CN203706079U - Heat collecting plate and sheet copper component for heat dissipation mould of notebook computer - Google Patents
Heat collecting plate and sheet copper component for heat dissipation mould of notebook computer Download PDFInfo
- Publication number
- CN203706079U CN203706079U CN201320802176.XU CN201320802176U CN203706079U CN 203706079 U CN203706079 U CN 203706079U CN 201320802176 U CN201320802176 U CN 201320802176U CN 203706079 U CN203706079 U CN 203706079U
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- collecting plate
- rectangular opening
- copper sheet
- sides
- convex closure
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Abstract
The utility model discloses a heat collecting plate and sheet copper component for a heat dissipation mould of a notebook computer. The component comprises a heat collecting plate (1) and a sheet copper (2), wherein the heat collecting plate (1) is a rectangular plate, and a rectangular hole (1a) is formed in the middle of the rectangular plate in the long direction; convex hulls (3) are arranged on both sides of the long edge of the rectangular hole (1a); both sides of the sheet copper (2) are riveted to the lower surfaces of the convex hulls (3) on both sides of the rectangular hole (1a); a baffle (4) is arranged on one sides, which is close to the rectangular hole (1a), of each convex hull, and downward bends (5) are respectively arranged on the left side and the right side of the heat collecting plate (1); mounting journal stirrups (6) are respectively arranged at both ends of the bends (5) on the left side and the right side of the heat collecting plate (1); mounting holes (7) are formed in the mounting journal stirrups (6); an L-shaped fastener (8) is arranged on the heat collecting plate (1). The component has the advantages of reasonableness in design, simple structure, easiness in implementation, convenience in use and assembly, good assembly intensity and good heat dissipation effect.
Description
Technical field
The utility model relates to a kind of collecting plate and copper sheet assembly of laptop heat-dissipation module.
Background technology
Along with improving constantly of the heat-generating electronic elements power such as central processing unit (CPU), heat dissipation problem is more and more subject to people's attention, all the more so in notebook computer.
In field of radiating, technology adopts heat radiation module to dispel the heat to heat-generating electronic elements conventionally now, at present, the heat radiation module that most of notebook computers use is generally made up of the collecting plate of fan, heat pipe, copper sheet, fin and aluminum etc., the two ends of this heat pipe are separately fixed in collecting plate and fins group, copper sheet is welded on collecting plate, the surface of copper sheet is by molten heat-conducting cream adhering chip, because the collecting plate surface of aluminum can form highly stable oxide layer, therefore usually bad welding of the welding of copper sheet, weld strength is poor, is prone to loosening.Secondly, existing heat pipe is to be also welded on collecting plate, and welding effect is poor, heat radiation module assembly process complexity.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of copper sheet and collecting plate to be connected firmly, and heat pipe does not need welding, and assembly process is simple, collecting plate and the copper sheet assembly of the laptop heat-dissipation module of good heat dissipation effect.
The technical solution of the utility model is as follows: a kind of collecting plate of laptop heat-dissipation module and copper sheet assembly, comprise collecting plate (1) and copper sheet (2), it is characterized in that: described collecting plate (1) is rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described collecting plate (1), right side is respectively equipped with downward bending (5), on a left side for described collecting plate (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), described collecting plate (1) is upper is provided with L shaped clamp (8) near rectangular opening (1a), the upper end of the vertical bar of described L shaped clamp (8) connects transverse bar, the length of described transverse bar is more than or equal to the width of rectangular opening (1a), the lower end of the vertical bar of described L shaped clamp (8) is fixed on the collecting plate (1) in rectangular opening (1a) outside, and described transverse bar is along the Width setting of rectangular opening (1a).
Adopt technique scheme, in the both sides of rectangular opening, convex closure is set, copper sheet is fixed on to the lower surface of convex closure by the mode of riveted joint, do not need welding, constant intensity is good.Secondly, two heat pipes are contained on copper sheet, and before being stuck in the baffle plate of two convex closures, by two baffle plate stationary positioned,, heat pipe are stuck on L shaped clamp meanwhile, do not need welding, and assembly process is simple, fixation.Secondly, heat pipe directly and the back side close contact of copper sheet, take away by the heat that chip is delivered on copper sheet, and radiating effect is better.Finally, we arrange bending in the both sides of collecting plate, at the two ends of bending, installation journal stirrup is set, increase on the one hand the intensity of plate body, on the other hand, the installed surface of journal stirrup and CPU is installed and can be realized well laminating, and directly more easily process than bending on journal stirrup is directly being installed in the bending of the both sides of collecting plate.
