CN110264436B - Device and method for executing batch and multi-aspect image detection on electronic components - Google Patents
Device and method for executing batch and multi-aspect image detection on electronic components Download PDFInfo
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- CN110264436B CN110264436B CN201810202811.8A CN201810202811A CN110264436B CN 110264436 B CN110264436 B CN 110264436B CN 201810202811 A CN201810202811 A CN 201810202811A CN 110264436 B CN110264436 B CN 110264436B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
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Abstract
The invention relates to a device and a method for carrying out batch and multi-face image detection on electronic components, which are applied to the device and the method for carrying out batch and multi-face detection on a plurality of electronic components or modules at the same time.
Description
Technical Field
The present invention relates to a device and a method for detecting electronic components or modules, and more particularly, to a device and a method for detecting electronic components or modules by using three-dimensional visual recognition technology, wherein the device and the method can simultaneously perform batch and multi-face detection for tens or hundreds of electronic components or modules, so as to perform related detection on each component, circuit board circuit and contact on the electronic components or modules in batches, in a large quantity and accurately, thereby greatly improving the detection efficiency and the accuracy of each component, circuit board circuit and contact on the electronic components.
Background
The related industry of printed circuit boards is the star industry of twentieth century, especially in the year of the vigorous development of the taiwan electronic industry, however, as the functions of various electronic products are gradually increased, the number and the size of various components on the printed circuit boards in each electronic product are also increased, which correspondingly causes the problem that the volumes and the weights of various electronic products are increased gradually, so that many newly developed electronic products are often limited by the product volume or the weight, and thus many bottlenecks which are difficult to break through are faced in design.
With the progress of semiconductor materials and related manufacturing technologies, various components, such as passive components, active components and various integrated circuits …, on a printed circuit board can be respectively manufactured as a surface mount device (Surface Mount Device, hereinafter referred to as SMD), and then the components are assembled onto a printed circuit board one by one and precisely by the surface mount technology, so that another new era is created for the taiwan printed circuit board industry. In this new era, the new printed circuit board is fully supported by various innovative high-tech backgrounds, various passive elements, active elements, integrated circuits … and other various components required by the new printed circuit board can be manufactured into various surface adhesive elements with extremely small volumes, so that the design bottleneck that the new development products are limited by the extremely large volumes and the extremely heavy weights is completely broken, the electronic products with various innovative designs can be vigorously developed towards the directions of being lighter, thinner, smaller and more exquisite, and a lot of financial groups can be invested in a lot of excellent talents and huge funds successively before and after the new printed circuit board is manufactured and developed.
Now, although the assembly process and equipment of the new type of printed circuit board are very complete and automatic, due to the trend of more and more diversification and complexity of the various components mounted on the new type of printed circuit board, the parts to be tested on the electronic components or modules formed by the new type of printed circuit board after assembly and manufacture are not only the parts to be tested on the electronic components or modules (such as the good quality of the circuit board, the pins or the joints …, etc.), but also the parts to be interacted with each other (such as the good quality of the optical lenses, the integrated circuits …, etc.), and the parts to be tested on the electronic components or modules. Conventionally, for the detection work of each part, a person skilled in the art generally completes the detection of each electronic component or module by visual detection through detection personnel, and such visual detection way not only wastes time, but also often causes inconsistent detection results between different detection personnel to the same electronic component or module due to different subjective cognition of the detection personnel or different visual fatigue degrees of the individual in the visual detection process, so that each electronic component or module becomes extremely unstable and difficult and heavy in quality detection and control.
Taking a Cell-phone Camera Module (CCM) as an example, many similar electronic components or modules are described, and the following problems are faced in the detection control:
(1) In recent years, under the circumstance that the market demand of mobile phone terminals is continuously improved, the shipment volume of high-order smart phones is continuously growing along with the market demand of global mobile phone camera modules in 2010 is taken as an example, namely, the demand of the global mobile phone camera modules in the market is up to 12.3 hundred million, and the mobile phone camera modules not only grow by 13.5% in 2009, but also have a continuous growing trend. In addition, according to the global mobile phone sales data published by the well-known research institution Strategy Analytics in 2010, the global mobile phone with the camera function is expected to increase by 21% in 2011 compared with the sales in 2010, and the sales is first broken through 10 hundred million, and reaches 11.14 hundred million, wherein the mobile phone sales with the camera function is 74% of the total mobile phone sales, so that the mobile phone camera module obviously becomes one of the necessary specifications of the current smart mobile phone in design and development;
(2) In addition, with the increasing progress of material science and the continuous breakthrough of process technology, the pixels of the image sensing elements (such as the photosensitive coupling element (Charge Coupled Device, abbreviated as CCD) and the complementary metal oxide semiconductor (Complementary Metal-Oxide Semiconductor, abbreviated as CMOS)) in the mobile phone camera modules are also continuously improved, and on the premise that the pixels of the image sensing elements are continuously improved, the design and manufacturing quality of the optical modules such as the camera lens group and the lens thereof, which are mutually matched with the image sensing elements, in each mobile phone camera module must be continuously improved naturally, and in the same way, the requirements for detecting the optical imaging quality of the mobile phone camera modules are also more strict in the production and manufacturing of the mobile phone camera modules. In addition, after the optical system of the mobile phone camera module is gradually lightened, miniaturized and high-precision, the detection of the optical elements such as the camera lens group and the lens thereof is increasingly important in the market, especially, the lens combination responsible for imaging in the camera lens group is most likely to generate the problems of edge flaws and poor molding when the imaging lens is produced and manufactured, and the problems have critical influence on the quality of imaging quality, so that if the problems existing on the optical elements such as the camera lens group and the lens thereof can be accurately detected in the process of detecting each mobile phone camera module, the mobile phone camera module can be ensured to obtain clear and stable image quality in the future imaging process. Unfortunately, however, most of the people skilled in the art still utilize the conventional visual inspection method to classify defects and filter defective products according to the predetermined inspection specifications, and thus the problem of inconsistent inspection quality is inevitably faced, and in particular, the complexity of the various electronic components or modules and the items on which the individual inspection is required are not comparable to those of the conventional printed circuit boards;
