CN203606759U - Mistake-proof heat dissipation board body and copper sheet assembly of notebook computer heat dissipation module - Google Patents
Mistake-proof heat dissipation board body and copper sheet assembly of notebook computer heat dissipation module Download PDFInfo
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- CN203606759U CN203606759U CN201320798888.9U CN201320798888U CN203606759U CN 203606759 U CN203606759 U CN 203606759U CN 201320798888 U CN201320798888 U CN 201320798888U CN 203606759 U CN203606759 U CN 203606759U
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- copper sheet
- plate body
- heat radiation
- radiation plate
- heat dissipation
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Abstract
The utility model discloses a mistake-proof heat dissipation board body and copper sheet assembly of a notebook computer heat dissipation module. The mistake-proof heat dissipation board body and copper sheet assembly of the notebook computer heat dissipation module comprises a heat collection board body 1 and a copper sheet 2. The heat collection board body 1 is a rectangular board, a rectangular hole 1a is formed in the middle of the rectangular board in the length direction, convex hulls 3 are arranged on the two sides of the long side of the rectangular hole 1a, the two sides of the copper sheet 2 are connected to the lower surfaces of the convex hulls 3 on the two sides of the rectangular hole 1a in a riveted mode, a baffle 4 is arranged on one side, close to one side of the rectangular hole 1a, on each convex hull 3, downward bends 5 are arranged on the left and the right of the heat collection board body 1 respectively, mounting support lugs 6 are arranged at the two ends of the bends 5 on the left and the right of the heat collection board body 1, mounting holes 7 are formed in the mounting support lugs 6, and a mistake-proof notch 8 is formed in the front side of the heat collection board body 1. The mistake-proof heat collection board body and copper sheet assembly of the notebook computer heat dissipation module is reasonable in design, simple in structure, easy to implement, convenient to use and assemble, and good in assembly strength and heat dissipation effect.
Description
Technical field
The utility model relates to a kind of heat radiation plate body and copper sheet assembly of mistake proofing laptop heat-dissipation module.
Background technology
Along with improving constantly of the heat-generating electronic elements power such as central processing unit (CPU), heat dissipation problem is more and more subject to people's attention, all the more so in notebook computer.
In field of radiating, technology adopts heat radiation module to dispel the heat to heat-generating electronic elements conventionally now, at present, the heat radiation module that most of notebook computers use is generally made up of the heat radiation plate body of fan, heat pipe, copper sheet, fin and aluminum etc., the two ends of this heat pipe are separately fixed in heat radiation plate body and fins group, copper sheet is welded on heat radiation plate body, the surface of copper sheet is by molten heat-conducting cream adhering chip, because the heat sink surface of aluminum can form highly stable oxide layer, therefore usually bad welding of the welding of copper sheet, weld strength is poor, is prone to loosening.Secondly, existing heat pipe is to be also welded on heat radiation plate body, and welding effect is poor, heat radiation module assembly process complexity.On existing heat radiation plate body, there is no mistake proofing mark, when processing, assembling, easily make mistakes.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of copper sheet and heat radiation plate body to be connected firmly, and heat pipe does not need welding, and assembly process is simple, heat radiation plate body and the copper sheet assembly of the mistake proofing laptop heat-dissipation module of good heat dissipation effect.
The technical solution of the utility model is as follows: a kind of heat radiation plate body of mistake proofing laptop heat-dissipation module and copper sheet assembly, comprise heat radiation plate body (1) and copper sheet (2), described heat radiation plate body (1) is rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), the front side of described heat radiation plate body (1) is provided with mistake proofing breach (8).
Adopt technique scheme, in the both sides of rectangular opening, convex closure is set, copper sheet is fixed on to the lower surface of convex closure by the mode of riveted joint, do not need welding, constant intensity is good.Secondly, two heat pipes are contained on copper sheet, and before being stuck in the baffle plate of two convex closures, by two baffle plate stationary positioned, do not need welding, and assembly process is simple.Secondly, heat pipe directly contacts with the back side of copper sheet, and the heat that chip is delivered on copper sheet is taken away, and radiating effect is better.Finally, we arrange bending in the both sides of heat radiation plate body, at the two ends of bending, installation journal stirrup is set, increase on the one hand the intensity of plate body, on the other hand, the installed surface of journal stirrup and CPU is installed and can be realized well laminating, and directly more easily process than bending on journal stirrup is directly being installed in the both sides bending of heat radiation plate body.Arrange and misplace breach in heat radiation plate body front side, avoid makeing mistakes in production run, while avoiding assembling, make mistakes.
In technique scheme: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
In technique scheme: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
In technique scheme: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
In technique scheme: described heat radiation plate body (1) is stamped to form by aluminium alloy.Easy to process.
Beneficial effect: the utility model is reasonable in design, simple in structure, enforcement is easy, easy to use, easy to assembly, and assembling intensity is good, good heat dissipation effect.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
Upper and lower, left and right of the present utility model, front and back are the relative position in representative graph only, does not represent the absolute position of product.
As shown in Figure 1, the heat radiation plate body of laptop heat-dissipation module of the present utility model and copper sheet assembly are mainly made up of parts such as heat radiation plate body 1, copper sheet 2, convex closure 3, baffle plate 4, bending 5, installation journal stirrups 6, described heat radiation plate body 1 is a rectangular slab of being made up of aluminium alloy, middle part at rectangular slab is provided with rectangular opening 1a along its length, the both sides on the long limit of described rectangular opening 1a are provided with convex closure 3, the length of described convex closure 3 is less than the length of rectangular opening 1a, and described convex closure 3 is positioned at the middle part of rectangular opening 1a both sides.The lower surface of the convex closure 3 that is riveted on rectangular opening 1a both sides is riveted in the both sides of described copper sheet 2 by salient point, a side near rectangular opening 1a on each described convex closure 3 is provided with baffle plate 4, described baffle plate 4 is positioned at the middle part of convex closure 3, the left and right side of described heat radiation plate body 1 is respectively equipped with downward bending 5, described bending 5 is 100-120 degree with the angle a of heat radiation plate body 1, be respectively equipped with journal stirrup 6 is installed at the two ends of the bending 5 of the left and right side of described heat radiation plate body 1, on described installation journal stirrup 6, be provided with mounting hole 7.Heat radiation plate body 1 is arranged on CPU above by the mounting hole 7 of installing on journal stirrup 6, and the front side of described heat radiation plate body 1 is provided with mistake proofing breach 8.Avoid makeing mistakes in the time producing and assemble.
Claims (5)
1. the heat radiation plate body of a mistake proofing laptop heat-dissipation module and copper sheet assembly, comprise heat radiation plate body (1) and copper sheet (2), it is characterized in that: described heat radiation plate body (1) is rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), the front side of described heat radiation plate body (1) is provided with mistake proofing breach (8).
2. a kind of heat radiation plate body of mistake proofing laptop heat-dissipation module and copper sheet assembly according to claim 1, is characterized in that: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
3. a kind of heat radiation plate body of mistake proofing laptop heat-dissipation module and copper sheet assembly according to claim 1, is characterized in that: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
4. a kind of heat radiation plate body of mistake proofing laptop heat-dissipation module and copper sheet assembly according to claim 1, is characterized in that: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
5. a kind of heat radiation plate body of mistake proofing laptop heat-dissipation module and copper sheet assembly according to claim 1, is characterized in that: described heat radiation plate body (1) is stamped to form by aluminium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320798888.9U CN203606759U (en) | 2013-12-08 | 2013-12-08 | Mistake-proof heat dissipation board body and copper sheet assembly of notebook computer heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320798888.9U CN203606759U (en) | 2013-12-08 | 2013-12-08 | Mistake-proof heat dissipation board body and copper sheet assembly of notebook computer heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203606759U true CN203606759U (en) | 2014-05-21 |
Family
ID=50719422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320798888.9U Expired - Fee Related CN203606759U (en) | 2013-12-08 | 2013-12-08 | Mistake-proof heat dissipation board body and copper sheet assembly of notebook computer heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203606759U (en) |
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2013
- 2013-12-08 CN CN201320798888.9U patent/CN203606759U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140521 Termination date: 20141208 |
|
| EXPY | Termination of patent right or utility model |