with a diameter of about 6 μm.

Since the silver layer 28 in the exposed portion 27 is prevented from being sulfurized or the like by the protective layer 29, it continues to maintain good reflection characteristics and contributes to improving the luminous efficiency of the LED light emitting device 20. That is, the LED light emitting device 20 including the reflective exposed portion 27 is advantageous when the distance between the first LED die 11b and the second LED die 12b is large. Further, the filler 16b contained in the sealing resin 64 blurs the boundary between the first light emitting region 11a and the second light emitting region 12a by diffusion. Therefore, the LED light emitting device 20 has improved color mixing properties compared to the LED light emitting device 10.

Note that the LED light emitting devices 10 and 20 were equipped with a dam 15. The dam 15 can be omitted by adjusting the viscosity (or thixotropy) of the transparent resin layer 16 before curing. Further, the LED light emitting device 20 may omit the transparent resin layer 16. In this case, a portion of the wire 14 is exposed, but since the protective layer 29 is formed on the wire 14, the transparent resin layer 16 can be easily omitted.

(Third embodiment)
In the LED light emitting devices 10 and 20 shown as the first embodiment and the second embodiment, the upper side surfaces of the first LED die 11b and the second LED die 12b are covered with a first fluorescent resin layer 11c and a second fluorescent resin layer 12c, respectively. Ta. However, when the covered portion of the first fluorescent resin layer 11c or the second fluorescent resin layer 12c on the upper side surface is narrow, or when the creeping up of the die bonding material 17 is small, the side emitted light of the first LED die 11b and the second LED die 12b may not be sufficiently blocked.

Therefore, as a third embodiment of the present invention, an LED light emitting device 30 that can reliably block side emitted light will be described with reference to FIG. Note that the LED light emitting device 30 has substantially the same members and the same structure as the LED light emitting device 10, except that the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, and the die bonding material 17 have different cross-sectional shapes. It becomes. Therefore, when describing the LED light emitting device 30, FIGS. 1 to 4 will be referred to, and common members in FIG. 9 will be denoted by common reference numerals.

FIG. 9 is a partial cross-sectional view of the LED light emitting device 30, with main parts drawn along line AA' in FIG. FIG. 9 shows two first light emitting regions 11a and two second light emitting regions 12a. Similarly to FIG. 5, the wire 14 (see FIG. 3) is not shown in FIG. 9 as well.

As shown in FIG. 9, the die bonding material 17 climbs up the side surfaces of the first LED die 11b and the second LED die 12b, forming an inclined surface between the first LED die 11b and the second LED die 12b. In the LED light emitting device 30, the amount of the die bonding material 17 of the LED light emitting device 30 is larger than that of the die bonding material 17 of the LED light emitting device 10. The first fluorescent resin layer 11c and the second fluorescent resin layer 12c cover the upper surfaces of the first LED die 11b and the second LED die 12b, and also cover a part of the slope of the die bonding material 17.

As described above, in the LED light emitting device 30, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c cover a part of the slope of the die bonding material 17, thereby reliably blocking side emitted light. This method is also effective when, like the LED light emitting device 20, there is an exposed portion 27 of the mounting board 13 between the first LED die 11b and the second LED die 12b.

(Fourth embodiment)
In the LED light emitting device 30 shown as the third embodiment, in order to ensure sufficient thickness of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c at the upper side surfaces of the first LED die 11b and the second LED die 12b, The contact angle between the first fluorescent resin layer 11c and the second fluorescent resin layer 72c and the die bonding material 17 was increased (approximately 45° in FIG. 9). However, in general, when the contact angle is large, the adhesive force becomes weak.

Therefore, as a fourth embodiment of the present invention, as shown in FIG. , an LED light emitting device 40 that can improve the adhesion between the first fluorescent resin layer 11c and the second fluorescent resin layer 12c and the die bonding material 17 will be described. Note that the LED light emitting device 40 differs from the LED light emitting device 30 only in the cross-sectional shapes of the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, and the die bonding material 17. Therefore, when describing the LED light emitting device 40, FIGS. 1 to 4 will be referred to, and common members in FIG. 10 will be denoted by common reference numerals.

FIG. 10 is a partial cross-sectional view of the LED light emitting device 40, showing main parts along line AA' in FIG. FIG. 10 shows two first light emitting regions 11a and two second light emitting regions 12a. Similarly to FIG. 5, the wire 14 (see FIG. 3) is not shown in FIG. 10 as well.

As shown in FIG. 10, the die bonding material 17 of the LED light emitting device 40 has less creeping up compared to the die bonding material 17 of the LED light emitting device 30 (see FIG. 9), and the cross section between the first LED die 11b and the second LED die 12b. The curvature is also small. At this time, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c form a fillet at the contact portion with the die bonding material 17. That is, in the LED light emitting device 40, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c are adjusted to have lower viscosity and thixotropy during coating than in the LED light emitting device 30 (see FIG. 9), and are Although the LED die 11b and the second LED die 12b are slightly thinner at the upper corner portions, they are thicker at the middle portions of the side surfaces, and a sufficient thickness can be ensured overall.

As described above, even if the cross-sectional curvature of the die-bonding material 17 is small, the LED light-emitting device 40 has a fillet when the first fluorescent resin layer 11c and the second fluorescent resin layer 12c cover a part of the slope of the die-bonding material 17. By forming the first fluorescent resin layer 11c and the second fluorescent resin layer 12c on the side surfaces, sufficient thickness can be ensured, and good adhesion can be achieved.

In addition, in the LED light emitting device 40, both the first fluorescent resin layer 11c and the second fluorescent resin layer 12c were provided with fillets. However, fillets may be provided in at least one of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c. For example, the thickly applied first fluorescent resin layer 11c is provided with a fillet for strong adhesion, and the thinly applied second fluorescent resin layer 12c is provided with a second fluorescent resin layer included in the LED light emitting device 30. It is not necessary to provide a fillet like 12c (see FIG. 9).

(Fifth embodiment)
In the LED light emitting device 40 shown as the fourth embodiment, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c are thinner at the upper corners of the first LED die 11b and the second LED die 12b than at the middle part of the side surface. Ta. Therefore, the LED light emitting device 40 may not be able to sufficiently convert the wavelength of the blue light emitted from the upper corners of the first LED die 11b and the second LED die 12b, and in this case, color unevenness may occur depending on the azimuth angle. .

Therefore, as a fifth embodiment of the present invention, an LED light emitting device 50 that can reduce color unevenness due to azimuth angle will be described with reference to FIG. Note that the LED light emitting device 50 differs from the LED light emitting device 40 only in the cross-sectional shapes of the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, and the die bonding material 17. Therefore, when describing the LED light emitting device 50, FIGS. 1 to 4 will be referred to, and common members in FIG. 11 will be denoted by common reference numerals.

FIG. 11 is a partial cross-sectional view of the LED light emitting device 50, showing main parts along line AA' in FIG. FIG. 11 shows two first light emitting regions 11a and two second light emitting regions 12a. Similarly to FIG. 5, the wire 14 (see FIG. 3) is not shown in FIG. 11 as well.

As shown in FIG. 11, the height of the top surface of the die bonding material 17 of the LED light emitting device 50 matches the height of the top surfaces of the first LED die 11b and the second LED die 12b. Furthermore, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c form a fillet at the contact portion with the die bonding material 17. That is, in the LED light emitting device 50, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c are sufficiently formed at the upper corners of the first LED die 11b and the second LED die 12b, compared to the LED light emitting device 40 (see FIG. 9). The thickness is ensured.