In technique scheme: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
In technique scheme: described bending (5) is 100-120 degree with the angle (a) of collecting plate (1).
In technique scheme: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
Beneficial effect: the utility model is reasonable in design, simple in structure, enforcement is easy, easy to use, easy to assembly, and assembling intensity is good, good heat dissipation effect.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
Upper and lower, left and right of the present utility model, front and back are the relative position in representative graph only, does not represent the absolute position of product.
As shown in Figure 1, the collecting plate of laptop heat-dissipation module of the present utility model and copper sheet assembly are mainly made up of parts such as collecting plate 1, copper sheet 2, convex closure 3, baffle plate 4, bending 5, installation journal stirrups 6, described collecting plate 1 is a rectangular slab of being made up of aluminium alloy, middle part at rectangular slab is provided with rectangular opening 1a along its length, the both sides on the long limit of described rectangular opening 1a are provided with convex closure 3, the length of described convex closure 3 is less than the length of rectangular opening 1a, and described convex closure 3 is positioned at the middle part of rectangular opening 1a both sides.The lower surface of the convex closure 3 that is riveted on rectangular opening 1a both sides is riveted in the both sides of described copper sheet 2 by salient point, a side near rectangular opening 1a on each described convex closure 3 is provided with baffle plate 4, described baffle plate 4 is positioned at the middle part of convex closure 3, the left and right side of described collecting plate 1 is respectively equipped with downward bending 5, described bending 5 is 100-120 degree with the angle a of collecting plate 1, be respectively equipped with journal stirrup 6 is installed at the two ends of the bending 5 of the left and right side of described collecting plate 1, on described installation journal stirrup 6, be provided with mounting hole 7.Collecting plate 1 is arranged on CPU by the mounting hole 7 of installing on journal stirrup 6.On described collecting plate 1, be provided with L shaped clamp 8 near rectangular opening 1a, the height of L shaped clamp 8 and the matched of heat pipe, transverse bar is pressed on heat pipe, the upper end of the vertical bar of described L shaped clamp 8 connects transverse bar, the length of described transverse bar is more than or equal to the width of rectangular opening 1a, the lower end of the vertical bar of described L shaped clamp 8 is fixed on the collecting plate 1 in rectangular opening 1a outside, and described transverse bar is along the Width setting of rectangular opening 1a.
Claims (4)
1. the collecting plate of a laptop heat-dissipation module and copper sheet assembly, comprise collecting plate (1) and copper sheet (2), it is characterized in that: described collecting plate (1) is rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described collecting plate (1), right side is respectively equipped with downward bending (5), on a left side for described collecting plate (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), described collecting plate (1) is upper is provided with L shaped clamp (8) near rectangular opening (1a), the upper end of the vertical bar of described L shaped clamp (8) connects transverse bar, the length of described transverse bar is more than or equal to the width of rectangular opening (1a), the lower end of the vertical bar of described L shaped clamp (8) is fixed on the collecting plate (1) in rectangular opening (1a) outside, and described transverse bar is along the Width setting of rectangular opening (1a).
2. the collecting plate of laptop heat-dissipation module and copper sheet assembly according to claim 1, is characterized in that: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
3. the collecting plate of laptop heat-dissipation module and copper sheet assembly according to claim 1, is characterized in that: described bending (5) is 100-120 degree with the angle (a) of collecting plate (1).
4. the collecting plate of laptop heat-dissipation module and copper sheet assembly according to claim 1, is characterized in that: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320802176.XU CN203706079U (en) | 2013-12-08 | 2013-12-08 | Heat collecting plate and sheet copper component for heat dissipation mould of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320802176.XU CN203706079U (en) | 2013-12-08 | 2013-12-08 | Heat collecting plate and sheet copper component for heat dissipation mould of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203706079U true CN203706079U (en) | 2014-07-09 |
Family
ID=51056485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320802176.XU Expired - Fee Related CN203706079U (en) | 2013-12-08 | 2013-12-08 | Heat collecting plate and sheet copper component for heat dissipation mould of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203706079U (en) |
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2013
- 2013-12-08 CN CN201320802176.XU patent/CN203706079U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20141208 |
|
| EXPY | Termination of patent right or utility model |