CN106405164A - Flip direct falling type optical chip module testing socket - Google Patents
Flip direct falling type optical chip module testing socket Download PDFInfo
- Publication number
- CN106405164A CN106405164A CN201610996927.4A CN201610996927A CN106405164A CN 106405164 A CN106405164 A CN 106405164A CN 201610996927 A CN201610996927 A CN 201610996927A CN 106405164 A CN106405164 A CN 106405164A
- Authority
- CN
- China
- Prior art keywords
- base
- bearing pin
- hole
- chip module
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention aims to provide a flip direct falling type optical chip module testing socket, the relative sliding of a pressing plate and a chip is avoided, and the positioning precision of the chip is improved. The flip direct falling type optical chip module testing socket comprises a base, an upper cover, and a probe. The probe comprises a probe rod and needles. A motherboard and a maintaining plate under the motherboard are fixed on the base. A floating plate above the motherboard is arranged on the base in an up and down floating way. The upper part of floating plate is provided with a chip groove. The bottom of the chip groove is provided with a needle hole. The probe rod of the probe is fixed by the maintaining plate and the motherboard. The needle of the upper end goes through the motherboard and extends upward into the needle hole. The needle of the lower end goes through the maintaining plate and extends downward. The upper cover is connected to a rotation cover. The pressing plate is fixed under the rotation cover. The upper cover is connected to a pin shaft. The base is provided with a waist-shaped pin hole whose bottom is provided with an upward push spring. The side wall of the waist-shaped pin hole is provided with a limit spring. When a downward external force is applied to the pin shaft and the pin shaft exceeds the limit spring, the limit spring returns to a normal state, and the pin shaft is maintained at the lower part of the waist-shaped hole.
Description
Technical field
The socket that this technology uses when being and optical chip module being tested.
Background technology
Optical camera chip（CIS）And its camera module（CMOS）, it is widely used in industry, the field such as medical treatment and consumption.
Along with the requirement to image procossing for the terminal use, and the development of high pixel image processing collection and analytical technology, this product is very
Multi-field progressively instead of original Glass optical camera lens.
The millions of optical chip module are developing directions of CIS and CMOS industry, and this chip is main at present
Apply in satellite, high altitude reconnaissance plane and high pixel intelligent camera aspect.With the encapsulation of this product, the one-tenth increasingly of test technology
Ripe, the trend being applied to high definition photographing unit, monitoring camera, mobile phone camera and computer camera will be irresistible.
In China although occurred as soon as the optical chip module of 12,000,000 pixels early in 2004, but due to supporting envelope
Fill, test, assembling does not match, and up to the present millions pixel module still can not be introduced to the market well.Wherein main
Reason is that do not have this high-precision optical chip module measuring technology and its test cubing.
The content that the test of optical chip module is related to is more, positioning contact pedestal as high-accuracy in chip, probe, mirror
Head, lamp box etc..The test of optical chip module at present mainly has manual test and automatic board to test two kinds of forms.
The pedestal principle adopting in the market is：The product requiring contact pedestal first must be accomplished optical camera core
Piece（CIS）And its camera module（CMOS）Signal be transmitted, this is accomplished by adopting miniature probe（POGO PIN）Led
Go out the signal of product.Based on the test jack of this structure, all the cooperation position degree between upper lid and base is proposed higher
Require.
At present, the socket that a kind of manual optical chip module uses when being tested, including base, is hinged on base
Upper lid, cover fixation clip upper, base fix probe, tested chip is placed directly on probe, by upper lid
Upset, band dynamic pressure plate push chip.But, because turnover panel is upset, when pressing plate and chip just come into contact with, can only contact
To chip sidepiece a part so that pressing plate and the relative slip of chip, the displacement of chip may be led to, have impact on chip and consolidate
It is scheduled on the position degree between the camera aperture of the side of covering, directly affect high pixel optics chip testing result.