(3) In view of this, those skilled in the art have attempted to detect various electronic components or modules that are complicated nowadays by using Computer vision (AOI) automated optical inspection (Automatic Optical Inspection) technology that has been actively developed in recent years, and it is desired to use the AOI technology to completely overcome fatigue caused by long-time visual inspection by inspection personnel, thereby greatly improving inspection efficiency, and to maintain stable inspection quality, and to quantitatively represent various types of defects and the degree thereof that have been detected by related data, thereby being able to be used as a powerful evidence for improving each related process in the future. Generally, referring to fig. 1, a conventional computer vision inspection AOI system 10 basically includes a workpiece 20 to be inspected, at least one light source 11, at least one image sensor 12, a three-dimensional image reconstruction device 13, and an output device 14; wherein, each light source 11 is used for projecting light to the workpiece 20 to be measured, so that the workpiece 20 to be measured can present an image with clear characteristics; each image sensor 12 is used for obtaining a clear image of the workpiece 20 to be measured; the three-dimensional image reconstruction device 13 may be a computer, and is capable of reconstructing a three-dimensional image of the clear image of the workpiece 20 to be measured obtained and transmitted from the image sensing device 12 by using AOI technology; in recent years, under the condition that the single-chip manufacturing technology and functions are continuously improved, the image sensing device 12 is already in the market in the form of a single chip, and the National Instruments (NI) of the manufacturer especially provides an intelligent image sensing single chip in response to the huge and urgent demands of the market, and it is clearly pointed out that the image sensing device 12 of the single chip has integrated the image sensor and the high-performance digital signal processor (Digital signal processor, abbreviated as DSP) required by the intelligent camera, and can perform … functions such as object positioning, surface inspection, dimension measurement and industrial reading in machine vision, that is, the image sensing device 12 of the single chip is gradually capable of replacing the combination of the image sensing device 12 and the three-dimensional image reconstruction device 13 of the exigency. Conventionally, the image sensing devices of the general industrial level acquire images through the standard camera bus and transmit the images to the three-dimensional image reconstruction device 13 for performing the visual program operation. The intelligent image sensing device 12 of the single chip directly performs the visual operation in the Digital Signal Processor (DSP), so that the three-dimensional image reconstruction device 13 of the AOI system 10 is only responsible for programming and displaying the result of the dedicated detection software, and the cpu 130 is not required to perform the visual operation;
(4) In addition, in the design of the AOI system 10, it is first necessary to consider how to obtain a clear image of the workpiece 20 to be inspected? Thus, a perfect light source 11 design is the first step in the design of a computer vision inspection AOI system 10? The good design of the light source 11 not only can promote the success rate of automatically executing the computer vision detection, but also can greatly reduce the extra pretreatment steps which are required to be executed for obtaining the clear image, thereby effectively reducing the complexity of the subsequent detection algorithm. The common light source 11 is set up in the following manner, which is shown and described in detail:
(4-1) front-lit light source: with continued reference to fig. 1, the light source 11 and the image sensing device 12 are positioned on the same side of the workpiece 20 to be measured, so as to use different reflection intensities of the light projected by the light source 11 as illumination for detecting the surface features of the workpiece 20 to be measured.
(4-2) back-illuminated light source: the light source 11 and the image sensing device 12 are positioned on different sides of the workpiece 20 to be measured, so that the workpiece 20 to be measured can generate a contour line with strong contrast.
(4-3) side-lit light sources: the light source 11 is positioned at the side of the workpiece 20 to be measured, and the irradiation direction of the light projected by the light source 11 is approximately parallel to the plane of the workpiece 20 to be measured. Often used to highlight the geometry of the workpiece 20 being measured.
In addition, the polishing mode of the light source 11 on the workpiece 20 to be tested is classified into a common direct polishing mode; for the non-direct light source 11, the application of the coaxial light source is first pushed, wherein the coaxial light source mainly refers to positioning the light source 11 between the image sensing device 12 and the workpiece 20 to be measured, so as to vertically project the light projected by the light source 11 onto the surface of the workpiece 20 to be measured. The characteristic of the coaxial light source is to make the light projected by the light source 11 spread over the whole image field of view of the image sensing device 12, so that the tiny flaw image on the surface of the workpiece 20 to be measured can be clearly obtained by the image sensing device 12.
In practice, although the methods currently used for inspecting various electronic components or camera lenses are well developed, as mentioned above, it seems difficult to implement batch-to-batch and multi-directional inspection of tens or hundreds of electronic components or modules at the same time, so as to perform batch, mass and precise inspection of each component, circuit board circuit, contact …, etc. on each electronic component or module, under the condition that the structure and composition of each electronic component or module (such as a mobile phone camera module) are very complex. In view of this, how to design and manufacture a new inspection device and inspection method to greatly improve the inspection performance and accuracy of the electronic components is an important issue to be solved by many people in the electronic industry.
Disclosure of Invention
In view of the foregoing, it is still difficult for conventional computer vision inspection AOI systems to perform batch and multi-directional inspection for tens or hundreds of electronic components or modules at the same time, so that the related inspection work for each component, circuit board line, contact …, etc. on each electronic component or module cannot be performed in batch, in large quantity and accurately.