As described above, the LED light emitting device 50 allows the upper surfaces of the first LED die 11b and the second LED die 12b to As a result of ensuring a sufficient thickness of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c at the corner, it becomes possible to appropriately convert the wavelength of the blue light emitted from the upper corner, thereby changing the azimuth angle. It can reduce color unevenness caused by

Note that in order to make the upper surface of the die bonding material 17 coincide with the upper surfaces of the first LED die 11b and the second LED die 12b, it is effective to reduce the distance between the first LED die 11b and the second LED die 12b. In the LED light emitting device 50, the die size was 650 μm, and the distance between the first LED die 11b and the second LED die 12b was 400 μm. In addition, in order to reduce color unevenness caused by azimuth, the height of the top surface of the die bonding material 17 should be made to roughly match the top surfaces of the first LED die 11b and the second LED die 12b, and similarly It is sufficient if the area between the second LED dies 12b is generally flat.

(Sixth embodiment)
In the LED light emitting devices 10, 20, 30, 40, and 50, the highest portion of the die bonding material 17 was below the height of the upper surfaces of the first LED die 11b and the second LED die 12b. On the other hand, a white resin may be filled between the first LED die 11b and the second LED die 12b, and the top of this resin may be higher than the upper surfaces of the first LED die 11b and the second LED die 12b.

Therefore, as a sixth embodiment of the present invention, as shown in FIG. The LED light emitting device 60 will be explained. Note that the LED light emitting device 60 differs from the LED light emitting device 10 and the like only in that white resin 61 is added and that the die bonding material 17 creeps up less. Therefore, when describing the LED light emitting device 60, FIGS. 1 to 4 will be referred to, and common members in FIG. 12 will be denoted by common reference numerals.

FIG. 12 is a partial cross-sectional view of the LED light emitting device 60, with main parts drawn along line AA' in FIG. FIG. 12 shows two first light emitting regions 11a and two second light emitting regions 12a. Note that the wire 14 (see FIG. 3) is not shown in FIG. 12 as well as in FIG. 5.

As shown in FIG. 12, the die bonding material 17 only bonds the bottom surfaces of the first LED die 11b and the second LED die 12b to the surface of the mounting board 13, and almost covers the side surfaces of the first LED die 11b and the second LED die 12b. Not covered. The upper portions of the first LED die 11b and the second LED die 12b are individually covered with a dome-shaped first fluorescent resin layer 11c and a second fluorescent resin layer 12c, respectively. A white resin 61 is filled between the first LED die 11b and the second LED die 12b, and the upper surface of the white resin 61 is higher than the upper surfaces of the first LED die 11b and the second LED die 12b. A transparent resin layer 16 seals the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, and the white resin 61. Note that the white resin 61 is a silicone resin kneaded with fine particles of titanium oxide, and is a process added between the second fluorescent resin coating process 36 and the transparent resin coating process 37 shown in FIG. and second LED die 1
2b.

As described above, when the top surface of the white resin 61 is made higher than the top surfaces of the first LED die 11b and the second LED die 12b, the light emission from the first LED die 11b enters the second fluorescent resin layer 12c and the light emission from the second LED die 12b. The incidence of light entering the first fluorescent resin layer 11c is reduced, and the incidence of the respective emitted light entering into each other between the first fluorescent resin layer 11c and the second fluorescent resin layer 12c is also reduced. That is, in the LED light emitting device 60, due to the white resin 61, the phosphor contained in the first fluorescent resin layer 11c and the second fluorescent resin layer 12c is substantially excited only in the first LED die 11b and the second LED die 12b, respectively. will be done. As a result, noise in the LED light emitting device 60 is reduced, and the color of the emitted light can be managed even more easily.

(Seventh embodiment)
In the LED light emitting devices 10, 20, 30, 40, 50, 60, a dome-shaped first fluorescent resin layer 11c individually covers the first LED die 11b in the first light emitting region 11a, and a dome-shaped first fluorescent resin layer 11c individually covers the first LED die 11b in the second light emitting region 12a. A shaped second fluorescent resin layer 12c individually covered the second LED die 12b. However, in order to form the dome-shaped first fluorescent resin layer 11c and second fluorescent resin layer 12c, if spot printing is applied to all of the first LED die 11b and second LED die 12b as in the LED light emitting device 10, the manufacturing process becomes long.

Therefore, as a seventh embodiment, as shown in FIGS. 13 to 15, a plurality of fine first light emitting regions 11a that emit light in a first color and a plurality of fine light emitting regions 11a that emit light in a second color are provided on one mounting board. An LED light emitting device 70 that does not require a long manufacturing process even if the second light emitting regions 12a are arranged in a checkerboard pattern and a manufacturing method thereof will be described. Note that the LED light emitting device 70 differs from the LED light emitting device 10 only in that there is no transparent resin layer 16 and that the cross-sectional shape of the second fluorescent resin layer 12c is not dome-shaped. Therefore, when describing the LED light emitting device 70, FIGS. 1 to 4 will be referred to, and common members in FIGS. 13 to 15 will be denoted by common reference numerals.

FIG. 13 is a partial cross-sectional view of the LED light emitting device 70, with main parts drawn along line AA' in FIG. FIG. 13 shows two first light emitting regions 11a and two second light emitting regions 12a. As shown in FIG. 13, the bottom surfaces of the first LED die 11b and the second LED die 12b are bonded to the top surface of the mounting board 13 with a die bonding material 17. The die bonding material 17 is white and contains reflective fine particles made of Ti oxide, etc., and covers the side surfaces of the first LED die 11b and the second LED die 12b, and is used in the gap between the first LED die 11b and the second LED die 12b on the mounting board. It covers the top surface of 13. Note that the wire 14 is not shown in FIG. 13 as well as in FIG. 5.

As shown in FIG. 13, the upper surface of the first LED die 11b is individually covered with a dome-shaped first fluorescent resin layer 11c. Furthermore, the first fluorescent resin layer 11c also covers the upper part of the side surface of the first LED die 11b, and together with the die bonding material 17, prevents the light emitted from the first LED die 11b from leaking directly from the side surface of the first LED die 11b. The upper surface of the second LED die 12b is covered with a second fluorescent resin layer 12c. The second fluorescent resin layer 12c uniformly covers the upper surfaces of the plurality of second LED dies 12b, fills the gaps between the first LED die 11b and the second LED die 12b, and further covers the first fluorescent resin layer 11c. There is.

Note that, as shown in FIG. 13, the first light emitting region 11a is directly above and in the vicinity of the first LED die 11b. That is, since most of the light emitted from the first LED die 11b is concentrated directly above the first LED die 11b, even if the light emission from the first fluorescent resin layer 11c, which is excited by the light emission from the first LED die 11b and emits light, is isotropic. Since the first light emitting region 11a is recognized as a region where the intensity of the mixed light of the light emitted by the first LED die 11b and the light emitted by the first fluorescent resin layer 11c is strong, the first light emitting region 11a is limited to the area immediately above the first LED die 11b and its vicinity. It will be done. Similarly, the second light emitting region 12a is limited to the area immediately above and in the vicinity of the second LED die 12b.

Next, a method for manufacturing the LED light emitting device 70 will be described with reference to FIGS. 14 and 15. FIG. 14 is a flowchart showing the manufacturing steps included in the method for manufacturing the LED light emitting device 70, and FIG. 15 is an explanatory diagram of the manufacturing steps shown in the flowchart of FIG. Note that the same reference numerals as in FIGS. 1 to 4 and 6 indicate common members and steps, and are cited without special instructions.

As shown in FIG. 14, the manufacturing method of the LED light emitting device 70 includes a preparation step 31 of preparing the mounting board 13, the first LED die 11b, the second LED die 12b, etc.; a die bonding process 32 for bonding the first LED die 11b and the second LED die 12b to the wiring electrodes 19e to 19h; a wire bonding process 33 for electrically connecting the first LED dies 11b or the second LED dies 12b to each other with wires 14; A dam forming step 34 in which a dam 15 is formed on the mounting board 13 so as to surround the set of the first LED die 11b and the second LED die 12b, and a first fluorescent resin is applied to the first LED die 11b to form a first fluorescent resin layer 11c. The second fluorescent resin coating step 36 includes a first fluorescent resin coating step 35 of filling the inner region of the dam 15 with a second fluorescent resin to form a second fluorescent resin layer 12c.

