JP2020113537A - Led light emission device, and method of manufacturing the same - Google Patents

Abstract

To provide an LED light emission device which is maintained in the performance and quality thereof and is easy to be manufactured, even when LED dies of the same type constituting a first light emission area and a second light emission area are placed closer in arraying first light emission areas and second light emission areas in a checker pattern.SOLUTION: A first light emission area 11a and a second light emission area 12a include a first LED die 11b and a second LED die 12b, respectively. A potting of a first fluorescence resin 11c with dome shape is carried out by spot printing at least on an upper surface of the first LED die 11b and its neighborhood.SELECTED DRAWING: Figure 5

Description

The present invention relates to an LED light emitting device in which a first light emitting region that emits a first color and a second light emitting region that emits a second color are arranged in a checkered pattern on a single mounting substrate, and a manufacturing method thereof.

A plurality of minute first light emitting regions that emit a first color and a plurality of minute second light emitting regions that emit a second color are provided on one mounting substrate, and color unevenness of illumination light is suppressed. Therefore, an LED light emitting device in which these two types of light emitting regions are arranged in a checkered pattern is known.

For example, FIG. 1 of Patent Document 1 shows an LED light emitting device in which two types of fine light emitting regions are arranged in a checkered pattern to improve color unevenness.

Therefore, the LED light emitting device (LED module) will be described with reference to FIG. 1 of Patent Document 1 in FIG. 31 of the present application. FIG. 31 is a plan view of an LED light emitting device 200 shown as a conventional example. The terms used in Patent Document 1 are shown in parentheses. When quoting, changed sign.

As shown in FIG. 31, the LED light emitting device 200 includes a mounting substrate 207 (substrate), a plurality of LED dies 205 and 206 (LED chips), a dam 210 (frame portion), and a connector 213. On the insulating layer 208 formed on one surface 207a of the mounting substrate 207, a plurality of first LED rows 202 (first LED group) in which LED dies 205 emitting blue light are connected in series, and an LED die 206 emitting red light 206. Is mounted in series with a plurality of second LED rows 203 (second LED group). Further, on the insulating layer 208, the LED dies 205 and 206 are surrounded by a dam 210 and covered with a fluorescent resin 209 (translucent resin) containing a yellow fluorescent substance. That is, the LED light emitting device 200 includes a fine first light emitting region that emits white light by the LED die 205 and the fluorescent resin 209 containing a yellow phosphor as a first color, and a fine light emitting region that emits red light by the LED die 206 as a second color. A large number of second light emitting regions are provided and arranged in a checkered pattern.

Here, the LED light emitting device 200 includes a connection pattern 204 and wiring patterns 211 and 212 on the insulating layer 208. The anode of the first LED row 202 and the cathode of the second LED row 203 are connected to the connection pattern 204 by a wire 214 (bonding wire). The anode of the second LED row 203 is connected to the wiring pattern 211, and the cathode of the first LED row 202 is connected to the wiring pattern 212. The wiring patterns 211 and 212 are connected to the connector 213. That is, when power is supplied from the connector 213, current flows in the order of the wiring pattern 211, the second LED row 203, the connection pattern 204, the first LED row 202, and the wiring pattern 212, and the LED dies 205 and 206 are turned on.

At this time, in the LED light emitting device 200, the wire 214 connecting the LED dies 205 to each other and the wire 214 connecting the LED dies 206 to each other have a zigzag shape. In this manner, the LED light emitting device 200 arranges the two types of fine light emitting areas in a checkered pattern while preventing the wires 214 from crossing each other, and the white light obtained by the LED die 205 and the yellow phosphor. , The red light obtained from the LED die 206 is mixed uniformly and evenly.

JP-A-2014-203569 (FIG. 1)

In the LED light emitting device 200 shown in FIG. 31, the LED die 205 and the LED die 206 are mounted on the mounting substrate 207. That is, the LED light emitting device 200 must prepare two types of LED dies for manufacturing, the LED die 205 that emits blue light and the LED die 206 that emits red light.

Since it is a manufacturing burden to prepare two types of LED dies 205 and 206, it is desirable to configure the first light emitting region and the second light emitting region with only one type of LED die. To this end, a first fluorescent resin and a second fluorescent resin having different luminescent colors are prepared, and one type of LED die arranged in a matrix on the mounting substrate is replaced with the LED dies included in the first luminescent area as the first fluorescent resin. The LED die included in the second light emitting region may be sealed with a resin and then sealed with the second fluorescent resin.

However, in order to miniaturize the LED light emitting device and improve the color mixing property, the closer the LED dies are to each other, the more the two adjacent LED dies are sealed with the first fluorescent resin and the second fluorescent resin. It becomes difficult to divide.

Therefore, the present invention has been made in view of the above problems, and a plurality of fine first light emitting regions that emit light of a first color and a plurality of fine light emitting regions that emit a second color are provided on a single mounting substrate. In an LED light emitting device in which fine second light emitting areas are arranged in a checkerboard pattern, even if LED dies of the same type forming the first light emitting area and the second light emitting area are close to each other, performance and quality are comparable. An object of the present invention is to provide an LED light emitting device that is easy to manufacture.

In order to solve the above-mentioned problems, an LED light emitting device of the present invention includes a plurality of first light emitting areas that emit a first color and a plurality of second light emitting areas that emit a second color. The second light emitting region includes a first LED die and a second LED die respectively, and is arranged in a checkerboard pattern on a single mounting substrate. The first LED die and the second LED die have upper surfaces that are the first fluorescent resin layer and the first fluorescent resin layer, respectively. The first fluorescent resin layer is covered with two fluorescent resin layers, and the first fluorescent resin layer individually covers the upper portion of the first LED die in a dome shape.

The light emitting area of the LED light emitting device of the present invention is composed of an aggregate of a first light emitting area and a second light emitting area which are fine light emitting areas. In this light emitting region, the first light emitting region and the second light emitting region are adjacent to each other in the up-down direction and the left-right direction in a plan view, and form a checkered pattern arrangement. The first light emitting area includes one first LED die and emits a first color. Similarly, the second light emitting region includes a second LED die and emits a second color. The first fluorescent resin is potted on the upper surface of the first LED die and its vicinity by spot printing or the like. The first fluorescent resin layer has a curved upper surface (dome shape) and covers the upper portion of the first LED die.

The first LED die and the second LED die may have the same characteristics.

The second fluorescent resin layer may individually cover the upper portion of the second LED die in a dome shape.

The heights of the first fluorescent resin layer and the second fluorescent resin layer may be different from each other.

A white resin may be filled between the first LED die and the second LED die, and an upper surface of the white resin may be higher than an upper surface of the first LED die or the second LED die.

The second fluorescent resin layer may entirely cover upper surfaces of the plurality of second LED dies.

A dam surrounding the first LED die and the second LED die may be provided.

The height of the first LED die may be different from the height of the second LED die.

The bottom surfaces of the first LED die and the second LED die are bonded to the surface of the mounting substrate by a die bonding material, and the die bonding material contains reflective fine particles and crawls the side surfaces of the first LED die and the second LED die, respectively. You may coat|cover the said side surface so that it may go up.

The die bond material may cover the surface of the mounting substrate with a gap between the first LED die and the second LED die.

The mounting substrate may include a silver layer on a surface thereof, and the silver layer may be exposed from the die bond material in a gap between the first LED die and the second LED die.

The height of the upper surface of the die-bonding material may match the height of the upper surfaces of the first LED die and the second LED die.

Each of the first fluorescent resin layer and the second fluorescent resin layer may be covered with a transparent resin layer, and the transparent resin layer may contain a filler.

The first fluorescent resin layer may cover a part of the slope of the die bond material.

The first fluorescent resin layer may form a fillet at a contact portion with the die bond material.

A first wire connecting the first LEDs to each other and a second wire connecting the second LEDs to each other may be provided, and at least one of the first wire and the second wire may be reinforced by a coating. ..

At least one of the first wire and the second wire may be provided with a protective resin film on the lower portion.

When the first wire and the second wire intersect, one of the first wire and the second wire may be a side view curve and the other may be a side view trapezoid.

The mounting board is composed of n ² blocks arranged in a matrix of n rows and n columns for a natural number n represented by n=t ² +3t+2 (t=1, 2, 3,...) Each of the four corners is provided with a light emitting region from which n/2 of the blocks are removed, the block includes either the first light emitting region or the second light emitting region, and the light emitting region is the first LED die. May include (n/2-1) first LED strings connected in series by n, and the second LED die may include (n/2-1) second LED strings connected in series by n.

The first LED dies included in the first LED array and the second LED dies included in the second LED array may be connected to each other in a diagonal manner by wires.

In order to solve the above problems, a method for manufacturing an LED light emitting device according to the present invention includes a plurality of first light emitting regions that emit a first color and a plurality of second light emitting regions that emit a second color. The area and the second light emitting area include a first LED die and a second LED die, respectively, and are arranged in a checkerboard pattern on a single mounting substrate, and the first LED die and the second LED die each have an upper surface having a first fluorescent resin layer. And a second fluorescent resin layer, wherein the first fluorescent resin layer individually covers the upper portion of the first LED die in a dome shape, wherein the mounting substrate and the plurality of first LEDs are provided. A preparation step of preparing a die and the second LED die, a die bonding step of adhering the first LED die and the second LED die to the mounting substrate, and a wire connecting the first LED die and the second LED die to each other. A wire bonding step, a dam forming step of forming a dam around the set of the first LED die and the second LED die, and a solution of modified silicon is poured into a portion surrounded by the dam to volatilize a solvent of the solution. A protective resin film forming step of forming a protective resin film on the wire, and a first fluorescent resin coating step of individually applying a first fluorescent resin on the first LED die to form a first fluorescent resin layer, A second fluorescent resin coating step of coating the upper portion of the second LED die with a second fluorescent resin to form a second fluorescent resin layer.

In the method for manufacturing the LED light emitting device of the present invention, first, the mounting substrate, the first LED die and the second LED die are prepared. Next, after the first LED die and the second LED die are die-bonded to the mounting board, the first LED die and the second LED die are connected by wires. Next, when a dam is formed and a solution of modified silicon is poured into the space surrounded by the dam and the solvent is volatilized, a protective resin film is formed on the surface of the wire and a curtain-shaped protective resin film hanging from the wire. Is formed.

The method may further include a white resin filling step of filling a white resin in a gap between the first LED die and the second LED die.

The method may further include a transparent resin coating step of coating the upper surfaces of the first fluorescent resin layer and the second fluorescent resin layer and the wire with a transparent resin layer.

The method may include the first fluorescent resin coating step after the die bonding step, the dam forming step after the first fluorescent resin coating step, and the protective resin film forming step after the dam forming step.

In the preparation step, a large-sized board that can obtain a large number of the mounting boards when separated into pieces is prepared instead of the mounting board, and the large-sized board is cut after the transparent resin coating step or the second fluorescent resin coating step. An individualizing step for obtaining the LED light emitting device may be provided.

As described above, in the LED light emitting device of the present invention, the dome-shaped first fluorescent resin layer is formed only on the tip portion of the first LED die by spot printing or the like in the first light emitting region. In this way, the second LED die, which should not be covered with the first fluorescent resin layer, can be brought close to the first LED die. Further, most of the light emitted from the first LED die and the second LED die pass through the first fluorescent resin layer and the second fluorescent resin layer, respectively, so that the luminous efficiency and wavelength conversion efficiency are not deteriorated.

Therefore, the LED light-emitting device of the present invention has, on a single mounting substrate, a plurality of fine first light-emitting regions that emit a first color and a plurality of fine second light-emitting regions that emit a second color. When they are arranged in a checkerboard pattern, even if LED dies of the same type forming the first light emitting region and the second light emitting region are brought close to each other, there is no difference in performance and quality, and spot printing or the like can be applied, which facilitates manufacturing.

Further, in the method for manufacturing the LED light emitting device of the present invention, the wire is reinforced with the silicone resin when the above-described LED light emitting device is manufactured.

That is, the method for manufacturing an LED light-emitting device according to the present invention includes a plurality of fine first light-emitting regions that emit a first color and a plurality of fine second light-emitting regions that emit a second color on a single mounting substrate. When the areas are arranged in a checkerboard pattern, even if LED dies of the same type forming the first light emitting area and the second light emitting area are brought close to each other, there is no difference in performance and quality, and the crossed wires are reinforced and short-circuited. Easy to manufacture as it becomes difficult to manufacture.