The invention provides a detection device for performing batch and multi-face image detection on electronic components, which is applied to the detection device capable of performing batch and multi-face detection on a plurality of electronic components or modules at the same time, wherein the electronic components or modules comprise a soft or hard circuit board and at least one component element, the bottom surface of the circuit board is planar, and predetermined electronic circuits and contacts are arranged on the circuit board, and each component element is arranged on the top surface of the circuit board so that each component element can be in a state of being convexly arranged on the top surface of the circuit board; the detection device comprises a tray, a first horizontal displacement mechanism, a first light source mechanism, a first image sensing mechanism, a vacuum adsorption vertical displacement mechanism, a second horizontal displacement mechanism, a second light source mechanism, a second image sensing mechanism and a visual image detection processor, wherein a plurality of component element positioning grooves are concavely formed on the top surface of the tray so that when each electronic component element or module is carried on the top surface of the tray, and each component element protruding from the top surface of a circuit board is accommodated in each component element positioning groove one by one, the circuit boards of the electronic component elements or modules can be respectively arranged on the top surface of the tray with the bottom surfaces facing upwards and mutually spaced; the first horizontal displacement mechanism is used for bearing the bottom surface of the tray and can displace the tray from a first detection position to a first conversion position along the horizontal direction; the first light source mechanism can enable a first light source device on the first light source mechanism to move along the range of the first detection position so as to project light rays generated by the first light source device onto the bottom surface of a circuit board of each electronic component or module carried on the tray one by one; the first image sensing mechanism can enable a first image sensing device on the first image sensing mechanism to move along the range of the first detection position, so that the first image sensing device can acquire the image of the bottom surface of the circuit board of each electronic component or module carried on the tray one by one; when the tray is horizontally displaced from the first detection position to the first conversion position, the vacuum adsorption vertical displacement mechanism can enable the bottom surface of a vacuum adsorption platform on the tray to adsorb the bottom surface of a circuit board of each electronic component or module carried on the tray, and vertically displace each electronic component or module to a second conversion position, wherein the second conversion position enables the component parts protruding from the top surface of the circuit board of each electronic component or module to be completely separated from the state of being accommodated in each component positioning groove, and can respectively keep a preset distance with the top surface of the tray; the second horizontal displacement mechanism is used for horizontally displacing the vacuum adsorption vertical displacement mechanism from the second conversion position to a second detection position; the second light source mechanism can enable a second light source on the second light source mechanism to move along the range of the second detection position so as to project light rays generated by the second light source onto the top surface of the circuit board of each electronic component or module adsorbed by the bottom surface of the vacuum adsorption platform one by one; the second image sensing mechanism can enable a second image sensing device on the second image sensing mechanism to move along the range of the second detection position, so that the second image sensing device can acquire images on the top surface of the circuit board of each electronic component or module adsorbed by the bottom surface of the vacuum adsorption platform one by one; the vision image detection processor is respectively connected with the mechanisms and the devices and is used for controlling the normal operation of the mechanisms and the devices, reading the images of the bottom surface and the top surface of the circuit board of each electronic component or module acquired by the image sensing devices, respectively reconstructing three-dimensional images of the bottom surface and the top surface of the circuit board of each electronic component or module by utilizing the built-in computer vision automatic optical detection technology, and comparing and analyzing the images with a corresponding and perfect three-dimensional reference image according to the images, so that the detection of all components, circuit board lines and joints on the electronic component or module can be rapidly and accurately finished by multiple directions (at least by the bottom surface and the top surface of the circuit board of each electronic component or module), the circuit board lines and joints on the electronic component or module, the detection of all components, circuit board lines and joints on the electronic component or module can be realized in a batch mode, and the ideal work efficiency and the expected service life of all the electronic components or modules which finish the detection can be ensured.
Another object of the present invention is to provide a method for performing batch and multi-aspect image inspection on electronic components, the method being applied to batch and multi-aspect inspection on a plurality of electronic components or modules simultaneously, the electronic components or modules comprising a flexible or rigid circuit board and at least one component, wherein the bottom surface of the circuit board is planar and has predetermined electronic circuits and contacts disposed thereon, and each component is mounted on the top surface of the circuit board so that each component can be in a state of protruding on the top surface of the circuit board; the detection method comprises the following steps: firstly, the electronic components or modules are carried on the top surface of a tray, wherein the component components can be contained in component positioning grooves of the tray one by one, so that circuit boards of the electronic components or modules can be respectively arranged on the top surface of the tray with the bottom surfaces facing upwards; carrying the bottom surface of the tray by using a first horizontal displacement mechanism, and positioning the tray at a first detection position; moving a first light source device along the range of the first detection position to project light rays onto the bottom surface of the circuit board of each electronic component or module carried on the tray one by one; meanwhile, a first image sensing device is enabled to move along the range of the first detection position, so that the image of the bottom surface of the circuit board of each electronic component or module carried on the tray can be acquired one by one; the tray is moved from the first detection position to a first conversion position along the horizontal direction, the bottom surface of a vacuum adsorption platform can adsorb the bottom surface of a circuit board of each electronic component or module carried on the tray, each electronic component or module is moved to a second conversion position along the vertical direction, and the second conversion position can lead the component elements protruding from the top surface of the circuit board of each electronic component or module to be completely separated from being accommodated in the positioning grooves of the component elements and respectively keep a preset distance from the top surface of the tray; moving the vacuum adsorption platform from the second conversion position to a second detection position along the horizontal direction; moving a second light source device along the range of the second detection position to project light rays onto the top surface of the circuit board of each electronic component or module adsorbed by the bottom surface of the vacuum adsorption platform one by one; meanwhile, a second image sensing device is utilized to move along the range of the second detection position so as to acquire the image of the top surface of the circuit board of each electronic component or module adsorbed by the bottom surface of the vacuum adsorption platform one by one; finally, the image of the bottom surface and the top surface of the circuit board of each electronic component or module acquired by each image sensing device is read by a visual image detection processor, then the three-dimensional images are respectively reconstructed by a built-in computer visual automatic optical detection technology, and the characteristic comparison and analysis are carried out according to the images and a corresponding perfect three-dimensional reference image, so that the detection of each component, line and contact on each electronic component or module is rapidly and accurately finished from multiple directions (at least from the bottom surface and the top surface of the circuit board of each electronic component or module).
For a further understanding and appreciation of the objects, shapes, structural device features, and efficacy of the invention, reference should be made to the following detailed description, taken in connection with the accompanying drawings, of which:
drawings
FIG. 1 is a schematic diagram of a conventional AOI system for computer vision inspection;
FIG. 2 is an exploded view of a VCM AF camera module commonly used in smart phones;
FIG. 3 is an assembled perspective view of the upper left of the VCMAF camera module of FIG. 2;
fig. 4 is a top view of the top left of the tray of the present invention carrying the isoelectric components or modules.
FIG. 5 is a left lower perspective view of the VCM AF camera module shown in FIG. 2;
FIG. 6 is a schematic view of the tray of the present invention positioned in a first testing position of the testing device of the present invention;
FIG. 7 is a schematic view of the tray of the present invention positioned in a first transition position of the detection device of the present invention;
FIG. 8 is a schematic view of the tray of the present invention positioned in a second transition position of the detection device of the present invention;
FIG. 9 is a schematic view of the tray of the present invention positioned in a second testing position of the testing device of the present invention; and
FIG. 10 is a flow chart of the detection method of the present invention.
[ Main element symbols description ]
Electronic component or module................2
Image sensor..............., 21
Positioning seat..............., 22
Image pickup window................220
Filter lens..............., 23
Voice coil motor..............., 24
Insert pin..............., 240
Lens insert pocket................241
Camera lens group................25
Image signal processor..............., 26
Rigid circuit board..............., 201, 202
Soft circuit board................203
Predetermined line................2031
Tray................30
Component positioning groove................300
First horizontal displacement mechanism................31
First light Source mechanism................32
First light source device................320
First image sensing mechanism..............., 33
First image sensor devices..............., 330
Vacuum adsorption vertical displacement machine................34
Structure
Vacuum adsorption platform................340
Second horizontal displacement mechanism................35
Second light Source mechanism................36
Second light source device................360
Second image sensing mechanism..............., 37
Second image sensor devices..............., 370
Visual image detection processor................38
First detection position................41
First transition position................42
Second transition position................43
Second detection position................44
Pitch............... S
Detailed Description
As mentioned above, in recent years, as the functional requirements and demands of consumers for various electronic products are increasing and higher, in order to realize and fulfill the numerous requirements and demands of consumers, those skilled in the art are continuously developing new designs and functions of various electronic components or modules in each electronic product, which results in that the complexity of the various electronic components or modules in each electronic product and the items on which the individual detection is necessary are far beyond the comparison of the conventional printed circuit boards, such as an Auto Focus (AF) camera module (VCM) commonly used in the smart phone, referring to fig. 2, the VCM AF camera module has been continuously developed in the ultra-thin, miniaturized and high-pixel trend under the strong competition of the smart phone market, and generally comprises two hard circuit boards (Rigid Printed Circuit Board, RPCB) 201, 202, a soft circuit board (Flexible Printed Circuit Board, FPCB) 203, an image sensor 21, a positioning seat 22, a Filter LENS (IR Filter) 23, a Voice Coil Motor (VCM) 24, a camera LENS set (LENS) 25, and an image signal processor (image signal processor, ISP) 26, wherein the bottom surfaces and top surfaces of the circuit boards (Printed Circuit Board, PCBs) 201, 202, 203 are planar, the image sensor 21 is a single chip Surface Mount Device (SMD) and is mounted on the top surface of a hard circuit board 202 by surface mount technology, the positioning base 22 is also mounted on the top surface of the hard circuit board 202 corresponding to the position above the image sensor 21 by surface mount technology, so that an image pickup window 220 thereon can correspond to the image sensor 21, the filter lens 23 is embedded in the image pickup window 220, the voice coil motor 24 is embedded and fixed on the top side of the positioning base 22 by the embedded pins 240 at the bottom thereof by surface mount technology and can be communicated with related circuits arranged on the hard circuit board 202, the camera lens set 25 is embedded in a lens embedded groove 241 of the voice coil motor 24, and the image signal processor 26 is also a single chip surface mount device and is also mounted on the top surface of another hard circuit board 201 by surface mount technology; the soft circuit board 203 is connected between the two hard circuit boards 201 and 202 to make the two hard circuit boards 201 and 202 and the constituent elements 21, 24, 25 and 26 mounted thereon electrically conductive to each other via the predetermined circuit 2031, so that the VCM AF camera module can provide functions of Auto-focusing and image capturing, wherein the Auto-focusing function must be realized via the voice coil motor 24, because the voice coil motor 24 can make the camera lens set 25 calibrated to a clear focusing position of the image, that is, the Auto-focusing function is achieved by the Auto-focusing function, most of the rear lenses of the smart phones are provided with Auto-focusing function, and the front lenses thereof generally only have a Fixed focusing (Fixed focusing) function, in addition, according to the different actual requirements, the voice coil motor 24 can be distinguished into two functions of Open Loop type (Open) and Closed Loop type (close), wherein the Open Loop type of the voice coil motor 24 has the disadvantage that when the voice coil motor 24 is interfered with the camera lens set 25 is calibrated to a clear focusing position of the image, the image signal is still provided by the camera lens set 26 on the basis of the image signal processing element 21, but the image signal processing device is still provided with the image signal processing element is less than the image signal processing element 21 by the camera lens set of the camera lens set 21, to obtain the correct focusing position of the camera lens group 25; the image signal processor 26 outputs the correct focusing position of the camera lens assembly 25 to the voice coil motor 24 to drive the voice coil motor 24 to control the camera lens assembly 25, thereby adjusting the camera lens assembly 25 to the corresponding correct focusing position, and enabling the image sensing element 21 to obtain a clear image of the photographed object.
In addition, in the market of electronic devices such as mobile phones, tablet computers or notebook computers, as shown in fig. 2, the main current specification of the image sensor device 21 has been jumped from 3 megapixels, and the sales volume thereof has already been more than six in the whole market. On the premise that the pixels of the image sensor 21 are continuously improved, the design and manufacturing quality of the optical or non-optical component elements such as the camera lens group 25, the filter lens 23, the voice coil motor 24 and the image signal processor 26, which are matched with the image sensor 21, in each VCM AF imaging module must be continuously improved, and similarly, the requirements for detecting the optical imaging quality of the camera lens group 25 and the filter lens 23 in the production and manufacturing process of the VCM AF imaging module are also more strict. In addition, after the VCM AF imaging module is increasingly light in its optical system, miniaturized and highly precise, the detection of the constituent elements such as the camera lens group 25, the filter lens 23 and the voice coil motor 24 thereon is increasingly important, especially, the camera lens group 25 and the filter lens 23 responsible for imaging are most prone to edge defects and poor formation during production and manufacture of such imaging lenses, and these problems have critical effects on the quality of imaging, so that if the problems of the camera lens group 25 and the filter lens 23 thereon can be accurately detected during the process of detecting each VCM AF imaging module, the quality of clear and stable images obtained by each VCM AF imaging module during the future imaging can be ensured accordingly.
In view of this, the inventor has made extensive practical experience in designing and manufacturing automated inspection tools for many years, and has long been diligent in observing and researching, and has found that if it is desired to perform multi-directional inspection for several tens or hundreds of VCM AF imaging modules (hereinafter, referred to as "electronic components or modules") in batches by using a conventional computer vision inspection AOI system, so as to perform a large number of and accurately related inspection works on each component, circuit board circuit, contact point, etc. on each electronic component or module 2, the problem that it is necessary to solve first is that before performing related inspection works on each component and circuit on each electronic component or module 2, it is necessary to make each component on each electronic component or module 2 (for example: the image sensor 21, the positioning base 22, the filter lens 23, the voice coil motor 24, the camera lens set 25, the image signal processor 26, etc.), circuit board lines and joints (such as the lines and joints arranged on the hard circuit boards 201, 202 and the soft circuit board 203) can be completely exposed in an open and dead-angle-free perspective space, so that when the conventional computer vision inspection AOI system is used to perform related inspection work on the lines and joints of each component 21, 22, 23, 24, 25, 26, circuit boards 201, 202, 203 on each electronic component or module 2, the light generated by the light source in the conventional computer vision inspection AOI system can smoothly pass through the open and dead-angle-free perspective space and be projected onto each component 21, 22, 23, 24, 25, 26, circuit board 201, 202, 203 on each electronic component or module 2, meanwhile, the image sensing device in the conventional computer vision inspection AOI system can smoothly pass through the open perspective space without dead angles, and clear images of the lines, joints and the like of each component element 21, 22, 23, 24, 25, 26, circuit boards 201, 202, 203 and the like on each electronic component element or module 2 are acquired from different directions (at least from the top surface and the bottom surface of each electronic component element or module 2).
Thus, the conventional computer vision inspection AOI system can reconstruct three-dimensional images of the bottom and top surfaces of the circuit boards 201, 202, 203 of each electronic component or module 2 by using the built-in computer vision automated optical inspection technology, and perform feature comparison and analysis according to the reconstructed three-dimensional images and the reconstructed three-dimensional images, so as to rapidly and accurately perform various inspection on the circuit and contact points of each component 21, 22, 23, 24, 25, 26, the circuit boards 201, 202, 203 of the electronic component or module 2 from multiple directions (at least from the bottom and top surfaces of the circuit boards of each electronic component or module).
Based on this design concept, the inventor utilizes a tray with a special structural design to carry a plurality of electronic components or modules 2 in batches, and when the electronic components or modules 2 are moved to a corresponding detection position, the bottom surface or the top surface of the circuit board of the electronic components or modules can respectively correspond to an open detection space without dead angles. Thus, the conventional computer vision inspection AOI system can utilize the light source, the image sensing device and the built-in computer vision automated optical inspection technology to reconstruct three-dimensional images of the bottom surface and the top surface of the circuit board 201, 202, 203 of each electronic component or module 2, and perform feature comparison and analysis according to the reconstructed three-dimensional images and the reconstructed three-dimensional images, so as to rapidly and accurately perform various inspection on the component 21, 22, 23, 24, 25, 26, the circuit board 201, 202, 203, the circuit and the contact point of the electronic component or module 2 from multiple directions (at least from the bottom surface and the top surface of the circuit board of each electronic component or module).
The inventor has developed and devised an apparatus and a method for performing batch and multi-aspect image inspection on electronic components according to this design concept, in a preferred embodiment of the present invention, the apparatus for inspecting (hereinafter referred to as inspecting apparatus) is applied to inspecting a plurality of electronic components or modules 2 simultaneously in batch and multi-aspect, and referring to fig. 3, the electronic components or modules 2 include a soft or hard circuit board 201, 202, 203 and at least one component 24, 25, 26, wherein the bottom and top surfaces of the circuit board 201, 202, 203 are respectively planar, and predetermined electronic circuits and contacts are disposed thereon, and each component 24, 25, 26 is mounted on the top surface of the circuit board 201, 202, and may be at least one electronic component, an optical component, an electromechanical component or other physical component …, so that each component 24, 25, 26 can be in a state of protruding on the top surface of the circuit board 201, 202.
Referring to fig. 6, the detecting device includes a tray 30, a first horizontal displacement mechanism 31, a first light source mechanism 32, a first image sensing mechanism 33, a vacuum suction vertical displacement mechanism 34, a second horizontal displacement mechanism 35, a second light source mechanism 36, a second image sensing mechanism 37 and a visual image detecting processor 38, wherein, referring to fig. 4, the top and bottom surfaces of the tray 30 are respectively planar, and a plurality of component positioning slots 300 are concavely provided on the top surface of the tray 30, the component positioning slots 300 are spaced apart from each other and keep a predetermined distance from each other, the configuration, size and depth of each component positioning slot 300 are matched with the configuration, size and height of each component 24, 25, 26 convexly provided on the top surface of the circuit board 201, 202 of each electronic component or module 2, so that each component 24, 25, 26 convexly provided on the top surface of each electronic component or module 2 is carried on the tray 30, and each component 24, 26 convexly provided on the top surface of the circuit board 201, 202 is respectively held in the top surface of the tray 30, each component positioning slot 202 is respectively arranged in the top surface of the tray 5, the electronic component or module 2, referring to fig. 5, the component positioning slots are respectively arranged at intervals from each other, and each component positioning slot 300 is arranged one by one to the top surface of the electronic component positioning slots 203.
With continued reference to fig. 6, the first horizontal displacement mechanism 31 is configured to carry the bottom surface of the tray 30, and is capable of horizontally displacing the tray 30 from a first detection position 41 to a first conversion position 42; the first light source mechanism 32 can enable a first light source device 320 thereon to move along the range of the first detection position 41, so as to project the light generated by the first light source device 320 onto the bottom surface of the circuit board 201, 202 of each electronic component or module 2 carried on the tray 30 one by one; the first image sensing mechanism 33 can enable a first image sensing device 330 thereon to move along the range of the first detection position 41, so that the first image sensing device 330 can acquire the image of the bottom surface of the circuit board 201, 202 of each electronic component or module 2 carried on the tray 30 one by one.
