CN111398790A

CN111398790A - Optical chip module testing device

Info

Publication number: CN111398790A
Application number: CN202010356167.7A
Authority: CN
Inventors: 朱小刚
Original assignee: SUZHOU CHUANGRUI MACHINERY AND ELECTRICAL TECHNOLOGY CO LTD
Current assignee: SUZHOU CHUANGRUI MACHINERY AND ELECTRICAL TECHNOLOGY CO LTD
Priority date: 2020-04-29
Filing date: 2020-04-29
Publication date: 2020-07-10

Abstract

The invention discloses an optical chip module testing device which comprises an upper module and a lower module which are matched, wherein the upper module comprises a testing probe, the lower module comprises a chip placing seat, a chip placing groove is formed on the chip placing seat, an installation space which is opposite to the chip placing groove and communicated with the groove bottom of the chip placing groove is formed on the chip placing seat, L ENS is arranged in the installation space in a translation mode, and the scheme forms the installation space corresponding to the chip placing groove on the chip placing seat and arranges L ENS with an adjustable position in the installation space, so that the horizontal position of L ENS can be flexibly adjusted according to testing requirements, the centering precision of a lens center and the optical center of a chip is ensured to be within 0.01mm, error interference is favorably reduced, and the precision of a testing result is improved.

Description

Optical chip module testing device

Technical Field

The invention relates to the field of chip testing equipment, in particular to an optical chip module testing device.

Background

The COM/QFP optical chip module is a module consisting of a light sensing chip and a related frame structure, which is produced along with circuit integration and optical integration, wherein circuit signals are led out by adopting tinned copper wires or gold wires and the like, and the step pitch between the tinned copper wires/the gold wires is designed to be smaller and smaller, and reaches about 0.2mm at present.

In the processing process of the COM/QFP optical chip module, a special testing device is needed to test the performance of the chip, and during testing, the chip to be tested is usually placed in a jig and is contacted with pins of the chip through a testing probe to be matched with a corresponding testing structure for testing.

When a chip imaging performance test is carried out, the centering precision of the optical center of the optical chip module and the lens center needs to be kept within 0.01mm, but due to the existence of various processing, assembling and operating errors, and in the existing test equipment, the position of the lens L ENS is fixed, so that the error cannot be effectively adjusted to compensate the error, the centering precision of the optical chip module and the lens center is low, and the test precision is influenced.

Meanwhile, in the testing process, due to the light weight of the optical chip module, the problem of position deviation possibly occurs in the testing and pressing process, the probability of poor contact between a chip pin and a testing probe is increased, and the testing reliability is influenced.

At present, the diameter of pins of a chip module is basically within 0.05mm, even the pins of a plurality of chips are within 0.03mm, and meanwhile, the distance between the pins is about 0.2mm, so that the size of a test probe is not suitable to be too large, and the conventional various test probes are generally integrated with elastic members such as springs in order to have certain telescopic performance so as to avoid hard contact, for example, the test probes disclosed in application numbers 201780069227.3 and 201080067768.0, so that the structure of the test probe is complex and the size is large.

Some test probes are straight or polygonal special-shaped rhenium tungsten needles, and the test ends of the test probes are generally arranged in a spherical shape or a needle shape as shown in the patent, so that the contact area between the contact length of the test probes and the chip pins is small, the tolerance range between the test probes and the chip pins or the PAD is required to be about 0.02mm for effective contact, however, due to the existence of various processing and assembling tolerances, the test probes and the chip pins can not be effectively contacted, and the open circuit probability is high.

Still other probes are special-shaped shrapnels, and the probes are easy to deform in the using process, so that the probes cannot be accurately positioned.

Meanwhile, the requirements of the existing test probe structure on the machining and assembling precision of other structures are greatly improved, and the machining and assembling difficulty is increased.

Disclosure of Invention

The present invention is directed to solving the above-mentioned problems of the prior art, and provides an optical chip module testing apparatus.

The purpose of the invention is realized by the following technical scheme:

optical chip module testing arrangement, including the last module and the lower module of matching, go up the module and include the test probe, the lower module includes that the chip places the seat, the chip is placed and is formed with the chip standing groove on the seat, it is just right to form on the seat is placed to the chip standing groove and with the installation space of the tank bottom intercommunication of chip standing groove, but be provided with L ENS with translating in the installation space.

Preferably, in the optical chip module testing apparatus, the upper module and/or the lower module are connected to a moving mechanism for driving them to move relatively;

or one sides of the upper module and the lower module are hinged.

Preferably, in the optical chip module testing apparatus, the testing probe includes a probe main body, a testing end of the probe main body is obliquely cut to form an oblique cutting plane, and an area of the oblique cutting plane is larger than an area of an end surface of the testing end before cutting.

Preferably, in the optical chip module testing apparatus, the probe body includes a first portion and a second portion that are arranged at an obtuse angle, and the second portion is perpendicular to the chamfer plane.

Preferably, in the optical chip module testing device, the test probe is fixed on the test probe fixing jig and electrically connected to the test PCB, and the test PCB is fixed on the test probe fixing jig.