It is a top view of the LED light-emitting device shown as 1st Embodiment of this invention. 2 is a plan view of an LED die included in the LED light emitting device shown in FIG. 1. FIG. It is a top view of the LED light-emitting device shown in FIG. It is a circuit diagram of the LED light-emitting device shown in FIG. FIG. 2 is a partial cross-sectional view of the LED light emitting device shown in FIG. 1. 3 is a flowchart of a method for manufacturing the LED light emitting device shown in FIG. 1. It is explanatory drawing of each process shown by FIG. It is a partial cross section figure of the LED light-emitting device shown as 2nd Embodiment of this invention. It is a partial cross section figure of the LED light-emitting device shown as 3rd Embodiment of this invention. It is a fragmentary sectional view of the LED light-emitting device shown as a 4th embodiment of the present invention. It is a fragmentary sectional view of the LED light-emitting device shown as a 5th embodiment of the present invention. It is a fragmentary sectional view of the LED light-emitting device shown as a 6th embodiment of the present invention. It is a partial cross section figure of the LED light-emitting device shown as 7th Embodiment of this invention. 14 is a flowchart of a method for manufacturing the LED light emitting device shown in FIG. 13. It is explanatory drawing of each process shown in FIG. It is a partial cross section figure of the LED light-emitting device shown as 8th Embodiment of this invention. It is a partial cross section figure of the LED light-emitting device shown as 9th Embodiment of this invention. It is a partial cross section figure of the LED light-emitting device shown as 10th Embodiment of this invention. It is a partial cross section figure of the LED light-emitting device shown as 11th Embodiment of this invention. It is a flowchart of the manufacturing method of the LED light-emitting device shown in FIG. It is explanatory drawing of each process shown in the flowchart of FIG. It is a partial cross section figure of the LED light-emitting device shown as 12th Embodiment of this invention. FIG. 23 is a partial plan view of the LED light emitting device shown in FIG. 22. FIG. 23 is a partial perspective view of the LED light emitting device shown in FIG. 22. FIG. 23 is a partial cross-sectional view of the LED light emitting device shown in FIG. 22. 23 is a flowchart of a method for manufacturing the LED light emitting device shown in FIG. 22. It is explanatory drawing of each process shown in the flowchart of FIG. It is a schematic diagram of the LED light-emitting device shown as 13th Embodiment of this invention. FIG. 29 is a circuit diagram of the LED light emitting device shown in FIG. 28. It is a schematic diagram of the LED light-emitting device shown as 14th Embodiment of this invention. It is a top view of the LED light-emitting device shown as a prior art.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. In the description of the drawings, the same or corresponding elements will be denoted by the same reference symbols, without redundant description. For the sake of explanation, the scale of members is appropriately changed. () shows the matters specifying the invention shown in the claims.

(First embodiment)
FIG. 1 is a plan view of an LED light emitting device 10 shown as a first embodiment of the present invention. As shown in FIG. 1, the LED light emitting device 10 is a so-called COB (chip on board) module and includes a mounting substrate 13. The mounting substrate 13 has power electrodes 19a, 19b, 19c, and 19d formed at two corners. Further, an annular dam 15 is formed in a region inside the power supply electrodes 19a to 19d. A circular area (hereinafter referred to as “light emitting portion 15a”) inside the dam 15 is filled with the transparent resin layer 16, and the first light emitting areas 11a and the second light emitting areas 12a are arranged in a checkered pattern.

Here, in FIG. 1, the first light emitting region 11a and the second light emitting region 12a are represented by squares for convenience. That is, the first light emitting area 11a and the second light emitting area 12a shown in FIG. 1 are the first LED die 11b (see FIG. 5) included in the first light emitting area 11a and the second LED die included in the second light emitting area 12a, respectively. 12b (see FIG. 5). As shown in FIG. 5, the first light emitting region 11a includes a first LED die 11b and a first fluorescent resin layer 11c, and the second light emitting region 12a includes a second LED die 12b and a second fluorescent resin layer 12c. When the LED light emitting device 10 is not lit, the first light emitting region 11a is recognized as the first fluorescent resin layer 11c, and the second light emitting region 12a is recognized as the second fluorescent resin layer 12c. On the other hand, when the LED light-emitting device 10 is turned on, the first light-emitting region 11a and the second light-emitting region 12a are visually recognized as a rounded shape with square corners and a blurred peripheral portion. The wires 14 (see FIG. 3) connecting the first LED dies 11b included in the first light emitting area 11a and the second LED dies 12b included in the second light emitting area 12a (see FIG. 3) are visible but not shown.

FIG. 2 is a plan view of the first LED die 11b included in the first light emitting region 11a of the LED light emitting device 10. The second LED die 12b included in the second light emitting region 12a is not shown because it has the same characteristics and the same structure as the first LED die 11b. The first LED die 11b is a blue light emitting diode having a plane size of 0.6 mm×0.6 mm, and includes an anode 21 in the upper left corner and a cathode 22 in the lower right center. The anode 21 is formed on the upper surface of the P layer 23, and the cathode 22 is formed on the upper surface of the N layer 24 exposed from the P layer 23.

FIG. 3 is drawn in a state in which the transparent resin layer 16, the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, and the dam 15 are removed so that the connection state of the first LED die 11b and the second LED die 12b can be visually confirmed. 2 is a plan view of the LED light emitting device 10 shown in FIG. In FIG. 3, the first LED die 11b is filled with dots so that the first LED die 11b and the second LED die 12b, which are blue light emitting diodes having the same size and the same characteristics, can be distinguished from each other. As shown in FIG. 3, the first LED dies 11b and the second LED dies 12b are arranged in a matrix so as to form a checkered pattern as a whole.

Further, as shown in FIG. 3, power supply electrodes 19a to 19d and wiring electrodes 19e to 19h extending in an arc shape from the power supply electrodes 19a to 19d are formed on the mounting substrate 13 included in the LED light emitting device 10. ing. Zener diodes 18a and 18b for protection are arranged between the wiring electrode 19e and the power electrode 19c and between the power electrode 19b and the wiring electrode 19h, respectively. The Zener diode 18a is connected to the wiring electrode 19e and the power supply electrode 19c by the wire 14. Similarly, the Zener diode 18b is connected to the wiring electrode 19h and the power supply electrode 19b by the wire 14. Part of the power supply electrodes 19a to 19d, the wiring electrodes 19e to 19h, the Zener diodes 18a and 18b, and part of the wire 14 are covered with the dam 15 (see FIG. 1).

In the light emitting unit 15a, 60 first LED dies 11b and 60 second LED dies 12b are mounted. The 60 first LED dies 11b are connected in series 12 by 12 to form five first LED columns 11d (see FIG. 4). Similarly, the 60 second LED dies 12b are connected in series 12 by 12 to form five second LED columns 12d (see FIG. 4). The first LED dies 11b belonging to the first LED row 11d are arranged so as to be inclined while bending from the upper left to the lower right in the figure. Similarly, the second LED dies 12b belonging to the second LED row 12d are also arranged so as to be inclined while bending from the upper left to the lower right in the figure.

The first LED dies 11b are connected to each other and the second LED dies 12b are connected to each other by wires 14. In FIG. 3, the wires 14 belonging to the first LED row 11d are shown by dotted lines and the wires 14 belonging to the second LED row 12d are shown by solid lines in order to make the connection by the wires 14 easy to understand. As shown in FIG. 3, the wires 14 belonging to the first LED row 11d and the wires 14 belonging to the second LED row 12d are visually recognized as partially intersecting when viewed in a plan view. This limits the number of series stages of the first LED die 11b and the second LED die 12b included in the first LED row 11d and the second LED row 12d to 12 and allows the first LED row 11d and the second LED row 12d to have a relatively low voltage (for example, This is because the light can be turned on at 2.7 (V)×12 (steps)=32.4 (V)), which is the result of considering the ease of handling the LED light emitting device 10.

In the first LED row 11d, the anode 21 (see FIG. 2) of the first LED die 11b arranged at the upper end of the figure is connected to the wiring electrode 19e and is arranged at the lower end of the figure. The cathode 22 (see FIG. 2) of the first LED die 11b is connected to the wiring electrode 19g. Similarly, in the second LED row 12d, the anode 21 of the second LED die 12b arranged at the upper end of the figure is connected to the wiring electrode 19f, and the second LED die 12b arranged at the lower end of the figure is connected. The cathode 22 of is connected to the wiring electrode 19h.

FIG. 4 is a circuit diagram of the LED light emitting device 10. The LED light emitting device 10 includes a first circuit 11e that emits light at a low color temperature (for example, 3000°K) and a second circuit 12e that emits light at a high color temperature (for example, 5000°K).

As shown in FIG. 4, in the first circuit 11e, five first LED columns 11d in which twelve first LED dies 11b are connected in series are connected in parallel. The anode 21 (see FIG. 2) of the first-stage first LED die 11b included in the first LED row 11d is connected to the power supply electrode 19a via the wiring electrode 19e. The cathode 22 (see FIG. 2) of the final-stage first LED die 11b included in the first LED row 11d is connected to the power supply electrode 19c via the wiring electrode 19g. A protective Zener diode 18a is connected to the wiring electrodes 19e and 19g.

Similarly, in the second circuit 12e, five second LED columns 12d in which twelve second LED dies 12b are connected in series are connected in parallel. The anode 21 (see FIG. 2) of the first-stage second LED die 12b included in the second LED column 12d is connected to the power supply electrode 19b via the wiring electrode 19f. The cathode 22 (see FIG. 2) of the final-stage second LED die 12b included in the second LED column 12d is connected to the power supply electrode 19d via the wiring electrode 19h. A Zener diode 18b for protection is connected to the wiring electrodes 19f and 19h.

FIG. 5 is a partial cross-sectional view of the LED light emitting device 10 in which a main part is drawn along the line AA′ in FIG. 1. In FIG. 5, two first light emitting regions 11a and two second light emitting regions 12a are shown. Note that, also in FIG. 5, the wire 14 (see FIG. 3) is not shown as in FIG. 1.

As shown in FIG. 5, the bottom surfaces of the first LED die 11b and the second LED die 12b are bonded to the top surface of the mounting substrate 13 with a die bonding material 17. Furthermore, the die bonding material 17 covers the side surfaces of the first LED die 11b and the second LED die 12b so as to crawl up, and covers the surface of the mounting substrate 13 in the gap between the first LED die 11b and the second LED die 12b. The die bond material 17 contains reflective fine particles, and can secure a sufficient thickness (for example, 30 to 50 μm) for light shielding at a position where the height is about half on the side surfaces of the first LED die 11b and the second LED die 11b. To do so.

The first fluorescent resin layer 11c covers the upper surface and the upper surface of the side surface of the first LED die 11b, and has a dome shape (bowl shape) having a curved upper surface. Similarly, the second fluorescent resin layer 12c also covers the upper surface and the upper portion of the side surface of the second LED die 12b, and has a dome shape (bowl shape) having a curved upper portion. The 1st fluorescent resin layer 11c and the die-bonding material 17 which cover the side surface of the 1st LED die 11b have suppressed the light emission of the 1st LED die 11b radiated|emitted from the side surface of the 1st LED die 11b. Similarly, the second fluorescent resin layer 12c that covers the side surface of the second LED die 12b and the die bonding material 17 suppress the light emission of the second LED die 12b emitted from the side surface of the second LED die 12b. The first fluorescent resin layer 11c is thicker than the second fluorescent resin layer 12c in the vertical direction in the figure.

The transparent resin layer 16 covers the die bond material 17, the first fluorescent resin layer 11c, and the second fluorescent resin layer 12c from above and seals them. Of the wires 14 (see FIG. 3) not shown, the wires 14 connected to the upper surface of the first LED die 11b exit the first fluorescent resin layer 11c, pass through the transparent resin layer 16, and are not shown. And enters the first fluorescent resin layer 11c, and is connected to the upper surface of another first LED die 11b (not shown). The same applies to the wires 14 that connect the second LED dies 12b to each other.

The mounting substrate 13 is a white ceramic whose base material is made of alumina. On the upper surface of the mounting substrate 13, wiring electrodes 19e to 19h and power supply electrodes 19a to 19d made of a metal film in which Ni and Au are laminated on Cu are formed (see FIG. 3). The base material of the mounting substrate 13 may be aluminum nitride whose surface is subjected to a reflection treatment, or aluminum whose surface is provided with an insulating layer. The die bond material 17 is an adhesive material in which reflective fine particles made of titanium oxide are kneaded in a resin. The dam 15 is made of white silicon resin in which fine particles of titanium oxide are kneaded, and has a thickness of 0.7 to 1.0 mm and a height of 0.5 to 0.8 mm.

The first fluorescent resin layer 11c has a thickness of about 0.5 mm and includes a phosphor that emits green light (for example, Lu ₃ Al ₅ O ₁₂ :Ce) and a phosphor that emits red light (for example, CaAlSiN ₃ :Eu). Contains. The emission color of the first light emitting region 11a has a color temperature of about 3000° K due to the blue light emitted from the first LED die 11b and the emission of the first fluorescent resin layer 11c. The second fluorescent resin layer 12c has a thickness of about 0.3 mm, and includes a phosphor that emits green light (for example, Lu ₃ Al ₅ O ₁₂ :Ce) and a phosphor that emits red light (for example, CaAlSiN ₃ :Eu). Although it is contained, the concentration and ratio of the phosphor are different from those of the first fluorescent resin layer 11c. The emission color of the second emission region 12a becomes a color temperature of about 5000° K due to the blue light emitted from the second LED die 12b and the emission of the second fluorescent resin layer 12c.

Next, a method of manufacturing the LED light emitting device 10 will be described with reference to FIGS. FIG. 6 is a flowchart showing manufacturing steps included in the method for manufacturing the LED light emitting device 10, and FIG. 7 is an explanatory diagram of the manufacturing steps shown in the flowchart of FIG. It should be noted that the members shown in FIGS. 1 to 4 are cited without any special instruction.

As shown in FIG. 6, the manufacturing method of the LED light emitting device 10 includes a preparatory step 31 of preparing the mounting substrate 13, the first LED die 11b and the second LED die 12b, the first LED die 11b and the second LED die and the like on the mounting substrate 13. A die-bonding step 32 of adhering the two with a die-bonding material 17, a wire-bonding step 33 of electrically connecting the first LED dies 11b to each other and the second LED dies 12b to each other with a wire 14, and a set including the first LED die 11b and the second LED die 12b. A dam forming step 34 for forming the dam 15 on the mounting substrate 13 so as to surround it, a first fluorescent resin coating step 35 for coating the upper portion of the first LED die 11b with the first fluorescent resin layer 11c, and an upper portion of the second LED die 12b. A second fluorescent resin coating step 36 for coating with the second fluorescent resin layer 12c and a transparent resin coating step 37 for coating the region inside the dam 15 with the transparent resin layer 16 are included.