Referring to fig. 7, when the tray 30 is horizontally moved from the first detecting position 41 to the first converting position 42, the vacuum sucking platform 340 thereon can be vertically moved to the first converting position 42, the bottom surface of the vacuum sucking platform 340 sucks the bottom surface of the circuit board 201, 202 of each electronic component or module 2 carried on the tray 30, and then each electronic component or module 2 is vertically moved to the second converting position 43, and referring to fig. 8, the second converting position 43 enables the component 24, 25, 26 protruding on the top surface of the circuit board 201, 202 of each electronic component or module 2 to be completely separated from the state of being accommodated in each component positioning slot 300, and keeps a predetermined spacing S with the top surface of the tray 30; referring to fig. 9, the second horizontal displacement mechanism 35 is configured to displace the vacuum suction vertical displacement mechanism 34 from the second switching position 43 to a second detecting position 44 along a horizontal direction; the second light source mechanism 36 can enable a second light source device 360 thereon to move along the range of the second detection position 44, so as to project the light generated by the second light source device 360 onto the top surface of the circuit board 201, 202 of each electronic component or module 2 absorbed on the bottom surface of the vacuum absorption platform 340 one by one; the second image sensing mechanism 37 can enable a second image sensing device 370 thereon to move along the range of the second detection position 44, so that the second image sensing device 370 can acquire the image of the top surface of the circuit board 201, 202 of each electronic component or module 2 adsorbed on the bottom surface of the vacuum adsorption platform 340 one by one.
With reference to fig. 7, the visual image detection processor 38 is connected with the mechanisms 31, 32, 33, 34, 35, 36, 37 and the devices 320, 330, 360, 370 respectively, and is used for controlling the normal operation of the mechanisms 31, 32, 33, 34, 35, 36, 37 and the devices 320, 330, 360, 370, and is used for reading the images of the bottom surface and the top surface of the circuit board 201, 202 of each electronic component or module 2 acquired by the image sensing devices 330, 370, and then using the built-in computer vision automated optical detection technology to reconstruct three-dimensional images of the bottom surface and the top surface of the circuit board 201, 202 of each electronic component or module 2 respectively, and accordingly, and performs feature comparison and analysis with a corresponding and perfect three-dimensional reference image, so as to rapidly and accurately finish the detection of the components 24, 25, 26, and the detection of the contacts on the electronic component or module 2 (at least by the bottom surface and the top surface of the circuit board 201, 202 of each electronic component or module 2), and ensure the performance of the ideal components or the components and the expected performance of the electronic component or module 2, and the performance of the electronic component or module 2 can be ensured.
Thus, as shown in fig. 6, when the tray 30 is moved to the first detection position 41, the circuit boards 201, 202, 203 of each electronic component or module 2 carried by the top surface of the tray 30 are respectively arranged on the top surface of the tray 30 with the bottom surface facing upwards and spaced apart from each other, so that the first light source device 320 and the first image sensing device 330 are completely exposed in an open and dead-angle-free perspective space with respect to the bottom surface of the circuit board 201, 202, 203 of each electronic component or module 2, so that the first light source device 320 can move along the range of the first detection position 41 to precisely project the generated light onto the bottom surface of the circuit board 201, 202 of each electronic component or module 2 carried by the tray 30 one by one, thereby clearly showing the fine structural features of the bottom surfaces of the circuit boards 201, 202; based on the same principle, the first image sensing device 330 can also move along the range of the first detection position 41, so as to obtain clear images of the bottom surface of the circuit board 201, 202 of each electronic component or module 2 carried on the tray 30 one by one; in addition, as shown in fig. 9, when the vacuum suction vertical displacement mechanism 34 is displaced from the second conversion position 43 to the second detection position 44 along the horizontal direction, the top surfaces of the circuit boards 201, 202, 203 of each electronic component or module 2 sucked on the bottom surface of the vacuum suction platform 340 are respectively arranged on the bottom surface of the vacuum suction platform 340 with the top surfaces facing downwards and spaced apart from each other, so that the second light source device 360 and the second image sensing device 370 are completely exposed in an open and dead-angle-free perspective space with respect to the top surfaces of the circuit boards 201, 202, 203 of each electronic component or module 2, respectively, so that the second light source device 360 can move along the range of the second detection position 44, and precisely projects the generated light onto the top surfaces of the circuit boards 201, 202 of each electronic component or module 2 sucked on the bottom surface of the vacuum suction platform 340 one by one, thereby clearly showing the micro-structure characteristics of the top surfaces of the circuit boards 201, 202; based on the same principle, the second image sensing device 370 can also move along the range of the second detection position 44 to obtain clear images of the top surface of the circuit board 201, 202 of each electronic component or module 2 adsorbed on the bottom surface of the vacuum adsorption platform 340 one by one.
As described above, the visual image detection processor 38 can accurately reconstruct three-dimensional images of the bottom surface and the top surface of the circuit board 201, 202 of each electronic component or module 2 according to the clear images of the bottom surface and the top surface of the circuit board 201, 202 of each electronic component or module 2 acquired and transmitted by the image sensing devices 330, 370 by using the built-in computer vision automated optical detection technology, so as to effectively improve the accuracy of executing visual image detection by the visual image detection processor 38.
In the above description, only in a preferred embodiment of the present invention, the present invention is not limited to this, and any mechanism or device adopted thereon can be simplified or complicated according to the actual needs, however, any modification or change can be made, as long as the detection device is assisted by the tray 30, by using the three-dimensional visual recognition technology through the detection procedure and steps described in the following another preferred embodiment of the present invention, and batch and multi-directional detection is performed on a plurality of electronic components or modules 2, which are all the detection devices to be protected herein according to the present invention.
