CN203519659U - Automatic positioning test socket for CMOS camera chip float board - Google Patents
Automatic positioning test socket for CMOS camera chip float board Download PDFInfo
- Publication number
- CN203519659U CN203519659U CN201320542952.7U CN201320542952U CN203519659U CN 203519659 U CN203519659 U CN 203519659U CN 201320542952 U CN201320542952 U CN 201320542952U CN 203519659 U CN203519659 U CN 203519659U
- Authority
- CN
- China
- Prior art keywords
- support plate
- test
- unsteady
- chip
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses an automatic positioning test socket for a CMOS camera chip float board. The automatic positioning test socket comprises an upper cover and a base which cooperate with each other. The base comprises a PCB pinboard, a test unit, and float carrier plates from bottom to top in sequence. The upper cover comprises test lenses and lens pressing plates. A light source is disposed in a darkroom in front of the test lenses, and a comparison image is disposed between the test lens and the light source. The test unit comprises a plurality of test probes, and a probe maintaining main body, a probe maintaining board, and a probe maintaining frame used to install the test probes. Furthermore, when the upper cover is covered with the based, the float carrier plates contact with the lens pressing plates, and can move downwards by push of the lens pressing plates, and meanwhile the float carrier plates are also connected with at least an elastic component which provides forces making the float carrier plates move upwards. The automatic positioning test socket can be compatible to different testing machines, realizes automatic, efficient, and accurate tests on CMOS chips, and the chips would not be damaged.
Description
Technical field
The utility model relates to the unsteady automatic assignment test socket of support plate of a kind of CMOS chip testing equipment, particularly a kind of CMOS camera chip.
Background technology
The light sensation chip device that CMOS wafer system forms by process sensitive integrated circuits on silicon wafer, it is widely used in mobile phone, in the equipment such as computer, camera head.In general, CMOS wafer has that product circuit is integrated derives institute compared with high, circuit and adopt between tin ball the features such as step pitch little (about 0.2mm).
At present, most cmos imaging test chip automatic socket is for coordinating the requirement of board, single of basic employing, 1 * 4 and 2 * 2 mechanism for testing, but because optics CMOS chip is to the requirement of chip optical centre and optical center very high (test concentricity is no more than 0.03mm), the PITCH more and more less (reaching 0.20mm) of chip tin ball, the repetitive positioning accuracy that automatic test machine platform is placed is simultaneously different, so cause a lot of test jacks in design and processing, have to attend to one thing and lose sight of another, design standards and the machining precision of test jack have been reduced, meet the tolerances in design of product.Like this, the test of product be can not meet to test request to a great extent, reduced the test passes rate of product, for example, the image difference that test macro is adopted reaches more than 8%, and False Rate reaches more than 10%, in addition, also can cause a large amount of chips by board, to be damaged by pressure in test process, cause mechanical fault simultaneously, cause testing efficiency to reduce.
Utility model content
The purpose of this utility model is to provide a kind of CMOS camera chip automatic assignment test socket of support plate that floats, it can be compatible from different tester tables, realization to CMOS chip automatically, efficiently, test accurately, and unlikely damage chip, thus overcome deficiency of the prior art.
For realizing above-mentioned utility model object, the utility model has adopted following technical scheme:
A kind of CMOS camera chip automatic assignment test socket of support plate that floats, comprise the upper cover and the base that cooperatively interact, described base comprises PCB card extender, test cell and the unsteady support plate distributing successively from bottom to top, described upper cover comprises testing lens and camera lens pressing plate, in the darkroom in described testing lens the place ahead, be provided with light source, and, between described testing lens and light source, be also provided with contrast images, described test cell comprises complex root test probe and keeps main body, probe holding plate and probe holding frame in order to the probe of installation testing probe.
Further, when upper cover and base cover, described unsteady support plate touches mutually with camera lens pressing plate, and can be descending under the pushing of camera lens pressing plate, meanwhile, described unsteady support plate also with at least one in order to provide the flexible member of the effect of the up power of support plate that makes to float to be connected.
