CN117015169A - Horizontal alignment device and method for tile type radio frequency assembly electrical interconnection structure - Google Patents
Horizontal alignment device and method for tile type radio frequency assembly electrical interconnection structure Download PDFInfo
- Publication number
- CN117015169A CN117015169A CN202310895800.3A CN202310895800A CN117015169A CN 117015169 A CN117015169 A CN 117015169A CN 202310895800 A CN202310895800 A CN 202310895800A CN 117015169 A CN117015169 A CN 117015169A
- Authority
- CN
- China
- Prior art keywords
- positioning
- aligned
- radio frequency
- upper substrate
- horizontal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 238000003825 pressing Methods 0.000 claims description 35
- 230000006835 compression Effects 0.000 claims description 24
- 238000007906 compression Methods 0.000 claims description 24
- 230000000712 assembly Effects 0.000 claims description 12
- 238000000429 assembly Methods 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 12
- 230000000903 blocking effect Effects 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 5
- 238000012545 processing Methods 0.000 description 10
- 210000004209 hair Anatomy 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 206010047531 Visual acuity reduced Diseases 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1424—Card cages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention relates to alignment treatment of an electrical interconnection structure of a radio frequency assembly, in particular to a horizontal alignment device and a horizontal alignment method of the electrical interconnection structure of a tile type radio frequency assembly, wherein the horizontal alignment device comprises a base for placing a part to be aligned, the base accommodates the part to be aligned through a positioning cavity, and a positioning plate is arranged at the positioning cavity; the base on be provided with a plurality of level and support tight subassembly to and a plurality of level adjustment subassembly, still set up a plurality of and be used for compressing tightly the compressing tightly subassembly of waiting to aim at the part. According to the invention, the packaging box body is simulated through the base, so that the alignment between the cover plate and the upper substrate of the tile type component to be aligned is consistent with the actual assembly state, and the alignment precision is high; in the horizontal alignment process, the operation logic is clear, the observation is convenient, the X, Y and the rotation angle around the Z axis can be adjusted only by 3 degrees of freedom, and the efficiency is high; through the regulation to horizontal tight subassembly and compressing tightly the subassembly, the pressure of upper base plate is used in the control, avoids the operation process to bring the damage.
Description
Technical Field
The invention relates to alignment treatment of an electrical interconnection structure of a radio frequency assembly, in particular to a horizontal alignment device and method of the electrical interconnection structure of the tile type radio frequency assembly.
Background
With the continuous improvement of the performance and the installation and deployment requirements of electronic devices such as radars and communications, the integration and the lightening and thinning of the electronic devices have become the development trend, and the radio frequency assembly is gradually developed from two-dimensional planar integration to three-dimensional stereoscopic integration. Due to advantages in terms of integration density and low profile, tile-type radio frequency components are increasingly being used in place of brick-type radio frequency components in electronic devices.
The tile-type radio frequency assembly has the following characteristics:
(1) The planar dimensions of the antenna need to be matched with the aperture of the antenna, so that the area of a single-layer circuit is limited. In order to meet the requirements of more functions and performance improvement, a multi-layer circuit stacking layout is generally required, and vertical interconnection structures are arranged among circuits to ensure the electrical communication of the circuits;
(2) In order to improve the environmental adaptability and reliability, the radio frequency assembly needs to be hermetically packaged, so that a bare chip in the assembly is isolated from the external environment, and the bare chip is prevented from being polluted or corroded by harmful gas;
(3) In order to reduce the thickness of the radio frequency component to the maximum extent, meet the requirements of power supply, control and radio frequency transmission at the same time, improve the convenience of disassembly and assembly of the radio frequency component from equipment, and generally adopt elastic contact connectors such as button hairs and the like to realize the electrical interconnection of the radio frequency component and a radio frequency motherboard.
Patent CN202110239036.5 discloses an integration method of a three-dimensional tile type TR assembly using hair buttons, wherein an upper substrate and a lower substrate are arranged in a packaging box body of the TR assembly, and electric interconnection is realized between the upper substrate and the lower substrate by using the hair buttons. The upper substrate is welded with the cover plate into a whole, and then the whole is subjected to laser seal welding with the packaging box body, so that the airtight packaging of the TR component is realized. The electrical interconnection of the TR assembly with the external radio frequency motherboard is also typically implemented using button bristles. Thus, the upper substrate is precisely aligned with both the inner buttons and the outer buttons. The alignment of the upper substrate and the cover plate is a key step, and the adopted method is to use the side lines of the upper substrate and the cover plate as the reference, manually adjust the relative positions of the upper substrate and the cover plate, and weld the upper substrate and the cover plate into a whole after the relative positions are basically aligned. The method has low production efficiency, poor alignment precision, incapability of ensuring consistency and lower yield. The situation that the electric signals cannot be communicated due to inaccurate alignment often occurs, so that the cost is increased, and the product quality is reduced.