15(a) to 15(f) schematically depict a cross section of the LED light emitting device 70 in the process of being manufactured, in order to explain each process shown in FIG. 14. In FIG. 15, the preparation step 31 shown in (a), the die bonding step 32 shown in (b), the wire bonding step 33 shown in (c), the dam forming step 34 shown in (d), and the step (e) shown in FIG. The first fluorescent resin coating step 35 shown in FIG. It's the same thing. That is, in the LED light emitting device 70, as the steps shown in FIGS. 14 and 15, the second fluorescent resin coating step 36 shown in (f) is different from the second fluorescent resin coating step 36 shown in FIG. There is no transparent resin coating step 37 shown in 6.

In a second fluorescent resin coating step 36 shown in FIG. 15(f), a second fluorescent resin is filled into the inner region of the dam 15 to form a second fluorescent resin layer 12c so as to cover the upper surface of the second LED die 12b. . The second fluorescent resin before hardening has a low viscosity, and a dispenser is used for filling. Note that, as shown in FIG. 13, the first fluorescent resin layer 11c is covered with the second fluorescent resin layer 12c. The second fluorescent resin layer 12c also contains a phosphor that emits green light (for example, Lu ₃ Al ₅ O ₁₂ :Ce) and a phosphor that emits red light (for example, CaAlSiN ₃ :Eu). The concentration and ratio of the phosphor differs from that of the resin layer 11c. The color of the emitted light from the second light emitting region 12a has a color temperature of about 5000°K due to the blue light emitted by the second LED die 12b and the light emitted from the second fluorescent resin layer 12c.

As described above, the LED light emitting device 70 includes a plurality of fine first light emitting regions 11a that emit light in a first color and a plurality of fine second light emitting regions 11a that emit light in a second color on one mounting board 13. When arranging the regions 12a in a checkerboard pattern, the first LED dies 11b belonging to the first light emitting region 11a are arranged in a dome-shaped first fluorescent resin, although only one type of LED die is prepared. Since the second LED die 12b belonging to the second light emitting region 12a is collectively covered with the second fluorescent resin layer 12c while being individually covered with the layer 11c, the manufacturing process does not become long.

In the LED light emitting device 70, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c emit light based on the light emission of the first LED die 11b and the second LED die 12b, respectively. Additionally, the second fluorescent resin layer 12c emits light due to the light emission from the first fluorescent resin layer 11c and the light emission from the first LED die 11b that has passed through the first fluorescent resin layer 11c. That is, compared to the LED light emitting device 10 and the like, noise is increased. Therefore, the LED light emitting device 70 has few restrictions on the color of emitted light, and is suitable when brightness and cost are important.

Note that the LED light emitting device 70 was equipped with a dam 15. The dam 15 can be omitted by adjusting the viscosity (or thixotropy) of the second fluorescent resin before curing. However, with the dam 15, the thickness of the second fluorescent resin layer 12c can be made uniform, making it easier to handle.

In addition, the LED light emitting device 70 has a white die bonding material 17 crawling up the side surfaces of the first LED die 11b and the second LED die 12b to block light that is about to be emitted from the side surfaces of the first LED die 11b and the second LED die 12b. Ta. Even if the creeping up of the die bonding material 17 is reduced and the light is emitted from the side surfaces of the first LED die 11b and the second LED die 12b, a certain level of color mixing of the first color and the second color can be ensured. At this time, noise increases and controllability of emitted light color deteriorates, but brightness improves.

Further, in the LED light emitting device 70, the surface of the mounting substrate 13 was covered with the die bonding material 17 in the gap between the first LED die 11b and the second LED die 12b. If the surface of the mounting substrate is subjected to reflection treatment like the LED light emitting device 20, the upper surface of the mounting substrate 13 may be exposed in the region between the first LED die 11b and the second LED die 12b.

(Eighth embodiment)
In the LED light emitting device 70, the die bonding material 17 crawled up the sides of the first LED die 11b and the second LED die 12b. However, the die bonding material 17 does not necessarily need to climb up the sides of the first LED die 11b and the second LED die 12b.

Therefore, as an eighth embodiment of the present invention, an LED light emitting device 80 in which the die bonding material 17 does not creep up the side surfaces of the first LED die 11b and the second LED die 12b will be described with reference to FIG. Note that the LED light emitting device 80 differs from the LED light emitting device 70 only in the cross-sectional shapes of the die bonding material 17 and the second fluorescent resin layer 12c. Therefore, when describing the LED light emitting device 80, FIGS. 1 to 4 will be referred to, and common members in FIG. 16 will be denoted by common reference numerals.

FIG. 16 is a partial cross-sectional view of the LED light emitting device 80, with main parts drawn along line AA' in FIG. FIG. 16 shows two first light emitting regions 11a and two second light emitting regions 12a. Similarly to FIG. 5, the wire 14 (see FIG. 3) is not shown in FIG. 16 as well. As shown in FIG. 16, the dome-shaped first fluorescent resin layer 11c individually covers the upper part of the first LED die 11b, and the second fluorescent resin layer 12c covers the upper surface of the second LED die 12b, the first LED die 11b, and the first LED die 11b. It covers between the two LED dies 12b and the upper part of the first LED die 11b. The die bonding material 17 exists only between the bottom surfaces of the first LED die 11b and the second LED die 12b and the surface of the mounting board 13. That is, in the die bonding step 32 (see FIG. 6), the amount of the die bonding material 17 applied is reduced to prevent the die bonding material 17 from creeping up the side surfaces of the first LED die 11b and the second LED die 12b during die bonding.

In the LED light emitting device 80, all of the components emitted from the entire side surface of the light emitted from the first LED die 11b and the second LED die 12b are input to the second fluorescent resin layer 12c, so that the light emitting efficiency becomes high. That is, the LED light emitting device 80 is effective when emphasis is placed on luminous efficiency.

(Ninth embodiment)
In the LED light emitting device 70, the height of the first LED die 11b and the height of the second LED die 12b were equal. However, the heights of the first LED die 11b and the second LED die 12b do not necessarily have to be equal.

Therefore, as a ninth embodiment of the present invention, an LED light emitting device 90 in which the first LED die 11b and the second LED die 12b have different heights will be described with reference to FIG. Note that the LED light emitting device 90 differs from the LED light emitting device 70 only in the cross-sectional shapes of the first LED die 11b, the second LED die 12b, the die bonding material 17, and the second fluorescent resin layer 12c. Therefore, when explaining the LED light emitting device 90, FIGS. 1 to 4 will be referred to, and common members in FIG. 17 will be denoted by common reference numerals.

FIG. 17 is a partial cross-sectional view of the LED light emitting device 90, showing main parts along line AA' in FIG. FIG. 17 shows two first light emitting regions 11a and two second light emitting regions 12a. Similarly to FIG. 5, the wire 14 (see FIG. 3) is not shown in FIG. 17 as well. As shown in FIG. 17, the first LED die 11b is taller than the second LED die 12b. The dome-shaped first fluorescent resin layer 11c individually covers the upper part of the first LED die 11b, and the second fluorescent resin layer 12c covers the upper surface of the second LED die 12b, between the first LED die 11b and the second LED die 12b, and Cover the top of the first LED die 11b. The die bonding material 17 covers the surface of the mounting board 13 between the first LED die 11b and the second LED die 12b, and also extends slightly up the side surfaces of the first LED die 11b and the second LED die 12b.

The LED light emitting device 90 is characterized in that when it emits light at a low color temperature, it can emit light with less noise because the first fluorescent resin layer 11c is located near the surface of the second fluorescent resin layer 12c.

(10th embodiment)
In the LED light emitting device 90, the first LED die 11b was higher than the second LED die 12b. However, when the height of the first LED die 11b and the height of the second LED die 12b are made different, it is not necessarily necessary to make the first LED die 11b higher than the second LED die 12b.

