CN114152783B - Microneedle floating test tool and test module - Google Patents
Microneedle floating test tool and test module Download PDFInfo
- Publication number
- CN114152783B CN114152783B CN202111342103.2A CN202111342103A CN114152783B CN 114152783 B CN114152783 B CN 114152783B CN 202111342103 A CN202111342103 A CN 202111342103A CN 114152783 B CN114152783 B CN 114152783B
- Authority
- CN
- China
- Prior art keywords
- plate
- test
- chip
- upper cover
- carrier plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention provides a microneedle floating test tool and a test module, wherein the test tool comprises: an upper cover assembly; the upper cover component is pressed or separated from the carrier plate component; the carrier plate assembly comprises a fixed plate, a PCB adapter plate, a lower needle plate, a plurality of test probes, an upper needle plate and a chip carrier plate from bottom to top in sequence; the upper needle plate is arranged on the fixed plate, a plurality of reset springs are arranged between the upper needle plate and the fixed plate, a chip groove is formed in the upper surface of the chip carrier plate and used for placing a test chip, a probe hole is formed in the chip carrier plate, a test probe is fixed on the lower needle plate, when the upper cover assembly is pressed with the carrier plate assembly, the upper needle plate is contacted with the fixed plate, the reset springs are compressed, and the test probe extends out of the chip carrier plate; when the upper cover component and the carrier board component are separated, the upper needle plate and the fixed plate are separated, the reset spring is reset, and the test probe is hidden in the probe hole. The scheme can enable the taking and placing of the chip to be more convenient, and can avoid the broken holes of the probe and avoid influencing the test result of the chip.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a microneedle floating test tool and a test module.
Background
When the chip is produced, the performance of the chip needs to be tested, and the testing method generally transmits signals to a testing jig host through an external pin point for analysis and testing, and judges whether the function of the chip is good or not by detecting the signal conduction condition.
However, for some test chips with smaller volumes, the test chips are not easy to take and place during testing, and probe holes are easily broken, so that the measurement result is affected. Therefore, a testing tool is needed, which is convenient for taking and placing chips and can avoid breaking holes of probes.
Disclosure of Invention
The invention aims to provide a microneedle floating test tool and a test module, which are used for solving the problems that in the prior art, a chip is inconvenient to take and place and a probe is easy to break holes.
The technical scheme provided by the invention is as follows:
the invention provides a microneedle floating test tool, comprising:
an upper cover assembly;
the upper cover assembly is pressed or separated from the carrier plate assembly;
wherein, the carrier plate subassembly includes from down supreme in proper order:
a fixing plate;
the PCB adapter plate is provided with a mounting groove on the upper surface;
a lower needle plate placed in the installation groove;
a plurality of test probes;
the upper needle plate is arranged on the fixed plate, a plurality of reset springs are arranged around the upper needle plate and the fixed plate, and a first stepped hole and a second stepped hole are formed in the upper needle plate from top to bottom;
the lower half part of the chip carrier plate is embedded into the first stepped hole, a chip groove is formed in the upper surface of the chip carrier plate and used for placing a test chip, a probe hole extending from the bottom surface of the chip groove to the bottom surface of the chip carrier plate is formed in the chip carrier plate, and the probe hole is matched with the test needle point of the test chip in position and can allow the test probe to pass through;
the test probe is fixed on the lower needle plate, and the lower end of the test probe extends out from the bottom end of the lower needle plate and is contacted with the bottom surface of the mounting groove of the PCB adapter plate;
when the upper cover assembly and the carrier plate assembly are pressed, the bottom surface of the upper needle plate is contacted with the upper surface of the fixed plate, the reset spring is compressed, and the test probe extends out of the chip carrier plate;
when the upper cover assembly is separated from the carrier plate assembly, the bottom surface of the upper needle plate is separated from the upper surface of the fixed plate, the reset spring is reset, and the test probe is hidden in the probe hole.