As one of comparatively preferred embodiment, on described unsteady support plate, be also arranged with in order to chip under test is pushed to two of the support plate center of floating with top shoe and in order to provide make slide block away from two of the horizontal thrust at the support plate center of floating with upper reset spring, and, when unsteady support plate is descending, the ligulate Xie of described slide block and probe holding frame ?mechanism coordinate, and can described ligulate Xie ?to unsteady support plate center, move under the pushing of mechanism.
On described unsteady support plate, be also provided with the tin ball coordinating in order to the tin ball with on chip under test and place chamfering.
The chip under test standing groove degree of depth on described unsteady support plate is greater than chip under test thickness, and this both difference is at least test probe stroke half.
On described unsteady support plate, be also provided with the ligulate step coordinating with the ledge structure of chip under test.
Between described unsteady support plate and slide block, be also provided with slider guide cover plate, described slider guide cover plate coordinates with unsteady support plate to form uses the guide rail structure moving horizontally for slide block.
Between described unsteady support plate and slide block, be also provided with position-limit mechanism, described position-limit mechanism comprises and is distributed in the slide block stopper slot on the support plate that floats and is distributed in the slide block limited block on slide block.
Described camera lens pressing plate is fixedly connected with testing lens, and described camera lens pressing plate is also fixedly connected with lathe cylinder.
Described base also comprises equipment connection plate, and described equipment connection plate is located between upper cover and PCB card extender.
Principle of work of the present utility model is, by tested chip is placed in this socket, light and shade variation along with darkroom inner light source, CSP chip is the collection to image by testing lens, and optical signalling is inputted to the photosensitive area in CSP chip, and optical signalling is changed into current signal, and transfer signals to PCB card extender by test probe, and by current signal input peripheral testing apparatus, in peripheral hardware testing apparatus, current signal is changed into digital signal, regenerate picture signal; By the image parameter of in good time generation and original standard picture are contrasted, judge whether to meet design requirement.
That aforementioned test probe adopts is probe for semiconductor test (POGO PIN), can realize the microwave attenuation of signal, has guaranteed stability and the reliability of test;
By aforementioned probe retainer is set, placement in the time of can solving operating personnel and board operation, tested chip positioning problem, place easy to operate simultaneously, board operation convenience strengthens greatly, by the cooperation with tester table, meet product test and reach production capacity requirement: hour test volume is higher than 4KPCS chip.
Compared with prior art, the utility model at least tool have the following advantages:
(1) this test jack is simple to operate, easy to use, is applicable to individual manually or the automatic PC test operation of board, is applicable to test and the functional verification of integrated circuit (IC) chip;
(2) this test jack chips support plate adopts the unsteady carrying board structure of registration, can effectively protect the not tested damage of structure of chip, extends the serviceable life of probe;
(3) in this test jack, upper cover part material preferably adopts aluminium alloy, it can utilize high-precision CNC addition, guaranteed every use functional requirement, and base portion material preferably adopts the TORLON4203 that meets environmental requirement, it also can complete by high-precision CNC addition, has guaranteed every dimension precision requirement;
(4) this test jack can meet the IC of 100,000 times and detects the life-span, and more than a hour test volume reaches 3KPCS, and can meet the board test request of cooperation different manufacturers.
Accompanying drawing explanation
Fig. 1 is one of structural representation of the utility model one preferred embodiment;
Description of reference numerals: the support plate 1 that floats, kickboard slide block 2, chip under test 3, testing lens 4, camera lens pressing plate 5, probe holding frame 6, test probe 7, probe holding plate 8, probe keep main body 9, LED lamp plate 10, camera lens holding frame 11, PCB card extender 12, back-moving spring 13, slider guide cover plate.
Embodiment
Below in conjunction with accompanying drawing and a preferred embodiment, the technical solution of the utility model is further described.
Consult Fig. 1, the unsteady automatic assignment test socket of support plate of a kind of CMOS camera chip that the present embodiment is related, comprise the upper cover and the base that cooperatively interact, described base comprises the PCB card extender 12 distributing successively from bottom to top, test cell and unsteady support plate 1, described upper cover comprises testing lens 4 and camera lens pressing plate 5, in the darkroom in described testing lens the place ahead, be provided with light source (as, LED lamp plate 10), and, between described testing lens and light source, be also provided with contrast images, described test cell comprises complex root test probe 7 and keeps main body 9 in order to the probe of installation testing probe, probe holding plate 8 and probe holding frame 11.