Referring to fig. 3 and 10, the following steps included in the detection method will be briefly described:
(500) Firstly, as shown in fig. 6, the electronic components or modules 2 are carried on the top surface of a tray 30, and the plurality of component elements 24, 25, 26 protruding from the top surface of the circuit boards 201, 202 are received in the plurality of component element positioning slots 300 recessed from the top surface of the tray 30 one by one, so that the circuit boards 201, 202 of the electronic components or modules 2 can be arranged on the top surface of the tray 30 with their bottom surfaces facing upwards and being spaced apart from each other;
(501) With continued reference to fig. 6, a first horizontal displacement mechanism is used to carry the bottom surface of the tray 30, and the top surface of the tray 30 is positioned at a first detection position 41;
(502) With continued reference to fig. 6, a first light source device 320 is enabled to move along the range of the first detection position 41, so as to project the generated light onto the bottom surface of the circuit board 201, 202 of each electronic component or module 2 carried on the tray 30 one by one; meanwhile, a first image sensor 330 can move along the range of the first detection position 41, and acquire the image of the bottom surface of the circuit board 201, 202 of each electronic component or module 2 carried on the tray 30 one by one;
(503) With continued reference to fig. 6, the tray 30 is moved from the first detecting position 41 to a first switching position 42 in the horizontal direction by the first horizontal moving mechanism 31;
(504) When the tray 30 is horizontally displaced from the first detecting position 41 to the first converting position 42, as shown in fig. 7, the bottom surface of a vacuum adsorbing platform 340 on a vacuum adsorbing vertical displacement mechanism 34 is utilized to adsorb the bottom surface of the circuit board 201, 202 of each electronic component or module 2 carried on the tray 30 in a vacuum adsorbing manner, and each electronic component or module 2 is vertically displaced to a second converting position 43, and as shown in fig. 8, the second converting position 43 can completely separate the component 24, 25, 26 protruding from the top surface of the circuit board 201, 202 of each electronic component or module 2 from the state of being accommodated in each component positioning slot 300, and can maintain a predetermined spacing S with the top surface of the tray 30;
(505) Referring to fig. 9, the vacuum suction vertical displacement mechanism 34 is displaced from the second switching position 43 to a second detecting position 44 in the horizontal direction by a second horizontal displacement mechanism 35;
(506) A second light source device 360 can move along the range of the second detection position 44, so as to project the light generated by the second light source device 360 onto the top surface of the circuit board 201, 202 of each electronic component or module 2 absorbed by the bottom surface of the vacuum absorption platform 340 one by one; meanwhile, a second image sensing device 370 can move along the range of the second detection position 44, so that the second image sensing device 370 can acquire the image of the top surface of the circuit board 201, 202 of each electronic component or module 2 absorbed by the bottom surface of the vacuum absorption platform 340 one by one; and
(507) Finally, the images of the bottom and top surfaces of the circuit boards 201, 202 of each electronic component or module 2 acquired and transmitted from the image sensing devices 330, 370 are read by a visual image detection processor 38, then the images of the bottom and top surfaces of the circuit boards 201, 202 of each electronic component or module 2 are respectively reconstructed by a built-in computer vision automatic optical detection technology, and then feature comparison and analysis are performed according to the reconstructed images and a corresponding and perfect three-dimensional reference image, so that each detection of each component 24, 25, 26, circuit board 201, 202 line and joint on the electronic component or module 2 can be rapidly and accurately completed from multiple directions.
In many other possible and practical embodiments of the present invention, no matter how the structure and the mechanism details of the detection device are designed and arranged, as long as the structure and the mechanism can respectively implement the steps (501) - (507), the circuit boards 201, 202, 203 and the joints on each electronic zero element or module 2 can be completely exposed in an open and dead-angle-free perspective space, so that the light source devices 320, 360 and the image sensing devices 330, 370 and the vision image detection processor 38 can respectively implement three-dimensional image reconstruction on the images of the bottom surface and the top surface of the circuit boards 201, 202, 203 of each electronic zero element or module 2, and can respectively implement feature comparison and analysis with a corresponding and perfect three-dimensional reference image, so as to rapidly and accurately implement the detection of the circuit boards 24, 202, 203 and the joints on each electronic zero element or module 2 (at least by the circuit board bottom surface and the top surface of each electronic zero element or module) in multiple directions (at least, the circuit boards bottom surface and the circuit boards of each electronic zero element or module) and ensure that the circuit boards 202, 203 and the joints on each electronic zero element or module 2 can simultaneously implement the ideal performance of the circuit boards 201, 25 and the circuit boards 201 and the circuit boards of each electronic zero element or module 2 and the like, and the circuit boards can further implement the expected performance of the detection.
In summary, the present invention is not limited to the preferred embodiment, and any changes or modifications easily contemplated by those skilled in the art are intended to be included in the scope of the appended claims.
Claims (12)
1. An apparatus for performing batch and multi-aspect image inspection of electronic components, the apparatus being applied to batch and multi-aspect inspection of a plurality of electronic components or modules simultaneously, the electronic components or modules comprising a flexible or rigid circuit board and at least one component, wherein the bottom surface of the circuit board is planar and has predetermined electronic circuits and contacts disposed thereon, each of the component being mounted on the top surface of the circuit board so as to be capable of assuming a state protruding on the top surface of the circuit board, the apparatus comprising:
the top surface and the bottom surface of the tray are respectively in a plane shape, a plurality of component positioning grooves are concavely arranged on the top surface of the tray, the component positioning grooves are spaced from each other and keep a preset distance from each other, the configuration, the size and the depth of each component positioning groove are matched with the configuration, the size and the height of each component convexly arranged on the top surface of a circuit board of each electronic component or module, so that when each electronic component or module is carried on the top surface of the tray, and the component convexly arranged on the top surface of a circuit board of the electronic component or module is accommodated in each component positioning groove one by one, the circuit boards of the electronic components or modules can be respectively arranged on the top surface of the tray with the bottom surface upwards and mutually spaced from each other;
The first horizontal displacement mechanism is used for bearing the bottom surface of the tray and can displace the tray from a first detection position to a first conversion position along the horizontal direction;
the first light source device can move along the range of the first detection position through a first detection displacement mechanism or a first light source mechanism, and the generated light rays are projected onto the bottom surface of the circuit board of each electronic component or module carried on the tray one by one;
the first image sensing device can move along the range of the first detection position and acquire the image of the bottom surface of the circuit board of each electronic component or module carried on the tray one by one;
when the tray is horizontally displaced from the first detection position to the first conversion position, the bottom surface of a vacuum adsorption platform on the tray can adsorb the bottom surface of a circuit board of each electronic component or module carried on the tray in a vacuum adsorption mode, and each electronic component or module is vertically displaced to a second conversion position, wherein the second conversion position enables the component protruding from the top surface of the circuit board of each electronic component or module to be completely separated from the state of being accommodated in each component positioning groove, and can respectively keep a preset distance with the top surface of the tray;
A second horizontal displacement mechanism for displacing the vacuum suction vertical displacement mechanism from the second conversion position to a second detection position along the horizontal direction;
the second light source device can move along the range of the second detection position and throw the generated light rays onto the top surface of the circuit board of each electronic component or module adsorbed on the bottom surface of the vacuum adsorption platform one by one;
the second image sensing device can move along the range of the second detection position and acquire the image of the top surface of the circuit board of each electronic component or module adsorbed on the bottom surface of the vacuum adsorption platform one by one; and
And the visual image detection processor is respectively connected with the first horizontal displacement mechanism, the first light source device, the first image sensing device, the vacuum adsorption vertical displacement mechanism, the second horizontal displacement mechanism, the second light source device and the second image sensing device, is used for controlling the normal operation of the mechanisms and the devices, is used for reading the images of the bottom surface and the top surface of the circuit board of each electronic component or module acquired by the image sensing devices, and is used for reconstructing three-dimensional images of the bottom surface and the top surface of the circuit board of each electronic component or module by utilizing the built-in computer vision automatic optical detection technology, and carrying out feature comparison and analysis on the images and a three-dimensional reference image so as to finish all detection on each component, circuit board line and contact point on the electronic component or module from multiple directions.
