CN203720412U - A novel coupling structure for an optical waveguide and a photoelectric chip - Google Patents
A novel coupling structure for an optical waveguide and a photoelectric chip Download PDFInfo
- Publication number
- CN203720412U CN203720412U CN201320865929.1U CN201320865929U CN203720412U CN 203720412 U CN203720412 U CN 203720412U CN 201320865929 U CN201320865929 U CN 201320865929U CN 203720412 U CN203720412 U CN 203720412U
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- Prior art keywords
- chip
- optical waveguide
- photoelectric chip
- transparency carrier
- photoelectric
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- 230000003287 optical effect Effects 0.000 title claims abstract description 42
- 230000008878 coupling Effects 0.000 title claims abstract description 23
- 238000010168 coupling process Methods 0.000 title claims abstract description 23
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000005342 ion exchange Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 7
- 238000007493 shaping process Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The utility model discloses a novel coupling structure for an optical waveguide and a photoelectric chip. The novel coupling structure for the optical waveguide and a photoelectric chip comprises the optical waveguide chip and the photoelectric chip. An end surface of the optical waveguide chip is polished to be an end surface with an angle of 45 degrees. A transparent substrate which light waves can penetrate through is arranged between the optical waveguide and the photoelectric chip. According to the novel coupling structure for an optical waveguide and the photoelectric chip of the utility model, compact hermetic sealing of the photoelectric chip can be directly realized; the packaging density is raised; simultaneously, effective protection can be carried out on the optical waveguide chip; and forces between the optical waveguide chip and an upper level circuit and the photoelectric chip is are buffered.
Description
Technical field
The utility model relates to optical fiber communication, relates in particular to the coupled structure between a kind of optical waveguide and photoelectric chip.
Background technology
The development of society, information data magnanimity increases severely, and the technology such as information calculating, transmission are had higher requirement and challenged.Optical communication relies on its plurality of advantages, applies more and more extensively, and transfer rate is more and more higher.From intercity extra long distance transmission, to the LAN (Local Area Network) transmission of equipment room, the scope of light interconnection constantly increases, and the study hotspot of industry has extended to the chip-scale light interconnection in chip chamber and same chip at present.The light interconnection of chip-scale, has proposed in the industry kinds of schemes at present.One of them important directions, adopts optical waveguide to realize the light transmission of chip chamber.Integration density, coupling efficiency, reliability and cost are all the emphasis of studying at present.
Chip chamber relies on optical waveguide to carry out in the typical patent scheme of photoelectricity transmission, and chip of light waveguide is the one deck in multilayer board, and optical waveguide end face exists hole to connect to photoelectric chip surface, adopts glue to bond between each layer of circuit board and optical waveguide.This encapsulating structure requires photoelectric chip (as photodetector) to carry out enough air-tight packaging, is not suitable for more highdensity naked core chip level encapsulation.
Utility model content
In order to overcome the above problems, the utility model provides the novel coupling structure of a kind of optical waveguide and photoelectric chip, introduces layer of transparent substrate between optical waveguide and photoelectric chip, can directly realize the compact level Hermetic Package of photoelectric chip, improves packaging density.This transparency carrier can effectively be protected chip of light waveguide simultaneously, the stress between buffered optical waveguide chip and upper strata circuit and photoelectric chip.
The utility model adopts following technical scheme:
The novel coupling structure of a kind of optical waveguide and photoelectric chip, comprise chip of light waveguide and photoelectric chip, the end face of described chip of light waveguide is polished to the end face of 45° angle, between described chip of light waveguide and described photoelectric chip, is also provided with the transparency carrier that light wave can penetrate.
Preferably, the place that the upper surface light wave of described transparency carrier passes is provided with a locating slot, fixes a lens pillar in described locating slot.
Preferably, the place of passing at the upper surface light wave of transparency carrier is provided with a locating slot, and described locating slot is fixed a spherical lens.
Preferably, the upper surface of described transparency carrier is provided with semi-sphere lens, and the hemisphere face of described Semi-spherical face lenses is towards described photoelectric chip.
Preferably, an optical waveguide along direction of beam propagation is set between the upper and lower surface of described transparency carrier.
Preferably, at the upper and lower both sides processing of described transparency carrier gradual index lens, two described lens are relative, and are located along the same line.
Preferably, described chip of light waveguide is silicon waveguide chip or silica based waveguide chip or ion-exchange waveguides chip or polymer waveguide chip.
