CN203689323U - Novel heat dissipation module for laptop - Google Patents

Novel heat dissipation module for laptop Download PDF

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Publication number
CN203689323U
CN203689323U CN201320799442.8U CN201320799442U CN203689323U CN 203689323 U CN203689323 U CN 203689323U CN 201320799442 U CN201320799442 U CN 201320799442U CN 203689323 U CN203689323 U CN 203689323U
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CN
China
Prior art keywords
heat radiation
plate body
heat dissipation
copper sheet
radiation plate
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Expired - Fee Related
Application number
CN201320799442.8U
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Chinese (zh)
Inventor
项彬
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Chongqing Qiaocheng Technology Development Co Ltd
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Chongqing Qiaocheng Technology Development Co Ltd
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Priority to CN201320799442.8U priority Critical patent/CN203689323U/en
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Publication of CN203689323U publication Critical patent/CN203689323U/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a novel heat dissipation module for a laptop, which comprises a heat dissipation plate body, a copper sheet, two heat pipes, a fan and a heat dissipation fin set, wherein a rectangular hole is formed in the middle of the heat dissipation plate body in the length direction; bulges are arranged on the two sides of long edge of the rectangular hole; the two sides of the copper sheet are riveted to the lower surfaces of the bulges on the two sides of the rectangular hole; a baffle is arranged on one side, close to the rectangular hole, of each bulge; downward bent parts are arranged on the left side and the right side of the heat dissipation plate body respectively; mounting support lugs are arranged at the two ends of each of the bent parts on the left side and the right side of the heat dissipation plate body; a mounting hole is formed in each mounting support lug; a mistake proofing notch is formed in the front side of the heat dissipation plate body; the heat pipes are flat, one ends of the two heat pipes are mounted on the copper sheet; the two heat pipes are clamped between the two baffles side by side and connected with the heat dissipation fin set; the heat dissipation fin set is mounted at the air outlet of the fan. The novel heat dissipation module is reasonable in design, simple in structure, easy to implement, convenient to use and assemble, and excellent in assembling strength and heat dissipation effect.

