CN203706066U - Heat dissipation mould for notebook computer - Google Patents
Heat dissipation mould for notebook computer Download PDFInfo
- Publication number
- CN203706066U CN203706066U CN201320799872.XU CN201320799872U CN203706066U CN 203706066 U CN203706066 U CN 203706066U CN 201320799872 U CN201320799872 U CN 201320799872U CN 203706066 U CN203706066 U CN 203706066U
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- CN
- China
- Prior art keywords
- plate body
- heat
- heat dissipation
- radiation plate
- heat radiation
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- Expired - Fee Related
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Abstract
The utility model discloses a heat dissipation mould for a notebook computer. The heat dissipation mould comprises a heat dissipation plate body, a sheet copper, two heat pipes, a fan and a heat dissipation fin set, wherein the heat dissipation plate body is a rectangular plate; a rectangular hole is formed in the middle of the rectangular plate in the long direction; convex hulls are arranged on both sides of the long edge of the rectangular hole; both sides of the sheet copper are riveted to the lower surfaces of the convex hulls on the both sides of the rectangular hole; a baffle is arranged on one side, which is close to the rectangular hole, on each convex hull; downward bends are respectively arranged on the left side and the right side of the heat dissipation plate body; mounting journal stirrups are respectively arranged at both ends of the bends on the left side and the right side of the heat dissipation plate body; mounting holes are formed in the mounting journal stirrups; the two tabular heat pipes are mounted on the sheet copper, and are clamped between the two baffles side by side; the two heat pipes are both connected with the heat dissipation fin set mounted on the air outlet of the fan. The heat dissipation mould has the advantages of reasonableness in design, simple structure, easiness in implementation, convenience in use and assembly, good assembly intensity and good heat dissipation effect.
Description
Technical field
The utility model relates to a kind of laptop heat-dissipation module.
Background technology
Along with improving constantly of the heat-generating electronic elements power such as central processing unit (CPU), heat dissipation problem is more and more subject to people's attention, all the more so in notebook computer.
In field of radiating, technology adopts heat radiation module to dispel the heat to heat-generating electronic elements conventionally now, at present, the heat radiation module that most of notebook computers use is generally by fan, heat pipe, copper sheet, the compositions such as the heat radiation plate body of fin and aluminum, the two ends of this heat pipe are separately fixed in heat radiation plate body and fins group, fin is assembled the air outlet of sub-fan, copper sheet is welded on heat radiation plate body, the surface of copper sheet is by molten heat-conducting cream adhering chip, because the heat sink surface of aluminum can form highly stable oxide layer, therefore usually bad welding of the welding of copper sheet, weld strength is poor, be prone to loosening.Secondly, existing heat pipe is to be also welded on heat radiation plate body, and welding effect is poor, heat radiation module assembly process complexity.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of copper sheet and heat radiation plate body to be connected firmly, and heat pipe does not need welding, and assembly process is simple, the laptop heat-dissipation module of good heat dissipation effect.
The technical solution of the utility model is as follows: a kind of laptop heat-dissipation module, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (8), fan (9) and radiating fin group (10), it is characterized in that: described heat radiation plate body (1) is rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), described heat pipe (8) is flat, two described heat pipes (8) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (8), two described heat pipes (8) are clamped between two baffle plates (4), wherein one end of two described heat pipes (8) is connected with radiating fin group (10), described radiating fin group (10) is arranged on the air outlet of described fan (9).
Adopt technique scheme, in the both sides of the rectangular opening of described heat radiation plate body, convex closure is set, copper sheet is fixed on to the lower surface of convex closure by the mode of riveted joint, do not need welding, constant intensity is good.Secondly, two heat pipes are contained on copper sheet, and are stuck between the baffle plate of two convex closures, by two baffle plate stationary positioned, do not need welding, and assembly process is simple.Secondly, heat pipe directly contacts with copper sheet, and the heat that chip is delivered on copper sheet is taken away, and radiating effect is better.Finally, we arrange bending in the both sides of heat radiation plate body, at the two ends of bending, installation journal stirrup is set, increase on the one hand the intensity of plate body, on the other hand, in the time that module is installed, the installed surface of journal stirrup and CPU is installed and can be realized well laminating, and directly more easily process than bending on journal stirrup is directly being installed in the both sides bending of heat radiation plate body.Heat radiation module good heat dissipation effect, easy to assembly.
