CN111398791A - Test probe, optical chip module test probe assembly, probe assembly assembling method and optical chip module test device - Google Patents

Abstract

The invention discloses a test probe, an optical chip module test probe assembly, a probe assembly assembling method and an optical chip module test device, wherein the test probe comprises a probe main body, a test end of the probe main body is obliquely cut to form an oblique cutting plane, and the area of the oblique cutting plane is larger than that of the end face of the test end of the probe main body before cutting. This scheme simple structure, the test probe need not spring isotructure, the size reduces greatly, can satisfy the operation requirement of little pin step, through with the oblique cutting plane that the formation area is greater than its terminal surface area in the probe main part, for prior art, can increase area of contact effectively, widen the position tolerance scope between test probe and the pin, and simultaneously, be favorable to reducing test equipment's the whole processing and the equipment degree of difficulty, can be under conventional processing and equipment precision condition, reduce the production of the condition of opening a way, improve the reliability and the stability of test.

Description

Test probe, optical chip module test probe assembly, probe assembly assembling method and optical chip module test device

Technical Field

The invention relates to the field of chip testing equipment, in particular to a testing probe, an optical chip module testing probe assembly, a probe assembly assembling method and an optical chip module testing device.

Background

The COM/QFP optical chip module is a module consisting of a light sensing chip and a related frame structure, which is produced along with circuit integration and optical integration, wherein circuit signals are led out by adopting tinned copper wires or gold wires and the like, and the step pitch between the tinned copper wires/the gold wires is designed to be smaller and smaller, and reaches about 0.2mm at present.

In the process of processing a COM/QFP optical chip module, a chip performance test needs to be performed through a special test fixture, and during the test, electrical connection is realized by contacting test probes with pins of the chip module, the diameter of the pins of the chip module is basically within 0.05mm at present, even the pins of a plurality of chips are within 0.03mm, and meanwhile, the size of the test probes is not too large due to the fact that the distance between the pins is about 0.2mm, and various existing test probes are generally integrated with elastic pieces such as springs in order to have certain telescopic performance so as to avoid hard contact, for example, the test probes disclosed in application numbers 201780069227.3 and 201080067768.0, so that the structure of the test probes is complex and the size of the test probes is large.

Some test probes are straight or polygonal special-shaped rhenium tungsten needles, and the test ends of the test probes are generally arranged in a spherical shape or a needle shape as shown in the patent, so that the contact area between the contact length of the test probes and the chip pins is small, the tolerance range between the test probes and the chip pins or the PAD is required to be about 0.02mm for effective contact, however, due to the existence of various processing and assembling tolerances, the test probes and the chip pins can not be effectively contacted, and the open circuit probability is high.

And other probes are special-shaped elastic sheets, and the probes are easy to deform in the using process, so that the probes cannot be accurately positioned.

Meanwhile, the requirements of the existing test probe structure on the machining and assembling precision of other structures are greatly improved, and the machining and assembling difficulty is increased.

Disclosure of Invention

The present invention is directed to solving the above-mentioned problems of the prior art, and provides a test probe, an optical chip module test probe assembly, a probe assembly assembling method, and an optical chip module testing apparatus.

The purpose of the invention is realized by the following technical scheme:

the test probe comprises a probe body, wherein a test end of the probe body is obliquely cut to form an oblique cutting plane, and the area of the oblique cutting plane is larger than that of the end surface of the test end of the probe body before cutting.

Preferably, in the test probe, the probe body is linear, curved or folded.

Preferably, in the test probe, the probe body includes a first portion and a second portion arranged at an obtuse angle, and the second portion is perpendicular to the chamfer plane.

Preferably, in the test probe, the probe body is beryllium bronze.

Preferably, in the test probe, the diameter of the probe body is between 0.1 and 0.2 mm.

Preferably, in the test probe, the oblique cutting plane passes through or does not pass through the corresponding end face of the probe body before being cut, the oblique cutting plane passes through or does not pass through the end face of the test end of the probe body before being cut, and an included angle between the oblique cutting plane and the end face of the probe body before being cut is 60-70 degrees.

The optical chip module test probe assembly comprises a test probe fixing jig, wherein a group of test probes extending out of the test probe fixing jig are arranged on the test probe fixing jig, each test probe comprises a probe main body, the extending test end of the probe main body forms a beveling plane, and the area of the beveling plane is larger than that of the end face of the test end of the probe main body before cutting.

Preferably, among the optical chip module test probe subassembly, the fixed tool of test probe includes the fixing base, be formed with a chute on the fixing base, the tank bottom intercommunication of chute is one row of guiding hole that extends along the chute depth direction, be provided with the embedding piece in the chute, the test probe sets up on the embedding piece and every test probe passes one the guiding hole.

Preferably, in the optical chip module test probe assembly, the chute is filled with glue.

Preferably, in the optical chip module test probe assembly, the test probe fixing jig further includes a holding plate connected to the fixing base, the holding plate is formed with a positioning hole perpendicular thereto and facing the notch of the chute, each positioning hole corresponds to a guide hole in position and the extending direction thereof forms an obtuse angle, each probe body has a portion extending into the guide hole and the positioning hole, and the portion extending into the positioning hole is perpendicular to the chamfering plane.

Preferably, in the optical chip module test probe assembly, the positioning holes are arranged in two rows, and the two rows of positioning holes are distributed in a staggered manner.

Preferably, in the optical chip module test probe assembly, a parallelism tolerance of the chamfered plane of the probe body and the standard plane is within a range of 0.02 mm.

Preferably, in the optical chip module test probe assembly, the probe body is cylindrical beryllium bronze.

Preferably, in the optical chip module test probe assembly, the chamfer plane is an ellipse.

The assembling method of the optical chip module test probe assembly comprises the following steps:

processing to obtain a set of test probes according to any one of claims 1 to 6;

preassembling a group of test probes with the embedded block and the fixed seat and positioning the test probes through the probe precise positioning seat;

after the test probe is positioned to meet the requirement, pouring glue into the chute of the fixed seat to carry out structural shaping;

after the glue is fixed, bending the part of the driving probe main body extending out of the upper part of the fixed seat to be vertical to the top of the fixed seat;

and removing the probe accurate positioning seat, and fixing the optical chip module testing device by the holding plate and the fixing seat, wherein the optical chip module testing probe testing device comprises any optical chip module testing probe assembly.

The technical scheme of the invention has the advantages that:

this scheme simple structure, the test probe need not spring isotructure, the size reduces greatly, can satisfy the operation requirement of little pin step, through with the oblique cutting plane that the formation area is greater than its terminal surface area in the probe main part, for prior art, can increase area of contact effectively, widen the position tolerance scope between test probe and the pin, and simultaneously, be favorable to reducing test equipment's the whole processing and the equipment degree of difficulty, can be under conventional processing and equipment precision condition, reduce the production of the condition of opening a way, improve the reliability and the stability of test.

The two parts of the probe main body of this scheme become the obtuse angle setting, location and spacing when can effectively cooperate the tool structure to install, further make the second portion perpendicular with the plane of beveling, can with limit structure on the tool, realize fast, accurately that the plane of beveling keeps the parallel state with the horizontal plane and the range of depth of parallelism tolerance control at 0.02mm, greatly reduced the equipment degree of difficulty, improved the position accuracy of probe simultaneously, be favorable to improving the stability of test.

This scheme adopts beryllium bronze as the probe material for the probe main part has very high hardness, elastic limit, fatigue limit, wearability and electric conductivity, thereby make the test need not the spring also to have certain deformation degree of freedom, be favorable to simplifying the structure of test probe, reduce size, can avoid the probe to appear crooked in the test procedure effectively simultaneously, the scheduling problem warp, the life and the service reliability of test probe have been improved, indefinite elasticity value with the probe is set for the restriction, can not damage the fragile optical chip module that detects, especially avoid causing the pin to warp.

The diameter of the probe main body can effectively meet the requirement of a small step distance of 0.2mm between pins of a chip module, the area of a beveling plane is increased as much as possible, the contradiction between the small step distance and a large contact area is effectively coordinated, the position tolerance between the probe main body and the chip pins is increased to 0.06mm from the existing 0.02mm, and the contact reliability is greatly improved.

The probe fixing jig has the advantages that the structure is simple, the probe main body can be effectively positioned by adopting the embedding block and the limiting hole, the holding plate is combined, the assembling difficulty is low, the probe fixing jig is easy to realize, and the position precision is high.

The assembly structure is solidified by combining a glue pouring process, so that the stability of the whole structure can be improved, and errors caused by movement and deformation of the probe main body are avoided. In addition, the whole structure of the jig can disperse the stress of the probe main body, so that the pressure applied to the probe main body during testing is mainly borne by the leakage part of the probe main body and the probe fixing jig, and little force is transmitted to the testing PCB connected with the testing probe, so that the testing PCB can be effectively protected, the damage of the testing PCB is avoided, and the requirement for testing the PCB can be reduced.

According to the scheme, the installation space corresponding to the chip placing groove is formed on the chip placing seat, and L ENS with the position adjustable is arranged in the installation space, so that the horizontal position of L ENS can be flexibly adjusted according to the test requirement, the centering precision of the lens center and the chip optical center is guaranteed to be within 0.01mm, the error interference is favorably reduced, and the precision of the test result is improved.

The fine adjustment mechanism of the scheme creates a feasible condition for L ENS adjustment of the multi-hole test structure by enabling the extending directions of the first adjusting piece and the second adjusting piece to be parallel, and is simple in structure and easy to realize.

The chip placing seat is adjusted in mounting height through a group of bolts or nuts, and the height of the optical chip module can be flexibly and conveniently adjusted, so that the Z-direction distance precision between the optical chip module and the test probe is ensured, and the test probe is reliably contacted with a pin of the optical chip module.

This scheme is formed with evenly distributed's airflow channel and is connected the evacuation equipment through the tank bottom at the chip standing groove, can adsorb the optical chip module through vacuum adsorption fixedly, avoids shifting, has improved the stability and the reliability of test effectively.

The whole testing device can be used for manual testing and can also be matched with a machine tool for automatic testing, the service life of the device is long, and the requirement of 100-ten-thousand IC testing can be met.

Drawings

FIG. 1 is a perspective view of a test probe of the present invention with portions cut away in phantom;

FIG. 2 is a schematic illustration of the cutting pattern of the test probe of the present invention;

FIG. 3 is a front view of the test probe of the present invention;

FIG. 4 is a schematic view of a first embodiment of a probe assembly of the present invention;

FIG. 5 is a schematic view of a second embodiment of a probe assembly of the present invention;

FIG. 6 is a top view of the probe assembly of the present invention with the probe body partially positioned in the mounting base;

FIG. 7 is a schematic view illustrating the assembly of the probing module on the probe fine positioning seat according to the present invention;

FIG. 8 is a bottom plan view of the probe pinpoint locating base of the present invention;

FIG. 9 is a schematic structural view of probe bending by a bending push block in the present invention;

FIG. 10 is a front cross-sectional view of a testing device of the present invention;

FIG. 11 is a cross-sectional end view of the testing apparatus of the present invention (showing the machine platen down-pressing gantry plate and the machine platen plate hidden);

FIG. 12 is an enlarged view of area A of FIG. 10;

FIG. 13 is a cross-sectional view of the chip holder of the present invention;

FIG. 14 is a top view of the chip holder of the present invention;

fig. 15 is a top view of the fine adjustment mechanism of the present invention.

Detailed Description

Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. The embodiments are merely exemplary for applying the technical solutions of the present invention, and any technical solution formed by replacing or converting the equivalent thereof falls within the scope of the present invention claimed.

In the description of the schemes, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the embodiment, the operator is used as a reference, and the direction close to the operator is a proximal end, and the direction away from the operator is a distal end.

The test probe disclosed in the present invention is described with reference to the accompanying drawings, as shown in fig. 1, which includes a probe body 10, wherein the probe body 10 may be made of various known materials with conductive properties, such as various metals, specifically gold, copper, etc., and in a preferred manner, the probe body may be made of a conductive material with certain elasticity, such as beryllium bronze.

As shown in fig. 1, the probe body 10 may have various shapes, for example, the cross-sectional shape may be circular, oval, polygonal, especially positive multiple, and in this embodiment, the cross-sectional shape of the trunk region of the probe body 10 is exemplified as circular.

In order to increase the contact area of the testing end of the probe body 10, as shown in fig. 1, a chamfer plane 30 is formed at the testing end of the probe body 10 in a chamfer manner, and the area of the chamfer plane 30 is larger than that of the end surface 50 before the testing end is cut. Here, "beveling" means cutting from one side 601 of a test probe material 60 having a circular cross section to the other side 602 of the test probe material at or opposite to the end face 50 along the cutting lines 20, 40 by using various cutting methods available in the art, such as laser cutting, wire saw cutting, plasma cutting, etc., as shown in fig. 2, so as to obtain an oval bevel plane 30, wherein the flatness tolerance of the bevel plane 30 is within 0.02 mm. The cutting angles of the cutting lines 20, 40 can be designed according to different requirements, preferably, the cutting lines cut the chamfer plane 30 to form an included angle with the end face 50 of 60-70 degrees, preferably about 65 degrees, and preferably, the cutting lines 20 are used for cutting, and the area of the chamfer plane obtained by cutting is an optimal value.

The area of the chamfer plane 30 of the probe body 10 is determined by the cutting angle and the cross-sectional area of the cylindrical material, and the design of specific parameters can be performed through a large number of reliability experiments according to the size of the pins of the chip to be tested and the step distance between the pins. In this embodiment, the diameter of the trunk region (the diameter of the cylindrical material) of the probe body 10 is between 0.1 mm and 0.2mm, and more preferably between 0.15 ± 0.02mm, so as to effectively satisfy the requirement of small step distance between pins of the chip module, and at the same time, increase the area of the bevel plane 30 as much as possible to increase the contactable area, and effectively coordinate the contradiction between the small step distance and the large contact area, so that the position tolerance between the probe body and the chip pins is increased from the existing 0.02mm to 0.06mm, and the contact stability is greatly improved.

As shown in fig. 1, while the probe body 10 may be a straight needle, in which case the fixing difficulty of the straight needle on the jig is relatively large, in an alternative embodiment, the probe body 10 may also be a curved line or a broken line, for example, it is entirely L-shaped or V-shaped, and more preferably, as shown in fig. 1 and fig. 3, it has a first portion 11 and a second portion 12, the included angle a between the first portion 11 and the second portion 12 is an obtuse angle, preferably between 105 and 120 °, and more preferably about 115 °, and the extending direction of the second portion 12 is preferably perpendicular to the chamfer plane 30.

The first portion 11 and the second portion 12 may be connected by an arc-shaped engaging portion 13, and the first portion 11, the second portion 12 and the third portion 13 may be integrally formed (for example, integrally injection-molded or formed by bending a cylinder), or they may be assembled into a whole, for example, they may be assembled into a whole by welding, or by screwing, or by interference fit.

In another embodiment of the present invention, an optical chip module test probe assembly is disclosed, as shown in fig. 4, including a test probe fixing jig 70, a set of test probes extending to the outside of the test probe fixing jig 70 is disposed on the test probe fixing jig 70, each of the test probes includes a probe main body 10, the extended test end of the probe main body 10 is formed as a beveled plane 30, the area of the beveled plane 30 is greater than the area of the end surface before cutting, that is, a set of test probes of the above embodiments is disposed on the test probe fixing jig 70.

The test probes may be disposed on the test probe fixing jig 70 according to the distribution of pins of the chip to be tested, and preferably, the test probes are disposed in rows.

Specifically, as shown in fig. 4, the test probe fixing jig 70 includes a fixing seat 71, where the fixing seat 71 may have various feasible shapes, and in this embodiment, it is preferably a square, and a tilted groove 72 extending from a top surface 711 of the fixing seat to a top corner of a lower left side of the fixing seat is formed on the fixing seat 71, and a longitudinal section of the tilted groove 72 is a right trapezoid, but may have other shapes, and a length of the tilted groove extends to cover a position required by the test probe. The bottom 721 of the chute 72 communicates with a row of guide holes 73 extending in the depth direction of the chute, and the chute 72 is provided with an insertion block 74. The embedded block 74 is similar to the chute 72 in shape and size, can be completely embedded into the chute 72, has four side walls attached to the walls of the chute 72, and can be connected with the chute by interference fit or fixed in the chute 72 by glue or the like. A row of connecting holes 741 corresponding to the guide holes 73 one by one are formed in the insertion block 74, each connecting hole 741 is coaxial with its corresponding guide hole 73, and one end of the connecting hole 741 offset from the guide holes 73 communicates with a kidney-shaped slot 742 formed in the insertion block 74.

As shown in fig. 4, the connection hole 741 is used for connecting a test probe, and the connection hole 741 may be a through hole having a diameter corresponding to that of the probe main body 10, and preferably, the diameter of the connection hole 741 is slightly larger than that of the probe main body 10, so that the probe main body 10 can be effectively inserted into the connection hole 741. Of course, the probe body 10 may also be connected with the connection hole 741 in an interference fit manner; or the connection hole 741 may be a screw hole, and an external thread is formed at the outside of the probe body 10 to be screw-coupled.

As shown in fig. 4, each of the test probes passes through the connection hole 741 of the insertion block 74 and then extends into the guide hole 73 corresponding to the connection hole 741 and extends to the outside of the guide hole 73, and in order to avoid interference of the test probe by the lower left corner region of the fixing base 71, the lower left corner of the fixing base 71 is processed into a chamfered structure 712, so that more leakage portions of the test probes can be obtained, and the whole probe assembly can have a larger moving stroke.

During the integral assembly, as shown in fig. 5, the inclined groove 72 may be filled with glue 75 to position the embedded block 74 and the fixing seat 71 and position the test probe and the embedded block 74, so as to ensure the stability of the integral structure, and the waist-shaped groove 742 on the embedded block 74 may facilitate the glue to enter between the connection hole and the probe body 10.

In order to accurately and rapidly keep the beveling plane 30 of the testing probe in a parallel state with the horizontal plane, as shown in fig. 5, the testing probe fixing jig 70 further includes a holding plate 76 connected with the fixing seat 71, the holding plate 76 is fixed on the top of the fixing seat 71, the holding plate 76 is formed with a positioning hole 77 perpendicular thereto, that is, the positioning hole 77 is perpendicular to the upper and lower surfaces of the holding plate 76, the positioning hole 77 faces the notch of the inclined groove 72, each positioning hole 77 corresponds to a guiding hole 73 in position and the extending direction thereof forms an obtuse angle, and the specific included angle between each positioning hole 77 and the extending direction of one guiding hole 73 is consistent with the included angle between the first part 11 and the second part 12 of the probe body 10. Therefore, when assembling, the first part 11 of each probe body 10 extends into the guide hole 73, and the second part 12 extends into the positioning hole 77, so that the probe body 10 can only keep the state that the beveling plane 30 faces downwards and is parallel to the horizontal plane through the positional relationship between the guide hole 73 and the positioning hole 77, thereby rapidly realizing the assembling, and ensuring that the parallelism tolerance of the chip plane 50 and the standard plane is within 0.02mm, wherein the standard plane can be determined according to the placing state of the chip module to be assembled by the probe assembly, for example, the chip module is placed horizontally, the standard plane can be the horizontal plane, and the chip module is placed vertically, the standard plane is the vertical plane perpendicular to the horizontal plane. Of course, the holding plate 76 can also hold the test probes in the corresponding state without positional deviation.

In addition, in an embodiment, as shown in fig. 6, the positioning holes 77 are two rows, and the two rows of positioning holes are distributed in a staggered manner, each positioning hole 77 is provided with a test probe, and the length of the first portion 11 of the test probe 101 in the positioning hole 771 on the front side is smaller than the length of the first portion 11 of the test probe 102 in the positioning hole 772 on the rear side, so that the lengths of all the test probes extending out of the fixing base 1 can be effectively ensured to be consistent, and the beveling plane 30 can be kept flush.

When the optical chip module test probe assembly is assembled, the method comprises the following steps:

s1, a set of test probes 130 of the above-described embodiment are obtained by precision machining process.

Then, preassembling a group of test probes with the embedded block and the fixing base, and positioning the test probes through the probe precise positioning seat, which may specifically include:

s2, as shown in fig. 7, a set of test probes 130 is inserted into the connection holes 741 of the insertion block 74 and the insertion block 74 is inserted into the inclined groove 72 of the fixing base 71, so that each test probe 130 extends out of the front end of its corresponding guide hole 73.

S3, as shown in fig. 7, the fixing base 71 is placed on the probe precision positioning seat 80 for positioning, specifically, a connection hole 86 corresponding to the assembly hole 713 on the fixing base 71 is formed on the probe precision positioning seat 80, and the fixing base 71 is fixed on the probe precision positioning seat 80 by a connection method such as screwing. At this time, the bottom surface of the fixing seat 71 is attached to the supporting surface 81 of the precise probe positioning seat 80, meanwhile, the tip of the test probe 130 on the fixing seat 71 abuts against the vertex angle 83 of the triangular positioning groove 82 of the precise probe positioning seat 80, the beveled plane 30 of the test probe is attached to the positioning plane 84 of the triangular positioning groove 82, and the positioning plane 84 is flush with the supporting surface 81.

In addition, as shown in fig. 7 and 8, an observation window 85 is further formed on the probe precision positioning seat 80, the observation window 85 extends from the bottom surface 89 of the probe precision positioning seat 80 to the positioning plane 84 and faces the top corner 83, and the length of the observation window 85 is enough to cover all the test probes, so that the positioning precision of the test probes can be determined through the observation window, for example, the spacing between the test probes, the flatness of the beveling plane, and the position precision of the testing end of each probe in the X, Y, Z direction can be determined.

Of course, the sequence numbers of S2-S3 are not the only limitation to the specific operation sequence, and for example, the fixing base 71 may be placed on the probe precisely positioning base 80, and then the insert with the test probe may be placed in the fixing base 71, or the test probe may be placed in the fixing base 71 and then inserted into the probe.

And S4, after the test probe is positioned to meet the requirement, for example, when the position precision of the test end of the test probe in the X, Y, Z direction is controlled within 0.01mm, the positioning meets the requirement, glue is poured into the inclined groove for shaping, and the glue can be various adhesive with viscosity and solidifiable, such as epoxy glue, UV glue and the like.

And S5, after the probe body is fixed by glue, as shown in FIG. 7, the part of the probe body 10 extending above the fixed seat is driven by the bending push block 90 to bend to form the second part 12 of the probe body perpendicular to the top of the fixed seat 71.

The bending pushing block 90 can be designed as required, as shown in fig. 9, for example, a group of insertion holes or grooves 91 having the same extending direction as the un-bent probe body 10 is formed on the bending pushing block 90, the insertion holes or grooves 91 extend vertically inwards from an inclined plane 92 on the bending pushing block 90, an included angle b between the inclined plane 92 and the top surface of the fixing base 71 is the complementary angle of an included angle c between the un-bent probe body 10 and the top surface of the fixing base 71, and the inclined plane 92 is connected with a bottom surface 93 of the bending pushing block 90 parallel to the top surface 711 of the fixing base 71.

Of course, in other embodiments, as shown in fig. 7, the bending pushing block 90 may also be matched with a limiting block 87 to achieve a predetermined bending angle, for example, the limiting block 87 is formed on the probe precise positioning seat 80, the limiting block 87 has a limiting plane 88 located above the top surface of the fixing seat 71 and located at a position to be bent by the probe main body, and when the limiting plane 88 is attached to the bending portion of the probe main body, the bending portion is bent to a corresponding shape. Meanwhile, the limiting block 87 can be matched with the supporting surface 81 to limit the positioning seat 71.

S6, after bending, removing the probe positioning seat 80, placing the holding plate 76 on top of the fixing seat 71 and inserting the second part 12 of each probe body 10 into one positioning hole 77 of the holding plate 76, and then fixing the holding plate 76 and the fixing seat 71 by screwing, clipping, etc. so as to maintain the state of the probe by the holding plate 76 and avoid the probe from deviating, as shown in fig. 5.

The assembling method is simple in process and easy to realize, can realize and maintain higher positioning precision and structural stability, and is beneficial to long-time test and use.

In another embodiment of the present invention, as shown in fig. 10-12, an optical chip module testing apparatus is disclosed, which includes an upper module 100 and a lower module 300 that are matched with each other, where the upper module 100 includes a testing probe, the lower module 300 includes a chip placing seat 301, a chip placing groove 302 is formed on the chip placing seat 301, when in operation, a chip 900 to be tested is placed in the chip placing groove 302, the testing probe is connected to a corresponding testing circuit board, and the testing probe on the upper module 100 is in contact with a pin on the chip to be tested through manual or automatic equipment to realize electrical connection, so as to perform a corresponding test.

In an embodiment, as shown in fig. 11 and 12, the upper module 100 includes a base 110, a bottom of the base 110 is formed with a limited space (not shown), a test PCB 120 is fixed in the limited space, an outer contour of the test PCB 120 has a portion identical to the limited space, and a portion protruding outside the base 110, and a bottom surface of the test PCB 120 is lower than a bottom surface 112 of the base 110.

The test PCB 120 is formed with a corresponding test circuit, which is a known technology and is not an innovative point of the present invention, and is not described herein again. As shown in fig. 11 and 12, the test PCB 120 is connected to the test probes 130, the test probes 130 are matched according to the number and positions of the pins of the chip 900 to be tested, for example, the test probes 130 for measuring each chip to be tested are arranged in two rows, the two rows of test probes 130 are arranged in a mirror symmetry manner, each row of test probes 130 is fixed on a test probe fixing jig 70, and the test probe fixing jig 70 is fixed on the test PCB 120, that is, the optical chip module testing apparatus includes the optical chip module test probe assembly according to the above embodiment, and the probe assemblies are preferably arranged in two and mirror symmetry manners, and the test probes on the probe assemblies are arranged oppositely, so that the test of the two rows of pins of the chip module can be performed at one time.

The upper module 100 and/or the lower module 300 may be closed and opened in an automatic manner or a manual manner at the time of actual testing. When implemented in an automatic manner, the upper module 100 and/or the lower module 300 are connected to a moving mechanism that drives them to move relatively; the upper module 100 is movable, the position of the lower module 300 is fixed as an example, as shown in fig. 10, the base 110 of the upper module 100 is connected to a machine table pressing portal plate 140 located above the base, the machine table pressing portal plate 140 covers the test PCB 120, the pressing portal plate 140 is connected to a lifting mechanism (not shown in the figure) for driving the pressing portal plate to lift, and the lifting mechanism can be, for example, an air cylinder or an electric cylinder, which can generate linear movement, so that automatic testing can be performed through a numerical control machine. The lower module 300 is connected to the stage mounting plate 500 to be fixed in position.

When the manual mode is adopted, one sides of the upper module 100 and the lower module 300 can be hinged, so that the upper module 100 is manually turned to rotate relative to the lower module 300, the test is carried out when the upper module 100 and the lower module are closed, the test is stopped when the upper module and the lower module are opened, and the chip to be tested can be replaced. Here, the corresponding hinge structure may refer to a structure disclosed in a prior patent application No. 201220192127.4 filed by the applicant, and the upper module 100 and the lower module 300 may have the locking structure disclosed in the above patent as well.

As shown in fig. 10 and 12, the lower module 300 includes a supporting platform 360 connected to the platform board 500, at least one mounting hole 361 is formed on the supporting platform 360, preferably, the mounting holes 361 are distributed in a row at equal intervals, a chip holder 301 is disposed in each mounting hole 361, and the chip holder 301 is movably disposed on the supporting platform 360 along an axis thereof.

As shown in fig. 12, the chip placing seat 301 includes a column 3011 embedded in the mounting hole 361 and a connecting plate 3012 connected to the supporting platform 360, through holes 3013 connected to the supporting platform 360 are formed in the connecting plate 3012, screw holes corresponding to each through hole 3013 are formed in the supporting platform 360, the supporting platform 360 is connected to the supporting platform 360 through a set of bolts passing through the through holes 3013 and screwed into the screw holes, and parameters such as levelness and height of the chip placing seat 301 can be finely adjusted by adjusting mounting heights of the bolts at different positions, so that the axial (Z direction) position of the chip placing seat 301 can be accurately adjusted.

Of course, in other embodiments, as shown in fig. 13, a set of guide posts 370 corresponding to the through holes 3013 of the connection plates 3012 may be vertically disposed at the bottom of the support platform 360, the lower side wall or the entire side wall of the guide posts 370 is formed with an external thread, the external thread is screwed with a nut 380 located below the connection plate 3012, and the height of the chip placing seat 301 can be adjusted by adjusting the height of each nut 380.

The top surface of the chip placement seat 301 is exposed outside the top surface of the supporting platform 360, and the top surface thereof is formed with a chip placement groove 302, the shape of the chip placement groove 302 can be adaptively designed according to the external contour of the chip to be tested, for example, as shown in fig. 14, it includes a square main groove 3021, the four vertex angles of the square main groove 3021 are respectively engaged with a large semicircular gap 3022, each side of the square main groove 3021 is respectively engaged with a U-shaped groove 3023, the chip placement seat 301 is formed with a mounting space 303 facing the chip placement groove 302 and communicating with the groove bottom of the chip placement groove 302, the mounting space 303 can be a straight hole or a straight groove coaxial with the chip placement seat 301, L ENS304 is translatably arranged in the mounting space 303, the L ENS304 is coaxial with the chip placement groove 302, and fine adjustment of the horizontal position thereof is achieved by translation of the L ENS304, so that the precision of the optical center and the lens center of the chip to be tested can be adjusted to be within 0.01 mm.

As shown in fig. 12, the L ENS304 is disposed on the lens frame 305, the mounting space 303 is disposed with a support surface (not shown) for supporting the lens frame 305, and the lens frame 305 may be supported by a fine adjustment mechanism, wherein the side wall of the lens frame 305 has a gap with the inner wall of the mounting space 303 and is connected to and drives the fine adjustment mechanism to move horizontally, the fine adjustment mechanism includes a first fine adjustment mechanism 310 for driving the lens frame 305 to move along the first direction X and/or a second fine adjustment mechanism 320 for driving the lens frame 305 to move along the second direction Y, and of course, in the embodiment, the first fine adjustment mechanism 310 may drive the lens frame 305 to move along the second direction Y and the second fine adjustment mechanism 320 may drive the lens frame 305 to move along the first direction X.

As shown in fig. 15, the first fine adjustment mechanism 310 includes a first elastic member 311 and a first adjustment member 312, the first elastic member 311 is mounted in a through hole or a slot 3014 formed on the chip holder 301 and extending in the first direction X (up-down direction), and when a hole is formed on the chip holder 301, a plug (not shown) is further provided at an outer end of the hole. The first elastic element 311 may be any object with elastic deformation capability, for example, it may be a spring, a leaf spring, a rubber body, or a combination of an elastic body and a block, a sphere, or a cylinder.

One end of the first elastic member 311 is fixed or abutted on the groove bottom of the groove or the inner end surface of the stopper so as to be defined, and the other end thereof extends into the mounting space 303 and abuts or is fixed with the side wall of the lens frame 305.

As shown in fig. 15, the first adjustment member 312 and the first elastic member 311 apply a pressure F2 to the lens frame 305 opposite to the pressure F1 applied by the elastic member to the lens frame 305, so that the two cooperate to hold the lens frame 305. One end of the first adjusting member 312 abuts against the other side of the lens frame 305 with respect to the first elastic member 311, and is disposed on the chip mount 301 in a position-adjustable manner. That is, the chip seat 301 is formed with a mounting hole 3015 coaxial with the through hole or slot 3014, the mounting hole 3015 is preferably a screw hole, and the first adjusting member 312 is preferably a screw rod passing through the through hole 3601 on the mounting platform 360 and the chip seat 301 and extending into the mounting space 303 to abut against the sidewall of the lens holder 305. The outer end surface of the lens holder 305 is formed with a non-circular driving groove 313, such as an inner hexagonal groove, a spline shape, a straight groove, a cross groove, etc., so that the length of the first adjusting member 312 inserted into the mounting space 303 of the chip holder 301 can be adjusted by inserting a corresponding tool into the driving groove and driving the first adjusting member to rotate, so that the first elastic member 311 in a compressed state can have a deformation space to adjust the elastic force thereof, and the lens holder 305 can move under the action of the deformation elastic force of the first elastic member 311 to realize the position adjustment in the first direction X.

As shown in fig. 15, the second fine adjustment mechanism 320 includes a second elastic element 321 and a second adjustment element 322, and the structures of the second elastic element 321 and the second adjustment element 322 may be the same as the structure of the first fine adjustment mechanism 310, which is not described herein, at this time, the extending direction of the second adjustment element 322 of the second fine adjustment mechanism 320 is perpendicular to the extending direction of the first adjustment element 312.

Of course, the structure of the second fine adjustment mechanism 320 may be different from the structure of the first fine adjustment mechanism 310, and especially when a multi-cavity structure (a plurality of chip placing seats are arranged side by side, for example, they are arranged along the second direction) is adopted, since the left and right sides of the chip placing seat 301 located at the middle position are shielded by other chip placing seats 301, so that the outer end of the second adjustment member 322 on them cannot be exposed to the outside, and at this time, the adjustment of the second adjustment member 322 cannot be performed by a tool, at least one end of the second adjustment member 322 needs to be located at the same side or the opposite side as the exposed end of the first adjustment member 312.

Accordingly, as shown in fig. 15, the extending direction of the second adjuster 322 of the second fine adjustment mechanism 320 is the same as the extending direction of the first adjuster 312, and at least one end of the second adjuster 322 is formed with a driving groove 324 close to the first adjuster 312 and exposed, and the chip holder 301 and the supporting base 360 are respectively formed with through holes 3016 and 3602 for the second adjuster 322 to pass through.

The second adjusting member 322 is rotatably mounted (mounted on two bearings, preferably on the supporting platform 360) on the chip holder 301, and when the second adjusting member 322 rotates, different positions of an eccentric body 303 are driven to contact with the sidewall of the lens holder 305, so that the elastic force of the second elastic member 321 is adjusted to drive the lens holder 305 to move. The eccentric member 303 may be an eccentric cam coaxially fixed on the second adjusting member 322, or the eccentric member 303 may be an eccentric wheel or eccentric rod disposed on a rotatable turbine 324, the turbine 324 is driven to rotate when the second adjusting member 322 rotates, the turbine rotates to drive the sheet wheel or eccentric rod to rotate, and the lens holder 305 may be driven to rotate and perform the position adjustment in the second direction Y.

Furthermore, because the COM and QFP chips are light, especially the COM chips are light, position deviation is easy to occur, or the situation that the chips are not placed in place during testing occurs, a position error is likely to be caused, and the testing probe cannot be accurately contacted with the pin.

Therefore, as shown in fig. 13 and 14, a set of airflow channels 330 is formed on the chip placing seat 301, the airflow channels 330 are uniformly distributed around the installation space 303, one end of each airflow channel 330 is located at the bottom of the chip placing groove 302, and the other end of each airflow channel 330 is located at the bottom of the chip placing seat 301, so that external vacuum pumping equipment can be connected, a negative pressure is formed at the bottom of the groove, a chip to be tested can be fixed in the chip placing groove before testing, the occurrence of problems such as position deviation or improper placement is avoided, and the position precision is favorably ensured.

As shown in fig. 12, the light source 340 facing the chip placement groove 302 is disposed in the mounting space 303, the light source 340 may be various devices capable of emitting light, such as an L ED lamp panel, the centering accuracy between the light source center of the light source 340 and the lens of the L ENS304 is within 0.01mm, a light equalizing device 350 is disposed between the light source 340 and the L ENS304, the light equalizing device 350 is preferably two layers of light equalizing plates 351 and 352, where the L ED lamp panel and the light equalizing plate are known technologies, and their mounting positions and mounting manners in the mounting hole 303 are not innovative points of the present invention and will not be described herein.

The invention has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the invention.

Claims (15)

1. A test probe characterized by: the probe comprises a probe body, wherein a test end of the probe body is obliquely cut to form an oblique cutting plane, and the area of the oblique cutting plane is larger than that of the end surface of the test end of the probe body before cutting.

2. The test probe of claim 1, wherein: the probe body is linear, curved or broken line-shaped.

3. The test probe of claim 1, wherein: the probe body comprises a first part and a second part which are arranged at an obtuse angle, and the second part is perpendicular to the beveling plane.

4. The test probe of claim 1, wherein: the probe body is beryllium bronze.

5. The test probe of claim 1, wherein: the diameter of the probe body is between 0.1 and 0.2 mm.

6. The test probe of any one of claims 1 to 5, wherein: the inclined cutting plane passes through or does not pass through the end face of the probe body before the test end is not cut, and the included angle between the inclined cutting plane and the end face of the probe body before the test end is not cut is 60-70 degrees.

7. Optical chip module test probe subassembly, its characterized in that: the test probe fixing jig is provided with a group of test probes extending out of the test probe fixing jig, each test probe comprises a probe main body, a test end of the probe main body is provided with a beveling plane, and the area of the beveling plane is larger than that of the end face of the test end of the probe main body before cutting.

8. The optical chip module test probe assembly of claim 7, wherein: the fixture is fixed to test probe includes the fixing base, be formed with a chute on the fixing base, the tank bottom intercommunication of chute is one row along the guiding hole that the chute depth direction extends, be provided with the embedding piece in the chute, test probe sets up on the embedding piece and every test probe passes one the guiding hole.

9. The optical chip module test probe assembly of claim 8, wherein: glue is filled in the chute.

10. The optical chip module test probe assembly of claim 8, wherein: the test probe fixing jig further comprises a retaining plate connected with the fixed seat, positioning holes perpendicular to the retaining plate and facing the notch of the chute are formed in the retaining plate, each positioning hole corresponds to one guide hole in position, the extending direction of each positioning hole and the corresponding guide hole form an obtuse angle, each probe body is provided with a part extending into the guide hole and the corresponding positioning hole, and the part extending into the positioning hole is perpendicular to the beveling plane.

11. The optical chip module test probe assembly of claim 10, wherein: the positioning holes are arranged in two rows, and the two rows of positioning holes are distributed in a staggered mode.

12. The optical chip module test probe assembly of any one of claims 7-10, wherein: the parallelism tolerance of the beveling plane and the standard plane of the probe main body is within 0.02 mm.

13. The optical chip module test probe assembly of any one of claims 7-10, wherein: the probe body is cylindrical beryllium bronze.

14. The method for assembling the optical chip module test probe assembly is characterized in that: the method comprises the following steps:

processing to obtain a set of test probes according to any one of claims 1 to 6;

preassembling a group of test probes with the embedded block and the fixed seat and positioning the test probes through the probe precise positioning seat;

after the test probe is positioned to meet the requirement, pouring glue into the chute of the fixed seat to carry out structural shaping;

after the glue is fixed, bending the part of the driving probe main body extending out of the upper part of the fixed seat to be vertical to the top of the fixed seat;

and removing the probe accurate positioning seat and fixing the retaining plate and the fixing seat.

15. Optical chip module testing arrangement, its characterized in that: a test probe assembly comprising the optical chip module of any one of claims 7-13.

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