CN203733830U - Packaging structure of LED lamp - Google Patents

Packaging structure of LED lamp Download PDF

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Publication number
CN203733830U
CN203733830U CN201320860359.7U CN201320860359U CN203733830U CN 203733830 U CN203733830 U CN 203733830U CN 201320860359 U CN201320860359 U CN 201320860359U CN 203733830 U CN203733830 U CN 203733830U
Authority
CN
China
Prior art keywords
led chip
led lamp
filter coating
substrate
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320860359.7U
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Chinese (zh)
Inventor
林莉
李东明
贾晋
罗超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Sunfor Light Co Ltd
Original Assignee
Sichuan Sunfor Light Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Sunfor Light Co Ltd filed Critical Sichuan Sunfor Light Co Ltd
Priority to CN201320860359.7U priority Critical patent/CN203733830U/en
Application granted granted Critical
Publication of CN203733830U publication Critical patent/CN203733830U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a packaging structure of an LED lamp and belongs to the field of illumination. The problem to solve is that: under the prerequisite that color purity performance of an LED chip is not improved, the luminous efficiency and light color purity of the LED lamp are improved. The packaging structure comprises a substrate, an LED chip, a filter coating, a phosphor layer and a box dam. The substrate and the box dam arranged on the substrate form a cavity with an opening on the top. The phosphor layer, the filter coating and the LED chip are arranged in the cavity from top to bottom. Transparent colloid is filled between the filter coating and the substrate. On the one hand, by arranging the filter coating, the stray light sent by the LED chip is reduced, thus the luminous efficiency and light color purity of the LED lamp are improved; and on the other hand, when the stray light sent by the LED chip is filtered, the spectrum curve is more visual, which provides convenience for matching phosphor.

Description

LED lamp encapsulation structure
Technical field
The utility model relates to a kind of fitting structure, especially a kind of encapsulating structure of LED lamp.
Background technology
LED is that light-emitting diode is merely able to toward a direction conducting, in the time that electric current flows through, electronics overlaps therein with electric hole and sends monochromatic light, and this is electroluminescent effect, and the wavelength of light, color are relevant with the element impurity of deliberately infiltration with its semiconductor material kind adopting.The efficient height of LED light fixture, life-span be long, not cracky, the too late advantage of conventional light source such as reaction speed is fast, reliability is high.
In the time that the colorimetric purity performance of LED chip is not enough, penetrates light and there will be veiling glare.Although these veiling glare majorities can not be identified by naked eyes, the light efficiency to LED lamp and photochromic purity all have a certain impact.
Utility model content
Technical problem to be solved in the utility model is: provide a kind of and do not improving under the prerequisite of LED chip colorimetric purity performance, can improve the light efficiency of LED lamp and the LED lamp encapsulation structure of photochromic purity.
The utility model solves the technical scheme that its technical problem adopts: LED lamp encapsulation structure, comprises substrate, LED chip, filter coating, phosphor powder layer and box dam; Substrate and box dam disposed thereon form the chamber of upper opening, and phosphor powder layer, filter coating and LED chip are from top to bottom set in described chamber;
Further: described LED lamp encapsulation structure also comprises the transparent colloid being filled between filter coating and substrate.
Further: the refractive index of described transparent colloid is lower than the refractive index of LED chip.
Further: the refractive index of described transparent colloid is higher than the refractive index of phosphor powder layer.
Further: the luminous wave band of described LED chip is 452.5-455nm or 457.5-460nm; Corresponding described filter coating filtering wave band is 452.5-455nm or 457.5-460nm with it.
The beneficial effects of the utility model are: 1) reduced by filter coating the veiling glare that LED chip sends, as ultraviolet light or infrared light etc., can improve light efficiency and the photochromic purity of LED lamp; 2) after the veiling glare that LED chip sends is filtered, the curve of spectrum is more directly perceived, more convenient in fluorescent material proportioning.
Brief description of the drawings
Fig. 1 is schematic diagram of the present utility model;
Shown in figure: 101-LED chip, 102-transparent colloid, 103-filter coating, 104-phosphor powder layer, 105-box dam, 106-substrate.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further illustrated.
As shown in Figure 1, the utility model LED lamp encapsulation structure, comprises substrate 106, LED chip 101, filter coating 103, phosphor powder layer 104 and box dam 105; Substrate 106 and box dam 105 disposed thereon form the chamber of upper opening, and phosphor powder layer 104, filter coating 103 and LED chip 101 are from top to bottom set in described chamber; Between filter coating 103 and substrate 106, be filled with transparent colloid 102.
LED chip 101 is light emitting sources of LED lamp, and fluorescent material is the important auxiliary material of LED lamp.LED lamp is that light kind and the fluorescent material proportioning mode sent by adjustment LED chip 101 obtain the light needing.Because the relation such as processing conditions, manufacturing cost, the colorimetric purity performance of LED chip 101 is often not enough, causes light that LED chip 101 sends with veiling glare.Filter coating 103 is a kind of equipment that filters light, can the unwanted veiling glare of filtering.The present embodiment uses filter coating 103 to filter out the veiling glare of LED chip 101 in emitting beam, and improves the colorimetric purity of injecting phosphor powder layer 104 light.As remaining blue light only after the blue chip filtering veiling glare of white led lamps, finally again the blue light of filtering veiling glare is converted into white light with fluorescent material.Can improve so on the one hand light efficiency and the photochromic purity of LED lamp; After the veiling glare that LED chip 101 sends is on the other hand filtered, the curve of spectrum is more directly perceived, and in fluorescent material proportioning, efficiency is higher.
The present embodiment is filled with transparent colloid 102 between filter coating 103 and substrate 106.Transparent colloid 102 is fillers of a kind of printing opacity.The effect being filled between filter coating 103 and substrate 106 is: the one, support filter coating 103; The 2nd, be used for protecting chip and gold thread, improve its reliability, thereby improve the useful life of LED lamp.
In the present embodiment, the refractive index of described transparent colloid 102 is less than the refractive index of LED chip 101, and is greater than the refractive index of phosphor powder layer 104.In light transmittance process, import from the higher medium of refractive index the medium that refractive index is lower into, light loss is less, so from light source, the refractive index of light propagation medium should reduce successively.Wherein the refractive index of LED chip 101 is mainly the refractive index of LED chip epitaxial loayer; Phosphor powder layer 104 is mainly made up of fluorescent material and its encapsulating material, and what affect refractive index is mainly the composition of encapsulating material, and the refractive index of phosphor powder layer 104 approximates the refractive index of encapsulating material in general.The benefit that LED lamp is so set is: light loss is less, can improve light extraction efficiency.
In the present embodiment, the luminous wave band of described LED chip 101 is 452.5-455nm or 457.5-460nm; Corresponding described filter coating 103 filtering wave bands are 452.5-455nm or 457.5-460nm with it.Be that described LED chip 101 is divided into two kinds of A or B, the luminous wave band of A is 452.5-455nm, and the luminous wave band of B is 457.5-460nm; Corresponding described filter coating 103 is divided into two kinds of A or B with it, the light of A beyond can cut-off wavelength 452.5-455nm, and B can end the light of wave band beyond 457.5-460nm.The luminous wave band of blue-light LED chip generally using is now generally at 450-460nm, and the wave band that design filter coating 103 filters is 450-460nm, and the veiling glare of other wave band is all filtered out.But for better performance, in chip selection process, can select more short-wave band as 452.5-455nm or 457.5-460nm.Select glow frequency at the LED of the LED chip of these two wave bands lamp, the light consistency of sending is higher, and color is corrected, product quality is higher.