Therefore, as a tenth embodiment of the present invention, an LED light emitting device 100 in which the first LED die 11b is shorter than the second LED die 12b will be described with reference to FIG. Note that the LED light emitting device 100 differs from the LED light emitting device 90 only in the cross-sectional shapes of the first LED die 11b, the second LED die 12b, and the second fluorescent resin layer 12c. Therefore, when describing the LED light emitting device 100, FIGS. 1 to 4 will be referred to, and common members in FIG. 18 will be denoted by common reference numerals.

FIG. 18 is a partial cross-sectional view of the LED light emitting device 100, showing main parts along line AA' in FIG. FIG. 18 shows two first light emitting regions 11a and two second light emitting regions 12a. Similarly to FIG. 5, the wire 14 (see FIG. 3) is not shown in FIG. 18 as well. As shown in FIG. 18, the first LED die 11b is shorter than the second LED die 12b. The dome-shaped first phosphor resin layer 11c individually covers the upper part of the first LED die 11b, and the second phosphor resin layer 12c covers the upper surface of the second LED die 12b, between the first LED die 11b and the second LED die 12b, It also covers the upper part of the first LED die 11b. The die bonding material 17 covers the surface of the mounting board 13 between the first LED die 11b and the second LED die 12b, and also extends slightly up the side surfaces of the first LED die 11b and the second LED die 12b.

As described above, in the LED light emitting device 100, most components of the light emitted from the second LED die 12b are directed upward. Of this component, the portion directed obliquely upward does not enter the first fluorescent resin layer 11c because the second LED die is tall. That is, when the LED light emitting device 100 emits light at a high color temperature (when the first LED die 11b is almost off), the first fluorescent resin layer 11c is difficult to be excited by the light emitted from the second LED die 12b, so that noise is reduced. It has the characteristic of being able to emit light even when the amount of light is low.

It can be said that in the LED light emitting devices 90 and 100 shown as the ninth and tenth embodiments, the heights of the light emitting surfaces of the first LED die 11b and the second LED die 12b are substantially different. That is, the height of the light emitting surface may be adjusted by providing unevenness on the surface of the mounting board 13. For example, an LED light emitting device equivalent to the LED light emitting device 90 can be obtained by making the first LED die 11b and the second LED die 12b the same size and providing a protrusion on the mounting portion of the first LED 11b.

(Eleventh embodiment)
In the LED light emitting device 10 and the like, a large number of first LED dies 11b and second LED dies 12b are mounted on a mounting board 13 that is square in plan view, while the light emitting part 15a is circular (see FIG. 1). This is done by forming power supply electrodes 19a to 19d on two opposing corners of the four corners of the mounting board 13, and attaching an attachment mechanism to the motherboard, heat sink, etc. (in Fig. 1, a 1/4 circular cutout) on the remaining two corners. This is because the provision of the notch (notch) makes the structure more efficient, and furthermore, when a circular lens is attached, it is convenient if the light emitting portion 15a is also circular.

However, like the LED light emitting device 10, the outer edge of the checkered pattern arrangement of the first LED die 11b and the second LED die 12b is polygonal (octagonal), and the plurality of first LED rows 11d and the second LED rows 12d are connected in parallel. If so, the wires 14 are forced to intersect as shown in FIG. 3 when viewed from above. However, when the wires 114 intersect (in the description of the present embodiment and the twelfth embodiment, a state in which they are visually recognized as intersecting when viewed from above is simply referred to as "intersection"), the first fluorescent resin and the second fluorescent resin cross each other. When the resin or transparent resin is filled from above the wires 14, there is an increased risk that the wires 14 will short-circuit at the intersection.

Therefore, as an eleventh embodiment of the present invention, an LED light emitting device 110 and a method for manufacturing the same will be described with reference to FIGS. 19 to 21, in which short circuits between the wires 14 can be avoided with high probability even if the wires 14 cross. Note that since the basic configuration of the LED light emitting device 110 is the same as that of the LED light emitting device 10, etc., FIGS. 1 to 4 will be referred to for explanation, and common members in FIGS. 19 to 21 will be denoted by common symbols.

FIG. 19 is a partial cross-sectional view of the LED light emitting device 110, with main parts drawn along line AA' in FIG. FIG. 19 shows one first light emitting region 11a and one second light emitting region 12a. As shown in FIG. 19, the first LED die 11b and the second LED die 12b are mounted on the mounting board 13 via a die bonding material 17. A white resin 61 is filled between the first LED die 11b and the second LED die 12b. The upper surfaces of the first LED die 11b and the second LED die 12b are covered with a first fluorescent resin layer 11c and a second fluorescent resin layer 12c, respectively. The white resin 61, the first fluorescent resin layer 11c, and the second fluorescent resin layer 12c are covered with a transparent resin layer 16. Note that the top of the first fluorescent resin layer 11c is lower than that of the second fluorescent resin layer 12c. Note that the wire 14 (see FIG. 3) is not shown in FIG. 19 as well as in FIG. 5.

When the first fluorescent resin layer 11c and the second fluorescent resin layer 12c are viewed in plan, the areas occupied by the first fluorescent resin layer 11c and the second fluorescent resin layer 12c are the first light emitting region 11a and the second light emitting region 12a, respectively. (See Figure 1). That is, the first light emitting region 11a and the second light emitting region 12a include a first fluorescent resin layer 11c and a second fluorescent resin layer 12c, and a first LED die 11b and a second LED die 12b, respectively.

Next, a method for manufacturing the LED light emitting device 110 will be described with reference to FIGS. 20 and 21. FIG. 20 is a flowchart showing the manufacturing steps included in the method for manufacturing the LED light emitting device 110, and FIG. 21 is an explanatory diagram of the manufacturing steps shown in the flowchart of FIG. Note that the features of the structure of the LED light emitting device 110 shown in FIGS. 20 and 21 will also be described.

As shown in FIG. 20, the manufacturing method of the LED light emitting device 110 includes a preparation step 31 of preparing the mounting board 13, the first LED die 11b, the second LED die 12b, etc.; A die bonding process 32 for bonding the first LED die 11b and the wiring electrodes 19e to 19h, a wire bonding process 33 for electrically connecting the first LED dies 11b to each other or the second LED dies 12b using wires 14, a dam forming step 34 of forming a dam 15 on the mounting board 13 so as to surround a set of two LED dies 12b; a white resin filling step 38 of filling the gap between the first LED die 11b and the second LED die 12b with white resin 61; A protective resin film forming step 39 in which a protective resin film 62 is formed on the wire 14 etc., a first fluorescent resin coating step 35 in which a first fluorescent resin is applied to form a first fluorescent resin layer 11c, and a second fluorescent resin is applied. a second fluorescent resin coating step 36 in which the second fluorescent resin layer 12c is formed, and a transparent resin coating step 37 in which the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, and the wire 14 are covered with the transparent resin layer 16. .

FIG. 21 is an explanatory diagram schematically depicting a cross section of the LED light emitting device 110 in the process of being manufactured, in order to explain each process shown in FIG. 20. In FIG. 21, the preparation step 31 shown in (a), the die bonding step 32 shown in (b), the wire bonding step 33 shown in (c), and the dam forming step 34 shown in (d) are the preparation steps shown in FIG. 6, respectively. 31, a die bonding process 32, a wire bonding process 33, and a dam forming process 34. In FIG. 21, a first fluorescent resin coating step 35 shown in (g), a second fluorescent resin coating step 36 shown in (h), and a transparent resin coating step 37 shown in (i) are performed by applying a white resin 61 and a protective resin film 62. Except for the presence of , this step is substantially the same as the first fluorescent resin coating step 35, the second fluorescent resin coating step 36, and the transparent resin coating step 37 shown in FIG.