In FIG. 7, in order to explain each step shown in FIG. 6, a cross section of the LED light emitting device 10 being manufactured is schematically drawn. The LED light-emitting device 10 may be manufactured by a method in which the LED die 11 is mounted on the individually separated mounting substrate 13 and various electronic components and resins are arranged on the upper surface of the mounting substrate 13, or individualized. Then, various electronic components and resins may be arranged on a large-sized board from which a large number of mounting boards 13 are obtained, and finally the large-sized board may be separated into individual pieces to obtain the LED light-emitting device 10, which is a so-called collective board construction method. The latter construction method is suitable for mass production, but in FIG. 7, for simplicity, the former construction method will be used to describe the method for manufacturing the LED light-emitting device 10. In addition, in FIGS. 7A to 7F, a set of 60 first LED dies 11b and 60 second LED dies 12b is representatively described with only one each.

FIG. 7A is an explanatory diagram of the preparation process 31. In the preparation step 31, the mounting substrate 13, the first LED die 11b, the second LED die 12b, and the Zener diodes 18a and 18b are prepared. The mounting substrate 13 is a white ceramic whose base material is made of alumina. On the upper surface of the mounting substrate 13, wiring electrodes 19e to 19h and power supply electrodes 19a to 19d made of a metal film in which Ni and Au are laminated on Cu are formed (see FIG. 3). The base material of the mounting board 13 may be aluminum nitride whose surface is subjected to a reflection treatment, or aluminum whose surface is provided with an insulating layer. The first LED die 11b and the second LED die 12b have a semiconductor layer on the upper surface, and the Zener diodes 18a and 18b are smaller than the first LED die 11b and the second LED die 12b.

FIG. 7B is an explanatory diagram of the die bonding step 32. In the die bonding step 32, the first LED die 11b, the second LED die 12b, and the zener diodes 18a and 18b are bonded to the mounting substrate 13 with the die bonding material 17. Before mounting the first LED die 11b, the second LED die 12b, and the Zener diodes 18a and 18b on the mounting substrate 13, the die bond material 17 is applied in advance to the position where each element is arranged. Then, each element is arranged at a predetermined position with a picker. At this time, the amount of the die-bonding material 17 for adhering the first LED die 11b and the second LED die 12b is adjusted, and the die-bonding material 17 is protruded around the first LED die 11b and the second LED die 12b at the time of die-bonding. 17 makes the side surfaces of the first LED die 11b and the second LED die 12b crawl up. In parallel with this, the die bond materials 17 are connected to each other between the adjacent first LED die 11b and second LED die 12b. Finally, the LED light emitting device 10 is heated to cure the die bond material 17. Here, the distance between the first LED die 11b and the second LED die 12b is 0.1 to 0.4 mm.

FIG. 7C is an explanatory diagram of the wire bonding step 33. In the wire bonding step 33, the first LED dies 11b, the second LED dies 12b, the first LED dies 11b and the wiring electrodes 19e and 19c, the second LED dies 12b and the wiring electrodes 19f and 19h, the Zener diode 18a and the power supply electrode 19c, and the wiring electrodes. 19e, and the Zener diode 18b and the power supply electrode 19b and the wiring electrode 19h are electrically connected by the wire 14. As described above, when the first LED die 11b and the second LED die 12b are arranged in the area inside the annular dam 15 with high area utilization efficiency and are connected in consideration of ease of handling, some of the wires 14 Intersect (visible when seen in a plan view, but not connected in three dimensions). In addition, in order to symbolically show this crossing in the figure, the tops of the wires 14 are crossed. Regarding the wire 14, only the vicinity of the first LED die 11b and the second LED die 12b is drawn, and other portions are omitted.

FIG. 7D is an explanatory diagram of the dam forming step 34. In the dam forming step 34, the dam 15 is formed on the mounting substrate 13 so as to surround the set of the first LED die 11b and the second LED die 12b. The dam 15 is made of white silicone resin and has a thickness of 0.7 to 1.0 mm and a height of 0.5 to 0.8 mm. Further, the dam 15 is formed by discharging the white silicone resin having a high viscosity (or thixotropy) from the nozzle while moving the nozzle of the dispenser. At this time, the Zener diodes 18 a and 18 b are embedded in the dam 15. Similarly, the wiring electrodes 19e to 19h and a part of the wire 14 connecting the wiring electrodes 19e to 19h and the first LED die 11b or the second LED die 12b are also embedded in the dam 15. Finally, the LED light emitting device 10 is heated to cure the dam 15.

FIG. 7E is an explanatory diagram of the first fluorescent resin coating step 35. In the first fluorescent resin coating step 35, the first fluorescent resin layer 11c is formed by applying the first fluorescent resin on the upper part of the first LED die 11b. The first fluorescent resin is a silicon resin containing a phosphor that emits green light (for example, Lu ₃ Al ₅ O ₁₂ :Ce) and a phosphor that emits red light (for example, CaAlSiN ₃ :Eu). Spot printing is performed on the upper part of the first LED die 11b by the nozzle. The first fluorescent resin layer 11c generated by spot printing has a dome shape with a maximum thickness of about 0.5 mm. The emission color of the first light emitting region 11a including the first fluorescent resin layer 11c is about 3000° K due to the blue light emitted from the first LED die 11b and the emission of the first fluorescent resin layer 11c.

FIG. 7F is an explanatory diagram of the second fluorescent resin coating step 36. In the second fluorescent resin coating step 36, the second fluorescent resin is applied on the second LED die 12b to form the second fluorescent resin layer 12c. The second fluorescent resin is also a silicon resin containing a phosphor that emits green light (for example, Lu ₃ Al ₅ O ₁₂ :Ce) and a phosphor that emits red light (for example, CaAlSiN ₃ :Eu), and is movable. The spot printing is performed on the upper portion of the second LED die 12b by the nozzle. The second fluorescent resin layer 12c generated by spot printing has a dome shape with a maximum thickness of about 0.3 mm. The emission color of the second light emitting region 12a including the second fluorescent resin layer 12c is about 5000 K due to the blue light emitted from the first LED die 11b and the emission of the first fluorescent resin layer 11c.

FIG. 7G is an explanatory diagram of the transparent resin coating step 37. In the transparent resin coating step 37, the transparent resin layer 16 is formed by filling the region inside the dam 15 with the transparent resin. The transparent resin is a transparent silicone resin, has a low viscosity before curing, and a dispenser is used for filling. After the filling, the transparent resin is cured by heating.

In the first fluorescent resin coating step 35, the first fluorescent resin was applied by spot printing to the upper portion of the first LED die 11b. Similarly, also in the second fluorescent resin coating step 36, the second fluorescent resin was applied by spot printing to the upper surface of the second LED die 12b. However, the application method is not limited to spot printing, and for example, spray printing may be used instead of spot printing. In either method, after application, the first fluorescent resin and the second fluorescent resin are formed into a dome shape by surface tension.

The LED light emitting device 10 described with reference to FIGS. 1 to 7 includes an aggregate of the first light emitting region 11a and the second light emitting region 12a, which are fine light emitting regions. In the light emitting unit 15a, the first light emitting regions 11a and the second light emitting regions 12a are adjacent to each other in the vertical and horizontal directions when seen in a plan view, and are arranged in a checkered pattern. The first light emitting region 11a includes one first LED die 11b and emits light at about 3000° K (first color). Similarly, the second light emitting region 12a includes one second LED die 12b and emits light at about 5000° K (second color). The upper surface of the first LED die 11b and the side surface near the upper surface are potted with the first fluorescent resin by spot printing or the like. The first fluorescent resin layer 11c thus formed has a dome shape with a curved surface on the upper surface.

The LED light emitting device 10 can independently control the current flowing through the first circuit 11e and the current flowing through the second circuit 12e to adjust the emission color. That is, the brightness of the first circuit 11e (the amount of light emitted from all the first light emitting areas 11a forming the first circuit 11e) and the brightness of the second circuit 12e (all the second light emitting areas 12a forming the second circuit 12e). The amount of light emitted from the LED light emitting device 10 can be controlled independently, so that the LED light emitting device 10 can obtain a light emission color between 3000°K and 5000°K at any luminance.

As described above, in the LED light emitting device 10, the dome-shaped first fluorescent resin layer 11c is formed by spot printing only on the tip portion of the first LED die 11b, and the LED fluorescent device 10 should not be covered with the first fluorescent resin layer 11c. The second LED die 12b is placed close to the first LED die 11b. Further, most of the light emitted from the first LED die 11b and the second LED die 12b passes through the first fluorescent resin layer 11c and the second fluorescent resin layer 12c, respectively, so that the luminous efficiency and the wavelength conversion efficiency are not deteriorated. Therefore, the LED light emitting device 10 includes a plurality of fine first light emitting regions 11a emitting a first color and a plurality of fine second light emitting regions 12a emitting a second color on one mounting substrate 13. When the LEDs are arranged in a checkerboard pattern, even if the same type of the first LED die 11b and the second LED die 12b forming the first light emitting region 11a and the second light emitting region 12a are brought close to each other, the LED light emission with a large distance between the LED die Compared to equipment, it is comparable in performance and quality and easy to manufacture.

In addition, in the LED light emitting device 10, the first LED die 11b and the second LED die 12b have the same size and the same characteristics, and the second LED die 12b is also individually covered with the second fluorescent resin layer 12c in a dome shape. That is, the die bonding material 17 has crawled up the side surfaces of the first LED die 11b and the second LED die 12b, and the surface of the mounting substrate 13 between the first LED die 11b and the second LED die 12b is covered with the die bonding material 17. There is a feature called that.

Specifically, the LED light emitting device 10 includes a first light emitting region 11a that emits a first color and a second light emitting region 12a that emits a second color on the mounting substrate 13, and the first light emitting region 11a and the second light emitting region 11a are provided. The light emitting regions 12a were arranged in a checkered pattern. Further, the LED light emitting device 10 includes a plurality of first LED dies 11b and second LED dies 12b mounted on a mounting substrate 13, a dam 15 surrounding a set of the first LED dies 11b and the second LED dies 12b, and a first LED die 11b. It was provided with the wire 14 which connects each other or the said 2nd LED die 12b, and the 1st fluorescent resin layer 11c and the 2nd fluorescent resin layer 12c which cover the upper surface of 1st LED die 11b and 2nd LED die 12b, respectively. At this time, the first LED die 11b and the second LED die 12b were the same blue light emitting diode. The first light emitting region 11a includes a first LED die 11b and a first fluorescent resin layer 11c, and the second light emitting region 12a includes a second LED die 12b and a second fluorescent resin layer 12c. The side surfaces of the first LED die 11b and the second LED die 12b are shielded by the white die bonding material 17, and the upper surface of the mounting substrate 13 is white in the gap between the first LED die 11b and the second LED die 12b. Was covered by.

The first LED die 11b and the second LED die 12b, which are one type of LED die, are arranged in a matrix on the mounting substrate 13 of the LED light emitting device 10, and are two types of fluorescent resin that are in a checkered pattern. The fluorescent resin and the second fluorescent resin were individually applied to the upper portions of the first LED die 11b and the second LED die 12b. In this way, the LED light emitting device 10 has the plurality of fine first light emitting regions 11a emitting the first color and the plurality of second fine emitting regions 12a emitting the second color on the mounting substrate 13. Had a configuration arranged in a checkered pattern. Therefore, in the LED light emitting device 10, only one type of LED die needs to be prepared in the preparation step 31 shown in FIG. 6, so that the manufacturing process can be further simplified. Further, since there is only one type of LED die, it becomes easy to optimize the area utilization efficiency of the mounting substrate 13.

Note that the desired emission color may not be achieved simply by adjusting the fluorescent resin. For example, the second color (spectrum) that is the emission color of the second light emitting region 12a may not be achieved by only adjusting the second fluorescent resin layer 12c. At this time, the second LED die 12b may be a near-ultraviolet light emitting LED, and its characteristics and size may be different from those of the first LED die 11b. By doing so, the second fluorescent resin layer 12c contains a fluorescent substance that emits blue light, and the spectrum of blue light becomes wider and approaches natural light.

Further, if the second LED die 12b is individually covered with the second fluorescent resin layer 12c, the size of the second fluorescent resin layer 12c is reduced, so that the emitted light of the first LED die 11b passes through the first fluorescent resin layer 11c. It becomes difficult for the above components to excite the phosphor in the second fluorescent resin layer 12c. That is, since the phosphor light emission in the second fluorescent resin layer 12c due to the light emitted from the first LED die 11b is an unexpected light emission and causes so-called noise, the LED light emitting device 10 has a low level of this noise. Therefore, the LED light emitting device 10 can easily control and manage the emission color. In the LED light emitting device 10, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c have different heights. This indicates that the emission colors of the first light emitting region 11a and the second light emitting region 12a can be adjusted by heights other than the concentrations of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c.

Further, the die bonding material 17 protrudes from the bottom surfaces of the first LED die 11b and the second LED die 12b included in the first light emitting area 11a and the second light emitting area 12a, respectively, and creeps up on the side surfaces of the first LED die and the second LED die. The die bond material 17 blocks side surface emitted light of the first LED die 11b and the second LED die 12b, and the surface functions as a reflection layer. Therefore, the LED light emitting device 10 can maintain high light emission efficiency while suppressing side surface emission light with a simple structure without disposing an additional light shielding member on the side surface of the first LED die 11b and the second LED die 12b. ..

In addition, the white die-bonding material 17 crawling up on the side surfaces of the first LED die 11b and the second LED die 12b reduces noise. That is, the die bonding material 17 blocks light (side emission light) that is going to be emitted from the side surfaces of the first LED die 11b and the second LED die 12b, thereby reducing unintended phosphor excitation. For example, if the die-bonding material 17 is not provided, the light emitted from the side surface of the first LED die 11b enters the second LED die 12b and excites the phosphor in the second fluorescent resin layer 12c. Therefore, when the side surfaces of the first LED die 11b and the second LED die 12b are shielded by the die bonding material 17, this noise is significantly reduced, and the control and management of the emission color of the LED light emitting device 10 are facilitated.

