CN203588994U - Insulated high-temperature resistant radiating film - Google Patents
Insulated high-temperature resistant radiating film Download PDFInfo
- Publication number
- CN203588994U CN203588994U CN201320774637.7U CN201320774637U CN203588994U CN 203588994 U CN203588994 U CN 203588994U CN 201320774637 U CN201320774637 U CN 201320774637U CN 203588994 U CN203588994 U CN 203588994U
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- China
- Prior art keywords
- layer
- base material
- temperature
- temperature resistant
- adhesive layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000463 material Substances 0.000 claims abstract description 23
- 239000010410 layer Substances 0.000 claims abstract description 22
- 239000012790 adhesive layer Substances 0.000 claims abstract description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000004642 Polyimide Substances 0.000 claims abstract description 10
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 10
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 10
- 229920001721 polyimide Polymers 0.000 claims abstract description 10
- 238000009413 insulation Methods 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses an insulated high-temperature resistant radiating film which comprises a base material. The base material is a polyimide layer. One face of the base material is uniformly coated with a radiating layer, and the other face of the base material is coated with an adhesive layer. A release layer covers the bottom of the adhesive layer. The radiating layer is a carbon nanotube layer. The insulated high-temperature resistant radiating film adopts afterwork die-cutting, can be attached to any plane or bent surface, has good heat conduction and heat radiation properties, and can be widely applied to electronic products such as mobile phones, tablet computers, LCD screens and the like.
Description
Technical field
The utility model relates to a kind of insulation high-temperature-resistant heat dissipation film.
Background technology
High speed development along with electronic industry, modern society's electronic installation is more and more universal, as more and more in household electronic device, industrial electronic device and information communication devices such as PC, mobile phone, server, GPS navigation devices, function is more and more and powerful.Electronic apparatus functions gets more and more and from strength to strength, its inside chip or electronic module are also more and more accordingly, and the speed of service is more and more faster.Inside chip or the electronic module speed of service are more and more faster, and the parts of the high temperature of generation are also more and more.Add short, thin, light, littleization of electronic installation, so that in minimum space, to place considerable chip like this or electronic module, short thin light little space cannot or be difficult to by fan is set, heat be conducted merely, and chip or electronic module at high temperature can reduce service behaviour, shorten working life.Under the development trend of such electronic industry, the thermal energy conduction producing in the time of certainly will will having heat conducting material handle to result from chip or electronic module work out.But the heat at high-temperature component place between high temperature resistant adhesive tape and heat sink material conventionally with adhesive tape gluing, but glue-line exists the inhomogeneous discontinuous problem of heat conduction so that high-temperature component place heat build-up is difficult to diversion, cause electronic product radiating not in time, affect its serviceability.
Summary of the invention
The utility model relates to a kind of insulation high-temperature-resistant heat dissipation film, has good thermal conductivity, can be electronic unit heat dissipation interface is provided.
For realizing this purpose, the structure that the utility model adopts is: a kind of insulation high-temperature-resistant heat dissipation film, comprise base material, described base material is to be the polyimides sheet material that plane is extended, described base material one side is evenly coated with heat dissipating layer, another side is evenly coated with adhesive layer, on described adhesive layer, is coated with release layer, and described heat dissipating layer is carbon nanotube layer.
What described adhesive layer adopted is heat-conducting glue structure.
Thickness >=12 μ the m of described polyimides sheet material.
Thickness >=5 μ the m of described carbon nanotube layer.
Its beneficial effect is: this insulation high-temperature-resistant heat radiation wood cross cutting of knocking off, can be attached at any plane or curved surface, and there is good heat conduction and heat radiation performance, can be widely used in the electronic products such as mobile phone, flat board, LCD screen.
Accompanying drawing explanation
The utility model will illustrate by example and with reference to the mode of accompanying drawing, wherein:
Fig. 1 is the utility model structural representation.
Embodiment
Disclosed all features in this specification, or the step in disclosed all methods or process, except mutually exclusive feature and/or step, all can combine by any way.
Disclosed arbitrary feature in this specification (comprising any accessory claim, summary and accompanying drawing), unless narration especially all can be replaced by other equivalences or the alternative features with similar object.That is,, unless narration especially, each feature is an example in a series of equivalences or similar characteristics.
Insulation high-temperature-resistant heat dissipation film as shown in Figure 1, comprise base material 1, what base material 1 adopted is to be the polyimides sheet material that plane is extended, the thickness >=12 μ m of polyimides sheet material, polyimides has good heat conductivility, and has higher tensile strength and rigidity.The one side of base material 1 is evenly coated with heat dissipating layer 2, heat dissipating layer 2 is carbon nanotube layer, thickness >=5 μ the m of carbon nanotube layer, carbon nano-tube has good insulation property and horizontal heat conductivility, heat on base material 1 can be dispersed in to the surface of carbon nanotube layer, and heat diversion is extremely extraneous, to play the function of level heat radiation, having made up polyimides can only thermal resistance and problem that can not heat conduction and heat radiation, and polyimide layer has made up again the problem of carbon nano-tube tensile strength and rigidity deficiency simultaneously.The another side of base material 1 is evenly coated with adhesive layer 3, is coated with one deck release layer 4 on adhesive layer 3, and what described adhesive layer 3 adopted is heat-conducting glue structure, the heat on electronic component can be conducted to base material 1.
The utility model is not limited to aforesaid embodiment.The utility model expands to any new feature or any new combination disclosing in this manual, and the arbitrary new method disclosing or step or any new combination of process.
Claims (4)
1. an insulation high-temperature-resistant heat dissipation film, comprise base material (1), it is characterized in that, the polyimides sheet material that described base material (1) extends for being plane, described base material (1) one side is evenly coated with heat dissipating layer (2), another side is evenly coated with adhesive layer (3), is coated with release layer (4) on described adhesive layer (3), and described heat dissipating layer (2) is carbon nanotube layer.
2. insulation high-temperature-resistant heat dissipation film according to claim 1, is characterized in that, what described adhesive layer (3) adopted is heat-conducting glue structure.
3. insulation high-temperature-resistant heat dissipation film according to claim 1, is characterized in that, the thickness >=12 μ m of described polyimides sheet material.
4. insulation high-temperature-resistant heat dissipation film according to claim 1, is characterized in that, the thickness >=5 μ m of described carbon nanotube layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320774637.7U CN203588994U (en) | 2013-11-29 | 2013-11-29 | Insulated high-temperature resistant radiating film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320774637.7U CN203588994U (en) | 2013-11-29 | 2013-11-29 | Insulated high-temperature resistant radiating film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203588994U true CN203588994U (en) | 2014-05-07 |
Family
ID=50586864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320774637.7U Expired - Lifetime CN203588994U (en) | 2013-11-29 | 2013-11-29 | Insulated high-temperature resistant radiating film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203588994U (en) |
-
2013
- 2013-11-29 CN CN201320774637.7U patent/CN203588994U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140507 |
|
| CX01 | Expiry of patent term |