CN203689304U - Novel laptop radiating module - Google Patents

Novel laptop radiating module Download PDF

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Publication number
CN203689304U
CN203689304U CN201320799074.7U CN201320799074U CN203689304U CN 203689304 U CN203689304 U CN 203689304U CN 201320799074 U CN201320799074 U CN 201320799074U CN 203689304 U CN203689304 U CN 203689304U
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CN
China
Prior art keywords
plate body
radiation plate
heat radiation
copper sheet
rectangular opening
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Expired - Fee Related
Application number
CN201320799074.7U
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Chinese (zh)
Inventor
项彬
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Chongqing Qiaocheng Technology Development Co Ltd
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Chongqing Qiaocheng Technology Development Co Ltd
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Priority to CN201320799074.7U priority Critical patent/CN203689304U/en
Application granted granted Critical
Publication of CN203689304U publication Critical patent/CN203689304U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a novel laptop radiating module which comprises a radiating panel body, a copper sheet, two heat pipes, a fan and a radiating fin group, wherein a rectangular hole is formed in the middle of the radiating panel body in the length direction; convex hulls are arranged on two sides of the long edges of the rectangular hole; the two sides of the copper sheet are riveted with the lower surfaces of the convex hulls on the two sides of the rectangular hole; a baffle plate is arranged on the side, close to the rectangular hole, of each convex hull; downward bends are arranged on the left side and the right side of the radiating panel body respectively; mounting lugs are arranged on the bends; mounting holes are formed in the mounting lugs; mistake proofing codes are arranged at four corners of the radiating panel body; the heat pipes are flat, clamped side by side between the two baffle plates and clamped in an L-shaped clip on the radiating panel body, and connected with the radiating fin group; the radiating fin group is mounted at the air outlet of the fan. The novel laptop CPU radiating module is reasonable in design, simple in structure, easy to implement, and convenient to use and assemble and has high assembly strength and good radiating effect.

Description

A kind of novel laptop heat-dissipation module
Technical field
The utility model relates to a kind of novel laptop heat-dissipation module.
Background technology
Along with improving constantly of the heat-generating electronic elements power such as central processing unit (CPU), heat dissipation problem is more and more subject to people's attention, all the more so in notebook computer.
In field of radiating, technology adopts heat radiation module to dispel the heat to heat-generating electronic elements conventionally now, at present, the heat radiation module that most of notebook computers use is generally made up of the heat radiation plate body of fan, heat pipe, copper sheet, fin and aluminum etc., the two ends of this heat pipe are separately fixed in heat radiation plate body and fins group, and fins group is arranged on the air outlet of fan.Copper sheet is welded on heat radiation plate body, and molten heat-conducting cream adhering chip is passed through on the surface of copper sheet, because the heat sink surface of aluminum can form highly stable oxide layer, and therefore usually bad welding of the welding of copper sheet, weld strength is poor, is prone to loosening.Secondly, existing heat pipe is to be also welded on heat radiation plate body, and welding effect is poor, heat radiation module assembly process complexity.On existing heat radiation plate body, there is no mistake proofing mark, when processing, assembling, easily make mistakes.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of copper sheet and heat radiation plate body to be connected firmly, and heat pipe does not need welding, and assembly process is simple, the novel laptop heat-dissipation module of good heat dissipation effect.
The technical solution of the utility model is as follows: a kind of novel laptop heat-dissipation module, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (8), fan (9) and radiating fin group (10), it is characterized in that: described heat radiation plate body (1) comprises a rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), on four angles of described heat radiation plate body (1), be respectively equipped with anti-miscoding (A, B, C, D), the upper position near rectangular opening (1a) of described heat radiation plate body (1) is provided with L shaped clamp (11), described heat pipe (8) is flat, two described heat pipes (8) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (8), two described heat pipes (8) are clamped between two baffle plates (4), two described heat pipes (8) are also stuck in L shaped clamp (11) side by side, wherein one end of two described heat pipes (11) is connected with radiating fin group (10), described radiating fin group (10) is arranged on the air outlet of described fan (9).
Adopt technique scheme, in the both sides of rectangular opening of heat radiation plate body, convex closure is set, copper sheet is fixed on to the lower surface of convex closure by the mode of riveted joint, do not need welding, constant intensity is good.Secondly, two heat pipes are contained on copper sheet, and before being stuck in the baffle plate of two convex closures, by two baffle plate stationary positioned,, heat pipe are stuck in L shaped clamp meanwhile, do not need welding, and assembly process is simple, fixation.Secondly, heat pipe directly contacts with copper sheet, and the heat that chip is delivered on copper sheet is taken away, and radiating effect is better.Finally, we arrange bending in the both sides of heat radiation plate body, at the two ends of bending, installation journal stirrup is set, increase on the one hand the intensity of plate body, on the other hand, the installed surface of journal stirrup and CPU is installed and can be realized well laminating, and directly more easily process than bending on journal stirrup is directly being installed in the both sides bending of heat radiation plate body.On four angles of heat radiation plate body, anti-miscoding is set respectively, avoids makeing mistakes in production run, while avoiding assembling, make mistakes.Heat radiation module good heat dissipation effect, easy to assembly.
In technique scheme: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
In technique scheme: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
In technique scheme: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
In technique scheme: described heat radiation plate body (1) is stamped to form by aluminium alloy.Easy to process.
Beneficial effect: the utility model is reasonable in design, simple in structure, enforcement is easy, easy to use, easy to assembly, and assembling intensity is good, good heat dissipation effect.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of heat radiation plate body.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
Upper and lower, left and right of the present utility model, front and back are the relative position in representative graph only, does not represent the absolute position of product.
As shown in Figure 1, a kind of novel laptop heat-dissipation module of the present utility model mainly by heat radiation plate body 1, copper sheet 2, convex closure 3, baffle plate 4, bending 5, the parts such as journal stirrup 6, mounting hole 7, two heat pipes 8, fan 9 and radiating fin groups 10, L shaped clamp 11 be installed formed, described heat radiation plate body 1 is a rectangular slab of being made up of aluminium alloy, middle part at rectangular slab is provided with rectangular opening 1a along its length, the both sides on the long limit of described rectangular opening 1a are provided with convex closure 3, the length of described convex closure 3 is less than the length of rectangular opening 1a, and described convex closure 3 is positioned at the middle part of rectangular opening 1a both sides.The lower surface of the convex closure 3 that is riveted on rectangular opening 1a both sides is riveted in the both sides of described copper sheet 2 by salient point, a side near rectangular opening 1a on each described convex closure 3 is provided with baffle plate 4, described baffle plate 4 is positioned at the middle part of convex closure 3, the left and right side of described heat radiation plate body 1 is respectively equipped with downward bending 5, described bending 5 is 100-120 degree with the angle a of heat radiation plate body 1, be respectively equipped with journal stirrup 6 is installed at the two ends of the bending 5 of the left and right side of described heat radiation plate body 1, on described installation journal stirrup 6, be provided with mounting hole 7.Heat radiation plate body 1 is arranged on CPU above by the mounting hole 7 of installing on journal stirrup 6, on four angles of described heat radiation plate body 1, is respectively equipped with anti-miscoding A, B, C, D, avoids makeing mistakes in the time producing and assemble.Position near rectangular opening 1a on described heat radiation plate body 1 is provided with L shaped clamp 11, the height of the aspect ratio baffle plate 4 of L shaped clamp 11 is lower slightly or identical, the upper end of the vertical bar of L shaped clamp 11 connects transverse bar, the length of described transverse bar is identical with the width of rectangular opening 1a, described transverse bar is along the Width setting of rectangular opening 1a, the lower end of the vertical bar of described L shaped clamp 11 is fixed on the outside of rectangular opening 1a on heat radiation plate body 1, described heat pipe 8 is flat, two described heat pipes 8 are contained on copper sheet 2 side by side along the length direction of heat radiation plate body 1, and all stretch out outside copper sheet 2 at the two ends of described heat pipe 8, two described heat pipes 8 are clamped between two baffle plates 4, two described heat pipes 8 are also stuck in L shaped clamp 11 side by side, the transverse bar of L shaped clamp 11 is pressed on heat pipe 8.Wherein one end of two described heat pipes 8 extends to radiating fin group 10 and is connected, and described radiating fin group 10 is arranged on the air outlet of described fan 9.

Claims (5)

1. a novel laptop heat-dissipation module, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (8), fan (9) and radiating fin group (10), it is characterized in that: described heat radiation plate body (1) comprises a rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), on four angles of described heat radiation plate body (1), be respectively equipped with anti-miscoding (A, B, C, D), the upper position near rectangular opening (1a) of described heat radiation plate body (1) is provided with L shaped clamp (11), described heat pipe (8) is flat, two described heat pipes (8) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (8), two described heat pipes (8) are clamped between two baffle plates (4), two described heat pipes (8) are also stuck in L shaped clamp (11) side by side, wherein one end of two described heat pipes (11) is connected with radiating fin group (10), described radiating fin group (10) is arranged on the air outlet of described fan (9).
2. a kind of novel laptop heat-dissipation module according to claim 1, is characterized in that: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
3. a kind of novel laptop heat-dissipation module according to claim 1, is characterized in that: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
4. a kind of novel laptop heat-dissipation module according to claim 1, is characterized in that: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
5. a kind of novel laptop heat-dissipation module according to claim 1, is characterized in that: described heat radiation plate body (1) is stamped to form by aluminium alloy.
CN201320799074.7U 2013-12-08 2013-12-08 Novel laptop radiating module Expired - Fee Related CN203689304U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320799074.7U CN203689304U (en) 2013-12-08 2013-12-08 Novel laptop radiating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320799074.7U CN203689304U (en) 2013-12-08 2013-12-08 Novel laptop radiating module

Publications (1)

Publication Number Publication Date
CN203689304U true CN203689304U (en) 2014-07-02

Family

ID=51011182

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320799074.7U Expired - Fee Related CN203689304U (en) 2013-12-08 2013-12-08 Novel laptop radiating module

Country Status (1)

Country Link
CN (1) CN203689304U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140702

Termination date: 20141208

EXPY Termination of patent right or utility model