FIG. 21(e) is an explanatory diagram of the white resin filling step 38. In the white resin filling step 38, white resin 61 is filled into the gap between the first LED die 11b and the second LED die 12b. First, an appropriate amount of white resin 61 with a low viscosity is dropped using a dispenser while avoiding the first LED die 11b and the second LED die 12b. The gap between the first LED die 11b and the second LED die 12b is filled with white resin 61 by capillary action. At this time, the upper surface of the white resin 61 and the upper surfaces of the first LED die 11b and the second LED die 12b are approximately equal. Finally, the LED light emitting device 110 is heated to harden the white resin 61. Note that the white resin 61 is a silicone resin kneaded with reflective fine particles such as titanium oxide.

FIG. 21(f) is an explanatory diagram of the protective resin film forming step 39. In the protective resin film forming step 39, a protective resin film 62 is formed on the wire 14. First, the space inside the dam 15 is filled with a solution containing acrylic modified silicone and polysilazane diluted with a solvent such as ethyl acetate using a dispenser. Thereafter, the solution was left at 150°C for about 1 hour to volatilize the solvent. As a result, a cured protective resin film 62 is obtained which is coated along the shape of the adherend (such as the wire 14). The protective resin film 62 also contains SiO2. Further, a curtain-shaped protective resin film 62 is formed under the wire 14. The mechanical strength of the wire 14 is increased by the protective resin film 62 and the curtain-shaped protective resin film 62, and the wire 14 is subjected to the first fluorescent resin coating step 35, the second fluorescent resin coating step 36, and the transparent resin coating step, which are the subsequent steps. 37, problems such as short circuits are reduced.

As described above, since the strength of the LED light emitting device 110 is increased by the protective resin film 62, the protective resin film forming step 39 is followed by the first fluorescent resin coating step 35, the second fluorescent resin coating step 36, and the transparent resin coating. In the step of depositing resin such as step 37, the wire 14 is less likely to be deformed or fall down. As a result, in the LED light emitting device 110 and its manufacturing method, since the light emitting portion 15a is circular, even if the wires 14 intersect, short circuits between the wires 14 can be avoided with a high probability in the manufacturing process after wire bonding.

In addition, in the manufacturing method of the LED light emitting device 110 shown in FIGS. 20 and 21, the first LED die 11b and the second LED die 12b are mounted on the mounting board 13, and various resins are arranged. However, as described above, for mass production, it is suitable to use a collective board construction method using large-sized boards, which can yield a large number of mounting boards 13 included in the LED light emitting device 110 when separated into pieces. At this time, the set of the first LED die 11b and the second LED die 12b surrounded by one dam 15 is included in the LED light emitting device 110, and a large number of dams 15 are formed on the large substrate. The assembled board construction method includes, after the transparent resin coating step 37, a singulation step of cutting the large substrate to separate the LED light emitting devices 110 into pieces.

In addition, in the manufacturing method of the LED light emitting device 110 shown in FIGS. 20 and 21, after the dam 15 is formed, the area inside the dam 15 is filled with white resin 61. However, by making the die bonding material 17 white and using it frequently, as in the LED light emitting device 10, the die bonding material 17 protrudes around the LED die 11 during die bonding, and the protruding die bonding material 17 is transferred to the white resin 61. can be substituted for. That is, the protruding die-bonding material 17 may creep up the side surfaces of the first LED die 11b and the second LED die 12b, shielding the side surfaces of the first LED die 11b and the second LED die 12b from light, and may function as a reflective member. In this way, the white resin filling step 38 can be omitted.

Furthermore, when the base material of the mounting board 13 is aluminum, a silver layer 28 (see FIG. 8) may be provided on the upper surface thereof. That is, even if the white die bonding material 17 creeps up the side surfaces of the first LED die 11b and the second LED die 12b and can shield the side surfaces of the first LED die 11b and the second LED die 12b, the first LED die 11b and the second LED die 12b If the interval is large, the top surface of the mounting board 13 may be exposed from the white die bonding material 17. In such an LED light emitting device 110, since the exposed portion 27 (see FIG. 8) of the mounting board 13 is the silver layer 28, the light emitting efficiency is improved based on the high reflectance of the silver layer 28, and the protective resin film 62 By covering the exposed portion 27 with the silver layer 28, the silver layer 28 is prevented from being sulfurized and high reliability is obtained.

(12th embodiment)
In the LED light emitting device 110 shown as the eleventh embodiment, like the LED light emitting device 10 and the like, a dome-shaped first fluorescent resin layer 11c is formed on the first LED die 11b in the first light emitting region 11a by spot printing. At the same time, in the second light emitting region 12a, a dome-shaped second fluorescent resin layer 12c was also formed on the second LED die 12b by spot printing. However, like the LED light emitting device 70 etc. (see FIG. 13), the first fluorescent resin layer 11c is formed by spot printing on the first LED die 11b in the first light emitting region 11a, while the first fluorescent resin layer 11c is formed on the first LED die 11b in the first light emitting region 11a, while The second fluorescent resin layer 12c may be formed by filling so as to cover the area. In this way, even if the wire 14 has the protective resin film 62, the manufacturing process is simplified as in the case of the LED light emitting device 70. At the same time, the white resin filling step 38 can be omitted from the manufacturing process of the LED light emitting device 110.

Furthermore, in order to prevent a short circuit between the wires 14 at the intersection, one of the wires 14 that intersect with each other is preferably trapezoidal in side view, and the other wire is preferably curved (normal shape) in side view.

Therefore, as shown in FIGS. 22 to 27, as a twelfth embodiment of the present invention, the second fluorescent resin layer 12c is filled over the entire inner region of the dam 15, and the side surfaces of the first LED die 11b and the second LED die 12b are shielded from light. An LED light emitting device 120 including a wire 14 which is not shaped like a trapezoid in side view and a method for manufacturing the same will be described. Note that since the basic configuration of the LED light emitting device 120 is the same as that of the LED light emitting device 70, etc., FIGS. 1 to 4 will be referred to for explanation, and common members in FIGS. 22 to 27 will be denoted by common symbols.

FIG. 22 is a partial cross-sectional view of the LED light emitting device 120, with main parts drawn along line AA' in FIG. In FIG. 22, one first light emitting region 11a and one second light emitting region 12a are shown. As shown in FIG. 22, the first LED die 11b and the second LED die 12b are mounted on the mounting substrate 13 via a die bonding material 17. The upper surface of the first LED die 11b is individually covered with a first fluorescent resin layer 11c in a dome shape. On the other hand, the second fluorescent resin layer 12c is formed over the entire inner region of the dam 15 (see FIG. 1), including the side surfaces of the first LED die 11b and the second LED die 12b, the upper surface of the second LED die 12b, and the first The fluorescent resin layer 11c and the surface of the mounting board 13 are covered.

Furthermore, in FIG. 22, a part of the wire 14 (see FIG. 3) connected to the first LED die 11b (referred to as wire 14a (first wire) in FIGS. 22 to 27) and a part of the wire 14 (see FIG. 3) connected to the first LED die 11b, A part of the wire 14 (referred to as wire 14b (second wire) in FIGS. 22 to 27) connected to die 12b is shown. As shown in FIG. 22, the wire 14a extends upward from the surface of the first LED die 11b, passes through the first fluorescent resin layer 11c, and curves downward in the second fluorescent resin layer 12c ( (hereinafter referred to as "normal shape"). The wire 14b extends upward from the surface of the second LED die 12b, is bent in the second fluorescent resin layer 12c, and is directed laterally. Note that the wire 14b has a special shape (trapezoidal in side view) at the intersection with the wire 14a to avoid a short circuit. Further, the wire 14b has a normal shape except at the intersection. As a result, the wire 14a goes under the wire 14b at the intersection. That is, in the LED light emitting device 120, at the intersection, the wire 14a connected to the first LED die 11b has a curved line (normal shape) in side view, and the wire 14b connected to the second LED die 12b has a trapezoidal shape in side view, thereby preventing short circuits. are effectively avoided.

The wires 14a and 14b of the LED light emitting device 120 shown in FIG. 22 will be explained in more detail with reference to FIGS. 23 to 25. FIG. 23 is a partial plan view showing a region where the wire 14a and the wire 14b intersect in the light emitting section 15a (see FIG. 3). FIG. 24 is a perspective view of the area shown in FIG. 23. 25, (a) is a sectional view taken along the line BB' in FIG. 23, and (b) is a sectional view taken along the line CC' in FIG. 23. In the description of FIGS. 23 to 25, FIG. 22 will be referred to without special instructions (the same applies to FIGS. 26 and 27). Since the area shown in FIG. 22 includes two each of the first LED die 11b and the second LED die 12b, when explaining FIGS. 23 to 25, the first LED die 11b and the second LED die 12b are They are distinguished as one LED die 11b1, 11b2, and second LED die 12b1, 12b2. Further, in FIGS. 23 to 25, the wires 14 other than the wires 14a and 14b (see FIG. 3), the second fluorescent resin layer 12c, and the mounting board 13 are not shown. Furthermore, the first fluorescent resin layer 11c is not illustrated in FIGS. 23 and 24.

As shown in FIG. 23, the anode 21 of the first LED die 11b1 is connected to the cathode 22 of the first LED die 11b2 by a wire 14a. The cathode 22 of the second LED die 12b1 is connected to the anode 21 of the second LED die 12b2 by a wire 14b. Although the wires 14a and 14b are observed to intersect when viewed from above, they are not three-dimensionally short-circuited. That is, as described above, the wire 14a goes under the wire 14b at the intersection.

In FIG. 24, in order to make it easier to visually see how the wire 14a goes under the wire 14b at the intersection, the wire 14a is painted in black, while the wire 14b is shown in white. As shown in FIG. 24, the wire 14a has a curved shape (normal shape) when viewed from the side, and the wire 14b has a trapezoidal shape when viewed from the side.

As shown in FIG. 25(a), the wire 14a extends upward from the surface of the first LED die 11b2, passes through the first fluorescent resin layer 11c, and curves inside the second fluorescent resin layer 12c (not shown). , facing downward, entering the first fluorescent resin layer 11c on the first LED die 11b1, and reaching the surface of the first LED die 11b1. Note that the first bonding is performed on the first LED die 11b2 side (indicated by a black circle in the figure), and the second bonding is performed on the first LED die 11b1 side. Wire 14a passes under wire 14b at the intersection. The distance between the wire 14a and the wire 14b at the intersection is about 100 μm. The surface of the wire 14a is covered with a protective resin film 62, and a curtain-shaped protective resin film 62 is formed below the wire 14a. Note that the protective resin film 62 is formed only on the outside of the first fluorescent resin layer 11c because high productivity is required as will be described later (see FIG. 14). In FIG. 25(a), the protective resin film 62 (see (b)) of the wire 14b is not shown.

As shown in FIG. 25(b), the wire 14b goes upward from the surface of the second LED die 12b1, bends inside the second fluorescent resin layer 12c (not shown), and goes to the side. Further, the wire 14b bends downward and reaches the surface of the second LED die 12b2. Note that the second LED die 12b1 side is the first bonding (indicated by a black circle in the figure), and the second LED die 12b2 side is the second bonding. Wire 14b straddles wire 14a at the intersection. The entire surface of the wire 14b is covered with a protective resin film 62, and a curtain-shaped protective resin film 62 is formed below the wire 14b. Note that a protective resin film 62 is formed entirely on the wire 14b. In FIG. 25(b), the protective resin film 62 (see (a)) of the wire 14a is not shown.

As described above, in the LED light emitting device 120, short circuits are avoided by making the wire 14a a curved line (normal shape) in side view and the wire 14b having a trapezoidal shape in side view at the intersection. However, even though short circuits are effectively avoided, the wire 14b, which is trapezoidal in side view, is structurally weaker (easier to cause disconnection, etc.) than the wire 14a, which is curved in side view. Confirmed by sex test. Therefore, in the LED light emitting device 120, the wire 14b is reinforced by forming a protective resin film 62 over the entire wire 14b to the extent that there is no practical problem (at the same time, the wires other than the wire 14b including the wire 14a are reinforced). 14 has also been reinforced).

Next, a method for manufacturing the LED light emitting device 120 will be explained with reference to FIGS. 26 and 27. FIG. 26 is a flowchart showing a method for manufacturing the LED light emitting device 120. As shown in FIG. 26, the manufacturing method of the LED light emitting device 120 includes a preparation step 31 of preparing the mounting board 13, the first LED die 11b, the second LED die 12b, etc.; a die bonding process 32 for bonding the first LED die 11b and the second LED die 12b to the wiring electrodes 19e to 19h; a wire bonding process 33 for electrically connecting the first LED dies 11b or the second LED dies 12b to each other with wires 14; A first fluorescent resin coating step 35 in which a first fluorescent resin is applied to form a first fluorescent resin layer 11c, and a dam 15 is formed on the mounting board 13 so as to surround the set of the first LED die 11b and the second LED die 12b. A dam forming step 34, a protective resin film forming step 39 of forming a protective resin film 62 on the wire 14, etc., and a second step of filling the inner region of the dam 15 with a second fluorescent resin layer to form a second fluorescent resin layer 12c. A fluorescent resin coating step 36 is included.

The flowchart shown in FIG. 26 differs from the flowchart shown in FIG. The difference lies in the order of the resin film forming step 39.

As described above, in the LED light emitting device 120, the second fluorescent resin is filled throughout the inner region of the dam 15, and the side surfaces of the first LED die 11b and the second LED die 12b are not shielded from light. The filling process 38 and the transparent resin coating process 37 are no longer necessary.

In addition, when spot printing the first fluorescent resin after forming the dam 15, when trying to bring the nozzle tip closer to the element (first LED die 11b or second LED die 12b) for thread cutting operation of spot printing, The dam 15 may become an obstacle and prolong the manufacturing time. Therefore, in manufacturing the LED light emitting device 120, the order of the first fluorescent resin coating step 35, the dam forming step 34, and the protective resin film forming step 39 was adopted. That is, high productivity is ensured by forming the dam 15 after spot printing of the first fluorescent resin. Note that in the LED light emitting device 120, even if the first fluorescent resin coating step 35, the dam forming step 34, and the protective resin film forming step 39 are performed in this order, the entire wire 14b, which has a trapezoidal shape in side view and whose strength is reduced, is The protective resin film 62 has been formed over the entire area.

FIG. 27 is an explanatory diagram of each step of the flowchart of FIG. 26 drawn in the same manner as FIG. 21. The preparation step 31 shown in (a) and the die bonding step 32 shown in (b) are the same as the preparation step 31 and die bonding step 32 shown in FIG. The wire bonding step 33 shown in FIG. 21C is characterized in that at the intersection of the wires 14, the wire 14a is curved in side view, and the wire 14b is trapezoidal in side view.Other than this, the wire bonding step 33 shown in FIG. Same as 33.

In the first fluorescent resin coating step 35 shown in FIG. 27(d), unlike the first fluorescent resin coating step 35 shown in FIG. 21, the first fluorescent resin is coated without the dam 15 and the protective resin film 62 being formed. Spot printing is performed on the first LED die 11b. That is, since it is necessary to keep the top surface of the first LED die 11b clean immediately before spot-printing the first fluorescent resin 91c, the first fluorescent resin is spot-printed before forming the protective resin film 62. It's good. As a result, high productivity and reliability are ensured.

The dam forming step 34 shown in FIG. 14(e) and the protective resin film forming step 39 shown in FIG. 14(f) are related to forming the dam 15 and the protective resin film 62, respectively. This is the same as the protective resin film forming step 39. In the second fluorescent resin coating step 36 shown in (g), the inner region of the dam 15 is filled with the second fluorescent resin using a dispenser.