2. The apparatus of claim 1, wherein the first detection displacement mechanism is capable of moving the first light source device and the first image sensor device thereon along a range of the first detection position.
3. The device of claim 1, further comprising a first image sensing mechanism capable of moving the first image sensing device thereon along the range of the first detection position.
4. The apparatus of claim 3, further comprising a second detection displacement mechanism capable of moving the second light source device and the second image sensor device thereon along the range of the second detection position.
5. The apparatus of claim 1, further comprising a second light source mechanism capable of moving the second light source device thereon along the range of second detection positions.
6. The device of claim 1 or 5, further comprising a second image sensing mechanism capable of moving the second image sensing device thereon along the range of second detection positions.
7. A method for performing batch and multi-aspect image inspection of electronic components, the method being applied to batch and multi-aspect inspection of a plurality of electronic components or modules simultaneously, the electronic components or modules comprising a flexible or rigid circuit board and at least one component, wherein the bottom surface of the circuit board is planar and has predetermined electronic circuits and contacts disposed thereon, each of the component being mounted on the top surface of the circuit board so as to be capable of assuming a state protruding on the top surface of the circuit board, the method comprising the steps of:
The electronic components or modules are carried on the top surface of a tray, wherein the top surface and the bottom surface of the tray are respectively in a plane shape, a plurality of component positioning grooves are concavely arranged on the top surface of the tray, the component positioning grooves are mutually spaced and keep a preset distance, the configuration, the size and the depth of each component positioning groove are matched with the configuration, the size and the height of each component protruding on the top surface of a circuit board of each electronic component or module, and when each electronic component or module is carried on the top surface of the tray, and the component protruding on the top surface of the circuit board is accommodated in each component positioning groove one by one, the circuit boards of the electronic components or modules can be respectively arranged on the top surface of the tray with the bottom surfaces upwards and mutually spaced;
carrying the bottom surface of the tray by using a first horizontal displacement mechanism, and positioning the tray at a first detection position;
utilizing a first light source device to move along the range of the first detection position, projecting light rays generated by the first light source device onto the bottom surface of the circuit board of each electronic component or module carried on the tray one by one, and simultaneously utilizing a first image sensing device to move along the range of the first detection position, and acquiring images of the bottom surface of the circuit board of each electronic component or module carried on the tray one by one, wherein the first light source device moves through a first detection displacement mechanism or a first light source mechanism;
Using the first horizontal displacement mechanism to horizontally displace the tray from the first detection position to a first conversion position;
the bottom surface of a vacuum adsorption platform on the vacuum adsorption vertical displacement mechanism is enabled to adsorb the bottom surface of a circuit board of each electronic component or module carried on the tray in a vacuum adsorption mode, each electronic component or module is displaced to a second conversion position along the vertical direction, the second conversion position enables the component protruding from the top surface of the circuit board of each electronic component or module to be completely separated from the state of being accommodated in each component positioning groove, and a preset distance can be kept between the component and the top surface of the tray;
using a second horizontal displacement mechanism to displace the vacuum adsorption vertical displacement mechanism from the second conversion position to a second detection position along the horizontal direction;
utilizing a second light source device to move along the range of the second detection position so as to project the light rays generated by the second light source device onto the top surface of the circuit board of each electronic component or module adsorbed by the bottom surface of the vacuum adsorption platform one by one, and simultaneously utilizing a second image sensing device to move along the range of the second detection position so as to enable the second image sensing device to acquire the image of the top surface of the circuit board of each electronic component or module adsorbed by the bottom surface of the vacuum adsorption platform one by one; and
The method comprises the steps of utilizing a visual image detection processor to read the images of the bottom surface and the top surface of the circuit board of each electronic component or module acquired by each image sensing device, then utilizing the built-in computer vision automatic optical detection technology to reconstruct three-dimensional images of the bottom surface and the top surface of the circuit board of each electronic component or module respectively, and comparing and analyzing characteristics with a three-dimensional reference image according to the images, so as to finish all detection of each component, line and contact on the electronic component or module from multiple directions.
8. The method of claim 7, further comprising using the first detection displacement mechanism to enable the first image sensor to move along the range of the first detection position.
9. The method of claim 7, further comprising using a first image sensing mechanism to enable the first image sensing device to move along the range of the first detection position.
10. The method of claim 8, further comprising using a second detection displacement mechanism to enable the second light source device and the second image sensor device to move along the range of the second detection position.
11. The method of claim 7, further comprising moving the second light source device along the range of the second detection position using a second light source mechanism.
12. The method of claim 7 or 11, further comprising using a second image sensing mechanism to enable the second image sensing device to move along the range of the second detection position.
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| CN112285129A (en) * | 2020-12-30 | 2021-01-29 | 宁波丞达精机股份有限公司 | AOI optical test machine position motion module |
| CN115790725B (en) * | 2023-02-08 | 2023-04-25 | 常州市科启新电子有限公司 | Multifunctional detection equipment for electronic components |
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