Through setting up upper cover subassembly and carrier plate subassembly, and upper cover subassembly and carrier plate subassembly can pressfitting or separation, the carrier plate subassembly is used for placing the test chip, the carrier plate subassembly is supreme including the fixed plate from bottom to top in proper order, PCB keysets, down faller, test probe, go up faller and chip carrier plate, go up and connect through reset spring between faller and the fixed plate, the chip carrier plate inlays in the first shoulder hole of faller, make when carrying out the chip test, place the test chip on the chip groove of chip carrier plate, and with upper cover subassembly and carrier plate subassembly pressfitting, the bottom surface of going up the faller contacts with the upper surface of fixed plate, reset spring can compress, test probe can stretch out the chip carrier plate and be connected with the test chip, realize the connection of chip; and when the test is finished, the upper cover assembly is separated from the carrier plate assembly, the bottom surface of the upper needle plate is separated from the upper surface of the fixing plate, the reset spring can reset, the test probe can be separated from the test chip, the test chip is taken out, and meanwhile, the test probe can be hidden in the probe hole, so that the purpose of protecting the probe is achieved. The scheme can make the taking and placing of the chip more convenient, and the reset spring can play a buffering role for the connection of the test probe and the chip, so that the test result of the chip is prevented from being influenced by the broken hole of the test probe.
Further, the upper cover assembly includes:
an upper cover plate;
the pressing block is arranged below the upper cover plate and fixedly connected with the upper cover plate through a plurality of first screws, and is used for pressing the test chip when the upper cover assembly is pressed with the carrier plate assembly.
Through set up upper cover plate and briquetting at the upper cover subassembly, the briquetting is located the below of upper cover plate to through first screw and upper cover plate fixed connection, make when upper cover subassembly and carrier plate subassembly press, the briquetting can press test chip, so that the probe is connected with test chip.
Further, both sides of the upper cover plate are provided with side grooves, buckles are arranged in the side grooves, both sides of the buckles are provided with rotating shafts, the end parts of the rotating shafts are connected with the side walls of the side grooves through base screws,
the inner side surfaces of the buckles are connected with the inner side surfaces of the side grooves through buckle springs.
Further, the top of buckle all is provided with presses the portion, just the bottom of buckle all is provided with the orientation the fixture block that the briquetting direction extends, the bottom both sides of fixed plate all be provided with the draw-in groove that the fixture block matches.
Through setting up the side tank in the both sides of upper cover plate to set up the buckle in the side tank, buckle and side tank swing joint, and the top of buckle is provided with the pressing part, the bottom of buckle is provided with inwards extending fixture block, the bottom both sides of fixed plate all are provided with the draw-in groove that matches with the fixture block, make when pressing upper cover subassembly and carrier plate subassembly, can make the fixture block of two buckles outwards rotate through inwards pressing two pressing parts, later with upper cover subassembly and carrier plate subassembly pressfitting, and loosen pressing part, under the effect of buckle spring, the fixture block can inwards rotate and combine with the draw-in groove, realize upper cover subassembly and carrier plate subassembly's fixed; and when upper cover subassembly and carrier plate subassembly separation are needed, also only need inwards press two presses the portion, wait that the fixture block separates with the draw-in groove, upwards mention upper cover subassembly can for upper cover subassembly and carrier plate subassembly's pressfitting, separation are more convenient, and more firm during the pressfitting, are favorable to the going on of test.
Further, the two sides of the bottom end of the upper cover plate are respectively provided with a first locating pin, the pressing block is positioned between the two first locating pins,
the upper needle plate is arranged between the two positioning blocks.
Through set up first locating pin in the bottom of upper cover plate, set up the locating hole that matches with first locating pin in the top of fixed plate for when pressing upper cover subassembly and carrier plate subassembly, can lead to the downmovement of upper cover subassembly, avoid upper cover subassembly and carrier plate subassembly's position to appear deviating, lead to the connection of probe and test chip to appear deviating, influence the result of test.
Further, a plurality of carrier springs are arranged between the chip carrier plate and the lower needle plate, when the upper cover assembly and the carrier plate assembly are pressed, the carrier springs are compressed, and the test probes extend out of the chip carrier plate;
when the upper cover assembly and the carrier plate assembly are separated, the carrier plate spring is reset, and the test probes are hidden in the probe holes of the chip carrier plate.
Through set up a plurality of carrier plate springs between chip carrier plate and faller down, can carry out buffer protection to the test chip when upper cover subassembly and carrier plate subassembly are pressed, avoid pressure too big, lead to the chip fracture.
Further, the upper half part of the PCB adapter plate is embedded into the second stepped hole of the upper needle plate, the opening of the first stepped hole is larger than that of the second stepped hole, one diagonal angle of the PCB adapter plate is connected with the fixing plate through a second screw, and the other diagonal angle of the PCB adapter plate is connected with the fixing plate through a second locating pin.