Further, when upper cover and base cover, described unsteady support plate touches mutually with camera lens pressing plate, and can be descending under the pushing of camera lens pressing plate, meanwhile, described unsteady support plate also with at least one in order to provide the flexible member of the effect of the up power of support plate that makes to float to be connected.
As one of comparatively preferred embodiment, on described unsteady support plate, be also arranged with in order to chip under test is pushed to two of the support plate center of floating with top shoe and in order to provide make slide block away from two of the horizontal thrust at the support plate center of floating with upper reset spring, and, when unsteady support plate is descending, the ligulate Xie of described slide block and probe holding frame ?mechanism coordinate, and can described ligulate Xie ?to unsteady support plate center, move under the pushing of mechanism.
On described unsteady support plate, be also provided with the tin ball coordinating in order to the tin ball with on chip under test and place chamfering.
The chip under test standing groove degree of depth on described unsteady support plate is greater than chip under test thickness, and this both difference is at least test probe stroke half.
On described unsteady support plate, be also provided with the ligulate step coordinating with the ledge structure of chip under test.
Between described unsteady support plate and slide block, be also provided with slider guide cover plate, described slider guide cover plate coordinates with unsteady support plate to form uses the guide rail structure moving horizontally for slide block.
Between described unsteady support plate and slide block, be also provided with position-limit mechanism, the accuracy moving to meet slide block, described position-limit mechanism comprises and is distributed in the slide block stopper slot on the support plate that floats and is distributed in the slide block limited block on slide block, meanwhile, slide block limited block has been reserved enough spaces to aforementioned back-moving spring placement is installed.
Described camera lens pressing plate is fixedly connected with testing lens, and described camera lens pressing plate is also fixedly connected with lathe cylinder.
Described base also comprises equipment connection plate, and described equipment connection plate is located between upper cover and PCB card extender.
Further, be also distributed with some equal tabula rasas in described darkroom, these equal tabula rasas are distributed between LED lamp plate and testing lens.
Further, in described unsteady support plate, the peak excursion 0.03mm of chip under test optical centre and upper cover optical center, realizes both good location.
Further, described base also comprises equipment connection plate, and described equipment connection plate is located between upper cover and PCB card extender, by the setting of this equipment connection plate, can make the simplification that connects of this socket and peripheral hardware testing apparatus, as, only with fastened by screw.
Aforementioned base (SOCKET) part can adopt TORLON4203 material, makes electrostatic prevention grade reach 10
14ohm.cm grade.
Further, in described test probe, be provided with spring, and when upper cover and base cover completely, described spring is compressed, and fully contacts with the tin ball on tested chip.
And aforementioned probe keeps the combination of main body, probe holding plate and probe holding frame, can make the placement of test probe and taking-up very convenient, and make tested chip freely to put into or to take out.
In the present embodiment, the principle of work of unsteady support plate comprises: the slip of test chip (IC) in the support plate that floats relies on slide block to realize, the slip of slide block is under the effect that has downforce, rely on pretension back-moving spring realize slide block to central slide, when slide block is accurately positioned behind unsteady support plate center at test chip (IC), in the situation that losing downforce, rely on pretension back-moving spring to realize the reset to origin-location of slide block.
And the principle of work that the support plate automatic vertical that floats slides comprises:
(1) camera lens pressing plate and testing lens, by screw threads for fastening, guarantee that the horizontal relative position of optical center and lower platen optical centre is (0,0);
(2) lathe cylinder and camera lens pressing plate pass through screw threads for fastening, drive camera lens pressing plate to move down, pushing down the support plate that floats moves down, because slide block is in folding process, touch probe holding frame ligulate Xie ?mechanism, to unsteady support plate center, move, simultaneously, owing to there being the level of slider guide cover plate to keep, slide block compression pretension back-moving spring, and push to test chip moves to unsteady support plate center;
(3) camera lens pressing plate is in the process of the unsteady support plate of compression, aforementioned structure design due to probe holding frame (F), make slide block in same time, move to design attitude, so just the value of exerting all one's strength has determined the displacement of slide block, make four slide blocks reach the position location of setting simultaneously, chip is done to accurate location;
(4) because the support plate that floats is along with the moving down of lower platen, test chip is behind location automatically, and test probe will touch test chip tin ball, realize circuit turn-on, test;
(5) after test completes, camera lens pressing plate, along with the reset of lathe cylinder, will be automatically reset by the back-moving spring of kickboard support plate, and chip completes integrated testability.