Content of the invention
This technology purpose is to provide a kind of relative slip avoiding pressing plate and chip, improves the upset of the positioning precision of chip
Vertical optical chip module test jack.
Upset vertical optical chip module test jack, including base, overturns the upper lid being connected on base, probe；
Probe includes shank and the syringe needle at floating connection shank two ends；Mainboard is fixed on base, is integrally fixed at base below mainboard
On holding plate；Kickboard is arranged on base with fluctuating by floating spring, and kickboard is located above mainboard, and kickboard top is opened
There is the chip slot for placing optical chip module, chip trench bottom has syringe needle hole；The shank of probe is kept plate and mainboard
Fixing, the syringe needle of shank upper end passes through mainboard and extends upwardly into syringe needle hole；The syringe needle of shank lower end extends downwardly from through holding plate；
On cover and be connected with spiral cover, pressing plate is fixed on below spiral cover；When upper lid upset is extremely parallel with base, pressing plate is located in kickboard
The top of chip slot；It is connected with bearing pin in the side of upper lid, has pin shaft hole in the side of base, pin shaft hole is mounting hole；Pin
The upper top spring that the bottom setting of axis hole exerts a force upward to the bearing pin through pin shaft hole, is arranged to waist on the side wall of mounting hole
The position-limiting spring leaf that shape in the hole side projects；In normality, bearing pin upper top spring in the presence of, positioned at the top of mounting hole；Right
When bearing pin applies downward external force, bearing pin overcomes the elastic force of upper top spring and the elastic force of position-limiting spring leaf to move down, and works as bearing pin
When crossing position-limiting spring leaf, position-limiting spring leaf returns to normal, and bearing pin is maintained at the position of mounting hole bottom.
Above-mentioned upset vertical optical chip module test jack, is connected with guide finger in upper lid bottom, on base
Portion has the guide pin hole stretching into for guide finger, and the guide pin hole top side away from bearing pin has gathering sill diagonally downward.
Above-mentioned upset vertical optical chip module test jack, upper lid and base between be provided with so that on cover around
The resupinate back-moving spring of bearing pin.
Above-mentioned upset vertical optical chip module test jack, is provided with so that Shang Gai and bottom between upper lid and base
The buckling device that seat is kept closed.Buckling device includes overturning and is connected to the clasp covering, be arranged on base with
The lug of clasp cooperation.
The beneficial effect of this technology：This technology adopts the pin shaft hole of kidney-shaped, and upper end bearing pin can move up and down in bearing pin in the hole
Move so that upper lid can move up and down.When needing upper lid closure, need bearing pin or upper lid are applied with the external force to power, pin
Axle overcomes the elastic force of upper top spring and the elastic force of position-limiting spring leaf to move down；When bearing pin is downward across position-limiting spring leaf, spacing
Reed returns to normal so that bearing pin is maintained at the position of mounting hole bottom.Need when upper lid is opened it is also possible to bearing pin
Or upper lid applies external force upwards so that bearing pin overcomes the elastic force of position-limiting spring leaf to move up, until bearing pin is in mounting hole
The position on top.
During use, chip is placed in chip slot, afterwards turns over lid, upper lid pushes when substantially parallel with base
So that chip depressed vertically downward by pressing plate, straight down immediately, the syringe needle of probe pin upper ends is connect lid immediately with chip for chip and kickboard
Touch.When this ensure that lid closure, pressing plate is substantially in vertical direction movement, it is to avoid pressing plate and chip product in pressing
Raw slip relatively, pressing plate is less with the relative position deviation of chip.
Guide finger and the cooperation of guide pin hole, further ensure the vertical depression of lid.Back-moving spring can reduce to be beaten
Open required external force during lid.Buckling device ensure that when lid and base closure so that upper lid and base are maintained at this state.
Buckling device is prior art.
Brief description
Fig. 1 is the front view of upset vertical Manual optical chip module test jack（Closure state）.
Fig. 2 is the schematic diagram of upset vertical Manual optical chip module test jack（State before closure）.
Fig. 3 is the axonometric chart of upset vertical Manual optical chip module test jack（Closure state）.
Fig. 4 is the enlarged diagrams such as position-limiting spring leaf during closure state, bearing pin, pin shaft hole.
Fig. 5 is the explosive view of upset vertical Manual optical chip module test jack.
Fig. 6 is the schematic diagram when Shang Gai, base are separate for the upset vertical Manual optical chip module test jack（Remove
Clasp etc.）.
In figure, base 1, upper lid 2, upper cap bore 21, spiral cover 3, pressing plate 4, step 51, base holes 52, pin shaft hole 53, guide finger
Hole 54, gathering sill 55, lug 56, mainboard 6, holding plate 7, kickboard 8, chip slot 81, syringe needle hole 82, probe 10, shank 101, on
Syringe needle 102, lower syringe needle 103, stop screw 11, floating spring 12, bearing pin 13, upper top spring 14, adjusting screw 15, position-limiting spring leaf
16th, elastic protrusion 161, upside 162, guide finger 17, back-moving spring 18, buckling device 19, clasp 191, optical chip module 20.
Specific embodiment
Referring to the upset vertical Manual optical chip module test jack shown in Fig. 1,2,5, mainly include base 1, turn over
Turn the upper lid 2 being connected on base, spiral cover 3, pressing plate 4, mainboard 6, holding plate 7, kickboard 8, probe 10.
Probe 10 belongs to prior art, including the upper syringe needle 102 at shank 101 and floating connection shank two ends, lower syringe needle
103.
One base holes 52 with step 51 is had on base 1, mainboard 6 is fixed in base holes 52 bottom, under mainboard
Side is integrally fixed at the holding plate 7 on base.Base holes 52 have kickboard 8 in top.Kickboard 8 bottom periphery passes through four floating springs
12 are arranged on step 51 top with fluctuating, and kickboard is located above mainboard, and kickboard top has for placing optical chip mould
The chip slot 81 of group 20, chip trench bottom has syringe needle hole 82.
Four stop screws 11 are further fixed on base, stop screw 11 limits kickboard in the presence of floating spring 12
The extreme higher position moving up.
The shank 101 of probe is located between holding plate 7 and mainboard 6, is kept plate and mainboard is fixedly clamped, shank upper end
Upper syringe needle 102 passes through mainboard and extends upwardly into syringe needle hole；The lower syringe needle 102 of shank lower end extends downwardly from through holding plate.
It is connected with bearing pin 13 in the side of upper lid, has pin shaft hole 53 in the side of base, pin shaft hole is mounting hole.
The upper top spring 14 that the bottom setting of pin shaft hole exerts a force upward to the bearing pin through pin shaft hole, upper top spring 14
Lower end is contacted with the adjusting screw 15 being combined on base.By rotating adjusting screw 15, the bullet of top spring 14 can be adjusted
Power.The elastic force of upper top spring 14 will reach maximum, but cross position-limiting spring leaf when bearing pin simultaneously and be in downwards mounting hole bottom
Position, when position-limiting spring leaf returns to normal, the elastic force of upper top spring 14 enables to the position that bearing pin is maintained at mounting hole bottom
Put.
Referring to Fig. 4, prominent position-limiting spring leaf 16 inside to mounting hole is arranged on the side wall of mounting hole.Position-limiting spring leaf 16
Centre is elastic protrusion in the elastic protrusion 161 of upper and lower sides.In the upper and lower sides of position-limiting spring leaf 16, only upside or downside are fixed on
On mounting hole inwall（For convenience of description, it is fixed on mounting hole inwall with the upside 162 of position-limiting spring leaf 16 to illustrate）.
In normality, bearing pin upper top spring in the presence of, positioned at the top of mounting hole；To bearing pin or on lid apply to
Under external force when, bearing pin overcomes the elastic force of the upper top elastic force of spring and position-limiting spring leaf to move down, now, elastic protrusion 161
It is depressed into the state being substantially substantially flush with upper and lower sides（In other words, elastic protrusion 161 is fitted with mounting hole inwall substantially）, will not
Moving down of bearing pin is counteracted.When bearing pin crosses position-limiting spring leaf, position-limiting spring leaf returns to elastic protrusion 161 to kidney-shaped
The normality of in the hole lateral process, prevents bearing pin from moving up so that bearing pin is maintained at the position of mounting hole bottom.
On cover and have cap bore 21, the two side of spiral cover 3 is passed through two all parallel with bearing pin rotating shafts（Not shown）
It is rotatably arranged on cap bore inwall.Pressing plate is bolted on below spiral cover.So, in closure, spiral cover, pressing plate also may be used
Slightly to rotate around the shaft, further ensure pressing plate be vertical direction mobile so that the relative position of pressing plate and chip
Deviation is less.
Referring to Fig. 2, when upper lid upset is extremely parallel with base, the top of the chip slot that pressing plate is located in kickboard.
It is connected with two guide fingers 17 in upper lid bottom, have, on base top, the guide pin hole 54 stretching into for guide finger,
Guide pin hole top side away from bearing pin has gathering sill 55 diagonally downward.
Be provided with the counterbore of two, base top so that on cover around the resupinate back-moving spring of bearing pin 18.
Buckling device 19 includes overturning and is connected to the clasp 191 covering, and clasp 191 is located above covering away from bearing pin
Side.With base in closure state, the lug 56 that can be hooked by clasp is arranged on base upper lid.
In the present embodiment, in order to realize vertically pushing the purpose of chip to be measured, enter using kidney-shaped pin shaft hole and to guide finger
The special-shaped gathering sill of row guide-localization constrain simultaneously lid motion it is ensured that on cover during finally pushing, and to be measured
Chip only exists upper and lower unidirectional motion.Open for convenience, be mounted with back-moving spring between upper lid and base respectively, be easy to
Upper lid launches.
Claims (6)
1. overturn vertical optical chip module test jack, including base, overturn the upper lid being connected on base, probe；Visit
Pin includes shank and the syringe needle at floating connection shank two ends；Mainboard is fixed on base, is integrally fixed on base below mainboard
Holding plate；Kickboard is arranged on base with fluctuating by floating spring, and kickboard is located above mainboard, and kickboard top has
For placing the chip slot of optical chip module, chip trench bottom has syringe needle hole；The shank of probe is kept plate and mainboard is solid
Fixed, the syringe needle of shank upper end passes through mainboard and extends upwardly into syringe needle hole；The syringe needle of shank lower end extends downwardly from through holding plate；On
Cover and be connected with spiral cover, pressing plate is fixed on below spiral cover；When upper lid upset is extremely parallel with base, the core that pressing plate is located in kickboard
The top of film trap；It is characterized in that：It is connected with bearing pin in the side of upper lid, has pin shaft hole in the side of base, pin shaft hole is waist
Shape hole；The upper top spring that the bottom setting of pin shaft hole exerts a force upward to the bearing pin through pin shaft hole, on the side wall of mounting hole
Prominent position-limiting spring leaf to inside mounting hole is set；In normality, bearing pin is in the presence of the spring of upper top, upper positioned at mounting hole
Portion；When applying downward external force to bearing pin, bearing pin overcomes the elastic force of upper top spring and the elastic force of position-limiting spring leaf to move down,
When bearing pin crosses position-limiting spring leaf, position-limiting spring leaf returns to normal, and bearing pin is maintained at the position of mounting hole bottom.
2. upset vertical optical chip module test jack as claimed in claim 1, is characterized in that：Connect in upper lid bottom
There is guide finger, have, on base top, the guide pin hole stretching into for guide finger, the guide pin hole top side away from bearing pin has
Gathering sill diagonally downward.
3. upset vertical optical chip module test jack as claimed in claim 1, is characterized in that：Upper lid with base it
Between be provided with so that upper lid is around the resupinate back-moving spring of bearing pin.
4. upset vertical optical chip module test jack as claimed in claim 1, is characterized in that：Between upper lid and base
It is provided with so that above covering the buckling device being kept closed with base.
5. upset vertical optical chip module test jack as claimed in claim 4, is characterized in that：Buckling device includes turning over
Turn and be connected to the clasp covering, be arranged on the lug with clasp cooperation on base.
6. upset vertical optical chip module test jack as claimed in claim 1, is characterized in that：Upper top spring is located at pin
Axle and being combined between the adjusting screw on base, can change the elastic force of upper top spring by rotating adjusting screw；Upper top bullet
The elastic force of spring will reach maximum, but simultaneously when bearing pin crosses the position that position-limiting spring leaf is in downwards mounting hole bottom, spacing spring
When piece returns to normal, the elastic force of upper top spring enables to the position that bearing pin is maintained at mounting hole bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996927.4A CN106405164B (en) | 2016-11-10 | 2016-11-10 | Turnover straight-falling type optical chip module test socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996927.4A CN106405164B (en) | 2016-11-10 | 2016-11-10 | Turnover straight-falling type optical chip module test socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106405164A true CN106405164A (en) | 2017-02-15 |
| CN106405164B CN106405164B (en) | 2023-08-18 |
Family
ID=59230250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610996927.4A Active CN106405164B (en) | 2016-11-10 | 2016-11-10 | Turnover straight-falling type optical chip module test socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106405164B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106896315A (en) * | 2017-04-28 | 2017-06-27 | 上海捷策创电子科技有限公司 | A kind of sensitive chip test equipment |
| CN108181489A (en) * | 2018-01-05 | 2018-06-19 | 郑州信大捷安信息技术股份有限公司 | TF card test bench |
| CN108663546A (en) * | 2017-03-27 | 2018-10-16 | Nts株式会社 | Test jack |
| CN111398790A (en) * | 2020-04-29 | 2020-07-10 | 苏州创瑞机电科技有限公司 | Optical chip module testing device |
| CN112261819A (en) * | 2020-10-20 | 2021-01-22 | 吉林工程技术师范学院 | Fixing device for vehicle detection chip |
| CN113899700A (en) * | 2021-12-08 | 2022-01-07 | 深圳市伟盛丰科技有限公司 | Cell-phone module circuit board tool of lighting a lamp that charges |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108663546A (en) * | 2017-03-27 | 2018-10-16 | Nts株式会社 | Test jack |
| CN108663546B (en) * | 2017-03-27 | 2020-09-15 | Nts株式会社 | Test socket |
| CN106896315A (en) * | 2017-04-28 | 2017-06-27 | 上海捷策创电子科技有限公司 | A kind of sensitive chip test equipment |
| CN106896315B (en) * | 2017-04-28 | 2023-12-08 | 上海捷策创电子科技有限公司 | Photosensitive chip test equipment |
| CN108181489A (en) * | 2018-01-05 | 2018-06-19 | 郑州信大捷安信息技术股份有限公司 | TF card test bench |
| CN111398790A (en) * | 2020-04-29 | 2020-07-10 | 苏州创瑞机电科技有限公司 | Optical chip module testing device |
| CN112261819A (en) * | 2020-10-20 | 2021-01-22 | 吉林工程技术师范学院 | Fixing device for vehicle detection chip |
| CN113899700A (en) * | 2021-12-08 | 2022-01-07 | 深圳市伟盛丰科技有限公司 | Cell-phone module circuit board tool of lighting a lamp that charges |
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| Publication number | Publication date |
|---|---|
| CN106405164B (en) | 2023-08-18 |
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