Further, the die bonding material 17 that covers the surface of the mounting substrate 13 in the gap between the first LED die 11b and the second LED die 12b improves the reflection efficiency of the light emitting unit 15a regardless of whether the surface of the mounting substrate 13 is subjected to the reflection treatment. Let Therefore, in the LED light emitting device 10, the light emitting efficiency is increased by the die bonding material 17.

Further, as shown in FIG. 3, in the LED light emitting device 10, the first LED die 11b and the second LED die 12b are mounted face-up on the mounting substrate 13 (mounting with the light emitting layer as the upper surface). For this reason, the wires 14 had to intersect at a part when viewed in a plan view. On the other hand, for example, when the first LED die 11b is face-up mounted and the second LED die 12b is face-down mounted (also referred to as flip chip mounting), the wires 14 do not cross each other. A wiring electrode for connecting the second LED dies 12b to each other is required on the upper surface of the mounting substrate 13.

(Second embodiment)
In the LED light emitting device 10 shown as the first embodiment, the upper surface of the mounting substrate 13 is covered with the white die bonding material 17 in the gap between the first LED die 11b and the second LED die 12b. However, if the reflectivity of the upper surface of the mounting board 13 is better than that of the die bond material 17, it is not necessary to cover the entire surface of the mounting board 13 with the white die bond material 17. That is, the first L
If the surface of the mounting substrate 13 is exposed in the gap between the ED die 11b and the second LED die 12b, the luminous efficiency is improved. Further, in the LED light emitting device 10, the transparent resin layer 16 integrally seals the first fluorescent resin layer 11c and the second fluorescent resin layer 12c, the wire 14, and the like. However, if the transmittance is not significantly reduced, the transparent resin layer 16 can be provided with diffusivity and the color mixing property can be improved.

Therefore, as a second embodiment of the present invention, an LED light emitting device 20 including a mounting substrate 13 having a reflective property and a transparent resin layer 16 having a diffusive property will be described with reference to FIG. The LED light emitting device 20 is different from the LED light emitting device 10 in that there is a reflective exposed portion 27 in the surface of the mounting substrate 13, in the gap between the first LED die 11b and the second LED die 12b, and in the transparent resin layer 16. Except that there are properties, they have substantially the same members and the same structure. Therefore, in describing the LED light emitting device 20, FIGS. 1 to 4 are cited, and common reference numerals are used for common members in FIG. 8.

FIG. 8 is a partial cross-sectional view of the LED light emitting device 20 showing the main part along the line AA′ in FIG. In FIG. 8, two first light emitting regions 11a and two second light emitting regions 12a are shown. Also in FIG. 8, the wire 14 (see FIG. 3) is not shown as in FIG.

As shown in FIG. 8, a silver layer 28 is formed on the upper surface of the mounting substrate 13. The first LED die 11b and the second LED die 12b have a bottom surface adhered to the silver layer 28 and a side surface covered by the die bonding material 17. An exposed portion 27 of the silver layer 28 exists in the gap between the first LED die 11b and the second LED die 12b, and the silver layer 28 is exposed from the die bond material 17 here.

In the LED light emitting device 20, as in the LED light emitting device 10, the upper portions of the first LED die 11b and the second LED die 12b are covered with the first fluorescent resin layer 11c and the second fluorescent resin layer 12c, respectively. Further, in the LED light emitting device 20, the protective layer 29 covers the exposed portion 27 of the silver layer 28, the surface of the die bonding material 17, and the surfaces of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c. The transparent resin layer 16 is composed of a transparent resin 16a and a filler 16b, and seals the first fluorescent resin layer 11c and the second fluorescent resin layer 12c, the wire 14 (not shown), and the like via the protective layer 29.

Of the wires 14 (not shown), the wire 14 connected to the upper surface of the first LED die 11b exits the first fluorescent resin layer 11c, passes through the transparent resin layer 16, and passes through the other first fluorescent resin layer 11c (not shown). Then, it is connected to the upper surface of another not shown first LED die 11b. The same applies to the wires 14 that connect the second LED dies 12b to each other. Since the material forming the protective layer 29 is attached to the wire 14, the strength of the wire 14 is increased as compared with the case where the wire 14 is provided alone.

In order to insulate the silver layer 28 from the power supply electrode 19a and the like, the mounting substrate 13 is provided with a flat plate base material on which the silver layer 28 is formed, and power supply electrodes 19a to 19d and wiring electrodes 19e to 19h on the upper surface. A printed board having openings for mounting the 1LED die 11b and the second LED die 12b is prepared, and the printed board is attached to a flat base material. For the protective layer 29, SiO ₂ or silicon resin can be used. When the protective layer 29 is made of SiO ₂ , after the wire bonding step 33, the dam forming step 34, the first fluorescent resin coating step 35 and the second fluorescent resin coating step 36, a protective film 29 having a thickness of several tens nm is formed by a sputtering method. Then, a SiO ₂ film is formed. When the protective layer 29 is made of silicone resin, the protective film is formed by spraying or coating after the wire bonding step 33, the dam forming step 34, the first fluorescent resin coating step 35 and the second fluorescent resin coating step 36 shown in FIG. As 29, a silicon film is formed with a thickness of 10 μm. The filler 16b is, for example, spherical titanium oxide having a diameter of about 6 μm.

Since the silver layer 28 in the exposed portion 27 is prevented from being sulphidized by the protective layer 29, it continues to maintain good reflection characteristics and contributes to improving the luminous efficiency of the LED light emitting device 20. That is, the LED light emitting device 20 including the reflective exposed portion 27 is advantageous when the distance between the first LED die 11b and the second LED die 12b is large. Further, the filler 16b contained in the sealing resin 64 blurs the boundary between the first light emitting region 11a and the second light emitting region 12a by diffusion. Therefore, the LED light emitting device 20 has improved color mixing properties as compared with the LED light emitting device 10.

The LED light emitting devices 10 and 20 were provided with the dam 15. The dam 15 can be omitted by adjusting the viscosity (or thixotropy) of the transparent resin layer 16 before curing. Further, the LED light emitting device 20 may omit the transparent resin layer 16. In this case, a part of the wire 14 is exposed, but since the protective layer 29 is formed on the wire 14, it is easy to omit the transparent resin layer 16.

(Third Embodiment)
In the LED light emitting devices 10 and 20 shown as the first embodiment and the second embodiment, the upper side surfaces of the first LED die 11b and the second LED die 12b are covered with the first fluorescent resin layer 11c and the second fluorescent resin layer 12c, respectively. It was However, when the covering portion of the first fluorescent resin layer 11c or the second fluorescent resin layer 12c on the upper side surface is narrow or when the die bond material 17 creeps up little, the side emission light of the first LED die 11b and the second LED die 12b is emitted. May not be sufficiently blocked.

Therefore, as a third embodiment of the present invention, an LED light emitting device 30 capable of reliably blocking side surface emitted light will be described with reference to FIG. The LED light emitting device 30 is substantially the same member and the same structure as the LED light emitting device 10 except that the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, and the die bonding material 17 have different cross-sectional shapes. Has become. Therefore, in describing the LED light emitting device 30, FIGS. 1 to 4 are cited, and common reference numerals are used for common members in FIG. 9.

FIG. 9 is a partial cross-sectional view of the LED light emitting device 30 in which a main part is drawn along the line AA′ in FIG. 1. In FIG. 9, two first light emitting areas 11a and two second light emitting areas 12a are shown. In FIG. 9, as in FIG. 5, the wire 14 (see FIG. 3) is not shown.

As shown in FIG. 9, the die bond material 17 crawls up the side surfaces of the first LED die 11b and the second LED die 12b, and forms a slope between the first LED die 11b and the second LED die 12b. In the LED light emitting device 30, the amount of the die bond material 17 of the LED light emitting device 30 is larger than that of the die bond material 17 of the LED light emitting device 10. The first fluorescent resin layer 11c and the second fluorescent resin layer 12c cover the upper surfaces of the first LED die 11b and the second LED die 12b, and also cover a part of the slope of the die bonding material 17.

As described above, in the LED light emitting device 30, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c cover a part of the slope of the die bond material 17, thereby reliably blocking the side emission light. This method is also effective when the exposed portion 27 of the mounting substrate 13 is between the first LED die 11b and the second LED die 12b as in the LED light emitting device 20.

(Fourth Embodiment)
In the LED light emitting device 30 shown as the third embodiment, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c have sufficient thicknesses on the upper side surfaces of the first LED die 11b and the second LED die 12b. The contact angle between the 1st fluorescent resin layer 11c and the 2nd fluorescent resin layer 72c and the die-bonding material 17 was enlarged (about 45 degrees in FIG. 9). However, generally, when the contact angle is large, the adhesive force becomes weak.

Therefore, as a fourth embodiment of the present invention, referring to FIG. 10, while sufficiently securing the thicknesses of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c at the upper side surfaces of the first LED die 11b and the second LED die 12b. The LED light emitting device 40 capable of improving the adhesion between the die bonding material 17 and the first fluorescent resin layer 11c and the second fluorescent resin layer 12c will be described. The LED light emitting device 40 differs from the LED light emitting device 30 only in the cross-sectional shapes of the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, and the die bonding material 17. Therefore, in describing the LED light emitting device 40, FIGS. 1 to 4 are cited, and common reference numerals are used for common members in FIG. 10.

FIG. 10 is a partial cross-sectional view of the LED light emitting device 40 in which a main part is drawn along the line AA′ in FIG. 1. In FIG. 10, two first light emitting regions 11a and two second light emitting regions 12a are shown. Also in FIG. 10, the wire 14 (see FIG. 3) is not shown as in FIG.

As shown in FIG. 10, the die-bonding material 17 of the LED light-emitting device 40 is less likely to crawl than the die-bonding material 17 of the LED light-emitting device 30 (see FIG. 9), and has a cross section between the first LED die 11b and the second LED die 12b. The curvature is also small. At this time, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c form a fillet at the contact portion with the die bond material 17. That is, in the LED light emitting device 40, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c are adjusted to have a lower viscosity/thixotropy at the time of application as compared with the LED light emitting device 30 (see FIG. 9). Although 11b and the upper corners of the second LED die 12b are slightly thin, they are thick at the side surface middle part, and a sufficient thickness can be secured as a whole.

As described above, in the LED light emitting device 40, even when the die-bonding material 17 has a small cross-sectional curvature, when the first fluorescent resin layer 11c and the second fluorescent resin layer 12c cover a part of the slope of the die-bonding material 17, the fillet is formed. By forming it, the adhesion can be made good while the thicknesses of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c on the side surface are sufficiently secured.

In the LED light emitting device 40, both the first fluorescent resin layer 11c and the second fluorescent resin layer 12c were provided with fillets. However, the fillet may be provided only on at least one of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c. For example, the thickly applied first fluorescent resin layer 11c is provided with a fillet for strong adhesion, and the thinly applied second fluorescent resin layer 12c is provided with the second fluorescent resin layer included in the LED light emitting device 30. It is not necessary to provide the fillet like 12c (see FIG. 9).

(Fifth Embodiment)
In the LED light-emitting device 40 shown as the fourth embodiment, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c are thinner in the upper corners of the first LED die 11b and the second LED die 12b than in the side surface middle portion. It was Therefore, the LED light emitting device 40 may not be able to sufficiently perform wavelength conversion of the blue light emitted from the upper corners of the first LED die 11b and the second LED die 12b, and at this time, color unevenness due to azimuth may occur. ..

Therefore, as a fifth embodiment of the present invention, an LED light emitting device 50 capable of reducing color unevenness due to azimuth will be described with reference to FIG. The LED light emitting device 50 differs from the LED light emitting device 40 only in the cross-sectional shapes of the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, and the die bond material 17. Therefore, in describing the LED light emitting device 50, FIGS. 1 to 4 are cited, and common reference numerals are used for common members in FIG. 11.

FIG. 11 is a partial cross-sectional view of the LED light emitting device 50 in which a main part is drawn along the line AA′ in FIG. 1. In FIG. 11, two first light emitting areas 11a and two second light emitting areas 12a are shown. Also in FIG. 11, the wire 14 (see FIG. 3) is not shown as in FIG.

As shown in FIG. 11, the die-bonding material 17 of the LED light-emitting device 50 has a top surface height that matches the top surface heights of the first LED die 11b and the second LED die 12b. Further, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c form a fillet at the contact portion with the die bond material 17. That is, in the LED light emitting device 50, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c are sufficiently located at the upper corners of the first LED die 11b and the second LED die 12b as compared with the LED light emitting device 40 (see FIG. 9). The thickness is secured.

As described above, in the LED light-emitting device 50, the height of the upper surface of the die bonding material 17 is made to match the height of the upper surfaces of the first LED die 11b and the second LED die 12b, and thus the upper side of the first LED die 11b and the second LED die 12b is increased. As a result of sufficiently securing the thicknesses of the first fluorescent resin layer 11c and the second fluorescent resin layer 12c at the corners, the blue light emitted from the upper corners can be appropriately wavelength-converted, and the azimuth angle It is possible to reduce color unevenness caused by.

In order to make the upper surface of the die bonding material 17 coincide with the upper surfaces of the first LED die 11b and the second LED die 12b, it is effective to reduce the distance between the first LED die 11b and the second LED die 12b. In the LED light-emitting device 50, the distance between the first LED die 11b and the second LED die 12b was 400 μm, while the die size was 650 μm. Further, in order to reduce the color unevenness caused by the azimuth angle, the height of the upper surface of the die bond material 17 may be substantially matched with the upper surfaces of the first LED die 11b and the second LED die 12b. It suffices if it is substantially flat between the second LED dies 12b.