Preferably, optical chip module testing arrangement in, the fixed tool of test probe includes the fixing base, be formed with a chute on the fixing base, the tank bottom intercommunication of chute is one row of guiding hole that extends along the chute depth direction, be provided with the embedding piece in the chute, the test probe sets up on the embedding piece and every test probe passes one the guiding hole.

Preferably, in the optical chip module testing device, the chute is filled with glue for coating the embedded block.

Preferably, in the optical chip module testing apparatus, the test probe fixing jig further includes a holding plate, the holding plate is disposed on the fixing base, and a group of positioning holes which are opposite to the notch of the chute and perpendicular to the bevel plane are formed on the holding plate, one positioning hole corresponds to one guiding hole, and the second portion of the probe main body extends into the positioning hole.

Preferably, in the optical chip module testing apparatus, the L ENS is disposed on a lens frame, the lens frame is connected to a fine adjustment mechanism for driving the lens frame to move horizontally, and the fine adjustment mechanism includes a first fine adjustment mechanism for driving the lens frame to move along a first direction X and/or a second fine adjustment mechanism for driving the lens frame to move along a second direction Y.

Preferably, in the optical chip module testing apparatus, the first fine adjustment mechanism includes a first elastic member and a first adjustment member that apply opposite pressure to opposite sides of the lens frame, and the first adjustment member can reciprocate along an extending direction thereof to adjust an elastic force of the first elastic member.

Preferably, in the optical chip module testing apparatus, the second fine adjustment mechanism includes a second elastic member and a second adjustment member for applying opposite pressures to opposite sides of the lens frame,

the second adjusting piece can move back and forth along the extending direction of the second adjusting piece so as to adjust the elastic force of the second elastic piece;

or the second adjusting piece can rotate in situ and drive different parts of an eccentric body to contact the lens frame so as to adjust the elasticity of the second elastic piece.

Preferably, in the optical chip module testing apparatus, the chip placing base is provided on the supporting base so as to be movable in an axial direction thereof.

Preferably, in the optical chip module testing apparatus, a group of airflow channels are formed on the chip placing seat, the airflow channels are uniformly distributed around the installation space, and one end of each airflow channel is located at the bottom of the chip placing groove.

Preferably, in the optical chip module testing device, a light source facing the chip placing groove is arranged in the mounting space, and a light equalizing device is arranged between the light source and the lens.

The technical scheme of the invention has the advantages that:

according to the scheme, the installation space corresponding to the chip placing groove is formed on the chip placing seat, and L ENS with the position adjustable is arranged in the installation space, so that the horizontal position of L ENS can be flexibly adjusted according to the test requirement, the centering precision of the lens center and the chip optical center is guaranteed to be within 0.01mm, the error interference is favorably reduced, and the precision of the test result is improved.

The fine adjustment mechanism of the scheme creates a feasible condition for L ENS adjustment of the multi-hole test structure by enabling the extending directions of the first adjusting piece and the second adjusting piece to be parallel, and is simple in structure and easy to realize.

The chip placing seat is adjusted in mounting height through a group of bolts or nuts, and the height of the optical chip module can be flexibly and conveniently adjusted, so that the Z-direction distance precision between the optical chip module and the test probe is ensured, and the test probe is reliably contacted with a pin of the optical chip module.

This scheme is formed with evenly distributed's airflow channel and is connected the evacuation equipment through the tank bottom at the chip standing groove, can adsorb the optical chip module through vacuum adsorption fixedly, avoids shifting, has improved the stability and the reliability of test effectively.

This scheme test probe need not spring isotructure, the size reduces greatly, can satisfy the operation requirement of little pin step, through with forming the oblique cutting plane that the area is greater than its terminal surface area in the probe main part, for prior art, can increase area of contact effectively, widen the position tolerance scope between test probe and the pin, and simultaneously, be favorable to reducing test equipment's whole processing and the equipment degree of difficulty, can be under conventional processing and equipment precision condition, reduce the production of the condition of opening a way, improve the reliability and the stability of test.

The two parts of the probe main body of this scheme become the obtuse angle setting, location and spacing when can effectively cooperate the tool structure to install, further make the second portion perpendicular with the plane of beveling, can with limit structure on the tool, realize fast, accurately that the plane of beveling keeps the parallel state with the horizontal plane and the range of depth of parallelism tolerance control at 0.02mm, greatly reduced the equipment degree of difficulty, improved the position accuracy of probe simultaneously, be favorable to improving the stability of test.

The technical scheme adopts the beryllium bronze as the probe material, so that the probe main body has high hardness, elastic limit, fatigue limit, wear resistance and conductivity, and a spring is not required for testing and has certain deformation freedom degree, thereby being beneficial to simplifying the structure of the test probe and reducing the size. The uncertain elastic force value of the probe is set and limited, the detected fragile optical chip module cannot be damaged, and particularly, the deformation of the pin is avoided.

The diameter of the probe main body can effectively meet the requirement of a small step distance of 0.2mm between pins of a chip module, the area of a beveling plane is increased as much as possible, the contradiction between the small step distance and a large contact area is effectively coordinated, the position tolerance between the probe main body and the chip pins is increased to 0.06mm from the existing 0.02mm, and the contact reliability is greatly improved.

The probe fixing jig has the advantages that the structure is simple, the probe main body can be effectively positioned by adopting the embedding block and the limiting hole, the holding plate is combined, the assembling difficulty is low, the probe fixing jig is easy to realize, and the position precision is high.

The assembly structure is solidified by combining a glue pouring process, so that the stability of the whole structure can be improved, and errors caused by movement and deformation of the probe main body are avoided. In addition, the whole structure of the jig can disperse the stress of the probe main body, so that the pressure applied to the probe main body during testing is mainly borne by the leakage part of the probe main body and the probe fixing jig, and little force is transmitted to the testing PCB connected with the testing probe, so that the testing PCB can be effectively protected, the damage of the testing PCB is avoided, and the requirement for testing the PCB can be reduced.

The whole testing device can be used for manual testing and can also be matched with a machine tool for automatic testing, the service life of the device is long, and the requirement of 100-ten-thousand IC testing can be met.

Drawings

FIG. 1 is a front cross-sectional view of an optical chip module testing apparatus of the present invention;

FIG. 2 is a cross-sectional end view of the optical chip module testing apparatus of the present invention (showing the gantry plate and the platform plate under the platform hidden);

FIG. 3 is an enlarged view of area A of FIG. 1;

FIG. 4 is a perspective view of a test probe of the present invention with portions cut away in phantom;

FIG. 5 is a schematic illustration of the cutting pattern of the test probe of the present invention;

FIG. 6 is a front view of the test probe of the present invention;

FIG. 7 is a schematic view of a first embodiment of a probe assembly of the present invention;

FIG. 8 is a schematic view of a second embodiment of a probe assembly of the present invention;

FIG. 9 is a top view of the probe assembly of the present invention with the probe body partially positioned in the holder in phantom;

FIG. 10 is a schematic view illustrating the assembly of the probing module on the probe fine positioning seat according to the present invention;

FIG. 11 is a bottom plan view of the fine positioning probe seat of the present invention;

FIG. 12 is a schematic view of the probe bending structure by the bending pushing block in the present invention;

FIG. 13 is a cross-sectional view of the chip holder of the present invention;

FIG. 14 is a top view of the chip holder of the present invention;

fig. 15 is a top view of the fine adjustment mechanism of the present invention.

Detailed Description

Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. The embodiments are merely exemplary for applying the technical solutions of the present invention, and any technical solution formed by replacing or converting the equivalent thereof falls within the scope of the present invention claimed.

In the description of the schemes, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the embodiment, the operator is used as a reference, and the direction close to the operator is a proximal end, and the direction away from the operator is a distal end.

The optical chip module testing apparatus disclosed in the present invention is described below with reference to the accompanying drawings, as shown in fig. 1 to fig. 3, the optical chip module testing apparatus includes an upper module 100 and a lower module 300 which are matched with each other, the upper module 100 includes a testing probe, the lower module 300 includes a chip placing seat 301, a chip placing groove 302 is formed on the chip placing seat 301, when the optical chip module testing apparatus is in operation, a chip 900 to be tested is placed in the chip placing groove 302, the testing probe is connected to a corresponding testing circuit board, and the testing probe on the upper module 100 is in contact with a pin on the chip to be tested to realize electrical connection through manual or automatic equipment, so as to perform a corresponding test.

In an embodiment, as shown in fig. 2 and 3, the upper module 100 includes a base 110, a bottom of the base 110 is formed with a limited space (not shown), a test PCB 120 is fixed in the limited space, an outer contour of the test PCB 120 has a portion identical to the limited space, and a portion protruding outside the base 110, and a bottom surface of the test PCB 120 is lower than the bottom surface 112 of the base 110.

The test PCB 120 is formed with a corresponding test circuit, which is a known technology and is not an innovative point of the present invention, and is not described herein again. As shown in fig. 2 and fig. 3, the test PCB 120 is connected to the test probes 130, the test probes 130 are matched according to the number and positions of the pins of the chip 900 to be tested, for example, the test probes 130 for measuring each chip to be tested are arranged in two rows, the two rows of test probes 130 are arranged in a mirror symmetry manner, each row of test probes 130 is fixed on a test probe fixing jig, and the test probe fixing jig is fixed on the test PCB.

The test probe 130 may be any of various known probes, such as a spring-loaded probe structure, an elastic straight pin, a shaped spring, etc. In a preferred embodiment, as shown in fig. 4, the test probe 130 includes a probe body 10, the probe body 10 may be made of various known materials with conductive property, such as various metals, specifically gold, copper, etc., and in a preferred mode, the probe body 10 may be made of a conductive material with certain elasticity, such as beryllium bronze.

As shown in fig. 4, the probe body 10 may have various shapes, for example, the cross-sectional shape may be circular, oval, polygonal, especially positive multiple, and in this embodiment, the cross-sectional shape of the trunk region of the probe body 10 is exemplified as circular.

In order to increase the contact area of the testing end of the probe body 10, as shown in fig. 4, a chamfer plane 30 is formed at the testing end of the probe body 10 in a chamfer manner, and the area of the chamfer plane 30 is larger than that of the end surface 50 before the testing end is cut. Here, "beveling" means cutting from one side 601 of a test probe material 60 having a circular cross section to the other side 602 at or opposite to the end face 50 of the test probe material along the cutting lines 20, 40 by using various cutting methods available in the art, such as laser cutting, wire saw cutting, plasma cutting, etc., as shown in fig. 5, so as to obtain an oval bevel plane 30, wherein the flatness tolerance of the bevel plane 30 is within 0.02 mm. The cutting angles of the cutting lines 20, 40 can be designed according to different requirements, preferably, the cutting lines cut the chamfer plane 30 to form an included angle with the end face 50 of 60-70 degrees, preferably about 65 degrees, and preferably, the cutting lines 20 are used for cutting, and the area of the chamfer plane obtained by cutting is an optimal value.

The area of the chamfer plane 30 of the probe body 10 is determined by the cutting angle and the cross-sectional area of the cylindrical material, and the design of specific parameters can be performed through a large number of reliability experiments according to the size of the pins of the chip to be tested and the step distance between the pins. In this embodiment, the diameter of the trunk region (the diameter of the cylindrical material) of the probe body 10 is between 0.1 mm and 0.2mm, and more preferably between 0.15 ± 0.02mm, so as to effectively satisfy the requirement of small step distance between pins of the chip module, and at the same time, increase the area of the bevel plane 30 as much as possible to increase the contactable area, and effectively coordinate the contradiction between the small step distance and the large contact area, so that the position tolerance between the probe body and the chip pins is increased from the existing 0.02mm to 0.06mm, and the contact stability is greatly improved.

As shown in fig. 4, while the probe body 10 may be a straight needle, in which case the fixing difficulty of the straight needle on the jig is relatively large, in an alternative embodiment, the probe body 10 may also be a curved line or a broken line, for example, it is entirely L-shaped or V-shaped, and more preferably, as shown in fig. 4 and fig. 6, it has a first portion 11 and a second portion 12, the included angle a between the first portion 11 and the second portion 12 is an obtuse angle, preferably between 105 and 120 °, and more preferably about 115 °, and the extending direction of the second portion 12 is preferably perpendicular to the chamfer plane 30.

The first portion 11 and the second portion 12 may be connected by an arc-shaped engaging portion 13, and the first portion 11, the second portion 12 and the third portion 13 may be integrally formed (for example, integrally injection-molded or formed by bending a cylinder), or they may be assembled into a whole, for example, they may be assembled into a whole by welding, or by screwing, or by interference fit.

The test probe 130 may be directly connected to the test PCB 120, or the test probe 130 may be fixed to the test probe fixing jig 70, the test probe fixing jig 70 is fixedly connected to the test PCB 120, and a second portion of the test probe 130 is perpendicularly connected to the test PCB 120.

In detail, as shown in fig. 7, the test probe fixing jig 70 includes a fixing base 71, the fixing base 71 may have various possible shapes, in this embodiment, it is preferably a square, an inclined groove 72 extending from a top surface 711 of the fixing base to a top corner of a lower left side of the fixing base is formed on the fixing base 71, a longitudinal section of the inclined groove 72 is a right trapezoid, but may have other shapes, and a length of the inclined groove extends to cover a position required by the test probe. The bottom 721 of the chute 72 is vertically connected with a row of guide holes 73, and the chute 72 is provided with an embedded block 74. The embedded block 74 is similar to the chute 72 in shape and size, can be completely embedded into the chute 72, has four side walls attached to the walls of the chute 72, and can be connected with the chute by interference fit or fixed in the chute 72 by glue or the like. A row of connecting holes 741 corresponding to the guide holes 73 one by one are formed in the insertion block 74, each connecting hole 741 is coaxial with its corresponding guide hole 73, and one end of the connecting hole 741 offset from the guide holes 73 communicates with a kidney-shaped slot 742 formed in the insertion block 74.

As shown in fig. 7, the connection hole 741 is used for connecting a test probe, and the connection hole 741 may be a through hole having a diameter corresponding to that of the probe main body 10, and preferably, the diameter of the connection hole 741 is slightly larger than that of the probe main body 10, so that the probe main body 10 can be effectively inserted into the connection hole 741. Of course, the probe body 10 may also be connected with the connection hole 741 in an interference fit manner; or the connection hole 741 may be a screw hole, and an external thread is formed at the outside of the probe body 10 to be screw-coupled.

As shown in fig. 7, each of the test probes passes through the connection hole 741 of the insertion block 74 and then extends into the guide hole 73 corresponding to the connection hole 741 and extends to the outside of the guide hole 73, and in order to avoid interference of the test probe by the lower left corner region of the fixing base 71, the lower left corner of the fixing base 71 is processed into a chamfered structure 712, so that more leakage portions of the test probe can be obtained, and the whole probe assembly can have a larger moving stroke.

During the integral assembly, as shown in fig. 8, the inclined groove 72 may be filled with glue 75 to position the embedded block 74 and the fixing seat 71 and position the test probe and the embedded block 74, so as to ensure the stability of the integral structure, and the waist-shaped groove 742 on the embedded block 74 may facilitate the glue to enter between the connection hole and the probe body 10.

In order to accurately and rapidly keep the beveling plane 30 of the testing probe in a parallel state with the horizontal plane, as shown in fig. 8, the testing probe fixing jig 70 further includes a holding plate 76 connected with the fixed seat 71, the holding plate 76 is fixed on the top of the fixed seat 71, the holding plate 76 is formed with a positioning hole 77 perpendicular thereto, that is, the positioning hole 77 is perpendicular to the upper and lower surfaces of the holding plate 76, the positioning hole 77 faces the notch of the inclined groove 72, each positioning hole 77 corresponds to a guiding hole 73 in position and the extending direction thereof forms an obtuse angle, and the specific included angle between each positioning hole 77 and the extending direction of one guiding hole 73 is consistent with the included angle between the first part 11 and the second part 12 of the probe body 10. Therefore, when assembling, the first part 11 of each probe body 10 extends into the guide hole 73, and the second part 12 extends into the positioning hole 77, so that the probe body 10 can only keep the state that the beveling plane 30 faces downwards and is parallel to the horizontal plane through the positional relationship between the guide hole 73 and the positioning hole 77, thereby rapidly realizing the assembling, and ensuring that the parallelism tolerance of the chip plane 50 and the standard plane is within 0.02mm, wherein the standard plane can be determined according to the placing state of the chip module to be assembled by the probe assembly, for example, the chip module is placed horizontally, the standard plane can be the horizontal plane, and the chip module is placed vertically, the standard plane is the vertical plane perpendicular to the horizontal plane. Of course, the holding plate 76 can also hold the test probes in the corresponding state without positional deviation.

In addition, in an embodiment, as shown in fig. 9, the positioning holes 77 are two rows, and the two rows of positioning holes are distributed in a staggered manner, each positioning hole 77 is provided with a test probe, and the length of the first portion 11 of the test probe 101 in the positioning hole 771 on the front side is smaller than the length of the first portion 11 of the test probe 102 in the positioning hole 772 on the rear side, so that the lengths of all the test probes extending out of the fixing base 1 can be effectively ensured to be consistent, and the beveling plane 30 can be kept flush.

When the test probe 130 and the test probe fixing jig 120 are assembled into a whole, the following method may be specifically adopted to implement the method, including the following steps:

when the optical chip module test probe assembly is assembled, the method comprises the following steps:

s1, a set of test probes 130 of the above-described embodiment are obtained by precision machining process.

Then, preassembling a group of test probes with the embedded block and the fixing base, and positioning the test probes through the probe precise positioning seat, which may specifically include:

s2, as shown in fig. 10, a set of test probes 130 is inserted into the connection holes 741 of the insertion block 74 and the insertion block 74 is inserted into the inclined groove 72 of the fixing base 71, so that each test probe 130 extends out of the front end of its corresponding guide hole 73.

S3, as shown in fig. 10, the fixing base 71 is placed on the probe precision positioning seat 80 for positioning, specifically, a connection hole 86 corresponding to the assembly hole 713 on the fixing base 71 is formed on the probe precision positioning seat 80, and the fixing base 71 is fixed on the probe precision positioning seat 80 by a connection method such as screwing. At this time, the bottom surface of the fixed seat 71 is attached to the supporting surface 81 of the probe fine positioning seat 80, meanwhile, the tip of the test probe 130 on the fixed seat 71 abuts against the vertex angle 83 of the triangular positioning groove 82 of the probe predetermined seat 80, the chamfered plane 30 of the test probe is attached to the positioning plane 84 of the triangular positioning groove 82, and the positioning plane 84 is flush with the supporting surface 81.

In addition, as shown in fig. 10 and 11, an observation window 85 is further formed on the probe precision positioning seat 80, the observation window 85 extends perpendicularly and inwardly from the bottom surface 89 of the probe precision positioning seat 80 to the positioning plane 84 and is opposite to the top corner 83, and the length of the observation window 85 is enough to cover all the test probes, so that the positioning precision of the test probes can be determined through the observation window, for example, the spacing between the test probes, the flatness of the chamfer plane, and the position precision of the test end of each probe in the X, Y, Z direction can be determined.

Of course, the sequence numbers of S2-S3 are not the only limitation to the specific operation sequence, and for example, the fixing base 71 may be placed on the probe precisely positioning base 80, and then the insert with the test probe may be placed in the fixing base 71, or the test probe may be placed in the fixing base 71 and then inserted into the probe.

And S4, after the test probe is positioned to meet the requirement, for example, when the position precision of the test end of the test probe in the X, Y, Z direction is controlled within 0.01mm, the positioning meets the requirement, glue is poured into the inclined groove for shaping, and the glue can be various adhesive with viscosity and solidifiable, such as epoxy glue, UV glue and the like.

And S5, after the probe body is fixed by glue, as shown in FIG. 10, the part of the probe body 10 extending above the fixed seat is driven by the bending push block 90 to bend to form the second part 12 of the probe body perpendicular to the top of the fixed seat 71.

The bending pushing block 90 can be designed as required, as shown in fig. 12, for example, a group of insertion holes or grooves 91 having the same extending direction as the un-bent probe body 10 is formed on the bending pushing block 90, the insertion holes or grooves 91 extend vertically inwards from an inclined plane 92 on the bending pushing block 90, an included angle b between the inclined plane 92 and the top surface of the fixing base 71 is the complementary angle of an included angle c between the un-bent probe body 10 and the top surface of the fixing base 71, and the inclined plane 92 is connected to a bottom surface 93 of the bending pushing block 90 parallel to the top surface 711 of the fixing base 71.

Of course, in other embodiments, as shown in fig. 10, the bending pushing block 90 may also be matched with a limiting block 87 to achieve a predetermined bending angle, for example, the limiting block 87 is formed on the probe precise positioning seat 80, the limiting block 87 has a limiting plane 88 located above the top surface of the fixing seat 71 and located at a position to be bent by the probe main body, and when the limiting plane 88 is attached to the bending portion of the probe main body, the bending portion is bent to a corresponding shape. Meanwhile, the limiting block 87 can be matched with the supporting surface 81 to limit the positioning seat 71.

S6, after bending, removing the probe positioning seat 80, placing the holding plate 76 on top of the fixing seat 71 and inserting the second part 12 of each probe body 10 into one positioning hole 77 of the holding plate 76, and then fixing the holding plate 76 and the fixing seat 71 by screwing, clipping, etc. so as to maintain the state of the probe by the holding plate 76 and avoid the probe from deviating, as shown in fig. 8.

The assembling method is simple in process and easy to realize, can realize and maintain higher positioning precision and structural stability, and is beneficial to long-time test and use.

The upper module 100 and/or the lower module 300 may be closed and opened in an automatic manner or a manual manner at the time of an actual chip test. When implemented in an automatic manner, the upper module 100 and/or the lower module 300 are connected to a moving mechanism that drives them to move relatively; the upper module 100 is movable, the position of the lower module 300 is fixed as an example, as shown in fig. 1, the base 110 of the upper module 100 is connected to a machine table pressing portal plate 140 located above the base, the machine table pressing portal plate 140 covers the test PCB 120, the pressing portal plate 140 is connected to a lifting mechanism (not shown in the figure) for driving the pressing portal plate to lift, and the lifting mechanism can be, for example, an air cylinder or an electric cylinder, which can generate linear movement, so that automatic testing can be performed through a numerical control machine. The lower module 300 is connected to the stage mounting plate 500 to be fixed in position.

When the manual mode is adopted, one sides of the upper module 100 and the lower module 300 can be hinged, so that the upper module 100 is manually turned to rotate relative to the lower module 300, the test is carried out when the upper module 100 and the lower module are closed, the test is stopped when the upper module and the lower module are opened, and the chip to be tested can be replaced. Here, the corresponding hinge structure may refer to a structure disclosed in a prior patent application No. 201220192127.4 filed by the applicant, and the upper module 100 and the lower module 300 may have the locking structure disclosed in the above patent as well.

As shown in fig. 1 and fig. 3, the lower module 300 includes a supporting platform 360 connected to the platform mounting plate 500, at least one mounting hole 361 is formed on the supporting platform 360, preferably, the mounting holes 361 are distributed in a row at equal intervals, a chip placing seat 301 is disposed in each mounting hole 361, and the chip placing seat 301 is movably disposed on the supporting platform 360 along an axis thereof.

As shown in fig. 3, the chip placing seat 301 includes a column 3011 embedded in the mounting hole 361 and a connecting plate 3012 connected to the supporting platform 360, a through hole 3013 connected to the supporting platform 360 is formed on the connecting plate 3012, a screw hole corresponding to each through hole 3013 is formed on the supporting platform 360, the supporting platform 360 is connected to the supporting platform 360 through a set of bolts passing through the through holes 3013 and screwed into the screw holes, and parameters such as levelness and height of the chip placing seat 301 can be finely adjusted by adjusting mounting heights of the bolts at different positions, so that the axial (Z direction) position of the chip placing seat 301 can be accurately adjusted.

Of course, in other embodiments, as shown in fig. 13, a set of guide posts 370 corresponding to the through holes 3013 of the connection plates 3012 may be vertically disposed at the bottom of the support platform 360, the lower side wall or the entire side wall of the guide posts 370 is formed with an external thread, the external thread is screwed with a nut 380 located below the connection plate 3012, and the height of the chip placing seat 301 can be adjusted by adjusting the height of each nut 380.

The top surface of the chip placement seat 301 is exposed outside the top surface of the supporting platform 360, and the top surface thereof is formed with a chip placement groove 302, the shape of the chip placement groove 302 can be adaptively designed according to the external contour of the chip to be tested, for example, as shown in fig. 14, it includes a square main groove 3021, the four vertex angles of the square main groove 3021 are respectively engaged with a large semicircular gap 3022, each side of the square main groove 3021 is respectively engaged with a U-shaped groove 3023, the chip placement seat 301 is formed with a mounting space 303 facing the chip placement groove 302 and communicating with the groove bottom of the chip placement groove 302, the mounting space 303 can be a straight hole or a straight groove coaxial with the chip placement seat 301, L ENS304 is translatably arranged in the mounting space 303, the L ENS304 is coaxial with the chip placement groove 302, and fine adjustment of the horizontal position thereof is achieved by translation of the L ENS304, so that the precision of the optical center and the lens center of the chip to be tested can be adjusted to be within 0.01 mm.

As shown in fig. 3, the L ENS304 is disposed on the lens frame 305, the mounting space 303 is disposed with a support surface (not shown) for supporting the lens frame 305, and the lens frame 305 may be supported by a fine adjustment mechanism, wherein the side wall of the lens frame 305 has a gap with the inner wall of the mounting space 303 and is connected to and drives the fine adjustment mechanism to move horizontally, the fine adjustment mechanism includes a first fine adjustment mechanism 310 for driving the lens frame 305 to move along the first direction X and/or a second fine adjustment mechanism 320 for driving the lens frame 305 to move along the second direction Y, and of course, in the embodiment, the first fine adjustment mechanism 310 may drive the lens frame 305 to move along the second direction Y and the second fine adjustment mechanism 320 may drive the lens frame 305 to move along the first direction X.

As shown in fig. 15, the first fine adjustment mechanism 310 includes a first elastic member 311 and a first adjustment member 312, the first elastic member 311 is mounted in a through hole or a slot 3014 formed on the chip holder 301 and extending in the first direction X (up-down direction), and when a hole is formed on the chip holder 301, a plug (not shown) is further provided at an outer end of the hole. The first elastic element 311 may be any object with elastic deformation capability, for example, it may be a spring, a leaf spring, a rubber body, or a combination of an elastic body and a block, a sphere, or a cylinder.

One end of the first elastic member 311 is fixed or abutted on the groove bottom of the groove or the inner end surface of the stopper so as to be defined, and the other end thereof extends into the mounting space 303 and abuts or is fixed with the side wall of the lens frame 305.

As shown in fig. 15, the first adjustment member 312 and the first elastic member 311 apply a pressure F2 to the lens frame 305 opposite to the pressure F1 applied by the elastic member to the lens frame 305, so that the two cooperate to hold the lens frame 305. One end of the first adjusting member 312 abuts against the other side of the lens frame 305 with respect to the first elastic member 311, and is disposed on the chip mount 301 in a position-adjustable manner. That is, the chip seat 301 is formed with a mounting hole 3015 coaxial with the through hole or slot 3014, the mounting hole 3015 is preferably a screw hole, and the first adjusting member 312 is preferably a screw rod passing through the through hole 3601 on the mounting platform 360 and the chip seat 301 and extending into the mounting space 303 to abut against the sidewall of the lens holder 305. The outer end surface of the lens holder 305 is formed with a non-circular driving groove 313, such as an inner hexagonal groove, a spline shape, a straight groove, a cross groove, etc., so that the length of the first adjusting member 312 inserted into the mounting space 303 of the chip holder 301 can be adjusted by inserting a corresponding tool into the driving groove and driving the first adjusting member to rotate, so that the first elastic member 311 in a compressed state can have a deformation space to adjust the elastic force thereof, and the lens holder 305 can move under the action of the deformation elastic force of the first elastic member 311 to realize the position adjustment in the first direction X.

As shown in fig. 15, the second fine adjustment mechanism 320 includes a second elastic element 321 and a second adjustment element 322, and the structures of the second elastic element 321 and the second adjustment element 322 may be the same as the structure of the first fine adjustment mechanism 310, which is not described herein, at this time, the extending direction of the second adjustment element 322 of the second fine adjustment mechanism 320 is perpendicular to the extending direction of the first adjustment element 312.

Of course, the structure of the second fine adjustment mechanism 320 may be different from the structure of the first fine adjustment mechanism 310, and especially when a multi-cavity structure (a plurality of chip placing seats are arranged side by side, for example, they are arranged along the second direction) is adopted, since the left and right sides of the chip placing seat 301 located at the middle position are shielded by other chip placing seats 301, so that the outer end of the second adjustment member 322 on them cannot be exposed to the outside, and at this time, the adjustment of the second adjustment member 322 cannot be performed by a tool, at least one end of the second adjustment member 322 needs to be located at the same side or the opposite side as the exposed end of the first adjustment member 312.

Accordingly, as shown in fig. 15, the extending direction of the second adjuster 322 of the second fine adjustment mechanism 320 is the same as the extending direction of the first adjuster 312, and at least one end of the second adjuster 322 is formed with a driving groove 324 close to the first adjuster 312 and exposed, and the chip holder 301 and the supporting base 360 are respectively formed with through

holes

3016 and 3602 for the second adjuster 322 to pass through.

The second adjusting member 322 is rotatably mounted (mounted on two bearings, preferably on the supporting platform 360) on the chip holder 301, and when the second adjusting member 322 rotates, different positions of an eccentric body 303 are driven to contact with the sidewall of the lens holder 305, so that the elastic force of the second elastic member 321 is adjusted to drive the lens holder 305 to move. The eccentric member 303 may be an eccentric cam coaxially fixed on the second adjusting member 322, or the eccentric member 303 may be an eccentric wheel or eccentric rod disposed on a rotatable turbine 324, the turbine 324 is driven to rotate when the second adjusting member 322 rotates, the turbine rotates to drive the sheet wheel or eccentric rod to rotate, and the lens holder 305 may be driven to rotate and perform the position adjustment in the second direction Y.

Furthermore, because the COM and QFP chips are light, especially the COM chips are light, position deviation is easy to occur, or the situation that the chips are not placed in place during testing occurs, a position error is likely to be caused, and the testing probe cannot be accurately contacted with the pin.

Therefore, as shown in fig. 13 and 14, a set of airflow channels 330 is formed on the chip placing seat 301, the airflow channels 330 are uniformly distributed around the installation space 303, one end of each airflow channel 330 is located at the bottom of the chip placing groove 302, and the other end of each airflow channel 330 is located at the bottom of the chip placing seat 301, so that external vacuum pumping equipment can be connected, a negative pressure is formed at the bottom of the groove, a chip to be tested can be fixed in the chip placing groove before testing, the occurrence of problems such as position deviation or improper placement is avoided, and the position precision is favorably ensured.

As shown in fig. 3, the light source 340 facing the chip placement groove 302 is disposed in the mounting space 303, the light source 340 may be various devices capable of emitting light, such as an L ED lamp panel, the centering accuracy between the light source center of the light source 340 and the lens of the L ENS304 is within 0.01mm, a light equalizing device 350 is disposed between the light source 340 and the L ENS304, the light equalizing device 350 is preferably two layers of light equalizing

plates

351 and 352, where the L ED lamp panel and the light equalizing plate are known technologies, and their mounting positions and mounting manners in the mounting hole 303 are not innovative points of the present invention and will not be described herein.

The invention has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the invention.

Claims

1. The optical chip module testing device comprises an upper module (100) and a lower module (300) which are matched, wherein the upper module comprises a testing probe, the lower module (300) comprises a chip placing seat (301), and a chip placing groove (302) is formed in the chip placing seat (301), and the optical chip module testing device is characterized in that an installation space (303) which is opposite to the chip placing groove (302) and communicated with the groove bottom of the chip placing groove (302) is formed in the chip placing seat (301), and L ENS (304) is arranged in the installation space (303) in a translation mode.

2. The optical chip module testing device according to claim 1, wherein: the upper die set (100) and/or the lower die set (300) are connected with a moving mechanism for driving the upper die set and/or the lower die set to move relatively;

or one side of the upper module and one side of the lower module (300) are hinged.

3. The optical chip module testing device according to claim 1, wherein: the test probe comprises a probe body, wherein a test end of the probe body is obliquely cut to form an oblique cutting plane, and the area of the oblique cutting plane is larger than that of the end surface of the test end of the probe body before cutting.

4. The optical chip module testing device according to claim 3, wherein: the test probe is fixed on the test probe fixing jig and is electrically connected with the test PCB, and the test PCB is fixed on the test probe fixing jig.

5. The optical chip module testing device according to claim 4, wherein: the fixture is fixed to test probe includes the fixing base, be formed with a chute on the fixing base, the tank bottom intercommunication of chute is one row along the guiding hole that the chute depth direction extends, be provided with the embedding piece in the chute, test probe sets up on the embedding piece and every test probe passes one the guiding hole.

6. The optical chip module testing device according to claim 5, wherein: and glue for coating the embedded block is filled in the chute.

7. The optical chip module testing device according to claim 5, wherein: the test probe fixing jig also comprises a retaining plate, wherein the retaining plate is arranged on the fixed seat and is provided with a group of positioning holes which are opposite to the notch of the chute and vertical to the beveling plane, and one positioning hole corresponds to one guide hole; the probe body further includes a second portion that extends into the locating hole.

8. The optical chip module testing device according to any one of claims 1-7, wherein said L ENS (304) is disposed on a lens holder (305), said lens holder (305) is connected to a fine adjustment mechanism for driving the lens holder (305) to move horizontally, said fine adjustment mechanism comprises a first fine adjustment mechanism and/or a second fine adjustment mechanism for driving said lens holder (305) to move along a first direction X and/or a second direction Y.

9. The optical chip module testing device according to claim 8, wherein: the first fine adjustment mechanism comprises a first elastic piece (311) and a first adjusting piece (312), wherein the first elastic piece (311) and the first adjusting piece (312) apply opposite pressure to two opposite sides of the lens frame (305), and the first adjusting piece (312) can move back and forth along the extending direction of the first adjusting piece to adjust the elastic force of the first elastic piece (311).

10. The optical chip module testing device according to claim 8, wherein: the second fine adjustment mechanism comprises a second elastic piece (321) and a second adjusting piece (322) which apply opposite pressure to two opposite sides of the lens frame (305),

the second adjusting piece (322) can move back and forth along the extending direction of the second adjusting piece to adjust the elastic force of the second elastic piece (321);

or the second adjusting piece (322) can rotate in place and drive different parts of an eccentric body (323) to be in contact with the lens frame (305) so as to adjust the elastic force of the second elastic piece (321).

11. The optical chip module testing device according to claim 8, wherein: the chip placing seat (301) is movably arranged on the support table along the axial direction thereof.

12. The optical chip module testing device according to claim 8, wherein: a group of airflow channels (330) which are uniformly distributed around the installation space (303) and one end of which is positioned at the bottom of the chip placing groove (302) are formed on the chip placing seat (301).

13. The optical chip module testing device according to claim 8, wherein a light source (340) facing said chip placement groove (302) is disposed in said mounting space (303), and a light equalizing device (350) is disposed between said light source (340) and L ENS (304).