CN203588995U - Chip heat conduction apparatus - Google Patents
Chip heat conduction apparatus Download PDFInfo
- Publication number
- CN203588995U CN203588995U CN201320779817.4U CN201320779817U CN203588995U CN 203588995 U CN203588995 U CN 203588995U CN 201320779817 U CN201320779817 U CN 201320779817U CN 203588995 U CN203588995 U CN 203588995U
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- chip
- heat
- printed board
- conduction support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000463 material Substances 0.000 claims description 22
- 238000001816 cooling Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract 4
- 239000006185 dispersion Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model, which belongs to the technical field of chip cooling, discloses a chip heat conduction apparatus comprising a heat conduction support, a printed board, a heat conducting material, a case, and locking bars. The printed board is installed at the upper end of the heat conduction support; an upper cover plate is installed at the printed board; the surface, facing the printed board, of the inside of the heat conduction support is coated with the heat conducting material; and a chip is arranged between the heat conducting material and the printed board. Besides, the locking bars are respectively installed at the two sides of the heat conduction support and are used for locking the heat conduction support at the side groove of the case, so that the side surface of the heat conduction support is fully contacted with the side surface of the case. When the chip works, the generated heat is conducted to the case successively by the heat conducting material and the heat conduction support and then is dissipated finally. The provided chip heat conduction apparatus with the good cooling effect is especially suitable for the environment with many integrated power devices at one chip and small installing space.
Description
Technical field
The utility model relates to chip cooling technical field, is specifically related to a kind of chip heat-transfer device.
Background technology
Along with reducing of electronic devices and components volume, a lot of functions are integrated on same chip or by a lot of chip array formulas and are encapsulated in printed board, make that the excessive or integrated level of chip power is too high to be caused chip when work, to produce amount of heat impelling chip temperature to raise, thereby cause chip operation not normal, even cause chip failure.In order to reduce chip temperature, strengthen heat radiation, at present, the radiating mode of the chip array of high-power chip or high integration is be mainly coated with heat conductive silica gel and fin is installed at chip surface, excessive or the integrated level of power need to increase fan when too high and carry out forced air cooling, and in some printed board, use a plurality of chips to cause installing space little, cannot use aforesaid way to dispel the heat.
Utility model content
For above defect or the Improvement requirement of prior art, the utility model provides a kind of and is applicable to that integrated power device on chip is many, the chip heat-transfer device under installing space circlet border.
A chip heat-transfer device, comprises heat conduction support, printed board, Heat Conduction Material, cabinet and locking strip;
Heat conduction support upper end is provided with printed board, and upper cover plate is installed in printed board, and heat conduction internal stent has Heat Conduction Material towards the surface-coated of printed board, and chip is placed between Heat Conduction Material and printed board; Heat conduction support both sides are separately installed with a locking strip, and locking strip is for being locked at heat conduction support in the lateral groove of cabinet heat conduction support side is fully contacted with cabinet side; The heat producing during chip operation is transmitted on cabinet by Heat Conduction Material, heat conduction support successively, and dissipation of heat is gone out the most at last.
Further, described cabinet is with fin.
Further, described heat-transfer device also comprises upper cover plate, and upper cover plate is placed in printed board upper end, is fixed on heat conduction support together with printed board.
Further, described Heat Conduction Material is nonmetallic materials.
Further, described chip is PowerPC chip.
In general, the utility model compared with prior art, owing to having increased Heat Conduction Material between PowerPC chip and heat conduction support, the heat that chip is produced can conduct to heat conduction support by Heat Conduction Material, by heat conduction support, conducted to cabinet again, to chip cooling, provide channel, due to the compressibility of Heat Conduction Material, improved the stickiness of thermal conductive surface simultaneously, increased thermal conductive surface and, make heat conduction fully; The heat that chip produces can also conduct to heat conduction support by printed board, then conducts to cabinet by heat conduction support, has realized Simulation of Dual-channel heat radiation.In addition, this device has also been realized heat conduction support and has not only been supported printed board, conducts the dual-use function of the heat of PowerPC chip generation simultaneously.Between PowerPC chip and heat conduction support, having increased Heat Conduction Material has also avoided chip and support directly firmly to contact the damage that chip is caused.