Further, the chip carrier plate is limited on the top surface of the upper needle plate through a limit screw, and the limit screw is in threaded fit with the top surface of the upper needle plate;
the bottom surface of the fixed plate is provided with a plurality of step screws used for connecting the upper needle plate.
In addition, the invention also provides a test module, which comprises a test main board, wherein the test main board is provided with a plurality of the micro-needle floating test tools, the bottom surface of the PCB adapter board is provided with a connector interface,
the fixing plate is provided with a groove matched with the connector interface, the depth of the connector interface is slightly larger than that of the groove, the bottom surface of the groove is embedded with a signal connecting wire, and the connector interface transmits signals to the test main board through the signal connecting wire.
Through setting up the test mainboard to set up a plurality of above-mentioned micropin floating test tool on the test mainboard, can realize testing chip's batch test, be favorable to improving efficiency of software testing.
Further, one opposite angle of the fixing plate is connected with the test main board through a third screw, and the other opposite angle of the fixing plate is connected with the test main board through a third locating pin.
According to the microneedle floating test tool and the test module provided by the invention, the microneedle floating test tool and the test module have the following beneficial effects:
(1) The scheme can enable the taking and placing of the chip to be more convenient, and the reset spring can play a buffering role for the connection of the test probe and the chip, so that the problem that the hole is broken by the test probe to influence the test result of the chip is avoided;
(2) The scheme can enable the pressing and separating of the upper cover component and the carrier board component to be more convenient, and the pressing is more stable, thereby being beneficial to the test;
(3) According to the scheme, when the upper cover assembly and the carrier plate assembly are pressed, downward movement of the upper cover assembly can be guided, and the situation that the connection of the test probe and the test chip is deviated due to deviation of positions of the upper cover assembly and the carrier plate assembly and the test result is influenced is avoided;
(4) Through set up a plurality of carrier plate springs between chip carrier plate and faller down, can carry out buffer protection to the test chip when upper cover subassembly and carrier plate subassembly are pressed, avoid pressure too big, lead to the chip fracture.
Drawings
The above features, technical features, advantages and implementation modes of the present invention will be further described in the following description of preferred embodiments with reference to the accompanying drawings in a clear and understandable manner.
FIG. 1 is a schematic overall structure of an embodiment of the present invention;
FIG. 2 is a schematic view of a top cover assembly according to an embodiment of the present invention;
FIG. 3 is a schematic perspective view of an upper cover assembly according to an embodiment of the present invention;
FIG. 4 is a schematic view of an exploded view of a carrier assembly according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of a carrier assembly according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a test module according to an embodiment of the invention.
Reference numerals in the drawings: 1-an upper cover assembly; 11-an upper cover plate; 12-briquetting; 13-a first screw; 14-side grooves; 15-clamping buckle; 151-a rotation axis; 152-base meter screw; 153-snap springs; 154-a pressing portion; 155-clamping blocks; 16-a first locating pin; 2-a carrier plate assembly; 21-a fixed plate; 211-clamping grooves; 212-positioning blocks; 213-positioning holes; 214-step screw; 215-a third screw; 216-a third locating pin; 22-upper needle plate; 23-chip carrier plate; 24-a return spring; 25-limiting screws; 26-test probes; 27-lower needle plate; 28-carrier plate springs; 29-a PCB adapter plate; 291-a second screw; 292-second locating pins; 3-testing the chip; 4-testing the motherboard.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will explain the specific embodiments of the present invention with reference to the accompanying drawings. It is evident that the drawings in the following description are only examples of the invention, from which other drawings and other embodiments can be obtained by a person skilled in the art without inventive effort.
For the sake of simplicity of the drawing, the parts relevant to the present invention are shown only schematically in the figures, which do not represent the actual structure thereof as a product. Additionally, in order to simplify the drawing for ease of understanding, components having the same structure or function in some of the drawings are shown schematically with only one of them, or only one of them is labeled. Herein, "a" means not only "only this one" but also "more than one" case.
Example 1
In one embodiment of the present invention, as shown in fig. 1, the present invention provides a microneedle floating test tool, which includes an upper cover assembly 1 and a carrier plate assembly 2, wherein the carrier plate assembly 2 is used for placing a test chip 3, and the upper cover assembly 1 and the carrier plate assembly 2 can be pressed or separated, so as to implement placement and removal of the test chip 3.
As shown in fig. 4 and 5, the carrier assembly 2 includes, in order from bottom to top, a fixing plate 21, a PCB adapter plate 29, a lower needle plate 27, test probes 26, an upper needle plate 22, and a chip carrier plate 23.