For protecting chip and tin ball thereof not damaged after being pushed, unsteady support plate also has lower array structure:
(1) ligulate step, makes full use of the ledge structure of test chip, and chip is pushed in process can be free to slide;
(2) the test chip standing groove degree of depth of floating on support plate is greater than test chip integral thickness, and general difference is half of test probe stroke; Make camera lens pressing plate in pressing down process, contact chip not, after only having and automatically having located to test chip, test probe is contact chip tin ball again;
(3) on the support plate that floats, design tin ball and place chamfering, tin ball, after completing location, is positioned to dot matrix top completely, it is fully located, also can prevent chip bounce-back when unsteady support plate resets simultaneously.
As one of comparatively preferred embodiment, the course of work of aforementioned test probe can be:
(1) test mode: (module is put into standing groove during at pressurized when test probe, upper cover LID presses down simultaneously) contained spring compression, the compressed value that expection is set can make spring fully contact with the tin ball on tested chip, and can by the upper tin ball of tested chip, (normal dia be at 0.2～0.5mm, height is at 0.1～0.25mm) puncture, and there will not be skewness;
(2) non-test mode: when test probe is not in the situation that being subject to external force compacting, keep relaxed state, so guarantee that probe is in not subjected to pressure state, guarantee that serviceable life and the conducting function in lifetime of probe is normal, reduce testing expense.
Preferably, described test probe can adopt semiconductor probe, so can better realize tin ball in chip is carried out to point-to-point contact, meet the conducting of test point, on to the test of tin ball, meet accurately some contact, and signal is transferred to control system, system validation contact is correct.And the area of test probe and tested chip contact site can be controlled very easily, make tin ball on tested chip be less than 1/4 of tin bulb diameter because of the diameter of engaged test probe damage field.
Further, by the composite design of aforementioned test cell, can make unit, single testing efficiency realize 2 times of improved efficiencies, test frequency can be consistent with the simple chip testing of test, and hour test volume can be higher than 1～5KPCS.
By the utility model, can realize the CMOS chip full automation of test automatically, test gimmick is simple, and it also can have following advantage:
(1) testing base (SOCKET) part adopts TORLON4203 material, electrostatic prevention grade is reached: 10
14ohmcm grade;
(2) connect simplification with test macro, for example, with fastened by screw;
(3) special unsteady support plate standing groove displacement structure make the placement of test chip and take out very convenient;
(4) test chip placement location is accurate, and test probe head comprehensive engagement tin ball, does not exist skewness, and reduced the pressure of test probe to test chip, has protected test chip;
(5) life-span of test probe promotes greatly, has reduced the expense of test;
(6) test effect is accurate, reliable;
(7) unit, single testing efficiency are realized ten times of improved efficiencies, and test frequency can be consistent with the simple chip testing of test.
And the utility model also can meet the high life requirement of CMOS chip testing, life of product reaches more than 500,000 times, meets the microwave attenuation of cmos signal transmission simultaneously, guarantees stability and the reliability of test signal transmission; And, meet in test macro optical image is accurately located, the requirement of judgement test result.
In addition, based on content of the present utility model, those skilled in the art also can expect easily, by the analysis to different size CMOS chip series structure, realize product design structure compatible, make different CMOS chip series can on different tester tables, realize installation, the compatibility of test.
It is pointed out that above embodiment is only for illustrating content of the present utility model, in addition, the utility model also has other embodiments.But all employings are equal to replaces or technical scheme that equivalent deformation mode forms all drops in protection domain of the present utility model.
Claims (10)
1. a CMOS camera chip automatic assignment test socket of support plate that floats, comprise the upper cover and the base that cooperatively interact, it is characterized in that, described base comprises PCB card extender, test cell and the unsteady support plate distributing successively from bottom to top, described upper cover comprises testing lens and camera lens pressing plate, in the darkroom in described testing lens the place ahead, be provided with light source, and, between described testing lens and light source, be also provided with contrast images, described test cell comprises complex root test probe and keeps main body, probe holding plate and probe holding frame in order to the probe of installation testing probe.