As optimization; described heat-transfer device also comprises upper cover plate, and screw is directly arranged on upper cover plate and printed board on heat conduction support, and upper cover plate both sides are directly pressed in printed board and make printed board installation more firm; protect components and parts in printed board simultaneously, play electromagnetic shielding and the effect of avoiding noise pollution.Cabinet, with fin, makes heat dispersion more excellent.
This device is particularly useful for that power device is many, installing space is little and avoids the particular surroundings of noise pollution.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model PowerPC multi-chip heat-transfer device.
Fig. 2 is the cabinet partial sectional view of Fig. 1, and wherein, Fig. 2 (a) is front view, and Fig. 2 (b) is end view.
In institute's drawings attached, identical Reference numeral is used for representing identical element or structure, wherein: 1-cabinet, 2-locking strip, 3-screw, 4-heat conduction support, 5-Heat Conduction Material, 6-PowerPC chip, 7-printed board, 8-upper cover plate.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.In addition,, in each execution mode of described the utility model, involved technical characterictic just can not combine mutually as long as do not form each other conflict.
As depicted in figs. 1 and 2, screw 3 is arranged on printed board 7 and upper cover plate 8 on heat conduction support 4; Chip (this example adopts PowerPC chip) 6 is crimped in printed board 7 and fully contacts with Heat Conduction Material 5; Heat Conduction Material 5 fully contacts with heat conduction support 4; Locking strip 2 is arranged on respectively heat conduction support 4 both sides, by locking strip 2, heat conduction support 4 is locked in cabinet 1 groove heat conduction support 4 binding faces are fully contacted with the binding face 101 of cabinet 1.
The heat producing when 6 work of PowerPC chip is directly transferred on cabinet by Heat Conduction Material 5, heat conduction support 4, and dissipation of heat is gone out.
Heat Conduction Material can be selected nonmetallic materials.Cabinet, with fin, makes heat dispersion more excellent.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (5)
1. a chip heat-transfer device, is characterized in that, comprises heat conduction support, printed board, Heat Conduction Material, cabinet and locking strip;
Heat conduction support upper end is provided with printed board, and upper cover plate is installed in printed board, and heat conduction internal stent has Heat Conduction Material towards the surface-coated of printed board, and chip is placed between Heat Conduction Material and printed board; Heat conduction support both sides are separately installed with a locking strip, and locking strip is for being locked at heat conduction support in the lateral groove of cabinet heat conduction support side is fully contacted with cabinet side; The heat producing during chip operation is transmitted on cabinet by Heat Conduction Material, heat conduction support successively, and dissipation of heat is gone out the most at last.
2. multi-chip heat-transfer device according to claim 1, is characterized in that, described cabinet is with fin.
3. chip heat-transfer device according to claim 1 and 2, is characterized in that, described heat-transfer device also comprises upper cover plate, and upper cover plate is placed in printed board upper end, is fixed on heat conduction support together with printed board.
4. chip heat-transfer device according to claim 1 and 2, is characterized in that, described Heat Conduction Material is nonmetallic materials.
5. chip heat-transfer device according to claim 1 and 2, is characterized in that, described chip is PowerPC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320779817.4U CN203588995U (en) | 2013-11-30 | 2013-11-30 | Chip heat conduction apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320779817.4U CN203588995U (en) | 2013-11-30 | 2013-11-30 | Chip heat conduction apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203588995U true CN203588995U (en) | 2014-05-07 |
Family
ID=50586865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320779817.4U Expired - Lifetime CN203588995U (en) | 2013-11-30 | 2013-11-30 | Chip heat conduction apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203588995U (en) |
-
2013
- 2013-11-30 CN CN201320779817.4U patent/CN203588995U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140507 |
|
| CX01 | Expiry of patent term |