The upper surface of the PCB adapter plate 29 is provided with a mounting groove in which the lower needle plate 27 is placed.
The upper needle plate 22 is arranged on the fixed plate 21, and a plurality of return springs 24 are arranged around between the upper needle plate 22 and the fixed plate 21, so that the upper needle plate 22 can move up and down under the action of the return springs 24.
The upper needle plate 22 is provided with a first stepped hole and a second stepped hole from top to bottom, the opening of the first stepped hole is larger than the opening of the second stepped hole, the lower half part of the chip carrier plate 23 is embedded into the first stepped hole, the upper surface of the chip carrier plate 23 is provided with a chip groove for placing the test chip 3, the chip carrier plate 23 is provided with a probe hole extending from the bottom surface of the chip groove to the bottom surface of the chip carrier plate 23, and the probe hole is matched with the test probe point position of the test chip 3 and can allow the test probe 26 to pass through.
The test probes 26 are fixed on the lower needle plate 27, and the lower ends of the test probes 26 extend out from the bottom end of the lower needle plate 27 and are contacted with the bottom surface of the mounting groove of the PCB adapter plate 29, so that signal transmission is realized.
When the upper cover assembly 1 and the carrier plate assembly 2 are pressed, the reset spring 24 is compressed, the test probes 26 extend out of the chip carrier plate 23, and the bottom surface of the upper needle plate 22 is contacted with the upper surface of the fixed plate 21; when the upper cover assembly 1 and the carrier plate assembly 2 are separated, the reset spring 24 is reset, the test probes 26 are hidden in the probe holes, and the bottom surface of the upper needle plate 22 is separated from the upper surface of the fixed plate 21.
Through setting up upper cover assembly 1 and carrier plate assembly 2, and upper cover assembly 1 and carrier plate assembly 2 can pressfitting or separation, carrier plate assembly 2 is used for placing test chip 3, carrier plate assembly 2 is from bottom to top including fixed plate 21, PCB keysets 29, lower faller 27, test probe 26, go up faller 22 and chip carrier plate 23 in proper order, go up and connect through reset spring 24 between faller 22 and the fixed plate 21, chip carrier plate 23 inlays in the first shoulder hole of faller 22, make when carrying out the chip test, place test chip 3 on the chip groove of chip carrier plate 23, and pressfitting upper cover assembly 1 and carrier plate assembly 2, reset spring 24 can compress, the bottom surface of going up faller 22 contacts with the upper surface of fixed plate 21, test probe 26 can stretch out chip carrier plate 23 and be connected with test chip 3, realize the connection of chip; when the test is finished, the upper cover assembly 1 and the carrier plate assembly 2 are separated, the reset spring 24 can reset, the bottom surface of the upper needle plate 22 is separated from the upper surface of the fixed plate 21, the test probes 26 can be separated from the test chip 3, the test chip 3 is taken out, and meanwhile, the test probes 26 can be hidden in the probe holes, so that the purpose of protecting the test probes 26 is achieved. The scheme can make the taking and placing of the chip more convenient, and the reset spring 24 can play a buffering role for the connection of the test probe 26 and the chip, so that the test result of the chip is prevented from being influenced by the broken hole of the test probe 26.
Example 2
In one embodiment of the present invention, as shown in fig. 2 and 3, the upper cover assembly 1 includes an upper cover plate 11 and a pressing block 12 on the basis of embodiment 1.
The briquetting 12 sets up the below of upper cover plate 11 to through a plurality of first screws 13 and upper cover plate 11 fixed connection, briquetting 12 is used for pressing down test chip 3 when upper cover assembly 1 and carrier plate assembly 2 pressfitting.
Through setting up upper cover plate 11 and briquetting 12 at upper cover assembly 1, briquetting 12 is located the below of upper cover plate 11 to through first screw 13 and upper cover plate 11 fixed connection, make when upper cover assembly 1 and carrier plate assembly 2 are pressed, briquetting 12 can press test chip 3, so that probe 26 is connected with test chip 3.
Preferably, both sides of the upper cover plate 11 are provided with side grooves 14, the side grooves 14 are internally provided with buckles 15, both sides of each buckle 15 are provided with rotating shafts 151, the end parts of the rotating shafts 151 are connected with the side walls of the side grooves 14 through base screws 152, and the inner side surfaces of the buckles 15 are connected with the inner side surfaces of the side grooves 14 through buckle springs 153.