2. the CMOS camera chip according to claim 1 automatic assignment test socket of support plate that floats, it is characterized in that, when upper cover and base cover, described unsteady support plate touches mutually with camera lens pressing plate, and can be descending under the pushing of camera lens pressing plate, meanwhile, described unsteady support plate also with at least one in order to provide the flexible member of the effect of the up power of support plate that makes to float to be connected.
3. the CMOS camera chip according to claim 2 automatic assignment test socket of support plate that floats, it is characterized in that, on described unsteady support plate, be also arranged with in order to chip under test is pushed to two of the support plate center of floating with top shoe and in order to provide make slide block away from two of the horizontal thrust at the support plate center of floating with upper reset spring, and, when unsteady support plate is descending, the ligulate Xie of described slide block and probe holding frame ?mechanism coordinate, and can described ligulate Xie ?to unsteady support plate center, move under the pushing of mechanism.
4. according to the unsteady automatic assignment test socket of support plate of the CMOS camera chip described in claim 2 or 3, it is characterized in that, on described unsteady support plate, be also provided with the tin ball coordinating in order to the tin ball with on chip under test and place chamfering.
5. according to the unsteady automatic assignment test socket of support plate of the CMOS camera chip described in claim 2 or 3, it is characterized in that, the chip under test standing groove degree of depth on described unsteady support plate is greater than chip under test thickness, and this both difference is at least test probe stroke half.
6. according to the unsteady automatic assignment test socket of support plate of the CMOS camera chip described in claim 2 or 3, it is characterized in that, on described unsteady support plate, be also provided with the ligulate step coordinating with the ledge structure of chip under test.
7. the CMOS camera chip according to claim 3 automatic assignment test socket of support plate that floats, it is characterized in that, between described unsteady support plate and slide block, be also provided with slider guide cover plate, described slider guide cover plate coordinates with unsteady support plate to form uses the guide rail structure moving horizontally for slide block.
8. the CMOS camera chip according to claim 3 automatic assignment test socket of support plate that floats, it is characterized in that, between described unsteady support plate and slide block, be also provided with position-limit mechanism, described position-limit mechanism comprises and is distributed in the slide block stopper slot on the support plate that floats and is distributed in the slide block limited block on slide block.
9. the unsteady automatic assignment test socket of support plate of CMOS camera chip according to claim 2, is characterized in that, described camera lens pressing plate is fixedly connected with testing lens, and described camera lens pressing plate is also fixedly connected with lathe cylinder.
10. the unsteady automatic assignment test socket of support plate of CMOS camera chip according to claim 1, is characterized in that, described base also comprises equipment connection plate, and described equipment connection plate is located between upper cover and PCB card extender.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320542952.7U CN203519659U (en) | 2013-09-03 | 2013-09-03 | Automatic positioning test socket for CMOS camera chip float board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320542952.7U CN203519659U (en) | 2013-09-03 | 2013-09-03 | Automatic positioning test socket for CMOS camera chip float board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203519659U true CN203519659U (en) | 2014-04-02 |
Family
ID=50378574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320542952.7U Withdrawn - After Issue CN203519659U (en) | 2013-09-03 | 2013-09-03 | Automatic positioning test socket for CMOS camera chip float board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203519659U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103439541A (en) * | 2013-09-03 | 2013-12-11 | 苏州创瑞机电科技有限公司 | Automatic locating and testing socket for CMOS camera shooting chip floating carrier plate |