In technique scheme: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
In technique scheme: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
In technique scheme: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
Beneficial effect: the utility model is reasonable in design, simple in structure, enforcement is easy, easy to use, easy to assembly, and assembling intensity is good, good heat dissipation effect.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of heat radiation plate body.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
Upper and lower, left and right of the present utility model, front and back are the relative position in representative graph only, does not represent the absolute position of product.
As shown in Figure 1, laptop heat-dissipation module of the present utility model mainly by heat radiation plate body 1, copper sheet 2, convex closure 3, baffle plate 4, bending 5, the parts such as journal stirrup 6, mounting hole 7, two heat pipes 8, fan 9 and radiating fin groups 10 be installed formed, described heat radiation plate body 1 is a rectangular slab of being made up of aluminium alloy, middle part at rectangular slab is provided with rectangular opening 1a along its length, the both sides on the long limit of described rectangular opening 1a are provided with convex closure 3, the length of described convex closure 3 is less than the length of rectangular opening 1a, and described convex closure 3 is positioned at the middle part of rectangular opening 1a both sides.The lower surface of the convex closure 3 that is riveted on rectangular opening 1a both sides is riveted in the both sides of described copper sheet 2 by salient point, a side near rectangular opening 1a on each described convex closure 3 is provided with baffle plate 4, baffle plate 4 upwards, described baffle plate 4 is positioned at the middle part of convex closure 3, the left and right side of described heat radiation plate body 1 is respectively equipped with downward bending 5, described bending 5 is 100-120 degree with the angle a of heat radiation plate body 1, be respectively equipped with journal stirrup 6 is installed at the two ends of the bending 5 of the left and right side of described heat radiation plate body 1, on described installation journal stirrup 6, be provided with mounting hole 7.Heat radiation plate body 1 is arranged on CPU by the mounting hole 7 of installing on journal stirrup 6.Described heat pipe 8 is flat, two described heat pipes 8 are contained on copper sheet 2 side by side along the length direction of heat radiation plate body 1, and all stretch out outside copper sheet 2 at the two ends of described heat pipe 8, two described heat pipes 8 are clamped between two baffle plates 4, wherein one end of two described heat pipes 8 extends to radiating fin group 10 and is connected, and described radiating fin group 10 is arranged on the air outlet of described fan 9.
Claims (4)
1. a laptop heat-dissipation module, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (8), fan (9) and radiating fin group (10), it is characterized in that: described heat radiation plate body (1) is rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), described heat pipe (8) is flat, two described heat pipes (8) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (8), two described heat pipes (8) are clamped between two baffle plates (4), wherein one end of two described heat pipes (8) is connected with radiating fin group (10), described radiating fin group (10) is arranged on the air outlet of described fan (9).
2. laptop heat-dissipation module according to claim 1, is characterized in that: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
3. laptop heat-dissipation module according to claim 1, is characterized in that: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
4. laptop heat-dissipation module according to claim 1, is characterized in that: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320799872.XU CN203706066U (en) | 2013-12-08 | 2013-12-08 | Heat dissipation mould for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320799872.XU CN203706066U (en) | 2013-12-08 | 2013-12-08 | Heat dissipation mould for notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203706066U true CN203706066U (en) | 2014-07-09 |
Family
ID=51056472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320799872.XU Expired - Fee Related CN203706066U (en) | 2013-12-08 | 2013-12-08 | Heat dissipation mould for notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203706066U (en) |
-
2013
- 2013-12-08 CN CN201320799872.XU patent/CN203706066U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20141208 |
|
| EXPY | Termination of patent right or utility model |