Further preferably, the top end of the buckle 15 is provided with a pressing part 154, the bottom end of the buckle 15 is provided with a clamping block 155 extending towards the direction of the pressing block 12, and two sides of the bottom end of the fixing plate 21 are provided with clamping grooves 211 matched with the clamping block 155.
Through setting up the side channel 14 in both sides of the upper cover plate 11, and set up the buckle 15 in the side channel 14, buckle 15 and side channel 14 swing joint, and the top of buckle 15 is provided with the pressing part 154, the bottom of buckle 15 is provided with the fixture block 155 of inwards extending, the bottom both sides of fixed plate 21 are provided with the draw-in groove 211 that matches with fixture block 155, make when pressing upper cover assembly 1 and carrier plate assembly 2, can make the fixture block 155 of two buckles 15 outwards rotate through inwards pressing two pressing parts 154, later press upper cover assembly 1 and carrier plate assembly 2, and loosen pressing part 154, under the effect of buckle spring 153, fixture block 155 can inwards rotate and combine with the draw-in groove 211, realize upper cover assembly 1 and carrier plate assembly 2's fixation; and when the upper cover assembly 1 and the carrier plate assembly 2 are required to be separated, only the two pressing parts 154 are required to be pressed inwards, and when the clamping block 155 is separated from the clamping groove 211, the upper cover assembly 1 is lifted upwards, so that the upper cover assembly 1 and the carrier plate assembly 2 are more conveniently pressed and separated, and the pressing is more stable, thereby being beneficial to the test.
Preferably, the two sides of the bottom end of the upper cover plate 11 are respectively provided with a first positioning pin 16, the pressing block 12 is located between the two first positioning pins 16, the two sides of the top end of the fixing plate 21 are respectively provided with a positioning block 212, the top ends of the positioning blocks 212 are respectively provided with a positioning hole 213 matched with the first positioning pins 16, and the upper needle plate 22 is located between the two positioning blocks 212.
Through setting up first locating pin 16 in the bottom of upper cover plate 11, set up the locating hole 213 that matches with first locating pin 16 in the top of fixed plate 21 for when pressing upper cover assembly 1 and carrier plate subassembly 2, can guide the downmovement of upper cover assembly 1, avoid upper cover assembly 1 and carrier plate subassembly 2's position to appear the deviation, lead to the connection of test probe 26 and test chip 3 to appear the deviation, influence the result of test.
Example 3
In one embodiment of the present invention, as shown in fig. 4, on the basis of embodiment 1 or 2, a plurality of carrier springs 28 are disposed between the chip carrier plate 23 and the lower needle plate 27, and when the upper cover assembly 1 and the carrier assembly 2 are pressed, the carrier springs 28 are compressed, and the test probes 26 extend out of the chip carrier plate 23; when the upper cover assembly 1 and the carrier plate assembly 2 are separated, the carrier plate springs 28 are reset, and the test probes 26 are hidden in the probe holes of the chip carrier plate 23.
Through setting up a plurality of carrier plate springs 28 between chip carrier plate 23 and lower faller 27, can carry out buffer protection to test chip 3 when upper cover subassembly 1 and carrier plate subassembly 2 are pressed, avoid the too big pressure, lead to the chip fracture.
Preferably, the upper half of the PCB adapter 29 is embedded in the second stepped hole of the upper needle plate 22, and signal transmission can be achieved through the test chip 3, the test probe 26, the lower needle plate 27 and the PCB adapter 29.
One diagonal of the PCB transferring plate 29 is connected to the fixing plate 21 through the second screw 291, and the other diagonal of the PCB transferring plate 29 is connected to the fixing plate 21 through the second positioning pin 292.
Specifically, in the installation of the PCB adapter 29, one diagonal corner of the PCB adapter 29 may be connected to the fixing plate 21 through the second screw 291, and the other diagonal corner is connected to the fixing plate 21 through the second positioning pin 292, so that not only the stable connection between the PCB adapter 29 and the fixing plate 21, but also the accurate position of the PCB adapter 29 can be ensured. In other embodiments, other connection manners, such as fixing the four corners of the PCB adapter 29 with the second screws 291, and additionally providing the second positioning pins 292, etc., are also possible, which is not limited herein.
Preferably, the chip carrier plate 23 is limited on the top surface of the upper needle plate 22 through a limit screw 25, and the limit screw 25 is in threaded fit with the top surface of the upper needle plate 22.
