CN203606758U - Heat dissipation module for notebook computer - Google Patents

Heat dissipation module for notebook computer Download PDF

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Publication number
CN203606758U
CN203606758U CN201320798886.XU CN201320798886U CN203606758U CN 203606758 U CN203606758 U CN 203606758U CN 201320798886 U CN201320798886 U CN 201320798886U CN 203606758 U CN203606758 U CN 203606758U
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CN
China
Prior art keywords
heat radiation
heat dissipation
plate body
rectangular opening
copper sheet
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Expired - Fee Related
Application number
CN201320798886.XU
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Chinese (zh)
Inventor
项彬
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Chongqing Qiaocheng Technology Development Co Ltd
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Chongqing Qiaocheng Technology Development Co Ltd
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Priority to CN201320798886.XU priority Critical patent/CN203606758U/en
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Publication of CN203606758U publication Critical patent/CN203606758U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a heat dissipation module for a notebook computer. The heat dissipation module comprises a heat dissipation plate, a copper sheet, two heat pipes, a fan and a heat dissipation fin set. The heat dissipation plate is a rectangular plate, a rectangular hole is formed in the middle of the rectangular plate, and bumps are arranged on the two sides of each long edge of the rectangular hole. The two sides of the copper sheet are connected to the lower surfaces of the bumps on the two sides of the rectangular hole in a riveting mode. A baffle is arranged on the side, close to the rectangular hole, of each bump. The left side and the right side of the heat dissipation plate are respectively provided with a downward elbow, and the elbows are provided with mounting lugs which are provided with mounting holes. The two heat pipes are of a flat shape and are installed on the copper sheet, the two heat pipes are clamped between the two baffles side by side, and the two heat pipes are further respectively clamped in an L-shaped clamp on the heat dissipation plate and both connected with the heat dissipation fin set. The heat dissipation fin set is installed to an air outlet of the fan. The heat dissipation module for the notebook computer is reasonable in design, simple in structure, easy to implement, convenient to use and assemble, high in assembly strength and good in heat dissipation effect.