Therefore, the existing radio frequency assembly electrical interconnection horizontal alignment scheme still has the problem to be solved, optimization is carried out to improve alignment precision, and the problems of low production efficiency, high cost and low product quality are solved. Therefore, a more reasonable technical scheme is required to be provided, and the technical problems in the prior art are solved.
Disclosure of Invention
At least to overcome the defects mentioned in one of the above, the invention provides a horizontal alignment method and a device for an electrical interconnection structure of a tile-type radio frequency assembly, which are used for carrying out adjustment alignment on horizontal positions of components to be aligned through an adjustment structure of the device, ensuring alignment precision and maintaining alignment state, and are simple and quick to operate without damaging the components to be aligned.
In order to achieve the above object, the alignment device disclosed by the invention can adopt the following technical scheme:
the horizontal alignment device of the tile type radio frequency assembly electrical interconnection structure comprises a base for placing a component to be aligned, wherein the base accommodates the component to be aligned through a positioning cavity, and a positioning plate is arranged at the positioning cavity; the base is provided with a plurality of horizontal propping assemblies for elastically propping the parts to be aligned along the X direction and the Y direction, a plurality of horizontal adjusting assemblies for adjusting the parts to be aligned and keeping alignment along the X direction and the Y direction, and a plurality of compressing assemblies for compressing the parts to be aligned.
According to the horizontal alignment device disclosed by the invention, the base is used as an alignment coordination center, the part to be aligned, which is required to be aligned, is arranged at the positioning cavity, the horizontal abutting component elastically abuts against the part in the X-Y directions, and meanwhile, the horizontal adjusting component is used for adjusting the part in the X-Y directions, so that the alignment of the upper substrate with the upper and lower structures is realized after the upper substrate is moved and adjusted.
Further, the structure of the positioning cavity is the same as the structure of the packaging box body of the component to be aligned, and the effect of arranging the cover plate in the positioning cavity is the same as that of arranging the cover plate in the packaging box body, so that the component to be aligned can be finally and accurately placed in the packaging box body after the positioning cavity is used for position alignment; the positioning of the cover plate in the positioning cavity can be achieved by adopting various schemes, particularly but not exclusively limited, and one of the possible options is optimized and proposed here: the positioning cavity is provided with a positioning structure which is matched with the component to be aligned, and the positioning structure at least comprises two positioning parts. When the scheme is adopted, the two positioning parts can be symmetrically arranged in the positioning cavity so as to position the positioning plate better, and in some schemes, more positioning parts can be arranged. Meanwhile, the positioning structure can adopt a structure of matching the positioning pin with the positioning hole.
Furthermore, the horizontal abutting component is used for abutting the parts to be aligned, dynamic abutting during horizontal adjustment is simultaneously met, the structure of the horizontal abutting component can be constructed in various forms, the structure is not limited solely, and the horizontal abutting component is optimized and one of the possible choices is provided: the horizontal abutting assembly comprises a connecting part fixedly matched with the base, an ejector pin piece is arranged in the connecting part in a telescopic manner, an abutting elastic piece which applies elastic force to the ejector pin piece is further arranged in the connecting part, the abutting elastic piece applies elastic force to the ejector pin piece and enables the front end of the ejector pin piece to extend out of the front port of the connecting part, the ejector pin piece supports and abuts against a component to be aligned, and the rear end of the ejector pin piece extends out of the rear port of the connecting part and is provided with a limiting blocking piece. When the scheme is adopted, the connecting part forms a cylindrical structure to accommodate the thimble piece, the front end of the thimble piece can be constructed into a spherical surface so as to be convenient for contact and apply force to the component to be aligned, and damage to the component to be aligned caused by overlarge pressure applied to the surface of the component to be aligned is reduced. The limiting blocking piece can adopt structures such as a blocking piece and a blocking head, and the outer diameter of the limiting blocking piece is larger than the inner diameter of the cylindrical structure of the connecting part, so that the thimble piece can be prevented from falling off from the connecting part.
Furthermore, in the invention, the horizontal position of the component to be aligned is pushed and adjusted through the horizontal adjusting component, so that the alignment of the upper substrate in the component to be aligned is realized, and the accuracy of processing is finally ensured; the leveling assembly can be constructed in a variety of configurations, particularly but not exclusively, optimized and one possible option presented herein: the horizontal adjusting assembly comprises an adjusting rod, the adjusting rod is rotationally matched with an adjusting seat and rotationally pushes the part to be aligned to move along the X direction or the Y direction, and an adjusting head for holding operation is further arranged on the adjusting rod. When the scheme is adopted, the adjusting rod and the adjusting seat can be in threaded fit, and the adjusting rod axially approaches or is far away from the part to be aligned in the rotating process. In order to improve the accuracy of adjustment, fine threads may be provided, and an indication scale may be provided on the adjustment lever to indicate the amount of feed.
