CN103439539A - Mega-pixel CMOS optical chip module automatic testing socket - Google Patents
Mega-pixel CMOS optical chip module automatic testing socket Download PDFInfo
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- CN103439539A CN103439539A CN2013103934812A CN201310393481A CN103439539A CN 103439539 A CN103439539 A CN 103439539A CN 2013103934812 A CN2013103934812 A CN 2013103934812A CN 201310393481 A CN201310393481 A CN 201310393481A CN 103439539 A CN103439539 A CN 103439539A
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Abstract
The invention discloses a mega-pixel CMOS optical chip module automatic testing socket. The mega-pixel CMOS optical chip module automatic testing socket comprises a PCB switching structure, a testing socket body and an independent light box unit, wherein the PCB switching structure, the testing socket body and the independent light box unit are sequentially distributed in a preset direction. The independent light box unit comprises a light box holding frame body. The testing socket body comprises a testing unit, a chip floating carrying plate and a lens holding frame body. An LED lamp panel is arranged in the light box holding frame body. A testing lens and a lens pressing plate are arranged in the lens holding frame body. The testing unit comprises a plurality of testing probes and a probe holding frame. The testing unit, the chip floating carrying plate, the lens pressing plate, the testing lens and the LED lamp panel are sequentially distributed in the direction gradually away from the PCB switching structure. According to the mega-pixel CMOS optical chip module automatic testing socket, a mega-pixel CMOS optical chip module can be automatically, efficiently and accurately tested, and the mega-pixel CMOS optical chip module automatic testing socket is simple in structure, convenient to operate and long in service life.
Description
Technical field
The present invention relates to a kind of chip testing equipment, the particularly automatic test jack of a kind of mega pixel level CMOS optical chip module.
Background technology
CMOS wafer system is by the light sensation chip device that the processing sensitive integrated circuits forms on silicon wafer, and it is widely used in mobile phone, in the equipment such as computer, camera head.In general, the CMOS wafer has that product circuit is integrated derives institute than high, circuit and adopt between the tin ball characteristics such as step pitch little (about 0.2mm).
Existing CMOS chip testing socket mostly concentrates on the following product test of mega pixel, can meet final performance test request on structure.For example, but, for mega pixel level optical chip module, it has higher test request:
A. due to 1,000,000 grades of optical chip modules on product structure than the chip below mega pixel large 3～10 times, so the structure of test jack can not be identical with existing test jack structure;
B. due to 1,000,000 grades of optical chip modules, the chip on imaging technique and below mega pixel has had great improvement, so just requires must accomplish accurate location in test jack, and its precision is up to micron order;
C. in the detection of test jack, there is no industry standard, is also a problem to the detection of its reliability, and existing test jack can not meet compatible requirement fully;
D. on the imaging precision otherness of high pixel optics chip module, due to many factors, as the defect of process equipment etc., cause the test passes rate of product undesirablely, and also can cause chip and device damage, testing efficiency is reduced.
Summary of the invention
The object of the present invention is to provide the automatic test jack of a kind of mega pixel level CMOS optical chip module, its can realize to mega pixel level CMOS optical chip module automatically, efficiently, accurately the test, and simple in structure, easy to operate, long service life, thus overcome deficiency of the prior art.
For achieving the above object, the present invention has adopted following technical scheme:
The automatic test jack of a kind of mega pixel level CMOS optical chip module, it is characterized in that, it comprises the PCB exchanging structure distributed successively along direction initialization, test jack main body and individual light box unit, wherein, described individual light box unit comprises that lamp box keeps framework, described test jack main body comprises test cell, the unsteady support plate of chip and camera lens keep framework, described lamp box keeps being provided with the LED lamp plate in framework, described camera lens keeps being provided with testing lens and camera lens pressing plate in framework, described test cell comprises complex root test probe and probe retainer, and, described test cell, the chip support plate that floats, the camera lens pressing plate, testing lens and LED lamp plate edge distribute successively away from the direction of PCB exchanging structure gradually.
Further, described camera lens keeps also being provided with automatic blowing mechanism with the testing lens corresponding position in framework.
Further, also be provided with standard plate between described testing lens and LED lamp plate.
Further, described individual light box unit has the darkroom structure, and also is provided with at least one equal tabula rasa in the structure of described darkroom, and described equal tabula rasa is distributed between testing lens and LED lamp plate.
Further, described PCB exchanging structure comprises top switching PCB, top switching PCB backing plate, bottom switching PCB and the bottom switching PCB backing plate of stacked setting, and wherein, top switching PCB directly coordinates with test cell.
Further, also be provided with the thermal resistance installation position in described PCB exchanging structure.
Further, be provided with spring in described test probe, when the upper cover that mainly by individual light box unit and camera lens, keeps framework to form covers with the base mainly be comprised of test cell, the unsteady support plate of chip, described spring is compressed, and fully contacts with the tin ball on tested chip module.
Principle of work of the present invention is, by tested chip module is placed in this socket, light and shade variation along with the darkroom inner light source, the test chip module is the collection to image by testing lens, and optical signalling is inputted to the photosensitive area in the CSP chip, and optical signalling is changed into to current signal, and transfer signals to the PCB card extender by test probe, and, by current signal input peripheral testing apparatus, in the peripheral hardware testing apparatus, current signal is changed into to digital signal, regenerate picture signal; Contrasted by the image parameter in good time generation and original standard picture, judge whether to meet design requirement.
That aforementioned test probe adopts is probe for semiconductor test (POGO PIN), can realize the microwave attenuation of signal, has guaranteed stability and the reliability of test;
By aforementioned automatic test jack design, in the time of can solving the operation of operating personnel and board, place, the accurate orientation problem of tested chip module, place easy to operately simultaneously, the board operation convenience strengthens greatly, by the cooperation with tester table, meet product test and reach the production capacity requirement.
Compared with prior art, the present invention at least has following advantage: the automatic test of having realized 1,000,000 grades of CMOS chip modules, make 1,000,000 grades of CMOS chip module tests oversimplify simultaneously, test result is more accurate, and physical construction is simple, be suitable for carrying out the test of 1,000,000 grades of CMOS chip modules on multiple board.
The accompanying drawing explanation
Fig. 1 is the structural representation of upper cover in a preferred embodiment of the present invention;
Fig. 2 is the structural representation of base in a preferred embodiment of the present invention;
Fig. 3 is the structural representation of switching PCB in bottom in a preferred embodiment of the present invention;
Description of reference numerals: upper cover A, base B, testing lens 1, automatic blowing mechanism 2, camera lens pressing plate 3, camera lens keep framework 4, double-deck all tabula rasas 5, large all tabula rasas 51, little equal tabula rasa 52, LED lamp plate 6, lamp box to keep framework 7, test probe 8, chip float support plate 9, probe retainer 10, top switching PCB11, top switching PCB backing plate 12, bottom switching PCB13, bottom switching PCB backing plate 14, thermal resistance installation position 15.
Embodiment
Below in conjunction with accompanying drawing and a preferred embodiment, technical scheme of the present invention is further described.
Consult Fig. 1-Fig. 3, the related automatic test jack of a kind of mega pixel level CMOS optical chip module of the present embodiment comprises the PCB exchanging structure distributed successively along direction initialization, test jack main body and individual light box unit, wherein, described individual light box unit comprises that lamp box keeps framework, described test jack main body comprises test cell, the unsteady support plate of chip and camera lens keep framework 4, described lamp box keeps being provided with LED lamp plate 6 in framework, described camera lens keeps being provided with testing lens 1 and camera lens pressing plate 3 in framework, described test cell comprises complex root test probe 8 and probe retainer 10, and, described test cell, the chip support plate 9 that floats, the camera lens pressing plate, testing lens and LED lamp plate edge distribute successively away from the direction of PCB exchanging structure gradually.
Further, described camera lens keeps also being provided with automatic blowing mechanism 2 with the testing lens corresponding position in framework.
Further, also be provided with standard plate between described testing lens and LED lamp plate.
Further, described individual light box unit has the darkroom structure, and also is provided with at least one equal tabula rasa in the structure of described darkroom, and for example, by the large equal tabula rasa 5 of bilayer that all tabula rasa 51, little equal tabula rasa 52 form, described equal tabula rasa is distributed between testing lens and LED lamp plate.
Further, described PCB exchanging structure comprises top switching PCB11, top switching PCB backing plate 12, bottom switching PCB13 and the bottom switching PCB backing plate 14 of stacked setting, and wherein, top switching PCB directly coordinates with test cell.
Further, also be provided with thermal resistance installation position 15 in described PCB exchanging structure.
Each critical piece in this test jack, as base (SOCKET) part can adopt composite ceramic material (ceramic PEEK, ceramic TORLON), to meet strength of parts and test life-span.
Further, be provided with spring in described test probe, when the upper cover A that mainly by individual light box unit and camera lens, keeps framework to form covers with the base B mainly be comprised of test cell, the unsteady support plate of chip, described spring is compressed, and fully contacts with the tin ball on tested chip module.
And aforementioned probe keeps the setting of main body and the unsteady support plate of chip, can make the placement of test probe and taking-up very convenient, and make tested chip module accurately to locate, and can freely put into or take out.
As one of comparatively preferred embodiment, the course of work of aforementioned test probe can be:
(1) test mode: when test probe, (module is put into standing groove during at pressurized, upper cover LID presses down simultaneously) the contained spring compression, the compressed value that expection is set can make spring fully contact with the tin ball on tested chip module, and can by the upper tin ball of tested chip module, (normal dia be at 0.2～0.5mm, height is at 0.1～0.25mm) puncture, and not there will be skewness;
(2) non-test mode: in the situation that be not subject to external force compacting, keep relaxed state when test probe, so guarantee that probe is in the not subjected to pressure state, guarantee that the serviceable life of probe and the conducting function in lifetime are normal, reduce testing expense.
The design of aforementioned individual light box unit, make this test jack no matter all can adopt on which kind of board, solved the problem that image difference in the test process exceeds standard.
The design of aforementioned PCB exchanging structure both can realize the protection of different components and parts by signal converting in chip range simultaneously, met to press down the mechanics performance need and electronic devices and components are dodged requirement.
Preferably, described test probe can adopt semiconductor test probe, so can better realize tin ball in chip is carried out to point-to-point contact, meet the conducting of test point, meet accurately some contact in the test to the tin ball, and signal is transferred to control system, the system validation contact is correct.Further, the area of aforementioned test probe and tested chip contact site can be controlled very easily, makes tin ball on tested chip be less than 1/4 of tin bulb diameter because of the diameter of engaged test probe damage field.
Further, by the composite design of aforementioned test cell, can make unit, single testing efficiency realize significantly promoting, the test frequency can be consistent with the simple chip speed of test.
Summarize it, by the present invention, can realize the test automation of mega pixel level CMOS optical chip module test with high-accuracy assignment test socket, also ten million Pixel-level CMOS optical chip module test can be oversimplified simultaneously, the test gimmick is simple, at least has in addition following advantage:
(1) base (SOCKET) part can adopt the TORLON4203 material, makes the electrostatic prevention grade reach: 10
14ohm cm grade;
(2) connect simplification with test macro, for example, get final product with fastened by screw;
(3) CMOS chip module is put into freely, and the placement of probe and taking-up are very convenient;
(4) CMOS chip module is accurately located, and the compensation of its profile makes probe comprehensive engagement tin ball, does not have skewness, reach again, can select different probes according to different CMOS chip modular structures, reduce the microdeformation of chip when the spring pressurized, and can not affect the test effect; The life-span of probe promotes greatly, reduced the expense of test, and the test effect is accurate, reliable;
(5) unit, single testing efficiency are realized, the test frequency can be consistent with the simple chip testing of test;
(6) the present invention, for the test of mega pixel level CMOS optical chip module provides the testing hardware carrier, has solved the image difference in the test process, Precision Machining and accurate orientation problem.
It is pointed out that above embodiment is only for illustrating content of the present invention, in addition, the present invention also has other embodiments.But all employings are equal to replaces or technical scheme that the equivalent deformation mode forms all drops in protection scope of the present invention.
Claims (7)
1. the automatic test jack of a mega pixel level CMOS optical chip module, it is characterized in that, it comprises the PCB exchanging structure distributed successively along direction initialization, test jack main body and individual light box unit, wherein, described individual light box unit comprises that lamp box keeps framework, described test jack main body comprises test cell, the unsteady support plate of chip and camera lens keep framework, described lamp box keeps being provided with the LED lamp plate in framework, described camera lens keeps being provided with testing lens and camera lens pressing plate in framework, described test cell comprises complex root test probe and probe retainer, and, described test cell, the chip support plate that floats, the camera lens pressing plate, testing lens and LED lamp plate edge distribute successively away from the direction of PCB exchanging structure gradually.
2. the automatic test jack of mega pixel level CMOS optical chip module according to claim 1, is characterized in that, described camera lens keeps also being provided with automatic blowing mechanism with the testing lens corresponding position in framework.
3. the automatic test jack of mega pixel level CMOS optical chip module according to claim 1, is characterized in that, between described testing lens and LED lamp plate, also is provided with standard plate.
4. the automatic test jack of mega pixel level CMOS optical chip module according to claim 1, it is characterized in that, described individual light box unit has the darkroom structure, and also is provided with at least one equal tabula rasa in the structure of described darkroom, and described equal tabula rasa is distributed between testing lens and LED lamp plate.
5. the automatic test jack of mega pixel level CMOS optical chip module according to claim 1, it is characterized in that, described PCB exchanging structure comprises top switching PCB, top switching PCB backing plate, bottom switching PCB and the bottom switching PCB backing plate of stacked setting, wherein, switching PCB in top directly coordinates with test cell.
6. the automatic test jack of mega pixel level CMOS optical chip module according to claim 1, is characterized in that, in described PCB exchanging structure, also is provided with the thermal resistance installation position.
7. the automatic test jack of mega pixel level CMOS optical chip module according to claim 1, it is characterized in that, be provided with spring in described test probe, when the upper cover that mainly by individual light box unit and camera lens, keeps framework to form covers with the base mainly be comprised of test cell, the unsteady support plate of chip, described spring is compressed, and fully contacts with the tin ball on tested chip module.
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Cited By (4)
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| CN106405164A (en) * | 2016-11-10 | 2017-02-15 | 苏州大学文正学院 | Flip direct falling type optical chip module testing socket |
| CN106896315A (en) * | 2017-04-28 | 2017-06-27 | 上海捷策创电子科技有限公司 | A kind of sensitive chip test equipment |
| WO2018176349A1 (en) * | 2017-03-30 | 2018-10-04 | 深圳市汇顶科技股份有限公司 | Light emitting device and wafer testing device |
| CN110441670A (en) * | 2019-07-18 | 2019-11-12 | 苏州创瑞机电科技有限公司 | A kind of large area tunable light source manual test pedestal |
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Application publication date: 20131211 |