Description

The heat radiation module of notebook
Technical field
The utility model relates to a kind of heat radiation module of notebook.
Background technology
Along with improving constantly of the heat-generating electronic elements power such as central processing unit (CPU), heat dissipation problem is more and more subject to people's attention, all the more so in notebook computer.
In field of radiating, technology adopts heat radiation module to dispel the heat to heat-generating electronic elements conventionally now, at present, the heat radiation module that most of notebook computers use is generally by fan, heat pipe, copper sheet, the compositions such as the heat radiation plate body of fin and aluminum, the two ends of this heat pipe are separately fixed in heat radiation plate body and fins group, fin is assembled the air outlet of sub-fan, copper sheet is welded on heat radiation plate body, the surface of copper sheet is by molten heat-conducting cream adhering chip, because the heat sink surface of aluminum can form highly stable oxide layer, therefore usually bad welding of the welding of copper sheet, weld strength is poor, be prone to loosening.Secondly, existing heat pipe is to be also welded on heat radiation plate body, and welding effect is poor, heat radiation module assembly process complexity.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of copper sheet and heat radiation plate body to be connected firmly, and heat pipe does not need welding, heat pipe fixation, and assembly process is simple, the heat radiation module of the notebook of good heat dissipation effect.
The technical solution of the utility model is as follows: a kind of heat radiation module of notebook, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (8), fan (9) and radiating fin group (10), it is characterized in that: described heat radiation plate body (1) is rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), described heat radiation plate body (1) is upper is provided with two L shaped clamps (11) side by side relatively near rectangular opening (1a), the transverse bar of two L shaped clamps (11) is along the Width setting of rectangular opening (1a), described heat pipe (8) is flat, two described heat pipes (8) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (8), two described heat pipes (8) are clamped between two baffle plates (4), two described heat pipes (8) are also stuck in a L shaped clamp (11), wherein one end of two described heat pipes (8) is connected with radiating fin group (10), described radiating fin group (10) is arranged on the air outlet of described fan (9).
Adopt technique scheme, in the both sides of the rectangular opening of described heat radiation plate body, convex closure is set, copper sheet is fixed on to the lower surface of convex closure by the mode of riveted joint, do not need welding, constant intensity is good.Secondly, two heat pipes are contained on copper sheet, and are stuck between the baffle plate of two convex closures, by two baffle plate stationary positioned, two heat pipes are also stuck in a L shaped clamp simultaneously, heat pipe fixation, difficult drop-off, guarantee and the close contact of copper sheet, do not need welding, assembly process is simple.Secondly, heat pipe directly contacts with copper sheet, and the heat that chip is delivered on copper sheet is taken away, and radiating effect is better.Finally, we arrange bending in the both sides of heat radiation plate body, at the two ends of bending, installation journal stirrup is set, increase on the one hand the intensity of plate body, on the other hand, in the time that module is installed, the installed surface of journal stirrup and CPU is installed and can be realized well laminating, and directly more easily process than bending on journal stirrup is directly being installed in the both sides bending of heat radiation plate body.Heat radiation module good heat dissipation effect, easy to assembly.
In technique scheme: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
In technique scheme: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
In technique scheme: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
Beneficial effect: the utility model is reasonable in design, simple in structure, enforcement is easy, easy to use, easy to assembly, heat pipe fixation, assembling intensity is good, good heat dissipation effect.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of heat radiation plate body.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
Upper and lower, left and right of the present utility model, front and back are the relative position in representative graph only, does not represent the absolute position of product.
As shown in Figure 1, the heat radiation module of notebook of the present utility model mainly by heat radiation plate body 1, copper sheet 2, convex closure 3, baffle plate 4, bending 5, the parts such as journal stirrup 6, mounting hole 7, two heat pipes 8, fan 9 and radiating fin groups 10 be installed formed, described heat radiation plate body 1 is a rectangular slab of being made up of aluminium alloy, middle part at rectangular slab is provided with rectangular opening 1a along its length, the both sides on the long limit of described rectangular opening 1a are provided with convex closure 3, the length of described convex closure 3 is less than the length of rectangular opening 1a, and described convex closure 3 is positioned at the middle part of rectangular opening 1a both sides.The lower surface of the convex closure 3 that is riveted on rectangular opening 1a both sides is riveted in the both sides of described copper sheet 2 by salient point, a side near rectangular opening 1a on each described convex closure 3 is provided with baffle plate 4, baffle plate 4 upwards, described baffle plate 4 is positioned at the middle part of convex closure 3, the left and right side of described heat radiation plate body 1 is respectively equipped with downward bending 5, described bending 5 is 100-120 degree with the angle a of heat radiation plate body 1, be respectively equipped with journal stirrup 6 is installed at the two ends of the bending 5 of the left and right side of described heat radiation plate body 1, on described installation journal stirrup 6, be provided with mounting hole 7.Heat radiation plate body 1 is arranged on CPU by the mounting hole 7 of installing on journal stirrup 6.On described heat radiation plate body 1, be relatively provided with side by side two L shaped clamps 11 near rectangular opening 1a, the upper end of the vertical bar of L shaped clamp 11 connects transverse bar, vertical bar is fixed on the outside of rectangular opening 1a on heat radiation plate body 1, the transverse bar of two L shaped clamps 11 is along the Width setting of rectangular opening 1a, the free end of the transverse bar of two L shaped clamps 11 is close and relative, described heat pipe 8 is flat, two described heat pipes 8 are contained on copper sheet 2 side by side along the length direction of heat radiation plate body 1, and all stretch out outside copper sheet 2 at the two ends of described heat pipe 8, two described heat pipes 8 are clamped between two baffle plates 4, two described heat pipes 8 are also stuck in a L shaped clamp 11, the transverse bar of L shaped clamp 11 is pressed on heat pipe 8.Wherein one end of two described heat pipes 8 extends to radiating fin group 10 and is connected, and described radiating fin group 10 is arranged on the air outlet of described fan 9.

Claims (4)

1. the heat radiation module of a notebook, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (8), fan (9) and radiating fin group (10), it is characterized in that: described heat radiation plate body (1) is rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), described heat radiation plate body (1) is upper is provided with two L shaped clamps (11) side by side relatively near rectangular opening (1a), the transverse bar of two L shaped clamps (11) is along the Width setting of rectangular opening (1a), described heat pipe (8) is flat, two described heat pipes (8) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (8), two described heat pipes (8) are clamped between two baffle plates (4), two described heat pipes (8) are also stuck in a L shaped clamp (11), wherein one end of two described heat pipes (8) is connected with radiating fin group (10), described radiating fin group (10) is arranged on the air outlet of described fan (9).
2. the heat radiation module of notebook according to claim 1, is characterized in that: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
3. the heat radiation module of notebook according to claim 1, is characterized in that: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
4. the heat radiation module of notebook according to claim 1, is characterized in that: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
CN201320798886.XU 2013-12-08 2013-12-08 Heat dissipation module for notebook computer Expired - Fee Related CN203606758U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320798886.XU CN203606758U (en) 2013-12-08 2013-12-08 Heat dissipation module for notebook computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320798886.XU CN203606758U (en) 2013-12-08 2013-12-08 Heat dissipation module for notebook computer

Publications (1)

Publication Number Publication Date
CN203606758U true CN203606758U (en) 2014-05-21

Family

ID=50719421

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320798886.XU Expired - Fee Related CN203606758U (en) 2013-12-08 2013-12-08 Heat dissipation module for notebook computer

Country Status (1)

Country Link
CN (1) CN203606758U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140521

Termination date: 20141208

EXPY Termination of patent right or utility model