Preferably, on described transparency carrier, be manufactured with pad, described photoelectric chip is by described pad and the welding of described transparency carrier, and described transparency carrier and described chip of light waveguide are bonding by glue
The beneficial effects of the utility model are:
The utility model arranges the transparency carrier that light wave can penetrate between chip of light waveguide and photoelectric chip, can directly realize the compact level Hermetic Package of photoelectric chip, improves packaging density.This transparency carrier can effectively be protected chip of light waveguide simultaneously, the stress between buffered optical waveguide chip and upper strata circuit and photoelectric chip.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model the first embodiment.
Fig. 2 is the structural representation of the utility model the second embodiment.
Fig. 3 is the locating slot of the utility model the second embodiment and the vertical view of lens pillar.
Fig. 4 is the structural representation of the utility model the 3rd embodiment.
Fig. 5 is the structural representation of the utility model the 4th embodiment.
Fig. 6 is the structural representation of the utility model the 5th embodiment.
Fig. 7 is the structural representation of the utility model the 6th embodiment.
Description of reference numerals:
1 ... photoelectric chip 2 ... pad 3 ... transparency carrier
4 ... chip of light waveguide 5 ... lens pillar 6 ... locating slot
7 ... spherical lens 8 ... gradual index lens 9 ... optical waveguide
Embodiment
Below in conjunction with the Fig. 1 to Fig. 7 in accompanying drawing, the novel coupling structure of optical waveguide of the present utility model and photoelectric chip is described in further detail.
The first embodiment of the present utility model, please refer to Fig. 1, comprises chip of light waveguide 4 and photoelectric chip 1, and the end face of chip of light waveguide 4 is polished to the end face of 45° angle, is also provided with the transparency carrier 3 that light wave can penetrate between chip of light waveguide 4 and photoelectric chip 1.On transparency carrier 3, be manufactured with pad 2, photoelectric chip 1 welds by pad 2 and transparency carrier 3, and transparency carrier 3 is bonding by glue with chip of light waveguide 4.In chip of light waveguide 4, the light wave of transmission, after the end face reflection of 45° angle, changes 90 ° of backward upper transmission of direction, arrives photoelectric chip 1 through transparency carrier 3.Transparency carrier 3, as the sealed window of photoelectric chip 1, provides seal protection, allows passing through of light wave, in addition, the stress between all right buffered optical waveguide chip 4 and upper strata circuit, photoelectric chip 1, protection chip of light waveguide 4, makes it avoid damage.
In the present embodiment, chip of light waveguide 4 can be silicon waveguide chip, silica based waveguide chip, ion-exchange waveguides chip or polymer waveguide chip; The material of transparency carrier 3 for allowing communication light wave to penetrate, such as glass, silicon chip, polymkeric substance etc.
The second embodiment of the present utility model, please refer to Fig. 2 and Fig. 3, on the basis of the first embodiment, the place of passing at the upper surface light wave of transparency carrier 3, process a locating slot 6, a lens pillar 5 is fixed in locating slot 6, the light beam that optical waveguide exit end is come carries out shaping, resolved beam arrives the divergence problem on photoelectric chip 1 surface, realizes the efficient coupling of light beam and small size photoelectric chip 1.
The 3rd embodiment of the present utility model, please refer to Fig. 4, on the basis of the second embodiment, lens pillar 5 is changed to spherical lens 7, be fixed in locating slot 6, the light beam that can come to optical waveguide exit end equally carries out shaping, the divergence problem of resolved beam, the coupling efficiency of raising light beam and photoelectric chip 1.
The 4th embodiment of the present utility model, please refer to Fig. 5, on the basis of the first embodiment, at the fixing semi-sphere lens 8 of upper surface of transparency carrier 3, the hemisphere face of Semi-spherical face lenses 8 is towards photoelectric chip 1, the light beam that can come to optical waveguide exit end focuses on shaping, improves the coupling efficiency of light beam and photoelectric chip 1.
The 5th embodiment of the present utility model, please refer to Fig. 6, one optical waveguide 9 along direction of beam propagation is set between the upper and lower surface of transparency carrier 3, electromagnetic total reflection phenomenon makes light wave be limited in the interior propagation of optical waveguide 9, optical waveguide 9 limits light wave and disperses, thereby improves the coupling efficiency of light beam and photoelectric chip 1.
The 6th embodiment of the present utility model, please refer to Fig. 7, inside surface in described transparency carrier both sides Shang Xia 3 is processed respectively gradual index lens 8, the hemisphere face of two lens 8 is relative, can play equally the effect of light beam being carried out to shaping, effectively improve the coupling efficiency between light beam and photoelectric chip 1.
The beneficial effects of the utility model are: by transparency carrier being set between chip of light waveguide and photoelectric chip; this transparency carrier, as the sealed window of photoelectric chip, provides seal protection, allows passing through of light wave; can directly realize the compact level Hermetic Package of photoelectric chip, improve packaging density.This transparency carrier can effectively be protected chip of light waveguide simultaneously, the stress between buffered optical waveguide chip and upper strata circuit and photoelectric chip.By reshaping structure is set on transparency carrier, the divergence problem of resolved beam from optical waveguide exit end to photoelectric chip surface, realizes the efficient coupling of light beam and small size photoelectric chip.
The above is preferred implementation of the present utility model; but can not serve as protection domain of the present utility model; every equivalence variation of making according to the design spirit in the utility model or modification or geometric ratio zoom in or out etc., all should think and fall into protection domain of the present utility model.
Claims (8)
1. the novel coupling structure of an optical waveguide and photoelectric chip, it is characterized in that: comprise chip of light waveguide and photoelectric chip, the end face of described chip of light waveguide is polished to the end face of 45° angle, between described chip of light waveguide and described photoelectric chip, is also provided with the transparency carrier that light wave can penetrate.
2. the novel coupling structure of optical waveguide according to claim 1 and photoelectric chip, is characterized in that: the place that the upper surface light wave of described transparency carrier passes is provided with a locating slot, fixes a lens pillar in described locating slot.
3. the novel coupling structure of optical waveguide according to claim 1 and photoelectric chip, is characterized in that: the place of passing at the upper surface light wave of transparency carrier is provided with a locating slot, and described locating slot is fixed a spherical lens.
4. the novel coupling structure of optical waveguide according to claim 1 and photoelectric chip, is characterized in that: the upper surface of described transparency carrier is provided with semi-sphere lens, and the hemisphere face of described Semi-spherical face lenses is towards described photoelectric chip.
5. the novel coupling structure of optical waveguide according to claim 1 and photoelectric chip, is characterized in that: an optical waveguide along direction of beam propagation is set between the upper and lower surface of described transparency carrier.
6. the novel coupling structure of optical waveguide according to claim 1 and photoelectric chip, is characterized in that: at the upper and lower both sides processing of described transparency carrier gradual index lens, two described lens are relative, and are located along the same line.
7. according to the arbitrary described optical waveguide of claim 1-6 and the novel coupling structure of photoelectric chip, it is characterized in that: described chip of light waveguide is silicon waveguide chip or silica based waveguide chip or ion-exchange waveguides chip or polymer waveguide chip.
8. according to the arbitrary described optical waveguide of claim 1-6 and the novel coupling structure of photoelectric chip, it is characterized in that: on described transparency carrier, be manufactured with pad, described photoelectric chip is by described pad and the welding of described transparency carrier, and described transparency carrier and described chip of light waveguide are bonding by glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320865929.1U CN203720412U (en) | 2013-12-25 | 2013-12-25 | A novel coupling structure for an optical waveguide and a photoelectric chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320865929.1U CN203720412U (en) | 2013-12-25 | 2013-12-25 | A novel coupling structure for an optical waveguide and a photoelectric chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203720412U true CN203720412U (en) | 2014-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320865929.1U Expired - Lifetime CN203720412U (en) | 2013-12-25 | 2013-12-25 | A novel coupling structure for an optical waveguide and a photoelectric chip |
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| Country | Link |
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| CN (1) | CN203720412U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104238045A (en) * | 2014-09-22 | 2014-12-24 | 华进半导体封装先导技术研发中心有限公司 | Slide glass used for photoelectric device packaging |
| CN106908911A (en) * | 2015-12-23 | 2017-06-30 | 福州高意通讯有限公司 | A kind of optical transceiver module for multidiameter delay transmission |
-
2013
- 2013-12-25 CN CN201320865929.1U patent/CN203720412U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104238045A (en) * | 2014-09-22 | 2014-12-24 | 华进半导体封装先导技术研发中心有限公司 | Slide glass used for photoelectric device packaging |
| CN106908911A (en) * | 2015-12-23 | 2017-06-30 | 福州高意通讯有限公司 | A kind of optical transceiver module for multidiameter delay transmission |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, Zhongxing new industrial park, 1 new head road, Bantian street, Longgang District, Guangdong, Shenzhen Patentee after: SINDI TECHNOLOGIES CO.,LTD. Address before: 518000, Zhongxing new industrial park, 1 new head road, Bantian street, Longgang District, Guangdong, Shenzhen Patentee before: Shenzhen Zhongxing Xindi Telecom Equipment Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140716 |
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| CX01 | Expiry of patent term |