Claims (5)

1.LED lamp encapsulation structure, comprises substrate (106), LED chip (101), phosphor powder layer (104) and box dam (105);
Substrate (106) and box dam (105) disposed thereon form the chamber of upper opening, and phosphor powder layer (104) and LED chip (101) are from top to bottom set in this chamber;
It is characterized in that: also comprise the filter coating (103) being arranged between phosphor powder layer (104) and LED chip (101).
2. LED lamp encapsulation structure as claimed in claim 1, is characterized in that: also comprise the transparent colloid (102) being filled between filter coating (103) and substrate (106).
3. LED lamp encapsulation structure as claimed in claim 2, is characterized in that: the refractive index of described transparent colloid (102) is less than the refractive index of LED chip (101).
4. LED lamp encapsulation structure as claimed in claim 2, is characterized in that: the refractive index of described transparent colloid (102) is greater than the refractive index of phosphor powder layer (104).
5. LED lamp encapsulation structure as described in claim 1,2,3 or 4, is characterized in that: the luminous wave band of described LED chip (101) is 452.5-455nm or 457.5-460nm; Corresponding described filter coating (103) filtering wave band is 452.5-455nm or 457.5-460nm with it.
CN201320860359.7U 2013-12-24 2013-12-24 Packaging structure of LED lamp Expired - Fee Related CN203733830U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320860359.7U CN203733830U (en) 2013-12-24 2013-12-24 Packaging structure of LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320860359.7U CN203733830U (en) 2013-12-24 2013-12-24 Packaging structure of LED lamp

Publications (1)

Publication Number Publication Date
CN203733830U true CN203733830U (en) 2014-07-23

Family

ID=51203878

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320860359.7U Expired - Fee Related CN203733830U (en) 2013-12-24 2013-12-24 Packaging structure of LED lamp

Country Status (1)

Country Link
CN (1) CN203733830U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110797451A (en) * 2018-08-01 2020-02-14 北京国科亿欧科技有限责任公司 LED packaging structure for spectrum adjustment
CN112103383A (en) * 2019-06-17 2020-12-18 李崇华 White light emitting diode, backlight module comprising same and display device
CN113725248A (en) * 2021-08-24 2021-11-30 上海天马微电子有限公司 Display device and manufacturing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110797451A (en) * 2018-08-01 2020-02-14 北京国科亿欧科技有限责任公司 LED packaging structure for spectrum adjustment
CN112103383A (en) * 2019-06-17 2020-12-18 李崇华 White light emitting diode, backlight module comprising same and display device
CN112103383B (en) * 2019-06-17 2022-06-03 李崇华 White light emitting diode, backlight module comprising same and display device
CN113725248A (en) * 2021-08-24 2021-11-30 上海天马微电子有限公司 Display device and manufacturing method thereof

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140723

Termination date: 20181224