Through setting up spacing screw 25, and the nut of spacing screw 25 can carry out spacingly to chip carrier plate 23, avoids the test probe 26 of chip carrier plate 23 to stretch out longer distance, damages test chip 3.
The bottom surface of the fixed plate 21 is provided with a plurality of step screws 214 for connecting the upper needle plate 22, and the upper needle plate 22 and the fixed plate 21 can be connected on the basis of ensuring the movement of the upper needle plate 22 by arranging the step screws 214.
Example 4
In one embodiment of the present invention, as shown in fig. 4 and 6, the present invention further provides a test module, which includes a test motherboard 4, a plurality of the micro-needle floating test tools described in any one of embodiments 1 to 3 are disposed on the test motherboard 4, a connector interface is disposed on a bottom surface of the PCB adapter 29, a groove matched with the connector interface is disposed on the fixing board 21, the depth of the connector interface is slightly greater than the depth of the groove, a signal connection wire is buried on the bottom surface of the groove, and the connector interface transmits signals to the test motherboard 4 through the signal connection wire.
Through setting up test motherboard 4 to set up a plurality of above-mentioned floating test tools of microneedle on test motherboard 4, can realize testing chip 3's batch test, be favorable to improving efficiency of software testing, like in this scheme, can place 25 floating test tools of microneedle simultaneously and test. By providing the connector interface on the bottom surface of the PCB adapter plate 29, the fixing plate 21 is provided with a groove matched with the connector interface, and the bottom surface of the groove is embedded with a signal connection wire, so that the connector interface can transmit signals to the test motherboard 4 through the signal connection wire, so as to perform chip test.
Preferably, the individual microneedle float test tools are evenly distributed on the test master board 4.
Further preferably, in this embodiment, when the fixing plate 21 is mounted, one diagonal corner of the fixing plate 21 is connected to the test motherboard 4 through the third screw 215, and the other diagonal corner of the fixing plate 21 is connected to the test motherboard 4 through the third positioning pin 216, so that not only a stable connection between the test motherboard 4 and the fixing plate 21 is ensured, but also an accurate position of the fixing plate 21 is ensured. In other embodiments, other connection methods may be used, such as fixing the four corners of the fixing plate 21 with the third screws 215, and further adding the third positioning pins 216, etc., which are not limited herein.
It should be noted that the above embodiments can be freely combined as needed. The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (10)
1. A microneedle float test tool, comprising:
an upper cover assembly;
the upper cover assembly is pressed or separated from the carrier plate assembly;
wherein, the carrier plate subassembly includes from down supreme in proper order:
a fixing plate;
the PCB adapter plate is provided with a mounting groove on the upper surface;
a lower needle plate placed in the installation groove;
a plurality of test probes;
the upper needle plate is arranged on the fixed plate, a plurality of reset springs are arranged around the upper needle plate and the fixed plate, and a first stepped hole and a second stepped hole are formed in the upper needle plate from top to bottom;
the lower half part of the chip carrier plate is embedded into the first stepped hole, a chip groove is formed in the upper surface of the chip carrier plate and used for placing a test chip, a probe hole extending from the bottom surface of the chip groove to the bottom surface of the chip carrier plate is formed in the chip carrier plate, and the probe hole is matched with the test needle point of the test chip in position and can allow the test probe to pass through;
the test probe is fixed on the lower needle plate, and the lower end of the test probe extends out from the bottom end of the lower needle plate and is contacted with the bottom surface of the mounting groove of the PCB adapter plate;
when the upper cover assembly and the carrier plate assembly are pressed, the bottom surface of the upper needle plate is contacted with the upper surface of the fixed plate; the reset spring is compressed, and the test probe extends out of the chip carrier plate;
when the upper cover assembly is separated from the carrier plate assembly, the bottom surface of the upper needle plate is separated from the upper surface of the fixed plate, the reset spring is reset, and the test probe is hidden in the probe hole.
2. A microneedle float test tool according to claim 1, wherein: the upper cover assembly includes:
an upper cover plate;
the pressing block is arranged below the upper cover plate and fixedly connected with the upper cover plate through a plurality of first screws, and is used for pressing the test chip when the upper cover assembly is pressed with the carrier plate assembly.
3. A microneedle float test tool according to claim 2, wherein: side grooves are arranged on two sides of the upper cover plate, buckles are arranged in the side grooves,
both sides of the buckle are provided with rotating shafts, the end parts of the rotating shafts are connected with the side walls of the side grooves through base screws,
the inner side surfaces of the buckles are connected with the inner side surfaces of the side grooves through buckle springs.