(Sixth Embodiment)
In the LED light emitting devices 10, 20, 30, 40, 50, the highest portion of the die bonding material 17 was below the height of the upper surfaces of the first LED die 11b and the second LED die 12b. Alternatively, a white resin may be filled between the first LED die 11b and the second LED die 12b, and the top of this resin may be higher than the upper surfaces of the first LED die 11b and the second LED die 12b.

Therefore, as a sixth embodiment of the present invention, as shown in FIG. 12, the top of the white resin 61 filled between the first LED die 11b and the second LED die 12b is higher than the upper surfaces of the first LED die 11b and the second LED die 12b. The LED light emitting device 60 will be described. The LED light emitting device 60 differs from the LED light emitting device 10 and the like only in that a white resin 61 is added and that the die bond material 17 does not creep up much. Therefore, in describing the LED light emitting device 60, FIGS. 1 to 4 are cited, and common reference numerals are used for common members in FIG.

FIG. 12 is a partial cross-sectional view of the LED light emitting device 60 in which a main part is drawn along the line AA′ in FIG. 1. In FIG. 12, two first light emitting areas 11a and two second light emitting areas 12a are shown. Note that, also in FIG. 12, the wire 14 (see FIG. 3) is not shown as in FIG.

As shown in FIG. 12, the die bond material 17 only adheres the bottom surfaces of the first LED die 11b and the second LED die 12b to the surface of the mounting substrate 13, and almost completely attaches the side surfaces of the first LED die 11b and the second LED die 12b. Not covered. The upper portions of the first LED die 11b and the second LED die 12b are individually covered with a dome-shaped first fluorescent resin layer 11c and a second fluorescent resin layer 12c. White resin 61 is filled between the first LED die 11b and the second LED die 12b, and the upper surface of the white resin 61 is higher than the upper surfaces of the first LED die 11b and the second LED die 12b. The transparent resin layer 16 seals the first fluorescent resin layer 11c, the second fluorescent resin layer 12c, and the white resin 61. The white resin 61 is a silicon resin obtained by kneading fine particles of titanium oxide, and is a step added between the second fluorescent resin coating step 36 and the transparent resin coating step 37 shown in FIG. And the second LED die 1
Filled between 2b.

As described above, when the upper surface of the white resin 61 is higher than the upper surfaces of the first LED die 11b and the second LED die 12b, the light emission of the first LED die 11b enters the second fluorescent resin layer 12c and the light emission of the second LED die 12b. Is less likely to enter the first fluorescent resin layer 11c, and the respective lights emitted between the first fluorescent resin layer 11c and the second fluorescent resin layer 12c are less likely to enter each other. That is, in the LED light emitting device 60, the white resin 61 causes the phosphors contained in the first fluorescent resin layer 11c and the second fluorescent resin layer 12c to be substantially excited only by the first LED die 11b and the second LED die 12b, respectively. Will be done. As a result, in the LED light emitting device 60, noise is reduced and it becomes easier to manage the emission color.

(Seventh embodiment)
In the LED light emitting devices 10, 20, 30, 40, 50, 60, the dome-shaped first fluorescent resin layer 11c individually covers the first LED die 11b in the first light emitting region 11a and the dome in the second light emitting region 12a. Shaped second fluorescent resin layer 12c individually covered the second LED die 12b. However, since the dome-shaped first fluorescent resin layer 11c and the second fluorescent resin layer 12c are formed, if spot printing is applied to all of the first LED die 11b and the second LED die 12b as in the LED light emitting device 10 and the like, the manufacturing process Will be long.

Therefore, referring to FIGS. 13 to 15, as a seventh embodiment, a plurality of fine first light emitting regions 11a emitting light of a first color and a plurality of fine light emitting areas of a second color are provided on one mounting substrate. The LED light emitting device 70 and the method for manufacturing the LED light emitting device 70 will not be lengthened even if the second light emitting regions 12a are arranged in a checkered pattern. The LED light emitting device 70 is different from the LED light emitting device 10 only in that the transparent resin layer 16 is not provided and that the cross-sectional shape of the second fluorescent resin layer 12c is not dome-shaped. Therefore, in describing the LED light emitting device 70, FIGS. 1 to 4 are cited, and common members are denoted by common reference numerals in FIGS. 13 to 15.

FIG. 13 is a partial cross-sectional view of the LED light emitting device 70 in which a main part is drawn along the line AA′ in FIG. 1. In FIG. 13, two first light emitting areas 11a and two second light emitting areas 12a are shown. As shown in FIG. 13, the bottom surfaces of the first LED die 11b and the second LED die 12b are bonded to the top surface of the mounting substrate 13 with a die bonding material 17. The die-bonding material 17 is white and contains reflective fine particles such as Ti oxide, covers the side surfaces of the first LED die 11b and the second LED die 12b, and is mounted on the mounting substrate in the gap between the first LED die 11b and the second LED die 12b. It covers the upper surface of 13. Note that the wire 14 is not shown in FIG. 13 as in FIG.

As shown in FIG. 13, the upper surface of the first LED die 11b is individually covered with the dome-shaped first fluorescent resin layer 11c. Further, the first fluorescent resin layer 11c also covers the upper side surface of the first LED die 11b so that the light emission of the first LED die 11b does not directly leak from the side surface of the first LED die 11b together with the die bonding material 17. The upper surface of the second LED die 12b is covered with the second fluorescent resin layer 12c. The second fluorescent resin layer 12c collectively covers the upper surfaces of the plurality of second LED dies 12b uniformly, fills the gap between the first LED die 11b and the second LED die 12b, and further covers the first fluorescent resin layer 11c. There is.

Note that, as shown in FIG. 13, the first light emitting region 11a is located immediately above the first LED die 11b and in the vicinity thereof. That is, the first LED die 11b concentrates a large amount of light emission immediately above, so that even if the first fluorescent resin layer 11c that is excited by the light emission of the first LED die 11b and emits light is isotropic. Since the first light emitting region 11a is recognized as a region in which the intensity of the mixed light of the light emitted from the first LED die 11b and the light emitted from the first fluorescent resin layer 11c is high, it is limited to just above the first LED die 11b and its vicinity. To be Similarly, the second light emitting region 12a is limited to just above the second LED die 12b and its vicinity.

Next, a method of manufacturing the LED light emitting device 70 will be described with reference to FIGS. FIG. 14 is a flowchart showing the manufacturing steps included in the method for manufacturing the LED light emitting device 70, and FIG. 15 is an explanatory diagram of the manufacturing steps shown in the flowchart of FIG. The reference numerals common to FIGS. 1 to 4 and 6 indicate common members and steps, and are cited without any special instruction.

As shown in FIG. 14, the manufacturing method of the LED light emitting device 70 includes a preparatory step 31 of preparing the mounting substrate 13, the first LED die 11b and the second LED die 12b, and the mounting substrate 13 including the first LED die 11b and the second LED die 12b. And the like, a die bonding step 32 for bonding the first LED die 11b and the second LED die 12b to the wiring electrodes 19e to 19h, a wire bonding step 33 for electrically connecting the first LED die 11b with each other or the second LED die 12b with the wire 14, A dam forming step 34 of forming a dam 15 on the mounting substrate 13 so as to surround a set of the 1LED die 11b and the second LED die 12b, and applying a first fluorescent resin to the first LED die 11b to form a first fluorescent resin layer 11c. And a second fluorescent resin coating step 36 for filling the region inside the dam 15 with the second fluorescent resin to form the second fluorescent resin layer 12c.

FIGS. 15A to 15F are schematic views of the cross section of the LED light emitting device 70 in the process of manufacturing in order to explain each step shown in FIG. In FIG. 15, in the preparatory step 31 shown in (a), the die bonding step 32 shown in (b), the wire bonding step 33 shown in (c), the dam forming step 34 shown in (d), and (e). The first fluorescent resin coating step 35 shown includes a preparation step 31, a die bonding step 32, a wire bonding step 33, a dam forming step 34, and a first fluorescent resin coating step 35 shown in (a) to (e) of FIG. Are the same. That is, in the LED light emitting device 70, as the steps shown in FIGS. 14 and 15, the second fluorescent resin coating step 36 shown in (f) is different from the second fluorescent resin coating step 36 shown in FIG. There is no transparent resin coating step 37 shown by 6.

In the second fluorescent resin coating step 36 shown in FIG. 15F, the second fluorescent resin is filled in the region inside the dam 15 to form the second fluorescent resin layer 12c so as to cover the upper surface of the second LED die 12b. .. The second fluorescent resin before curing has a low viscosity, and a dispenser is used for filling. Note that, as shown in FIG. 13, the first fluorescent resin layer 11c is covered with the second fluorescent resin layer 12c. The second fluorescent resin layer 12c also contains a phosphor that emits green light (for example, Lu ₃ Al ₅ O ₁₂ :Ce) and a phosphor that emits red light (for example, CaAlSiN ₃ :Eu). The concentration and ratio of the phosphor are different from those of the resin layer 11c. The emission color of the second light emitting region 12a becomes a color temperature of about 5000° K due to the blue light emitted from the second LED die 12b and the emission of the second fluorescent resin layer 12c.

As described above, the LED light emitting device 70 includes the plurality of fine first light emitting regions 11a emitting the first color and the plurality of second fine light emitting the second color on the one mounting substrate 13. When arranging the regions 12a in a checkerboard pattern, the first LED die 11b belonging to the first light emitting region 11a is replaced with the dome-shaped first fluorescent resin, although only one type of LED die is prepared. Since the second LED die 12b belonging to the second light emitting region 12a are collectively covered with the second fluorescent resin layer 12c while being individually covered with the layer 11c, the manufacturing process does not become long.

In the LED light emitting device 70, the first fluorescent resin layer 11c and the second fluorescent resin layer 12c emit light based on the light emitted from the first LED die 11b and the second LED die 12b, respectively. Further, additionally, the second fluorescent resin layer 12c emits light by the light emission of the first fluorescent resin layer 11c and the light emission of the first LED die 11b passing through the first fluorescent resin layer 11c. That is, noise is larger than that of the LED light emitting device 10 and the like. Therefore, the LED light emitting device 70 is suitable for a case where brightness and cost are important, with less restrictions on the color of light emitted.

The LED light emitting device 70 was equipped with the dam 15. The dam 15 can be omitted by adjusting the viscosity (or thixotropy) of the second fluorescent resin before curing. However, if the dam 15 is provided, the thickness of the second fluorescent resin layer 12c can be made uniform, which facilitates handling.

Moreover, the LED light-emitting device 70 makes the white die bond material 17 crawl on the side surfaces of the first LED die 11b and the second LED die 12b to block the light that is going to be emitted from the side surfaces of the first LED die 11b and the second LED die 12b. It was Even if the rise of the die bond material 17 is reduced and light is emitted from the side surfaces of the first LED die 11b and the second LED die 12b, a certain level of color mixing properties of the first color and the second color can be secured. At this time, noise increases and the controllability of the emission color decreases, but the brightness improves.

In the LED light emitting device 70, the surface of the mounting substrate 13 is covered with the die bonding material 17 in the gap between the first LED die 11b and the second LED die 12b. If the mounting substrate surface is subjected to the reflection treatment like the LED light emitting device 20, the upper surface of the mounting substrate 13 may be exposed in the region between the first LED die 11b and the second LED die 12b.

(Eighth Embodiment)
In the LED light-emitting device 70, the die bond material 17 has climbed up the side surfaces of the first LED die 11b and the second LED die 12b. However, the die bond material 17 does not necessarily have to crawl on the side surfaces of the first LED die 11b and the second LED die 12b.

Therefore, as an eighth embodiment of the present invention, an LED light emitting device 80 in which the die bonding material 17 does not crawl on the side surfaces of the first LED die 11b and the second LED die 12b will be described with reference to FIG. The LED light emitting device 80 differs from the LED light emitting device 70 only in the cross-sectional shapes of the die bond material 17 and the second fluorescent resin layer 12c. Therefore, in describing the LED light emitting device 80, FIGS. 1 to 4 are cited, and common reference numerals are used for common members in FIG. 16.

FIG. 16 is a partial cross-sectional view of the LED light emitting device 80 in which a main part is drawn along the line AA′ in FIG. 1. In FIG. 16, two first light emitting areas 11a and two second light emitting areas 12a are shown. Also in FIG. 16, the wire 14 (see FIG. 3) is not shown as in FIG. As shown in FIG. 16, the dome-shaped first fluorescent resin layer 11c individually covers the upper portion of the first LED die 11b, and the second fluorescent resin layer 12c includes the upper surface of the second LED die 12b, the first LED die 11b, and the first LED die 11b. The space between the two LED dies 12b and the upper part of the first LED die 11b are covered. The die bond material 17 exists only between the bottom surfaces of the first LED die 11b and the second LED die 12b and the surface of the mounting substrate 13. That is, in the die bonding step 32 (see FIG. 6), the coating amount of the die bonding material 17 is reduced so that the die bonding material 17 does not crawl up the side surfaces of the first LED die 11b and the second LED die 12b during die bonding.

In the LED light emitting device 80, since all the components emitted from the entire side surface of the light emitted from the first LED die 11b and the second LED die 12b are input to the second fluorescent resin layer 12c, the luminous efficiency is increased. That is, the LED light emitting device 80 is effective when the light emission efficiency is important.

(9th Embodiment)
In the LED light emitting device 70, the height of the first LED die 11b and the height of the second LED die 12b were equal. However, it is not always necessary that the first LED die 11b and the second LED die 12b have the same height.

Therefore, as a ninth embodiment of the present invention, an LED light emitting device 90 in which the first LED die 11b and the second LED die 12b have different heights will be described with reference to FIG. The LED light emitting device 90 differs from the LED light emitting device 70 only in the cross-sectional shapes of the first LED die 11b, the second LED die 12b, the die bonding material 17, and the second fluorescent resin layer 12c. Therefore, in describing the LED light emitting device 90, FIGS. 1 to 4 are cited, and common reference numerals are used for common members in FIG.

FIG. 17 is a partial cross-sectional view of the LED light emitting device 90 in which a main part is drawn along the line AA′ in FIG. 1. In FIG. 17, two first light emitting regions 11a and two second light emitting regions 12a are shown. Similarly to FIG. 5, the wire 14 (see FIG. 3) is not illustrated in FIG. 17. As shown in FIG. 17, the first LED die 11b is taller than the second LED die 12b. The dome-shaped first fluorescent resin layer 11c individually covers the upper part of the first LED die 11b, and the second fluorescent resin layer 12c covers the upper surface of the second LED die 12b, between the first LED die 11b and the second LED die 12b, and Cover the top of the first LED die 11b. The die bond material 17 covers the surface of the mounting substrate 13 between the first LED die 11b and the second LED die 12b, and slightly extends up the side surfaces of the first LED die 11b and the second LED die 12b.

When emitting light at a low color temperature, the LED light emitting device 90 is characterized in that it can emit light with less noise because the first fluorescent resin layer 11c is near the surface of the second fluorescent resin layer 12c.

(10th Embodiment)
In the LED light emitting device 90, the first LED die 11b was higher than the second LED die 12b. However, when making the height of the first LED die 11b different from the height of the second LED die 12b, it is not always necessary to make the first LED die 11b higher than the second LED die 12b.

Therefore, as a tenth embodiment of the present invention, an LED light emitting device 100 in which the first LED die 11b is shorter than the second LED die 12b will be described with reference to FIG. The LED light emitting device 100 differs from the LED light emitting device 90 only in the cross-sectional shapes of the first LED die 11b, the second LED die 12b, and the second fluorescent resin layer 12c. Therefore, in describing the LED light emitting device 100, FIGS. 1 to 4 are cited, and common reference numerals are used for common members in FIG. 18.

FIG. 18 is a partial cross-sectional view of the LED light emitting device 100 in which a main part is drawn along the line AA′ in FIG. 1. In FIG. 18, two first light emitting areas 11a and two second light emitting areas 12a are shown. 18, the wire 14 (see FIG. 3) is not shown as in FIG. As shown in FIG. 18, the first LED die 11b is shorter than the second LED die 12b. The dome-shaped first fluorescent resin layer 11c individually covers the upper part of the first LED die 11b, and the second fluorescent resin layer 12c covers the upper surface of the second LED die 12b, between the first LED die 11b and the second LED die 12b, In addition, the upper part of the first LED die 11b is covered. The die bond material 17 covers the surface of the mounting substrate 13 between the first LED die 11b and the second LED die 12b, and slightly extends up the side surfaces of the first LED die 11b and the second LED die 12b.

As described above, in the LED light emitting device 100, many components of the light emission of the second LED die 12b are directed upward. Of this component, the portion directed obliquely upward does not enter the first fluorescent resin layer 11c because the second LED die is tall. That is, when the LED light emitting device 100 emits light at a high color temperature (when the first LED die 11b is almost extinguished), it is difficult for the first fluorescent resin layer 11c to be excited by the light emission of the second LED die 12b, so that the noise of the LED light emitting device 100 is reduced. It has the feature that it can emit light in a small amount.

It can be said that the LED light emitting devices 90 and 100 shown as the ninth and tenth embodiments have substantially different heights of the light emitting surfaces of the first LED die 11b and the second LED die 12b. That is, unevenness may be provided on the surface of the mounting substrate 13 to adjust the height of the light emitting surface. For example, by making the first LED die 11b and the second LED die 12b the same size and providing a protrusion on the mounting portion of the first LED 11b, an LED light emitting device equivalent to the LED light emitting device 90 can be obtained.

(Eleventh embodiment)
In the LED light emitting device 10 and the like, the light emitting portion 15a has a circular shape while mounting a large number of the first LED die 11b and the second LED die 12b on the mounting substrate 13 having a square shape in plan view (see FIG. 1). This is because the power supply electrodes 19a to 19d are formed at two opposite corners of the four corners of the mounting board 13, and the remaining two corners have a mounting mechanism for mounting to a mother board, a heat sink, etc. This is because it is structurally efficient to provide the notch), and it is convenient that the light emitting portion 15a is also circular when the circular lens is attached.

However, like the LED light-emitting device 10, the outer edge of the checkered pattern arrangement of the first LED die 11b and the second LED die 12b is polygonal (octagonal), and the plurality of first LED rows 11d and the second LED rows 12d are connected in parallel. Then, when seen in a plan view, the wires 14 are forced to intersect as seen in FIG. However, when the wire 114 intersects (in the description of the present embodiment and the twelfth embodiment, a state in which the wire 114 is visually recognized as intersecting in a plan view is simply referred to as “intersection”), the first fluorescent resin and the second fluorescent resin. When resin or transparent resin is filled from above the wires 14, there is an increased risk of short-circuiting between the wires 14 at the intersections.

Therefore, as an eleventh embodiment of the present invention with reference to FIGS. 19 to 21, an LED light emitting device 110 capable of avoiding a short circuit between the wires 14 with a high probability even if the wires 14 cross each other, and a manufacturing method thereof will be described. Since the LED light emitting device 110 has the same basic configuration as the LED light emitting device 10 and the like, reference is made to FIGS. 1 to 4 in the description, and common members are denoted by common reference numerals in FIGS. 19 to 21.

FIG. 19 is a partial cross-sectional view of the LED light emitting device 110 in which a main part is drawn along the line AA′ in FIG. 1. In FIG. 19, one each of the 1st light emission area|region 11a and the 2nd light emission area 12a is shown. As shown in FIG. 19, the first LED die 11b and the second LED die 12b are mounted on the mounting substrate 13 via a die bond material 17. White resin 61 is filled between the first LED die 11b and the second LED die 12b. The upper surfaces of the first LED die 11b and the second LED die 12b are covered with a first fluorescent resin layer 11c and a second fluorescent resin layer 12c, respectively. The white resin 61, the first fluorescent resin layer 11c, and the second fluorescent resin layer 12c are covered with the transparent resin layer 16. The top of the first fluorescent resin layer 11c is lower than that of the second fluorescent resin layer 12c. Note that, also in FIG. 19, the wire 14 (see FIG. 3) is not shown as in FIG.

When the first fluorescent resin layer 11c and the second fluorescent resin layer 12c are viewed in a plan view, the regions occupied by the first fluorescent resin layer 11c and the second fluorescent resin layer 12c are the first light emitting region 11a and the second light emitting region 12a, respectively. (See FIG. 1). That is, the first light emitting region 11a and the second light emitting region 12a include the first fluorescent resin layer 11c and the second fluorescent resin layer 12c, and the first LED die 11b and the second LED die 12b, respectively.

Next, a method of manufacturing the LED light emitting device 110 will be described with reference to FIGS. 20 is a flowchart showing the manufacturing steps included in the method for manufacturing the LED light emitting device 110, and FIG. 21 is an explanatory diagram of the manufacturing steps shown in the flowchart of FIG. The features of the structure of the LED light emitting device 110 shown in FIGS. 20 and 21 will also be described.

As shown in FIG. 20, in the method for manufacturing the LED light emitting device 110, a preparatory step 31 of preparing the mounting substrate 13, the first LED die 11b, the second LED die 12b, and the like, the first LED die 11b, and the second LED die 12b on the mounting substrate 13. And the like, a die bonding step 32 of bonding the first LED die 11b and the wiring electrodes 19e to 19h, a wire bonding step 33 of electrically connecting the first LED dies 11b to each other or the second LED dies 12b to each other with a wire 14, the first LED die 11b and the A dam forming step 34 of forming a dam 15 on the mounting substrate 13 so as to surround the set of 2LED dies 12b, a white resin filling step 38 of filling a white resin 61 in a gap between the first LED die 11b and the second LED die 12b, A protective resin film forming step 39 of forming a protective resin film 62 on the wire 14 and the like, a first fluorescent resin coating step 35 of applying a first fluorescent resin to form a first fluorescent resin layer 11c, and a second fluorescent resin are applied. A second fluorescent resin coating step 36 of forming the second fluorescent resin layer 12c with the transparent resin layer 16 and a transparent resin coating step 37 of coating the first fluorescent resin layer 11c and the second fluorescent resin layer 12c and the wire 14 with the transparent resin layer 16. ..

FIG. 21 is an explanatory diagram schematically illustrating a cross section of the LED light emitting device 110 which is in the process of manufacturing, for explaining each step shown in FIG. In FIG. 21, the preparation step 31 shown in (a), the die bonding step 32 shown in (b), the wire bonding step 33 shown in (c), and the dam forming step 34 shown in (d) are respectively the preparation steps shown in FIG. 31, the same as the die bonding step 32, the wire bonding step 33, and the dam forming step 34. In FIG. 21, the first fluorescent resin coating step 35 shown in (g), the second fluorescent resin coating step 36 shown in (h), and the transparent resin coating step 37 shown in (i) are the white resin 61 and the protective resin film 62. 6 is substantially the same as the first fluorescent resin coating step 35, the second fluorescent resin coating step 36, and the transparent resin coating step 37 shown in FIG.

FIG. 21E is an explanatory diagram of the white resin filling step 38. In the white resin filling step 38, the white resin 61 is filled in the gap between the first LED die 11b and the second LED die 12b. First, while avoiding the first LED die 11b and the second LED die 12b, an appropriate amount of white resin 61 having a low viscosity is dropped by a dispenser. The gap between the first LED die 11b and the second LED die 12b is filled with the white resin 61 by a capillary phenomenon. At this time, the upper surface of the white resin 61 and the upper surfaces of the first LED die 11b and the second LED die 12b become substantially the same. Finally, the LED light emitting device 110 is heated to cure the white resin 61. The white resin 61 is a silicon resin in which reflective fine particles such as titanium oxide are kneaded.

FIG. 21F is an explanatory diagram of the protective resin film forming step 39. In the protective resin film forming step 39, the protective resin film 62 is formed on the wire 14. First, a space containing the dam 15 is filled with a solution containing acrylic-modified silicon and polysilazane diluted with a solvent such as ethyl acetate. Then, it is left at 150° C. for about 1 hour to volatilize the solvent. As a result, the protective resin film 62 that is coated and cured along the shape of the adherend (such as the wire 14) is obtained. The protective resin film 62 also contains SiO 2. Further, a protective resin film 62 having a shape like a curtain is formed under the wire 14. The wire 14 has increased mechanical strength due to the protective resin film 62 and the curtain-shaped protective resin film 62, and the first fluorescent resin coating step 35, the second fluorescent resin coating step 36, and the transparent resin coating step, which are the subsequent steps. At 37, defects such as short circuits are reduced.

As described above, since the LED light emitting device 110 is increased in strength by the protective resin film 62, the first fluorescent resin coating step 35, the second fluorescent resin coating step 36, and the transparent resin coating subsequent to the protective resin film forming step 39. In the step of depositing the resin such as step 37, the wire 14 is less likely to be deformed or collapsed. As a result, in the LED light emitting device 110 and the manufacturing method thereof, even if the wires 14 cross each other because the light emitting portion 15a has a circular shape, a short circuit between the wires 14 can be avoided with high probability in the manufacturing process after wire bonding.

In the method for manufacturing the LED light emitting device 110 shown in FIGS. 20 and 21, the first LED die 11b and the second LED die 12b are mounted on the mounting substrate 13 and various resins are arranged. However, as described above, during mass production, the collective substrate construction method using a large-sized substrate that can obtain a large number of mounting substrates 13 included in the LED light emitting device 110 when divided into individual pieces is suitable. At this time, a set of the first LED die 11b and the second LED die 12b surrounded by one dam 15 is included in the LED light emitting device 110, and a large number of dams 15 are formed on the large-sized substrate. In the collective substrate construction method, after the transparent resin coating step 37, there is provided an individualizing step of cutting the large-sized substrate into individual pieces of the LED light emitting devices 110.

In the method for manufacturing the LED light emitting device 110 shown in FIGS. 20 and 21, after forming the dam 15, the region inside the dam 15 was filled with the white resin 61. However, as in the LED light emitting device 10 or the like, the die bond material 17 is whitened and used for a large number of times, so that the die bond material 17 protrudes around the LED die 11 during die bonding, and the protruded die bond material 17 is white resin 61. Can be used instead of That is, the protruding die bond material 17 may crawl up the side surfaces of the first LED die 11b and the second LED die 12b, shield the side surfaces of the first LED die 11b and the second LED die 12b, and function as a reflecting member. In this way, the white resin filling step 38 can be omitted.

Further, when the base material of the mounting board 13 is aluminum, a silver layer 28 (see FIG. 8) may be provided on the upper surface thereof. That is, even if the white die-bonding material 17 crawls up the side surfaces of the first LED die 11b and the second LED die 12b and shields the side surfaces of the first LED die 11b and the second LED die 12b, the first LED die 11b and the second LED die 12b If the distance is large, the upper surface of the mounting substrate 13 may be exposed from the white die bond material 17. In such an LED light emitting device 110, since the exposed portion 27 (see FIG. 8) of the mounting substrate 13 is the silver layer 28, the luminous efficiency is improved based on the high reflectance of the silver layer 28, and the protective resin film 62 is also provided. By covering the exposed portion 27 with the silver layer 28, sulfidation of the silver layer 28 is prevented and high reliability is obtained.

(Twelfth Embodiment)
In the LED light emitting device 110 shown as the eleventh embodiment, similarly to the LED light emitting device 10 and the like, in the first light emitting region 11a, the dome-shaped first fluorescent resin layer 11c is formed by spot printing on the first LED die 11b. At the same time, also in the second light emitting region 12a, the dome-shaped second fluorescent resin layer 12c was formed by spot printing on the second LED die 12b. However, like the LED light emitting device 70 (see FIG. 13), the first fluorescent resin layer 11c is formed by spot printing on the first LED die 11b in the first light emitting region 11a, while the second light emitting region 12a and other The second fluorescent resin layer 12c may be formed by filling so as to cover the region. In this way, even if the wire 14 has the protective resin film 62, the manufacturing process is simplified as in the case of the LED light emitting device 70. At the same time, the white resin filling step 38 can be omitted from the manufacturing process of the LED light emitting device 110.

Further, in order to prevent short-circuiting between the wires 14 at the intersection, it is preferable that one of the wires 14 that intersects with each other has a trapezoidal shape in side view and the other wire has a curved shape (normal shape) in side view.

Therefore, referring to FIGS. 22 to 27, as the twelfth embodiment of the present invention, the second fluorescent resin layer 12c is filled over the entire inner region of the dam 15, and the side surfaces of the first LED die 11b and the second LED die 12b are shielded from light. The LED light emitting device 120 including the wire 14 that is not formed and has a trapezoidal shape in a side view, and a method for manufacturing the same will be described. Since the LED light emitting device 120 has a basic configuration similar to that of the LED light emitting device 70 and the like, reference is made to FIGS. 1 to 4 in the description, and common members in FIGS. 22 to 27 are denoted by common reference numerals.

FIG. 22 is a partial cross-sectional view of the LED light emitting device 120 in which a main part is drawn along the line AA′ in FIG. 1. In FIG. 22, one 1st light emitting area 11a and one 2nd light emitting area 12a are shown, respectively. As shown in FIG. 22, the first LED die 11b and the second LED die 12b are mounted on the mounting substrate 13 via the die bond material 17. The upper surface of the first LED die 11b is individually covered with the first fluorescent resin layer 11c in a dome shape. On the other hand, the second fluorescent resin layer 12c is formed over the entire inner region of the dam 15 (see FIG. 1), the side surfaces of the first LED die 11b and the second LED die 12b, the upper surface of the second LED die 12b, and the first LED die 12b. The surfaces of the fluorescent resin layer 11c and the mounting substrate 13 are covered.

Further, in FIG. 22, a part of the wire 14 (see FIG. 3) connected to the first LED die 11b (referred to as the wire 14a (first wire) in FIGS. 22 to 27) and the second LED. A part of the wire 14 (referred to as the wire 14b (second wire) in FIGS. 22 to 27) connected to the die 12b is shown. As shown in FIG. 22, the wire 14a extends upward from the surface of the first LED die 11b, passes through the first fluorescent resin layer 11c, and curves downward in the second fluorescent resin layer 12c (see FIG. Hereinafter referred to as "normal shape"). The wire 14b extends upward from the surface of the second LED die 12b, bends in the second fluorescent resin layer 12c, and extends laterally. The wire 14b has a special shape (trapezoidal side view) at the intersection with the wire 14a to avoid a short circuit. In addition, the wire 14b has a normal shape other than the intersection. As a result, the wire 14a dives under the wire 14b at the intersection. That is, in the LED light emitting device 120, at the intersection, the wire 14a connected to the first LED die 11b has a side view curve (normal shape), and the wire 14b connected to the second LED die 12b has a trapezoidal side view, thereby causing a short circuit. Effectively avoids.

23 to 25, the wires 14a and 14b of the LED light emitting device 120 shown in FIG. 22 will be described in more detail. FIG. 23 is a partial plan view showing a region where the wire 14a and the wire 14b intersect in the light emitting unit 15a (see FIG. 3). FIG. 24 is a perspective view of the area shown in FIG. 25A is a sectional view taken along line BB′ in FIG. 23, and FIG. 25B is a sectional view taken along line CC′ in FIG. 23 to 25, reference is made to FIG. 22 without any special instruction (the same applies to FIGS. 26 and 27). The area shown in FIG. 22 includes two first LED dies 11b and two second LED dies 12b, and therefore, when describing FIGS. 23 to 25, the first LED die 11b and the second LED die 12b are respectively The 1LED dies 11b1 and 11b2 are distinguished from the second LED dies 12b1 and 12b2. 23 to 25, the wires 14 (see FIG. 3) other than the wires 14a and 14b, the second fluorescent resin layer 12c, and the mounting substrate 13 are not shown. Furthermore, in FIG. 23 and FIG. 24, the first fluorescent resin layer 11c is not shown.

As shown in FIG. 23, the anode 21 of the first LED die 11b1 is connected to the cathode 22 of the first LED die 11b2 by the wire 14a. The cathode 22 of the second LED die 12b1 is connected to the anode 21 of the second LED die 12b2 by the wire 14b. The wire 14a and the wire 14b are observed as intersecting each other in a plan view, but they are not three-dimensionally short-circuited. That is, as described above, the wire 14a is under the wire 14b at the intersection.

In FIG. 24, in order to make it easier to visually understand the state where the wire 14a dive under the wire 14b at the intersection, the wire 14a is painted black while the wire 14b is displayed white. As shown in FIG. 24, the wire 14a has a side view curve (normal shape), and the wire 14b has a side view trapezoid.

As shown in FIG. 25A, the wire 14a extends upward from the surface of the first LED die 11b2, passes through the first fluorescent resin layer 11c, and is curved in the second fluorescent resin layer 12c (not shown). Draw downward, enter the first fluorescent resin layer 11c on the first LED die 11b1, and reach the surface of the first LED die 11b1. The first LED die 11b2 side is the first bonding (indicated by a black circle in the figure), and the first LED die 11b1 side is the second bonding. The wire 14a dives under the wire 14b at the intersection. The distance between the wire 14a and the wire 14b at the intersection is about 100 μm. The surface of the wire 14a is covered with a protective resin film 62, and a curtain-shaped protective resin film 62 is formed below the wire 14a. The protective resin film 62 is formed only on the outer side of the first fluorescent resin layer 11c because of the requirement for high productivity as described later (see FIG. 14). In FIG. 25A, the protective resin film 62 (see (b)) of the wire 14b is not shown.

As shown in FIG. 25B, the wire 14b extends upward from the surface of the second LED die 12b1, bends in the second fluorescent resin layer 12c (not shown), and extends laterally. Further, the wire 14b bends downward and reaches the surface of the second LED die 12b2. The second LED die 12b1 side is the first bonding (indicated by a black circle in the figure), and the second LED die 12b2 side is the second bonding. The wire 14b straddles the wire 14a at the intersection. The surface of the wire 14b is entirely covered with a protective resin film 62, and a curtain-shaped protective resin film 62 is formed below the wire 14b. A protective resin film 62 is formed on the wire 14b as a whole. In FIG. 25B, the protective resin film 62 (see (a)) of the wire 14a is not shown.

As described above, in the LED light emitting device 120, the wire 14a has a side view curve (normal shape) and the wire 14b has a trapezoidal side view at the intersection, thereby avoiding a short circuit. However, even if the short circuit is effectively avoided, the trapezoidal wire 14b in side view is structurally weaker than the wire 14a in side view curve (prone to breakage, etc.). Confirmed by sex test. Therefore, in the LED light emitting device 120, by forming the protective resin film 62 over the entire wire 14b, the wire 14b is reinforced to the extent that there is no practical problem (at the same time, wires other than the wire 14b including the wire 14a). 14 is also reinforced.)

Next, a method of manufacturing the LED light emitting device 120 will be described with reference to FIGS. FIG. 26 is a flowchart showing a method for manufacturing the LED light emitting device 120. As shown in FIG. 26, the manufacturing method of the LED light emitting device 120 includes a preparatory step 31 of preparing the mounting substrate 13, the first LED die 11b and the second LED die 12b, and the first LED die 11b and the second LED die 12b on the mounting substrate 13. And the like, a die bonding step 32 for bonding the first LED die 11b and the second LED die 12b to the wiring electrodes 19e to 19h, a wire bonding step 33 for electrically connecting the first LED die 11b with each other or the second LED die 12b with the wire 14, First fluorescent resin coating step 35 of applying one fluorescent resin to form the first fluorescent resin layer 11c, and forming the dam 15 on the mounting substrate 13 so as to surround the set of the first LED die 11b and the second LED die 12b. A dam forming step 34, a protective resin film forming step 39 of forming a protective resin film 62 on the wire 14 and the like, and a second fluorescent resin layer 12c is formed by filling a region inside the dam 15 with a second fluorescent resin layer 12c. A fluorescent resin coating step 36 is included.

The flowchart shown in FIG. 26 differs from the flowchart shown in FIG. 20 in that the white resin filling step 38 and the transparent resin coating step 37 are not provided, and the first fluorescent resin coating step 35, the dam forming step 34, and the protection step are performed. The difference is that the order is the resin film forming step 39.

As described above, in the LED light emitting device 120, the second fluorescent resin is filled in the entire inner region of the dam 15, and the side surfaces of the first LED die 11b and the second LED die 12b are not shielded from light, so that the white resin is used. The filling step 38 and the transparent resin coating step 37 are unnecessary.

Further, when spot printing the first fluorescent resin after forming the dam 15, when the nozzle tip is to be brought close to the element (the first LED die 11b or the second LED die 12b) for the thread cutting operation of the spot printing, The dam 15 may be an obstacle and the manufacturing time may be lengthened. Therefore, in manufacturing the LED light emitting device 120, the order of the first fluorescent resin coating step 35, the dam forming step 34, and the protective resin film forming step 39 was adopted. That is, high productivity is secured by forming the dam 15 after spot printing of the first fluorescent resin. In addition, in the LED light emitting device 120, even if the order is the first fluorescent resin coating step 35, the dam forming step 34, and the protective resin film forming step 39, since the wire 14b has a trapezoidal side view, the strength of the wire 14b is reduced. The protective resin film 62 can be formed over the entire area.

FIG. 27 is an explanatory diagram of each step of the flowchart of FIG. 26 drawn similarly to FIG. The preparation step 31 shown in (a) and the die bonding step 32 shown in (b) are the same as the preparation step 31 and the die bonding step 32 shown in FIG. The wire bonding step 33 shown in (c) is characterized in that the wire 14a has a curved side view and the wire 14b has a trapezoidal side view at the intersection of the wires 14, and otherwise, the wire bonding step shown in FIG. Same as 33.

In the first fluorescent resin coating step 35 shown in FIG. 27D, unlike the first fluorescent resin coating step 35 shown in FIG. 21, the first fluorescent resin is removed in a state where the dam 15 and the protective resin film 62 are not formed. Spot-print on the first LED die 11b. That is, immediately before spot-printing the first fluorescent resin 91c, it is necessary to keep the upper surface of the first LED die 11b clean. Therefore, spot-print the first fluorescent resin before forming the protective resin film 62. Is good. As a result, high productivity and reliability are secured.

The dam forming step 34 shown in FIG. 14E and the protective resin film forming step 39 shown in FIG. 14F relate to forming the dam 15 and the protective resin film 62, respectively. This is the same as the protective resin film forming step 39. In the second fluorescent resin coating step 36 shown in (g), the region inside the dam 15 is filled with the second fluorescent resin by a dispenser.

As described above, in the LED light emitting device 120, even if the wires 14 cross each other, similarly to the LED light emitting device 110, the protective resin film 62 avoids a short circuit between the wires 14 with high probability. Furthermore, in the LED light emitting device 120, the wire 14a and the wire 14b have a side view curve and a side view trapezoid, respectively, to avoid the short circuit more reliably. Further, in the LED light emitting device 120, by filling the region inside the dam 15 with the second fluorescent resin, the luminous efficiency is improved and the manufacturing process is shortened. By forming the protective resin film 62, both high productivity and reliability are achieved.

(13th Embodiment)
The LED light-emitting device 10 and the like can employ various planar light-emitting regions and circuit configurations as long as the two light-emitting regions are arranged in a checkered pattern. However, in consideration of the optical system such as the lens as described above, it is preferable that the light emitting portion has a circular shape in plan view. Further, when the number of series stages of the first LEDs 11b included in the first LED row 11d and the number of series stages of the second LEDs 12b included in the second LED row 12d are all equal, four power supply electrodes 19a to 19d are sufficient, which is efficient. That is, in the LED light emitting device including a plurality of fine first light emitting regions emitting a first color and a plurality of second fine emitting regions emitting a second color on one mounting substrate, a light emitting unit is provided. It is desirable that the first light emitting region and the second light emitting region can be efficiently arranged in a checkered pattern while making the circle circular.

Therefore, first, an outline of an LED light emitting device that can efficiently realize the above-described arrangement will be described, and then, an LED light emitting device 130 will be described as a thirteenth embodiment of the present invention with reference to FIGS. 28 and 29. In addition, since the LED light emitting device 130 has common members such as the LED light emitting device 10 and the like such as the first LED die 11b and the second LED die 12 and the circuit configuration is similar, FIGS. 1 to 4 are cited in the description, 28 and 29, common reference numerals are used for common members.

Efficiently arranging the first light emitting regions and the second light emitting regions in a checkered pattern, and the outer shape of the LED light emitting device having a substantially circular shape (polygonal shape) is {6, 12, 20, 30, 42, 56. , ...}, when one natural number n is selected from the sequence of numbers, n/2 blocks are removed at each of the four corners from a square area consisting of n ² blocks arranged in a matrix of n rows and n columns. It is represented as a substantially octagonal area.

Here, the block is a substantially square area including either the first light emitting area or the second light emitting area. By collecting n ² blocks and arranging them in n rows and n columns, a virtual light emitting portion having a substantially square shape is obtained. A region obtained by removing n/2 blocks from the four corners of the virtual light emitting portion becomes a substantially octagonal light emitting portion in which (n ² −2n) blocks are gathered. In this actual light emitting section, the first light emitting area and the second light emitting area are arranged in a checkered pattern. The first light emitting area and the second light emitting area each include one first LED die and one second LED die.

Furthermore, this LED light-emitting device comprises n first LED dies connected in series from a set of first LED dies to form (n/2-1) first LED columns. Similarly, from the set of second LED dies, n second LED dies are connected in series to form (n/2−1) second LED columns.

Next, the LED light emitting device 130 will be described with reference to FIGS. 28 and 29. The LED light emitting device 130 is a case where n=6 (t=1).

FIG. 28 is a schematic diagram of the light emitting unit 15a of the LED light emitting device 130. The LED light emitting device 130 has a smaller light emitting portion 15a than the LED light emitting device 10 and the like. That is, the light emitting unit 15a of the LED light emitting device 130 includes 12 first light emitting areas 11a and 12 second light emitting areas 12a. Since the mounting substrate 13 and the dam 15 of the LED light emitting device 130 are similar in size to each other, the plan view and the cross-sectional view of the LED light emitting device 130 are omitted, and the features of the light emitting portion 15a will be described with reference to schematic diagrams.

As shown in FIG. 28, the light emitting unit 15a is a substantially octagonal region including twelve first blocks 51 (first light emitting regions 11a) and twelve second blocks 52 (second light emitting regions 12a). is there. In the figure, the first block 51 is shown as a white block, and the second block 52 is shown as a block filled with dots. In the actual first light emitting region 11a and second light emitting region 12a, as shown in FIG. 1, a region including the die bond material 17 and the transparent resin layer 16 exists between the first light emitting region 11a and the second light emitting region 12a. However, in FIG. 28, this region is neglected in the modeling, and the first light emitting region 11a and the second light emitting region 12a are represented by the first block 51 and the second block 52 (also in FIG. 30).

In the LED light emitting device 130, the six first blocks 51 are obliquely connected to form the first LED row 11d. Similarly, the six second blocks 52 can be obliquely connected to form the second LED row 12d. The LED light emitting device 130 includes two first LED rows 11d and two second LED rows 12d. In the figure, the first LED row 11d is shown by a dotted line and the second LED row 12d is shown by a solid line.

The actual light emitting portion 15a of the LED light emitting device 130 is a portion excluding the 12 third blocks 53 shown in black from the matrix region of 6 rows and 6 columns which is a virtual light emitting portion. In the matrix area, which is a virtual light emitting unit, there are three third blocks 53 at each corner, for a total of twelve blocks. The twelve third blocks 53 are two for the first LED row 11d or the second LED row 12d. The actual light emitting portion 15a has a substantially octagonal extension, and the first blocks 51 and the second blocks 52 are arranged in a checkered pattern.

FIG. 29 is a circuit diagram of the LED light emitting device 130 shown in FIG. In the first circuit 11e, two first LED columns 11d in which six first LED dies 11b are connected in series are connected in parallel between the power supply electrodes 19a and 19c. Similarly, in the second circuit 12e, two second LED columns 12d in which six second LED dies 12b are connected in series are connected in parallel between the power supply electrodes 19b and 19d.

(14th Embodiment)
FIG. 30 is a schematic diagram of the light emitting unit 15a included in the LED light emitting device 140 shown as the fourteenth embodiment of the present invention. Note that FIG. 30 corresponds to the case of n=12 and (t=2), and is a schematic diagram of the light emitting unit 15a of the LED light emitting device 10 or the like. Further, when describing the LED light emitting device 140, FIGS. 1 to 4 are cited, and common reference numerals are used for common members in FIG.

The LED light emitting device 140 is modeled as in FIG. 28. The actual light emitting portion 15a of the LED light emitting device 140 is a portion excluding the 24 third blocks 53 shown in black from the matrix region, which is a virtual light emitting portion of 12 rows and 12 columns. In the matrix area, which is a virtual light emitting unit, there are six third blocks 53, six in each corner, for a total of 24. The 24 third blocks 53 are two for the first LED row 11d or the second LED row 12d. In the figure, as an example, one first LED row 11d is shown by a dotted line, and one second LED row 12d is shown by a solid line.

Finally, based on the LED light emitting devices 130 and 140 (FIGS. 28 to 30), the first light emitting region 11a and the second light emitting region 12a are efficiently formed while the light emitting portion 15a is formed into a substantially circular shape (a substantially octagonal shape). The conditions that can be arranged in a checkered pattern will be described in detail.

In the LED light emitting device to which the LED light emitting devices 130 and 140 belong, the actual light emitting portions 15a are arranged at four corners from a region (virtual light emitting portion) composed of n ² blocks arranged in a matrix of n rows and n columns. The areas are formed by removing n/2 third blocks, respectively. The four corner regions are approximately isosceles right triangles, and n/2 are 3, 6, 10, 15, 21,... That is, n becomes 6, 12, 20, 30, 42,...
n=t ² +3t+2 (t=1, 2, 3,...)
It is represented by. The actual light emitting unit 15a includes (n ² −2n) blocks.

In the octagonal area (actual light emitting section 15a) thus obtained, the first light emitting areas 11a and the second light emitting areas 12a are arranged in a checkered pattern, and are composed of n first light emitting areas 11a. It includes (n/2-1) first LED columns 11d and (n/2-1) second LED columns 12d formed of n second light emitting regions 12a. Note that the first LED row 11d and the second LED row 12d are skewed. By doing so, the wires 14 connecting the first LED dies 11b included in the first light emitting area 11a and the second LED dies 12b included in the second light emitting area 12a can be shortened, and efficient connection and arrangement can be achieved.

In a region (virtual light emitting portion) in which the first block 51 and the second block 52 including the first light emitting region 11a and the second light emitting region 12a are arranged in a checkered pattern in n rows and n columns, one in the first light emitting region 11a. A first LED row 11d in which n included first LED dies 11b are connected in series and a second LED row 12d in which n second LED dies 12b included in the second light emitting region 12a are connected in series are n/2 each. Can be configured. The LED light emitting devices 130 and 140 are provided with substantially octagonal regions (actual light emitting portions 15a) obtained by removing n/2 third blocks 53 from the four corners of the square matrix region. In the area, the first LED row 11d and the second LED row 12d are formed (n/2−1) each. That is, the substantially octagonal area is efficiently housed inside the annular dam 15, and even if the first light emitting areas 11a and the second light emitting areas 12a are arranged in a checkered pattern, the same number of first LED rows 11d are formed. Also, the second LED row 12d can be configured without waste.

Therefore, the LED light emitting devices 130 and 140 include the plurality of fine first light emitting areas 11a that emit the first color and the plurality of second fine light emitting areas 12a that emit the second color on the one mounting substrate 13. With the above configuration, the first light emitting region 11a and the second light emitting region 12a can be efficiently arranged in a checkered pattern while the light emitting portion 15a is circular.

10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140... LED light emitting device,
11a... a first light emitting region,
11b... the first LED die,
11c... 1st fluorescent resin layer,
11d... 1st LED row,
11e... the first circuit,
12a... the second light emitting region,
12b...second LED die,
12c...second fluorescent resin layer,
12d...second LED row,
12e... second circuit,
13... Mounting board,
14, 14a, 14b... Wires,
15... Dam,
15a... Light emitting part,
16... Transparent resin layer,
16a... transparent resin,
16b... filler,
17... Die bond material,
18a, 18b... Zener diode,
19a to 19d... Power supply electrodes,
19e to 19h... Wiring electrodes,
21... Anode,
22... Cathode,
23... P layer,
24... N layers,
27... Exposed part,
28... silver layer,
29... a protective layer,
31...Preparation process,
32... Die bond process,
33... Wire bonding process,
34... Dam formation process,
35... First fluorescent resin coating step,
36... Second fluorescent resin coating step,
37... Transparent resin coating step,
38... White resin filling step,
39... Protective resin film forming step,
51... the first block,
52... the second block,
53... the third block,
61... White resin,
62... Protective resin film.

Claims (25)

A plurality of first light emitting regions that emit a first color and a plurality of second light emitting regions that emit a second color;
The first light emitting region and the second light emitting region each include a first LED die and a second LED die, and are arranged in a checkerboard pattern on a single mounting substrate.
The first LED die and the second LED die have upper surfaces coated with a first fluorescent resin layer and a second fluorescent resin layer, respectively.
The LED light-emitting device, wherein the first fluorescent resin layer individually covers the upper portion of the first LED die in a dome shape. The LED light emitting device according to claim 1, wherein the first LED die and the second LED die have the same characteristics. The LED light emitting device according to claim 1 or 2, wherein the second fluorescent resin layer individually covers the upper portion of the second LED die in a dome shape. 4. The LED light emitting device according to claim 1, wherein the first fluorescent resin layer and the second fluorescent resin layer have different heights from each other. White resin is filled between the first LED die and the second LED die,
The LED light emitting device according to claim 3, wherein an upper surface of the white resin is higher than an upper surface of the first LED die or the second LED die. The LED light emitting device according to claim 1 or 2, wherein the second fluorescent resin layer entirely covers upper surfaces of the plurality of second LED dies. The LED light-emitting device according to any one of claims 1 to 6, further comprising a dam surrounding the first LED die and the second LED die. The LED light emitting device according to claim 1, wherein a height of the first LED die is different from a height of the second LED die. The bottom surfaces of the first LED die and the second LED die are adhered to the surface of the mounting board by a die bonding material,
9. The die bonding material contains reflective fine particles, and coats the side surfaces of the first LED die and the second LED die so as to crawl up on the side surfaces, respectively. LED light emitting device. The LED light emitting device according to claim 9, wherein the die bond material covers the surface of the mounting substrate with a gap between the first LED die and the second LED die. The mounting board has a silver layer on the surface,
The LED light emitting device according to claim 9, wherein the silver layer is exposed from the die bond material in a gap between the first LED die and the second LED die. The LED light-emitting device according to claim 9, wherein the die-bonding material has a top surface height that matches the top surface heights of the first LED die and the second LED die. The first fluorescent resin layer and the second fluorescent resin layer are each covered with a transparent resin layer,
The LED light-emitting device according to any one of claims 1 to 12, wherein the transparent resin layer contains a filler. The LED light emitting device according to claim 1, wherein the first fluorescent resin layer covers a part of an inclined surface of the die bonding material. The LED light emitting device according to claim 14, wherein the first fluorescent resin layer forms a fillet at a contact portion with the die bond material. A first wire that connects the first LEDs to each other and a second wire that connects the second LEDs to each other are provided, and at least one of the first wire and the second wire is reinforced by a coating. The LED light-emitting device according to claim 1, wherein the LED light-emitting device is a LED light-emitting device. The LED light emitting device according to claim 16, wherein at least one of the first wire and the second wire is provided with a protective resin film on a lower portion thereof. When the first wire and the second wire cross each other, one of the first wire and the second wire has a side view curve, and the other has a side view trapezoid. The LED light emitting device according to claim 16 or 17. The mounting board is composed of n ² blocks arranged in a matrix of n rows and n columns for a natural number n represented by n=t ² +3t+2 (t=1, 2, 3,...) Each of the four corners is provided with a light emitting region in which n/2 of the blocks are removed,
The block includes one of the first light emitting region and the second light emitting region,
The light emitting region includes (n/2-1) first LED rows in which the first LED dies are connected in series by n, and the second LED rows in which the second LED dies are connected in series by (n/2-1) are (n/2-1). The LED light-emitting device according to claim 1, further comprising a book. 20. The LED light emission according to claim 19, wherein the first LED dies included in the first LED array and the second LED dies included in the second LED array are connected to each other so as to be slanted with wires, respectively. apparatus. A plurality of first light emitting regions that emit a first color and a plurality of second light emitting regions that emit a second color;
The first light emitting region and the second light emitting region each include a first LED die and a second LED die, and are arranged in a checkerboard pattern on a single mounting substrate.
The upper surfaces of the first LED die and the second LED die are respectively covered with a first fluorescent resin layer and a second fluorescent resin layer,
In the method for manufacturing an LED light-emitting device, wherein the first fluorescent resin layer individually covers the upper portion of the first LED die in a dome shape,
A preparatory step of respectively preparing the mounting substrate and the plurality of first LED dies and the second LED dies;
A die bonding step of respectively adhering the first LED die and the second LED die to the mounting substrate;
A wire bonding step of connecting the first LED dies to each other and the second LED dies to each other with a wire;
A dam forming step of forming a dam around the set of the first LED die and the second LED die;
In a portion surrounded by the dam, a modified resin film is formed by pouring a solution of modified silicon into the solution to volatilize the solvent of the solution and form a protective resin film on the wire.
A first fluorescent resin coating step of individually coating a first fluorescent resin on the first LED die to form a first fluorescent resin layer;
A second fluorescent resin coating step of forming a second fluorescent resin layer by coating an upper portion of the second LED die with a second fluorescent resin. The method for manufacturing an LED light emitting device according to claim 21, further comprising a white resin filling step of filling a white resin in a gap between the first LED die and the second LED die. The LED light emitting device according to claim 21 or 22, further comprising a transparent resin coating step of coating the upper surfaces of the first fluorescent resin layer and the second fluorescent resin layer and the wire with a transparent resin layer. Manufacturing method. After the die bonding step, the first fluorescent resin coating step, the dam forming step after the first fluorescent resin coating step, and the protective resin film forming step after the dam forming step, respectively. 24. The method for manufacturing the LED light emitting device according to claim 21. In the preparation step, prepare a large-sized board, which can be obtained as a large number of mounting boards, in place of the mounting board.
25. The method according to claim 21, further comprising a step of cutting the large-sized substrate to obtain the LED light-emitting device after the transparent resin coating step or the second fluorescent resin coating step. A method for manufacturing an LED light-emitting device according to claim 1.