Description

Booknote heat radiation module
Technical field
The utility model relates to a kind of Booknote heat radiation module.
Background technology
Along with improving constantly of the heat-generating electronic elements power such as central processing unit (CPU), heat dissipation problem is more and more subject to people's attention, all the more so in notebook computer.
In field of radiating, technology adopts heat radiation module to dispel the heat to heat-generating electronic elements conventionally now, at present, the heat radiation module that most of notebook computers use is generally by fan, heat pipe, copper sheet, the compositions such as the heat radiation plate body of fin and aluminum, the two ends of this heat pipe are separately fixed in heat radiation plate body and fins group, fins group is contained in the air outlet of fan, copper sheet is welded on heat radiation plate body, the surface of copper sheet is by molten heat-conducting cream adhering chip, because the heat sink surface of aluminum can form highly stable oxide layer, therefore usually bad welding of the welding of copper sheet, weld strength is poor, be prone to loosening.Secondly, existing heat pipe is to be also welded on heat radiation plate body, and welding effect is poor, heat radiation module assembly process complexity.On existing heat radiation plate body, there is no mistake proofing mark, when processing, assembling, easily make mistakes.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of copper sheet and heat radiation plate body to be connected firmly, and heat pipe does not need welding, and assembly process is simple, the Booknote of good heat dissipation effect heat radiation module.
The technical solution of the utility model is as follows: a kind of Booknote heat radiation module, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (11), fan (9) and radiating fin group (10), it is characterized in that: described heat radiation plate body (1) is rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), the front side of described heat radiation plate body (1) is provided with mistake proofing breach (8), described heat pipe (11) is flat, two described heat pipes (11) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (11), two described heat pipes (11) are clamped between two baffle plates (4), wherein one end of two described heat pipes (11) is connected with radiating fin group (10), described radiating fin group (10) is arranged on the air outlet of described fan (9).
Adopt technique scheme, in the both sides of rectangular opening, convex closure is set, copper sheet is fixed on to the lower surface of convex closure by the mode of riveted joint, do not need welding, constant intensity is good.Secondly, two heat pipes are contained on copper sheet, and before being stuck in the baffle plate of two convex closures, by two baffle plate stationary positioned, do not need welding, and assembly process is simple.Secondly, heat pipe directly contacts with copper sheet, and the heat that chip is delivered on copper sheet is taken away, and good heat dissipation effect is better.Finally, we arrange bending in the both sides of heat radiation plate body, at the two ends of bending, installation journal stirrup is set, increase on the one hand the intensity of plate body, on the other hand, the installed surface of journal stirrup and CPU is installed and can be realized well laminating, and directly more easily process than bending on journal stirrup is directly being installed in the both sides bending of heat radiation plate body.Arrange and misplace breach in heat radiation plate body front side, avoid makeing mistakes in production run, while avoiding assembling, make mistakes.Heat radiation module good heat dissipation effect, easy to assembly.
In technique scheme: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
In technique scheme: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
In technique scheme: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
In technique scheme: described heat radiation plate body (1) is stamped to form by aluminium alloy.Easy to process.
Beneficial effect: the utility model is reasonable in design, simple in structure, enforcement is easy, easy to use, easy to assembly, and assembling intensity is good, good heat dissipation effect.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of heat radiation plate body.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
Upper and lower, left and right of the present utility model, front and back are the relative position in representative graph only, does not represent the absolute position of product.
As shown in Figure 1, laptop heat-dissipation module of the present utility model mainly by heat radiation plate body 1, copper sheet 2, convex closure 3, baffle plate 4, bending 5, the parts such as journal stirrup 6, mounting hole 7, mistake proofing breach 8, two heat pipes 11, fan 9 and radiating fin groups 10 be installed formed, described heat radiation plate body 1 is a rectangular slab of being made up of aluminium alloy, middle part at rectangular slab is provided with rectangular opening 1a along its length, the both sides on the long limit of described rectangular opening 1a are provided with convex closure 3, the length of described convex closure 3 is less than the length of rectangular opening 1a, and described convex closure 3 is positioned at the middle part of rectangular opening 1a both sides.The lower surface of the convex closure 3 that is riveted on rectangular opening 1a both sides is riveted in the both sides of described copper sheet 2 by salient point, a side near rectangular opening 1a on each described convex closure 3 is provided with baffle plate 4, described baffle plate 4 is positioned at the middle part of convex closure 3, the left and right side of described heat radiation plate body 1 is respectively equipped with downward bending 5, described bending 5 is 100-120 degree with the angle a of heat radiation plate body 1, be respectively equipped with journal stirrup 6 is installed at the two ends of the bending 5 of the left and right side of described heat radiation plate body 1, on described installation journal stirrup 6, be provided with mounting hole 7.Heat radiation plate body 1 is arranged on CPU above by the mounting hole 7 of installing on journal stirrup 6, and the front side of described heat radiation plate body 1 is provided with mistake proofing breach 8.Avoid makeing mistakes in the time producing and assemble.Described heat pipe 11 is flat, two described heat pipes 11 are contained on copper sheet 2 side by side along the length direction of heat radiation plate body 1, and all stretch out outside copper sheet 2 at the two ends of described heat pipe 11, two described heat pipes 11 are clamped between two baffle plates 4, wherein one end of two described heat pipes 11 extends to radiating fin group 10 and is connected, and described radiating fin group 10 is arranged on the air outlet of described fan 9.

Claims (5)

1. a Booknote heat radiation module, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (11), fan (9) and radiating fin group (10), it is characterized in that: described heat radiation plate body (1) is rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), the front side of described heat radiation plate body (1) is provided with mistake proofing breach (8), described heat pipe (11) is flat, two described heat pipes (11) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (11), two described heat pipes (11) are clamped between two baffle plates (4), wherein one end of two described heat pipes (11) is connected with radiating fin group (10), described radiating fin group (10) is arranged on the air outlet of described fan (9).
2. Booknote heat radiation module according to claim 1, is characterized in that: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.
3. Booknote heat radiation module according to claim 1, is characterized in that: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).
4. Booknote heat radiation module according to claim 1, is characterized in that: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).
5. Booknote heat radiation module according to claim 1, is characterized in that: described heat radiation plate body (1) is stamped to form by aluminium alloy.
CN201320799442.8U 2013-12-08 2013-12-08 Novel heat dissipation module for laptop Expired - Fee Related CN203689323U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320799442.8U CN203689323U (en) 2013-12-08 2013-12-08 Novel heat dissipation module for laptop

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320799442.8U CN203689323U (en) 2013-12-08 2013-12-08 Novel heat dissipation module for laptop

Publications (1)

Publication Number Publication Date
CN203689323U true CN203689323U (en) 2014-07-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320799442.8U Expired - Fee Related CN203689323U (en) 2013-12-08 2013-12-08 Novel heat dissipation module for laptop

Country Status (1)

Country Link
CN (1) CN203689323U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140702

Termination date: 20141208

EXPY Termination of patent right or utility model