4. A microneedle float test tool according to claim 3, wherein: the top ends of the buckles are provided with pressing parts, the bottom ends of the buckles are provided with clamping blocks extending towards the direction of the pressing blocks,
the bottom both sides of fixed plate all are provided with the draw-in groove that the fixture block matches.
5. A microneedle float test tool according to any one of claims 2 to 4, wherein: the two sides of the bottom end of the upper cover plate are respectively provided with a first locating pin, the pressing block is positioned between the two first locating pins,
the upper needle plate is arranged between the two positioning blocks.
6. A microneedle float test tool according to claim 1, wherein: a plurality of carrier springs are arranged between the chip carrier and the lower needle plate,
when the upper cover assembly and the carrier plate assembly are pressed, the carrier plate spring is compressed, and the test probe extends out of the chip carrier plate;
when the upper cover assembly and the carrier plate assembly are separated, the carrier plate spring is reset, and the test probes are hidden in the probe holes of the chip carrier plate.
7. A microneedle float test tool according to claim 6, wherein: the upper half part of the PCB adapter plate is embedded into a second stepped hole of the upper needle plate, the opening of the first stepped hole is larger than that of the second stepped hole,
one opposite angle of the PCB adapter plate is connected with the fixing plate through a second screw, and the other opposite angle of the PCB adapter plate is connected with the fixing plate through a second locating pin.
8. A microneedle float test tool according to claim 1, wherein: the chip carrier plate is limited on the top surface of the upper needle plate through a limit screw, and the limit screw is in threaded fit with the top surface of the upper needle plate;
the bottom surface of the fixed plate is provided with a plurality of step screws used for connecting the upper needle plate.
9. A test module, characterized in that: comprises a test main board, wherein a plurality of micro-needle floating test tools according to any one of claims 1-8 are arranged on the test main board, a connector interface is arranged on the bottom surface of the PCB adapter board,
the fixing plate is provided with a groove matched with the connector interface, the depth of the connector interface is slightly larger than that of the groove,
the signal connecting wires are buried in the bottom surfaces of the grooves, and the connector interfaces transmit signals to the test main board through the signal connecting wires.
10. A test module according to claim 9, wherein: one opposite angle of the fixing plate is connected with the test main board through a third screw, and the other opposite angle of the fixing plate is connected with the test main board through a third locating pin.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111342103.2A CN114152783B (en) | 2021-11-12 | 2021-11-12 | Microneedle floating test tool and test module |
| TW110149415A TWI800187B (en) | 2021-11-12 | 2021-12-29 | A microneedle floating test tool and test module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111342103.2A CN114152783B (en) | 2021-11-12 | 2021-11-12 | Microneedle floating test tool and test module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114152783A CN114152783A (en) | 2022-03-08 |
| CN114152783B true CN114152783B (en) | 2023-06-16 |
Family
ID=80459813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111342103.2A Active CN114152783B (en) | 2021-11-12 | 2021-11-12 | Microneedle floating test tool and test module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114152783B (en) |
| TW (1) | TWI800187B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1249965A (en) * | 1982-09-22 | 1989-02-14 | John D. Watts | Downhole well pump |
| CN103439541A (en) * | 2013-09-03 | 2013-12-11 | 苏州创瑞机电科技有限公司 | Automatic locating and testing socket for CMOS camera shooting chip floating carrier plate |
| CN203519659U (en) * | 2013-09-03 | 2014-04-02 | 苏州创瑞机电科技有限公司 | Automatic positioning test socket for CMOS camera chip float board |
| CN206193044U (en) * | 2016-11-10 | 2017-05-24 | 苏州大学文正学院 | Convertible optical chip module test socket of parallelogram |
| CN207148155U (en) * | 2017-07-31 | 2018-03-27 | 珠海市运泰利自动化设备有限公司 | The test fixture of IC chip |
| CN109828125A (en) * | 2019-03-15 | 2019-05-31 | 珠海市运泰利自动化设备有限公司 | Simple clamp is used in a kind of manual PCB debugging |
| CN209961800U (en) * | 2019-03-15 | 2020-01-17 | 珠海市运泰利自动化设备有限公司 | Simple clamp for manual PCB debugging |
| CN213149157U (en) * | 2020-06-13 | 2021-05-07 | 珠海市运泰利自动化设备有限公司 | High-precision microchip testing jig |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202471762U (en) * | 2011-12-02 | 2012-10-03 | 金英杰 | Manual test base of chip |
| KR20130111066A (en) * | 2012-03-30 | 2013-10-10 | 삼성전자주식회사 | Method for process proximity correction |
| CN203422394U (en) * | 2013-06-26 | 2014-02-05 | 陈妙妙 | FPC connector |
| TW201710685A (en) * | 2015-09-11 | 2017-03-16 | Wei-Fang Fan | Test socket structure, and assembly method of integrated circuit test structure comprising the same enabling significantly shortening the time required to install probes in subsequent applications by directly and integrally assembling probes with upper and lower covers |
| KR101864859B1 (en) * | 2016-12-07 | 2018-06-05 | 주식회사 아이에스시 | Electrical test socket |
-
2021
- 2021-11-12 CN CN202111342103.2A patent/CN114152783B/en active Active
- 2021-12-29 TW TW110149415A patent/TWI800187B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1249965A (en) * | 1982-09-22 | 1989-02-14 | John D. Watts | Downhole well pump |
| CN103439541A (en) * | 2013-09-03 | 2013-12-11 | 苏州创瑞机电科技有限公司 | Automatic locating and testing socket for CMOS camera shooting chip floating carrier plate |
| CN203519659U (en) * | 2013-09-03 | 2014-04-02 | 苏州创瑞机电科技有限公司 | Automatic positioning test socket for CMOS camera chip float board |
| CN206193044U (en) * | 2016-11-10 | 2017-05-24 | 苏州大学文正学院 | Convertible optical chip module test socket of parallelogram |
| CN207148155U (en) * | 2017-07-31 | 2018-03-27 | 珠海市运泰利自动化设备有限公司 | The test fixture of IC chip |
| CN109828125A (en) * | 2019-03-15 | 2019-05-31 | 珠海市运泰利自动化设备有限公司 | Simple clamp is used in a kind of manual PCB debugging |
| CN209961800U (en) * | 2019-03-15 | 2020-01-17 | 珠海市运泰利自动化设备有限公司 | Simple clamp for manual PCB debugging |
| CN213149157U (en) * | 2020-06-13 | 2021-05-07 | 珠海市运泰利自动化设备有限公司 | High-precision microchip testing jig |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202319754A (en) | 2023-05-16 |
| TWI800187B (en) | 2023-04-21 |
| CN114152783A (en) | 2022-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7129730B2 (en) | Probe card assembly | |
| US7160119B2 (en) | Controlled compliance fine pitch electrical interconnect | |
| US6707311B2 (en) | Contact structure with flexible cable and probe contact assembly using same | |
| US7547213B2 (en) | Memory modules and methods for manufacturing memory modules | |
| WO2011087215A2 (en) | Probe card | |
| KR20100099323A (en) | Variety exchanging unit, and manufacturing method | |
| US7753688B1 (en) | Board co-edge coupling with conductive elements | |
| JP2012533063A (en) | Probe card | |
| CN114152783B (en) | Microneedle floating test tool and test module | |
| CN215953786U (en) | Positioning tool for chip testing | |
| JP4845304B2 (en) | Socket and electronic component mounting apparatus including the same | |
| KR100353788B1 (en) | Probe card | |
| US5949238A (en) | Method and apparatus for probing large pin count integrated circuits | |
| CN211240083U (en) | Microphone chip test fixture and system | |
| US7202685B1 (en) | Embedded probe-enabling socket with integral probe structures | |
| CN101089643A (en) | Ball grid array package element investigating method and socket set of true system | |
| EP1204988A2 (en) | Controlled compliance fine pitch interconnect | |
| US20060121750A1 (en) | Contactor, frame comprising such a contactor, electrical measuring and testing apparatus and method of contacting by means of such a contactor | |
| CN217561545U (en) | Testing module of DFN series semiconductor chip | |
| CN215813200U (en) | Chip testing device and chip testing equipment | |
| KR101183612B1 (en) | Probe structure of probe card | |
| CN220040496U (en) | Switching device and function testing device | |
| CN213816476U (en) | PCBA B2B Connector switching structure | |
| JP5066193B2 (en) | Connector holding device, interface device including the same, and electronic component testing device | |
| KR102123882B1 (en) | A Connector Assembly, A Connector Subassembly And A Connector Pin For Test Apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |