CN203617248U - Improved ordinary pressure plasma processing device - Google Patents
Improved ordinary pressure plasma processing device Download PDFInfo
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- CN203617248U CN203617248U CN201320856371.0U CN201320856371U CN203617248U CN 203617248 U CN203617248 U CN 203617248U CN 201320856371 U CN201320856371 U CN 201320856371U CN 203617248 U CN203617248 U CN 203617248U
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- positive plate
- plate
- plasma processing
- vent hole
- air vent
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- 239000000463 material Substances 0.000 claims abstract description 23
- 230000005684 electric field Effects 0.000 claims abstract description 10
- 230000004888 barrier function Effects 0.000 claims description 16
- 239000007789 gas Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
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Abstract
The utility model relates to an improved ordinary pressure plasma processing device. The device comprises a negative plate, and a positive plate corresponding to the negative plate, wherein a high-frequency power supply is accessed between the negative plate and the positive plate, a high-frequency electric field is formed between the negative plate and the positive plate, an insulating layer is disposed between the negative plate and the positive plate, at least one vent holes are disposed on the negative plate and used for entry of gases, each vent hole is connected with a gas cavity, and a material to be processed is placed on the insulating layer. With adoption of the improved ordinary pressure plasma processing device, the material to be processed can be simply and uniformly processed under ordinary pressure instead of under vacuum conditions.
Description
Technical field
The utility model belongs to plasma processing apparatus, is specifically related to a kind of modified model atmospheric plasma processing unit.
Background technology
Material surface modifying treatment technology is one of current material preparation technology generally using, it is under certain external condition, material exterior materials and material surface generation physics or chemical reaction, thereby material surface state changed or produce new element and new group at material surface, finally meeting the needs of practical application.
But, the fast development of modern industry is had higher requirement to material wear-resistant wiping, wearing and tearing and the performance such as anticorrosive, meanwhile, also more and more higher to the requirement of environmental protection, thus effectively promote to be called as the development of material plasma process for modifying surface of green production process.Under vacuum, apply high-frequency electric field to reacting gas environment, gas ionizes and produces plasma under the excitation of high-frequency electric field.
But plasma processing apparatus of the prior art can not be processed material to be processed uniformly, and must under high pressure could material handling.
Utility model content
In order to solve the above-mentioned problems in the prior art, provide a kind of modified model atmospheric plasma processing unit.
The technical scheme that the utility model adopts is: a kind of modified model atmospheric plasma processing unit, comprise a minus plate, the positive plate corresponding with above-mentioned minus plate, between above-mentioned minus plate and above-mentioned positive plate, access high frequency electric source, between above-mentioned minus plate and above-mentioned positive plate, form high-frequency electric field, above-mentioned minus plate thickness is greater than above-mentioned positive plate thickness, between above-mentioned minus plate and above-mentioned positive plate, there is an insulating barrier, on above-mentioned minus plate, be provided with at least one air vent hole, above-mentioned air vent hole enters in order to gas, above-mentioned air vent hole is connected with an air chamber, material to be processed is arranged on above-mentioned insulating barrier.
Preferably, above-mentioned insulating barrier is arranged on above-mentioned positive plate, thinks laminating setting with above-mentioned positive plate.
Preferably, the one end in above-mentioned gas chamber is connected with above-mentioned air vent hole, and the other end in above-mentioned gas chamber is connected with above-mentioned insulating barrier.
Preferably, the cross section that above-mentioned air vent hole is is for circular, and above-mentioned air vent hole is arranged on positive plate equably.
Preferably, above-mentioned gas chamber is cylindrical, and the internal diameter in above-mentioned gas chamber is greater than the internal diameter of above-mentioned air vent hole.
Preferably, above-mentioned positive plate does ground connection setting.
Adopt the beneficial effect of the technical program to be: between plasma processing apparatus positive plate of the present utility model and minus plate, to form high-frequency electric field, and minus plate thickness is greater than positive plate thickness, on minus plate, be provided with air vent hole, air vent hole is connected with the air chamber being arranged between positive plate and minus plate, form micro-hollow cathode, material handling simply equably, between positive plate and minus plate, there is an insulating barrier, can effectively prevent that parallel electrode plate is just to sparking, this device need to not carry out under vacuum condition, need material to be processed as long as just can well process under normal pressure.
Accompanying drawing explanation
For content of the present utility model is more easily expressly understood, according to specific embodiment also by reference to the accompanying drawings, the utility model is described in further detail below, wherein:
Fig. 1 is the schematic perspective view of the utility model embodiment 1;
In figure, 1. air vent hole 2. air chamber 3. insulating barrier 4. positive plate 5. minus plates.
Embodiment
Describe specific embodiment of the utility model in detail below in conjunction with accompanying drawing.
Embodiment 1
As shown in Figure 1, a kind of modified model atmospheric plasma processing unit, comprise a minus plate 5, the positive plate 4 corresponding with minus plate 5, between minus plate 5 and positive plate 4, access high frequency electric source, between minus plate 5 and positive plate 4, form high-frequency electric field, and minus plate 5 thickness are greater than positive plate 4 thickness, this just forms micro-hollow cathode, for preventing that minus plate 5 and positive plate 4 are just to sparking, between minus plate 5 and positive plate 4, there is an insulating barrier 3, on minus plate 5, be provided with at least one air vent hole 1, air vent hole 1 enters in order to gas, air vent hole 1 is connected with an air chamber 2, material to be processed is arranged on described insulating barrier 3.Insulating barrier 3 is arranged on positive plate 4, is fitted with positive plate 4.Air chamber 2 is cylindrical, one end of air chamber 2 is connected with air vent hole 1, another opening of air chamber 2 is rectified being connected with insulating barrier 3, the internal diameter of air chamber 2 is greater than the internal diameter of air vent hole 1, the cross section of air vent hole 1 is circular, air vent hole 1 is arranged on minus plate 5 equably, and positive plate 4 does ground connection and arranges.
This plasma processing apparatus is in the time of material handling, material is placed on insulating barrier 3, in air vent hole 1, pass into gas, and connect high frequency electric source between positive plate 4 and minus plate 5, between positive plate 4 and minus plate 5, form high-frequency electric field, the gas passing in air vent hole 1 discharge generation plasma in high-frequency electric field carries out plasma treatment to material.
The beneficial effects of the utility model are: between plasma processing apparatus positive plate of the present utility model and minus plate, form high-frequency electric field, and minus plate thickness is greater than positive plate thickness, on minus plate, be provided with air vent hole, air vent hole is connected with the air chamber being arranged between minus plate and positive plate, form micro-hollow cathode, material handling simply equably, between positive plate and minus plate, there is an insulating barrier, can effectively prevent that parallel electrode plate is just to sparking, this device need to not carry out under vacuum condition, need material to be processed as long as just can well process under normal pressure.
Above-described is only preferred implementation of the present utility model; it should be pointed out that for the person of ordinary skill of the art, do not departing under the prerequisite of the utility model creation design; can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (6)
1. a modified model atmospheric plasma processing unit, comprise a minus plate, the positive plate corresponding with described minus plate, between described minus plate and described positive plate, access high frequency electric source, between described minus plate and described positive plate, form high-frequency electric field, it is characterized in that, described minus plate thickness is greater than described positive plate thickness, between described minus plate and described positive plate, there is an insulating barrier, on described minus plate, be provided with at least one air vent hole, described air vent hole enters in order to gas, described air vent hole is connected with an air chamber, material to be processed is arranged on described insulating barrier.
2. modified model atmospheric plasma processing unit according to claim 1, is characterized in that, described insulating barrier is arranged on described positive plate, is fitted with described positive plate.
3. modified model atmospheric plasma processing unit according to claim 2, is characterized in that, one end of described air chamber is connected with described air vent hole, and the other end of described air chamber is connected with described insulating barrier.
4. modified model atmospheric plasma processing unit according to claim 1, is characterized in that, the cross section that described air vent hole is is for circular, and described air vent hole is arranged on minus plate equably.
5. modified model atmospheric plasma processing unit according to claim 4, is characterized in that, described air chamber is cylindrical, and the internal diameter of described air chamber is greater than the internal diameter of described air vent hole.
6. modified model atmospheric plasma processing unit claimed in claim 1, is characterized in that, described positive plate does ground connection and arranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320856371.0U CN203617248U (en) | 2013-12-24 | 2013-12-24 | Improved ordinary pressure plasma processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320856371.0U CN203617248U (en) | 2013-12-24 | 2013-12-24 | Improved ordinary pressure plasma processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203617248U true CN203617248U (en) | 2014-05-28 |
Family
ID=50769875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320856371.0U Expired - Lifetime CN203617248U (en) | 2013-12-24 | 2013-12-24 | Improved ordinary pressure plasma processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203617248U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730322A (en) * | 2013-12-24 | 2014-04-16 | 苏州市奥普斯等离子体科技有限公司 | Improved normal pressure plasma processing device |
-
2013
- 2013-12-24 CN CN201320856371.0U patent/CN203617248U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730322A (en) * | 2013-12-24 | 2014-04-16 | 苏州市奥普斯等离子体科技有限公司 | Improved normal pressure plasma processing device |
| CN103730322B (en) * | 2013-12-24 | 2016-02-17 | 苏州市奥普斯等离子体科技有限公司 | A kind of atmospheric pressure plasma jet treatment device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170118 Address after: 518000 Guangdong city of Shenzhen province Luohu District Lake Street No. 118 Shennan East Road, Heping Road, the world financial center tower B Bao - Ping Street 0623 Patentee after: SHENZHEN OPS PLAMSMA TECHNOLOGY CO.,LTD. Address before: Taishan road Suzhou City, Jiangsu province 215011 Suzhou high tech Industrial Development Zone No. 2 (Canton Science Park) Patentee before: SUZHOU OPS PLASMA TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140528 |