As described above, in the LED light emitting device 120, even if the wires 14 intersect, like the LED light emitting device 110, the protective resin film 62 prevents short circuits between the wires 14 with a high probability. Further, in the LED light emitting device 120, the wire 14a and the wire 14b are respectively curved in side view and trapezoidal in side view to more reliably avoid short circuits. In addition, the LED light emitting device 120 improves luminous efficiency and shortens the manufacturing process by filling the inner region of the dam 15 with the second fluorescent resin, and after applying the first fluorescent resin, the dam 15 and By forming the protective resin film 62, both high productivity and reliability are achieved.

(13th embodiment)
As long as the two types of light emitting regions are arranged in a checkered pattern, the LED light emitting device 10 and the like can adopt various planar light emitting regions and circuit configurations. However, when considering the optical system such as a lens as described above, it is preferable that the light emitting part has a circular shape in plan view. Furthermore, if the number of series stages of the first LEDs 11b included in the first LED array 11d and the number of series stages of the second LEDs 12b included in the second LED array 12d are all equal, it is efficient because only four power supply electrodes 19a to 19d are required. That is, in an LED light emitting device including a plurality of fine first light emitting regions that emit light in a first color and a plurality of fine second light emitting regions that emit light in a second color on one mounting board, the light emitting portion It is desirable to be able to efficiently arrange the first light emitting region and the second light emitting region in a checkerboard pattern while forming a circular shape.

Therefore, first, an outline of an LED light emitting device that can efficiently realize the above arrangement will be presented, and then an LED light emitting device 130 will be described as a thirteenth embodiment of the present invention with reference to FIGS. 28 and 29. In addition, since the LED light emitting device 130 has common members such as the first LED die 11b and the second LED die 12 and similar circuit configurations with the LED light emitting device 10, etc., FIGS. 1 to 4 will be referred to for explanation. Common members in FIGS. 28 and 29 are denoted by common reference numerals.

The light-emitting part of the LED light-emitting device that can efficiently arrange the first light-emitting region and the second light-emitting region in a checkerboard pattern and have a substantially circular (polygonal) outer shape is {6, 12, 20, 30, 42, 56 ,...}, then remove n/ ² blocks from each of the four corners from a square area consisting of n 2 blocks arranged in a matrix with n rows and n columns. It is represented as a roughly octagonal area.

Here, the block is a generally square area that includes either the first light emitting area or the second light emitting area. By collecting n ² blocks and arranging them in n rows and n columns, a virtual light emitting section having an approximately square shape can be obtained. An area obtained by removing n/2 blocks from the four corners of this virtual light emitting section becomes a substantially octagonal actual light emitting section in which (n ² -2n) blocks are assembled. Note that in this actual light emitting section, the first light emitting area and the second light emitting area are arranged in a checkerboard pattern. The first light emitting region and the second light emitting region each include one first LED die and one second LED die.

Further, in this LED light emitting device, n first LED dies are connected in series from the set of first LED dies to form (n/2-1) first LED rows. Similarly, from the set of second LED dies, n second LED dies are connected in series to form (n/2-1) second LED rows.

Next, the LED light emitting device 130 will be described based on FIGS. 28 and 29. Note that the LED light emitting device 130 is a case where n=6 (t=1).

FIG. 28 is a schematic diagram of the light emitting section 15a of the LED light emitting device 130. The LED light emitting device 130 has a smaller light emitting portion 15a than the LED light emitting device 10 and the like. That is, the light emitting section 15a of the LED light emitting device 130 includes 12 first light emitting regions 11a and 12 second light emitting regions 12a. Since the mounting board 13 and dam 15 of the LED light emitting device 130 are only made smaller in size, a plan view and a cross-sectional view of the LED light emitting device 130 will be omitted, and the features of the light emitting portion 15a will be explained using a schematic diagram.

As shown in FIG. 28, the light emitting section 15a is a substantially octagonal area consisting of 12 first blocks 51 (first light emitting regions 11a) and 12 second blocks 52 (second light emitting regions 12a). be. In the figure, the first block 51 is shown as a white block, and the second block 52 is shown as a block filled with dots. In the actual first light emitting region 11a and second light emitting region 12a, as shown in FIG. However, in FIG. 28, this region is ignored in the schematization, and the first light emitting region 11a and the second light emitting region 12a are represented by the first block 51 and the second block 52 (the same applies in FIG. 30).

In the LED light emitting device 130, six first blocks 51 are connected diagonally to form a first LED column 11d. Similarly, six second blocks 52 can be connected diagonally to form the second LED row 12d. The LED light emitting device 130 includes two first LED rows 11d and two second LED rows 12d. In addition, in the figure, the first LED row 11d is shown by a dotted line, and the second LED row 12d is shown by a solid line.

The actual light emitting section 15a of the LED light emitting device 130 is a portion obtained by removing the 12 third blocks 53 shown in black from a matrix area of 6 rows and 6 columns, which is a virtual light emitting section. There are 12 third blocks 53 in total, three at each corner in the matrix area that is a virtual light emitting section. The twelve third blocks 53 are two for the first LED row 11d or the second LED row 12d. The actual light emitting section 15a has a substantially octagonal outer extension, and the first block 51 and the second block 52 are arranged in a checkered pattern.

FIG. 29 is a circuit diagram of the LED light emitting device 130 shown in FIG. 28. In the first circuit 11e, two first LED rows 11d each having six first LED dies 11b connected in series are connected in parallel between the power supply electrodes 19a and 19c. Similarly, in the second circuit 12e, two second LED rows 12d each having six second LED dies 12b connected in series are connected in parallel between the power supply electrodes 19b and 19d.

(14th embodiment)
FIG. 30 is a schematic diagram of a light emitting section 15a included in an LED light emitting device 140 shown as a fourteenth embodiment of the present invention. Note that FIG. 30 corresponds to the case where n=12 and (t=2), and is a schematic diagram of the light emitting section 15a of the LED light emitting device 10 or the like. Furthermore, when describing the LED light emitting device 140, FIGS. 1 to 4 will be referred to, and common members in FIG. 30 will be denoted by common reference numerals.

The LED light emitting device 140 will be schematically illustrated in the same manner as in FIG. The actual light emitting section 15a of the LED light emitting device 140 is a portion obtained by removing the 24 third blocks 53 shown in black from the matrix area, which is a virtual light emitting section arranged in 12 rows and 12 columns. There are 24 third blocks 53 in total, six at each corner in the matrix area that is a virtual light emitting section. The 24 third blocks 53 are two for the first LED row 11d or the second LED row 12d. In the figure, as an example, one first LED row 11d is shown as a dotted line, and one second LED row 12d is shown as a solid line.

Finally, based on the LED light emitting devices 130, 140 (FIGS. 28 to 30), the first light emitting region 11a and the second light emitting region 12a are efficiently formed while making the light emitting portion 15a substantially circular (substantially octagonal). The conditions that can be arranged in a checkered pattern will be explained in detail.

In the LED light emitting device to which the LED light emitting devices 130 and 140 belong, the actual light emitting section 15a is separated from a region (virtual light emitting section) consisting of n ² blocks arranged in a matrix of n rows and n columns at four corners. In each area, n/2 third blocks are removed. The four corner areas are approximately isosceles right triangles, and the n/2 areas are 3, 6, 10, 15, 21, . . . . That is, n becomes 6, 12, 20, 30, 42,...
n=t ² +3t+2 (t=1, 2, 3,...)
It is expressed as The actual light emitting section 15a includes (n ² -2n) blocks.

In the octagonal area (actual light emitting part 15a) obtained in this way, the first light emitting area 11a and the second light emitting area 12a are arranged in a checkerboard pattern, and the n first light emitting areas 11a are formed. It includes (n/2-1) first LED rows 11d and (n/2-1) second LED rows 12d each including n second light emitting regions 12a. Note that the first LED column 11d and the second LED column 12d are arranged diagonally. In this way, the wires 14 connecting the first LED dies 11b and the second LED dies 12b included in the first light emitting region 11a and the second light emitting region 12a can be shortened, and efficient connection and arrangement can be achieved.

In a region (virtual light emitting section) in which the first block 51 and the second block 52 including the first light emitting region 11a and the second light emitting region 12a are arranged in a checkered pattern in n rows and n columns, one light emitting region is provided in the first light emitting region 11a. A first LED row 11d in which n first LED dies 11b included in the first LED die 11b are connected in series, and a second LED row 12d in which n second LED dies 12b included in the second light emitting region 12a are connected in series, each having n/2 pieces. Can be configured. The LED light emitting devices 130 and 140 each have a substantially octagonal region (actual light emitting section 15a) obtained by removing n/2 third blocks 53 from each of the four corners of this square matrix region. In the area, (n/2-1) first LED rows 11d and (n/2-1) second LED rows 12d are formed. That is, this approximately octagonal area is efficiently fitted inside the annular dam 15, and even if the first light emitting areas 11a and the second light emitting areas 12a are arranged in a checkerboard pattern, the same number of first LED rows 11d can be arranged. And the second LED row 12d can be configured without waste.

Therefore, the LED light emitting devices 130 and 140 have a plurality of fine first light emitting regions 11a that emit light in a first color and a plurality of fine second light emitting regions 12a that emit light in a second color on one mounting board 13. When equipped, the first light emitting region 11a and the second light emitting region 12a can be efficiently arranged in a checkerboard pattern while making the light emitting part 15a circular.

10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140...LED light emitting device,
11a...first light emitting region,
11b...first LED die,
11c...first fluorescent resin layer,
11d...first LED row,
11e...first circuit,
12a... second light emitting region,
12b...second LED die,
12c... second fluorescent resin layer,
12d...Second LED row,
12e...second circuit,
13... Mounting board,
14, 14a, 14b...wire,
15...dam,
15a...light emitting part,
16...Transparent resin layer,
16a...transparent resin,
16b...Filler,
17...Die bond material,
18a, 18b...Zener diode,
19a to 19d...power electrode,
19e to 19h...wiring electrode,
21...Anode,
22...Cathode,
23...P layer,
24...N layer,
27...Exposed part,
28...Silver layer,
29...protective layer,
31...preparation process,
32...Die bonding process,
33...Wire bonding process,
34...Dam formation process,
35...first fluorescent resin coating step,
36...Second fluorescent resin coating step,
37...Transparent resin coating step,
38...white resin filling step,
39...Protective resin film forming step,
51...first block,
52...Second block,
53...Third block,
61...white resin,
62...Protective resin film.

Claims (13)

a plurality of first light emitting regions that emit light in a first color and a plurality of second light emitting regions that emit light in a second color; the first light emitting regions and the second light emitting regions each include a first LED die and a second LED die; including, arranged in a checkered pattern on one mounting board,
The bottom surfaces of the first LED die and the second LED die are each bonded to the surface of the mounting board by a die bonding material, and the die bonding material contains reflective particles and extends along the side surfaces of the first LED die and the second LED die, respectively. covering the side surface in a rising manner;
The upper surfaces of the first LED die and the second LED die are respectively covered with a first fluorescent resin layer and a second fluorescent resin layer, and the first fluorescent resin layer individually covers the upper part of the first LED die in a dome shape. An LED light emitting device characterized in that it also covers a part of the slope of the die bonding material . a plurality of first light emitting regions that emit light in a first color and a plurality of second light emitting regions that emit light in a second color; the first light emitting regions and the second light emitting regions each include a first LED die and a second LED die; including, arranged in a checkered pattern on one mounting board,
The bottom surfaces of the first LED die and the second LED die are each bonded to the surface of the mounting board by a die bonding material, and the die bonding material contains reflective particles and extends along the side surfaces of the first LED die and the second LED die, respectively. covering the side surface in a rising manner;
The upper surfaces of the first LED die and the second LED die are respectively covered with a first fluorescent resin layer and a second fluorescent resin layer, and the first fluorescent resin layer individually covers the upper part of the first LED die in a dome shape. ,
The LED light emitting device, wherein the mounting board has a silver layer on its surface, and the silver layer is exposed from the die bonding material in a gap between the first LED die and the second LED die. 3. The LED light emitting device according to claim 1 , wherein the first fluorescent resin layer forms a fillet at a contact portion with the die bonding material. A first wire that connects the first LEDs and a second wire that connects the second LEDs, and at least one of the first wire and the second wire is reinforced with a coating. The LED light emitting device according to claim 1 or 2 . 5. The LED light emitting device according to claim 4 , wherein at least one of the first wire and the second wire has a protective resin film on a lower portion thereof. When the first wire and the second wire intersect, one of the first wire and the second wire has a curved line in side view, and the other has a trapezoidal shape in side view. The LED light emitting device according to claim 4 or 5 . The mounting board has an area consisting of n ² blocks arranged in a matrix of n rows and n columns, where n is a natural number n expressed by n=t ² +3t+2 (t=1, 2, 3, ...). Each of the four corners has a light emitting region from which n/2 of the blocks have been removed,
The block includes either the first light emitting region or the second light emitting region,
The light emitting region includes (n/2-1) first LED columns in which n first LED dies are connected in series, and the second LED die includes (n/2-1) second LED columns in which n pieces are connected in series. 3. The LED light emitting device according to claim 1 , further comprising: an LED light emitting device. 8. The LED light emitting device according to claim 7 , wherein the first LED dies and the second LED dies included in the first LED column and the second LED column are respectively connected to each other in a diagonal manner by wires. Device. comprising a plurality of first light emitting regions that emit light in a first color and a plurality of second light emitting regions that emit light in a second color;
The first light emitting region and the second light emitting region each include a first LED die and a second LED die, and are arranged in a checkered pattern on one mounting board,
The first LED die and the second LED die have upper surfaces covered with a first fluorescent resin layer and a second fluorescent resin layer, respectively,
In the method for manufacturing an LED light emitting device, the first fluorescent resin layer individually covers the upper part of the first LED die in a dome shape,
a preparation step of preparing the mounting board and the plurality of first LED dies and the second LED dies, respectively;
a die bonding step of bonding the first LED die and the second LED die to the mounting board, respectively;
a wire bonding step of connecting the first LED dies and the second LED dies with a wire;
a dam forming step of forming a dam around a set of the first LED die and the second LED die;
A protective resin film forming step of pouring a modified silicone solution into the area surrounded by the dam, volatilizing the solvent of the solution, and forming a protective resin film on the wire;
a first fluorescent resin coating step of individually applying a first fluorescent resin on the top of the first LED die to form a first fluorescent resin layer;
A method for manufacturing an LED light emitting device, comprising: a second fluorescent resin coating step of coating an upper part of the second LED die with a second fluorescent resin to form a second fluorescent resin layer. 10. The method of manufacturing an LED light emitting device according to claim 9 , further comprising a white resin filling step of filling a gap between the first LED die and the second LED die with white resin. The LED light emitting device according to claim 9 or 10 , further comprising a transparent resin coating step of coating the upper surfaces of the first fluorescent resin layer and the second fluorescent resin layer and the wire with a transparent resin layer. manufacturing method. It is characterized by comprising the first fluorescent resin coating step after the die bonding step, the dam forming step after the first fluorescent resin coating step, and the protective resin film forming step after the dam forming step. The method for manufacturing an LED light emitting device according to any one of claims 9 to 11 . In the preparation step, a large-sized board from which a large number of the mounting boards can be obtained when singulated is prepared in place of the mounting board,
Any one of claims 9 to 12 , further comprising a step of cutting the large-sized substrate to obtain the LED light emitting device into pieces after the transparent resin coating step or the second fluorescent resin coating step. 1. A method for manufacturing an LED light emitting device according to item 1.