| CN104297659A (en) * | 2014-10-28 | 2015-01-21 | 北京思比科微电子技术股份有限公司 | Pattern CP device for CMOS image sensor products |
| CN105866655A (en) * | 2015-01-23 | 2016-08-17 | 大族激光科技产业集团股份有限公司 | PCB test fixture with alignment detection mechanism |
| CN107317213A (en) * | 2017-07-19 | 2017-11-03 | 深圳市明信测试设备有限公司 | A kind of accurate soft arranging wire automatic plug mechanism |
| CN109490680A (en) * | 2019-01-02 | 2019-03-19 | 珠海市运泰利自动化设备有限公司 | A kind of mechanism for testing of PCBA Male head connector |
| CN114152783A (en) * | 2021-11-12 | 2022-03-08 | 环维电子(上海)有限公司 | Micro-needle floating test tool and test module |
-
2013
- 2013-09-03 CN CN201320542952.7U patent/CN203519659U/en not_active Withdrawn - After Issue
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103439541A (en) * | 2013-09-03 | 2013-12-11 | 苏州创瑞机电科技有限公司 | Automatic locating and testing socket for CMOS camera shooting chip floating carrier plate |
| CN103439541B (en) * | 2013-09-03 | 2016-05-18 | 苏州创瑞机电科技有限公司 | The CMOS camera chip automatic assignment test socket of support plate that floats |
| CN104297659A (en) * | 2014-10-28 | 2015-01-21 | 北京思比科微电子技术股份有限公司 | Pattern CP device for CMOS image sensor products |
| CN104297659B (en) * | 2014-10-28 | 2017-08-08 | 北京思比科微电子技术股份有限公司 | The band pattern CP test devices of CMOS image sensor product |
| CN105866655A (en) * | 2015-01-23 | 2016-08-17 | 大族激光科技产业集团股份有限公司 | PCB test fixture with alignment detection mechanism |
| CN107317213A (en) * | 2017-07-19 | 2017-11-03 | 深圳市明信测试设备有限公司 | A kind of accurate soft arranging wire automatic plug mechanism |
| CN107317213B (en) * | 2017-07-19 | 2023-08-04 | 深圳市明信测试设备股份有限公司 | Accurate automatic plug mechanism of soft winding displacement |
| CN109490680A (en) * | 2019-01-02 | 2019-03-19 | 珠海市运泰利自动化设备有限公司 | A kind of mechanism for testing of PCBA Male head connector |
| CN109490680B (en) * | 2019-01-02 | 2024-03-19 | 珠海市运泰利自动化设备有限公司 | Test mechanism of PCBA male connector |
| CN114152783A (en) * | 2021-11-12 | 2022-03-08 | 环维电子(上海)有限公司 | Micro-needle floating test tool and test module |
| CN114152783B (en) * | 2021-11-12 | 2023-06-16 | 环维电子(上海)有限公司 | Microneedle floating test tool and test module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103439541B (en) | The CMOS camera chip automatic assignment test socket of support plate that floats | |
| CN203519659U (en) | Automatic positioning test socket for CMOS camera chip float board | |
| CN103487609A (en) | Tens of millions of pixel level CMOS optical chip module test socket | |
| CN203519658U (en) | Automatic test socket of megapixel-level CMOS optical chip module | |
| CN203519776U (en) | Straight needle automatic test socket for CMOS wafer automatic testing | |
| CN203519657U (en) | Wafer level camera module (WLC) automatic test socket | |
| CN103424681B (en) | Automatic test socket for CMOS wafer automatic test straight needle | |
| CN204388787U (en) | Based on the high-precision A CF soft base plate pick-up unit of ccd video camera | |
| CN105182142A (en) | Probe testing device | |
| CN103439539A (en) | Mega-pixel CMOS optical chip module automatic testing socket | |
| CN106483126A (en) | Semiconductor element video test equipment and its test equipment | |
| CN202794228U (en) | Pressure plate rotary mechanism of chip module group testing socket | |
| CN217181007U (en) | Detachable ceramic block type wafer test probe card | |
| CN104062474B (en) | Abnormity FPC optical chip module test jack | |
| CN104062472A (en) | Flexible printed circuit (FPC) optical chip module automatic test socket | |
| CN105783728A (en) | Foot pad detection device and method | |
| CN203519660U (en) | Ten million pixel level CMOS optical chip module test socket | |
| CN202533707U (en) | Multifunctional lens test clamp | |
| CN102222632A (en) | Wafer testing method and device | |
| CN204389534U (en) | The test jack of abnormity FPC optical chip module | |
| CN205067627U (en) | Probe testing apparatus | |
| CN1635388A (en) | Ball grid array substrate detecting device and constructive method thereof | |
| CN202758021U (en) | Electrical performance testing device and system | |
| CN202794229U (en) | Elastic force compensation mechanism of chip testing socket | |
| CN111678676A (en) | Silicon-based OLED probe testing device and testing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140402 Effective date of abandoning: 20160518 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |