CN202794229U - Elastic force compensation mechanism of chip testing socket - Google Patents
Elastic force compensation mechanism of chip testing socket Download PDFInfo
- Publication number
- CN202794229U CN202794229U CN 201220192171 CN201220192171U CN202794229U CN 202794229 U CN202794229 U CN 202794229U CN 201220192171 CN201220192171 CN 201220192171 CN 201220192171 U CN201220192171 U CN 201220192171U CN 202794229 U CN202794229 U CN 202794229U
- Authority
- CN
- China
- Prior art keywords
- main body
- loam cake
- chip testing
- buckle
- holding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The utility model relates to an elastic force compensation mechanism of a chip testing socket. The elastic force compensation mechanism comprises an upper cover main body, a maintenance plate, a rotary base ring and a pressure plate, wherein two ends of the upper cover main body are respectively hinged to one end of a maintenance framework and a buckle, multiple torsion springs are arranged between the upper portion of the buckle and the upper end surface of the upper cover main body, a slide pipe capable of matching with the buckle is arranged in the other end of the maintenance framework, the rotary base ring is fixedly embedded into the maintenance plate, the pressure plate presses the lower end surface of the rotary base ring and is fixedly connected with the rotary base ring, the maintenance plate is fixedly connected with the lower end surface of the upper cover main body, and multiple second elastic elements are arranged between the maintenance plate and the upper cover main body. According to the utility model, the problems of large rebound pressure and probe strokes in the process that chips or module groups contact with probes are solved, the chip testing efficiency and the product qualified rate are greatly increased, and damages to the chips are decreased.
Description
Technical field
The utility model relates to a kind of chip, module proving installation, relates in particular to a kind of chip module series of tests socket stretch compensation mechanism.
Background technology
A kind of light sensation chip that the CMOS optical chip is integrated along with circuit and optics is integrated and arise at the historic moment, it is widely used in the equipment such as mobile phone, computer, camera and video camera.Common CMOS optical chip has following features: integrated higher, the chip material of product circuit adopts silicon to derive as main material, circuit and adopts between tin ball or gold-plated paster, the tin ball step pitch design more and more less, reach about 0.2mm at present.
Can normally move for detecting the CMOS optical chip, generally need to test it, and in test process, the protective core chip architecture is not damaged be the most basic requirement.In the most commercially available apparatus for testing chip, behind the pressing plate contact chip, chip is along with kickboard is pressed down, tin ball contact probe, and the resilient pressure of probe will all be applied in the tin ball of chip or above the PAD, make the chip pressurized larger, very easily defective chip.For eliminating the damage to chip, generally adopt at present long stroke, little pressure probe, it is less to make chip press down process contact power, but actual effect is chip still exists impaired probability, and stroke is long just to have increased the time of pressing down, and elastic force is little just to have determined that the life-span of probe generally can only reach about half of normal probe life-span, and then affected testing efficiency and degree of accuracy, and directly increased testing cost.
The utility model content
The purpose of this utility model is to propose a kind of chip testing socket stretch compensation mechanism, it can solve the large and probe route problem of chip, module resilient pressure in the contact probe process, significantly promote the qualification rate of chip testing efficiency and product, and reduce the destruction to chip.
For realizing above-mentioned utility model purpose, the utility model has adopted following technical scheme:
A kind of chip testing socket stretch compensation mechanism comprises the loam cake main body, holding plate, rotation basic ring and pressing plate, these loam cake main body two ends are hinged with maintenance framework one end and a buckle respectively, be provided with plural the first flexible member between this buckle top and the loam cake main body upper surface, this maintenance framework other end be provided with can with the fixed mechanism that is clasped, this rotation basic ring fixedly is embedded in the holding plate, this pressing plate is installed with on rotation basic ring lower surface, and with the rotation basic ring be fixedly connected with, this holding plate is fixedly connected with loam cake main body lower surface, and also is provided with plural the second flexible member between holding plate and the loam cake main body.
Preferably, plural the first flexible member of symmetrical installation on this loam cake main body upper surface, this first flexible member preferably adopts torsion spring.
Preferably, four jiaos of places, this holding plate upper surface are arranged with plural mounting hole, are provided with one second flexible member in each mounting hole, and this second flexible member preferably adopts spring.
Preferably, aforementioned fixed mechanism adopts and is fixedly installed on the horizontal slip pipe that keeps the framework other end.
Preferably, described rotation basic ring is fixedly connected with holding plate through the horizontal pilot pin of symmetrically arranged plural number, and the two ends of each pilot pin are inserted in respectively in the pin-and-hole that arranges on rotation basic ring and the holding plate.
Preferably, this pressing plate is fixedly connected with rotation basic ring lower surface through symmetrical plural screw.
Preferably, this loam cake main body one end keeps framework one end hinged through a bearing pin and.
Preferably, this buckle top has a planar portions and an inclination upper convex portion, and the bottom has a pothook, and this first flexible member is located between the planar portions of loam cake main body upper surface and buckle.
The utility model compensates the elastic force in CMOS optical chip, the module test process, and therefore have at least following advantage: 1) operation is simple, lower to lathe and personnel's requirement; 2) the indefinite value of elastic of probe is by auto-compensation; 3) can not damage chip or the module of the fragility that detects; 4) life-span of probe promotes greatly, has reduced the expense of test; 5) the test effect is accurate, and is reliable; 6) unit, single testing efficiency promote greatly, and the test frequency can be consistent with the simple chip testing of test.
Description of drawings:
Fig. 1 is the decomposition texture synoptic diagram of the utility model one preferred embodiment chips test jack stretch compensation mechanism;
Fig. 2 is the stereographic map of the utility model one preferred embodiment chips test jack stretch compensation mechanism;
Fig. 3 is the structural representation of the socket of chip testing shown in Fig. 1-2 stretch compensation mechanism when reset mode;
Fig. 4 is the structural representation of the socket of chip testing shown in Fig. 1-2 stretch compensation mechanism when test mode;
Fig. 5 is the structural representation of the socket of chip testing shown in Fig. 1-2 stretch compensation mechanism when full open position;
Each assembly and Reference numeral thereof are respectively among the figure: rotation basic ring 1, pilot pin 2, pilot pin 3, maintenance framework 4, loam cake main body 5, buckle 6, pressing plate 7, holding plate 8, screw 9, screw 10, screw 11, screw 12, slip pipe 13, torsion spring 14.
Embodiment
As previously mentioned, the elastic force of the at present commercially available probe that is used for chip, module test generally is worth about A ± 10～20%, like this, just produced a problem, that is: how to eliminate or reduce the fluctuation range of the value of elastic of probe, guarantee both to have made in the proper testing process probe correctly to contact tin ball or PAD, can make again test jack (10～300,000 times) in long-time test guarantee chip, module is not damaged.This problem is all perplexing vast chip testing equipment producer and test factory all the time.
Based on this kind present situation, this case utility model people has proposed the technical solution of the utility model through studying for a long period of time and putting into practice, and is further described below in conjunction with accompanying drawing and this technical scheme of a preferred embodiment.
See also Fig. 1 and Fig. 2, this chip testing socket stretch compensation mechanism comprises loam cake main body 5, holding plate 8, rotation basic ring 1 and pressing plate 7, these loam cake main body 5 two ends keep framework 4 one ends and 6 rotatable connections an of buckle with one respectively, be provided with plural the first flexible member between these buckle 6 tops and loam cake main body 5 upper surfaces, these maintenance framework 4 other ends are provided with the fixed mechanism that can cooperate with buckle 6 clampings, this rotation basic ring 1 fixedly is embedded in the holding plate 8, this pressing plate 7 is installed with on rotation basic ring 1 lower surface, and with the rotation basic ring 1 be fixedly connected with, this holding plate 8 is fixedly connected with loam cake main body 5 lower surfaces, and also is provided with plural the second flexible member between holding plate 8 and the loam cake main body 5.
Preferably, plural the first flexible member of symmetrical installation on these loam cake main body 5 upper surfaces, this first flexible member preferably adopts torsion spring 14.
Preferably, four jiaos of places, these holding plate 8 upper surfaces are arranged with plural mounting hole, are provided with one second flexible member in each mounting hole, and this second flexible member preferably adopts spring.Preferably, aforementioned fixed mechanism adopts and is fixedly installed on the horizontal slip pipe 13 that keeps framework 4 other ends.
Preferably, described rotation basic ring 1 is fixedly connected with holding plate 8 through the horizontal pilot pin 3 of symmetrically arranged plural number, and the two ends of each pilot pin 3 are inserted in respectively in the pin-and-hole that arranges on rotation basic ring 1 and the holding plate 8.
Preferably, this pressing plate 7 is fixedly connected with rotation basic ring 1 lower surface through symmetrical plural screw.
Preferably, these loam cake main body 5 one ends keep framework 4 one ends hinged through a bearing pin and.
Preferably, these buckle 6 tops have a planar portions and an inclination upper convex portion, and the bottom has a pothook, and this first flexible member is located between the planar portions of loam cake main body 5 upper surfaces and buckle 6.
See also Fig. 3-4, this chip testing socket stretch compensation mechanism is when reset mode and duty, and the second flexible member is respectively and loosens and compressive state, can effectively protect probe and chip, and can obtain well to test effect.Consulting shown in Figure 5 is this chip testing socket stretch compensation mechanism structural representation when full open position.
The utility model is by previous designs, and the adequacy that has compensated when having guaranteed chip testing and integrality so that in the test process, can protect probe, can also be protected chip or module.Even adopt little stroke, the probe of large elastic force also can be guaranteed not damaged.
Above preferred embodiment is only for illustration of the utility model, but not to restriction of the present utility model, person skilled in the relevant technique is in the situation that does not break away from spirit and scope of the present utility model, do various conversion or modification, all belonged to category of the present utility model.
Claims (7)
1. chip testing socket stretch compensation mechanism, it is characterized in that, it comprises loam cake main body (5), holding plate (8), rotation basic ring (1) and pressing plate (7), described loam cake main body (5) two ends are hinged with maintenance framework (4) one ends and a buckle (6) respectively, be provided with plural torsion spring (14) between described buckle (6) top and loam cake main body (5) upper surface, described maintenance framework (4) other end is provided with the slip pipe (13) that can cooperate with buckle (6), described rotation basic ring (1) fixedly is embedded in the holding plate (8), described pressing plate (7) is installed with on rotation basic ring (1) lower surface, and with the rotation basic ring (1) be fixedly connected with, described holding plate (8) is fixedly connected with loam cake main body (5) lower surface, and also is provided with plural the second flexible member between holding plate (8) and the loam cake main body (5).
2. chip testing socket stretch compensation according to claim 1 mechanism is characterized in that, the symmetrical plural torsion spring (14) of installing on described loam cake main body (5) upper surface.
3. chip testing socket stretch compensation according to claim 1 mechanism, it is characterized in that, four jiaos of places, described holding plate (8) upper surface are arranged with plural mounting hole, are provided with one second flexible member in each mounting hole, and described the second flexible member adopts spring.
4. chip testing socket stretch compensation according to claim 1 mechanism, it is characterized in that, described rotation basic ring (1) is fixedly connected with holding plate (8) through the horizontal pilot pin of symmetrically arranged plural number (3), and the two ends of each pilot pin (3) are inserted in respectively in rotation basic ring (1) and the upper pin-and-hole that arranges of holding plate (8).
5. chip testing socket stretch compensation according to claim 1 mechanism is characterized in that, described pressing plate (7) is fixedly connected with rotation basic ring (1) lower surface through symmetrical plural screw.
6. chip testing socket stretch compensation according to claim 1 mechanism is characterized in that, described loam cake main body (5) one ends through a bearing pin with keep framework (4) one ends hinged.
7. chip testing socket stretch compensation according to claim 1 mechanism, it is characterized in that, described buckle (6) top has a planar portions and an inclination upper convex portion, the bottom has a pothook, and described torsion spring (14) is located between the planar portions of loam cake main body (5) upper surface and buckle (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220192171 CN202794229U (en) | 2012-05-02 | 2012-05-02 | Elastic force compensation mechanism of chip testing socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220192171 CN202794229U (en) | 2012-05-02 | 2012-05-02 | Elastic force compensation mechanism of chip testing socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202794229U true CN202794229U (en) | 2013-03-13 |
Family
ID=47821471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220192171 Expired - Fee Related CN202794229U (en) | 2012-05-02 | 2012-05-02 | Elastic force compensation mechanism of chip testing socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202794229U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108885227A (en) * | 2016-03-30 | 2018-11-23 | 李诺工业股份有限公司 | Test bench unit |
| CN114062890A (en) * | 2020-08-10 | 2022-02-18 | 杭州旗捷科技有限公司 | Chip test mainboard, chip test equipment and chip test method |
-
2012
- 2012-05-02 CN CN 201220192171 patent/CN202794229U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108885227A (en) * | 2016-03-30 | 2018-11-23 | 李诺工业股份有限公司 | Test bench unit |
| CN114062890A (en) * | 2020-08-10 | 2022-02-18 | 杭州旗捷科技有限公司 | Chip test mainboard, chip test equipment and chip test method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202614794U (en) | Chip module testing socket | |
| US20180322326A1 (en) | Fingerprint identification module | |
| CN202794228U (en) | Pressure plate rotary mechanism of chip module group testing socket | |
| MY155882A (en) | Electrically conductive pins for microcircuit tester | |
| CN103439541B (en) | The CMOS camera chip automatic assignment test socket of support plate that floats | |
| TW200717927A (en) | Vertical docking connector | |
| CN202794229U (en) | Elastic force compensation mechanism of chip testing socket | |
| CN203012063U (en) | Test board for batched electronic component testing | |
| CN210719524U (en) | Calibration equipment of vibrating wire type sensor | |
| CN202817247U (en) | Gold finger connecting device | |
| CN203519659U (en) | Automatic positioning test socket for CMOS camera chip float board | |
| CN202817246U (en) | Gold finger connecting device | |
| TW200701465A (en) | Active device matrix substrate and repair method of pixel unit thereof | |
| CN203039141U (en) | Spring probe connector with protection device | |
| CN102478590A (en) | Direct probe-testing type probe testing device | |
| CN103424681B (en) | Automatic test socket for CMOS wafer automatic test straight needle | |
| CN205231060U (en) | Testing arrangement of camera module | |
| CN202548165U (en) | Switching device for testing flexible circuit board circuit | |
| CN201229228Y (en) | Mobile phone camera shot module test connector | |
| CN202771125U (en) | Base type liquid crystal display test connect device | |
| CN208223689U (en) | Multifunctional demountable pressure sensor apparatus | |
| CN1971288A (en) | Thin-film probe card | |
| CN2919490Y (en) | Film keyboard key | |
| TW200642175A (en) | Method of testing ball grid array packed device in real system and test socket assembly therefor | |
| CN208489135U (en) | Has display module press-key structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20150502 |
|
| EXPY | Termination of patent right or utility model |