Further, in the present invention, the component to be aligned is compressed from the longitudinal direction by the compressing assembly, in order to improve the convenience of compressing operation and ensure the compressing effect, various compressing assembly structures may be adopted, and the structure is optimized and one of the possible choices is proposed herein: the pressing component comprises a rotating shaft connected to the base, the rotating shaft drives a pressing sleeve to synchronously deflect, a pressing rod and a pressing elastic piece applying elasticity to the pressing rod are arranged in the pressing sleeve, the front end of the pressing rod is pressed by the pressing elastic piece and extends out of the lower port of the pressing sleeve, the rear end of the pressing rod extends out of the upper port of the pressing sleeve, and a limiting anti-falling piece is arranged at the rear end of the pressing rod. When the scheme is adopted, the limiting anti-falling piece can adopt structures such as an anti-falling block and an anti-falling head, and the outer diameter of the limiting anti-falling piece is larger than the inner diameter of the compression sleeve, so that the compression rod is prevented from falling off from the compression sleeve.
Still further, the solutions that can be used when setting the shaft are not limited only, but are optimized and one of the possible choices is presented here: the base on be provided with the mounting hole that is used for installing the pivot, still be provided with the fixed orifices that is used for accepting the depression bar, when compressing tightly the subassembly and waiting to aim at the part cooperation, rotate the pivot and make the front end and the fixed orifices cooperation of depression bar. When the scheme is adopted, the bearing can be arranged in the mounting hole and used for being connected with the rotating shaft, so that the rotating shaft can rotate, the pressing reliability of the pressing assembly to the parts to be aligned can be improved, and the damping bearing can be adopted, so that the rotating shaft can deflect to a set angle and then can maintain the deflection angle.
Further, the radio frequency assembly generally comprises a closed box body, wherein a lower substrate, a button, an upper substrate and a cover plate are arranged in the closed box body from bottom to top, and the upper substrate is connected with the lower substrate through the button; because the requirements of positioning alignment connection of the upper substrate, the lower substrate and the cover plate and airtight connection requirements of the cover plate and the closed box body are met, the upper substrate and the cover plate are usually connected in advance to form an integral structure, and the cover plate and the upper substrate are independently detached for early alignment operation and optimized to provide the following structure convenient for positioning: the component to be aligned comprises a cover plate and an upper substrate which are arranged from bottom to top, an annular limiting baffle is arranged on the outer side of the upper substrate in a surrounding mode, a plurality of positioning pads are arranged on the upper substrate, a plurality of first positioning holes corresponding to the positioning pads are arranged on the positioning plate, a plurality of second positioning holes corresponding to the positioning pads are arranged in the accommodating cavity, and when the component to be aligned is aligned in the positioning cavity, the first positioning holes and the second positioning holes are aligned with the positioning pads. When adopting such scheme, set up the apron in the below of upper base plate to set up the locating plate in the top of upper base plate, adopted the structure of inversion, can improve the convenience when carrying out location alignment and follow-up processing connection through this kind of setting.
Further, in the present invention, after the alignment of the component to be aligned is completed, the base and the component to be aligned are integrally formed, the base assists the fixing of the component to be aligned and performs the subsequent butt-joint processing of the component to be aligned, and after the processing is completed, the component after the alignment processing is detached from the base, where optimization is performed and one of possible choices is proposed: the positioning cavity is internally provided with a plurality of dismounting holes, and the dismounting holes are used for dismounting the aligned components from the positioning cavity after alignment. When adopting this scheme, the quantity of dismantling the hole can be set up to a plurality of to distribute the arrangement on the base according to dismantling the demand.
The above disclosure discloses the structure of the horizontal alignment device, and the invention also provides a horizontal alignment method, which is described below.
A method for horizontally aligning an electrical interconnection structure of a tile-type radio frequency assembly, which adopts the horizontal alignment device mentioned in the above description, comprises the following steps:
setting a part to be aligned in the positioning cavity, wherein a welding lug is arranged between the cover plate and the upper substrate, and the limit baffle plate surrounds the periphery of the upper substrate;
setting a positioning plate and enabling the positioning plate to be matched with a positioning structure of the base;
observing the alignment condition of the positioning pad of the upper substrate and the first positioning hole of the positioning plate, and adjusting the position of the upper substrate through a horizontal adjusting assembly to realize alignment;
through observing the alignment condition of the locating bonding pad of the upper substrate and the second locating hole of the base, the alignment adjustment is completed when the locating bonding pad is aligned with the first locating hole and the second locating hole, and the upper substrate structure is wrong when the locating bonding pad cannot be aligned.
The alignment method can be used for adjusting the upper substrate in the horizontal direction, so that the upper substrate and the positioning plate are aligned, and simultaneously, the upper substrate can be aligned with the cover plate due to the position limitation of the upper substrate by the limiting baffle and the position limitation of the cover plate by the accommodating cavity, so that the alignment of the upper substrate and the cover plate is realized as a whole.
Further, after the alignment adjustment of the upper substrate is completed, a pressing assembly is arranged to press the positioning plate, and the whole alignment device and the aligned parts are integrally transferred into welding equipment for welding; and disassembling the parts subjected to alignment processing through the disassembly holes after welding.
Compared with the prior art, the technical scheme disclosed by the invention has the following partial beneficial effects:
1) According to the invention, the packaging box body of the tile-type radio frequency component is simulated by the base of the horizontal alignment device, so that the alignment between the cover plate and the upper substrate of the tile-type radio frequency component is ensured to be consistent with the actual assembly state, the alignment precision is high, and the yield is increased to more than 95% from less than 50% before.
2) In the horizontal alignment process, the operation logic is clear, the observation is convenient, the X, Y and the adjustment of the rotation angle around the Z axis can be completed only by 3 degrees of freedom, and the time for completing 1 time of alignment is shortened from about 5 minutes to 1-2 minutes.
3) The invention can control the pressure applied to the upper substrate (generally a ceramic substrate) by adjusting the spring force of the spring assembly and the vertical compression assembly, thereby avoiding damage caused by overlarge pressure in the operation process.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a tile-type RF assembly;
FIG. 2 is a cross-sectional view of a tile-type radio frequency assembly;
FIG. 3 is a schematic diagram of a horizontal alignment device of an electrical interconnect structure (including a bottom-up hierarchical schematic);
FIG. 4 is a schematic view of the electrical interconnect structure in a substrate hold down state;
FIG. 5 is a schematic view of the electrical interconnect structure in a relaxed state with the device substrate horizontally aligned;
FIG. 6 is an exploded view of a stacked portion of the electrical interconnect structure horizontal alignment device;
FIG. 7 is a schematic top view of the base;
FIG. 8 is an exploded view of the horizontal thrust assembly;
FIG. 9 is a schematic cross-sectional view of the compression assembly;
fig. 10 is a schematic view of the structure of the horizontal adjustment assembly.
In the above figures, the meaning of each reference numeral is:
1. a radio frequency assembly; 11. packaging the box body; 12. a lower substrate; 13. an upper substrate; 131. positioning a bonding pad; 14. a cover plate; 15. a button hair; 2. a base; 21. a positioning cavity; 22. a positioning pin; 23. a mounting hole; 24. a fixing hole; 25. disassembling the hole; 26. a second positioning hole; 3. a positioning plate; 31. a first positioning hole; 32. a first pin hole; 4. a level adjustment assembly; 41. an adjusting seat; 42. adjusting the head; 5. a horizontal abutment assembly; 51. a connection part; 52. abutting against the elastic piece; 53. a thimble member; 54. a limit stop; 6. a compression assembly; 61. a rotating shaft; 62. a compression bar; 63. compressing the elastic piece; 64. a limiting anti-falling piece; 7. a limit baffle; 71. and a second pin hole.
Detailed Description
The invention is further illustrated by the following description of specific embodiments in conjunction with the accompanying drawings.
Aiming at the conditions that the alignment operation of the radio frequency assembly is complex, the operation efficiency is low, the yield of products is affected and the production cost is not beneficial to reduction in the prior art, the following embodiments are optimized to improve the defects in the prior art.
Example 1
As shown in fig. 3 to 6, the present embodiment provides a horizontal alignment device of an electrical interconnection structure of a tile-type radio frequency assembly, which includes a base 2 for placing a component to be aligned, the base 2 accommodates the component to be aligned through a positioning cavity 21, and a positioning plate 3 is disposed at the positioning cavity 21; the base 2 is provided with a plurality of horizontal propping assemblies 5 for elastically propping the components to be aligned along the X direction and the Y direction, a plurality of horizontal adjusting assemblies 4 for adjusting the components to be aligned and keeping alignment along the X direction and the Y direction, and a plurality of compressing assemblies 6 for compressing the components to be aligned.
Preferably, in the present embodiment, two horizontal abutment assemblies 5 are provided in both the X-direction and the Y-direction; two horizontal adjusting components 4 are arranged in the X direction, and one horizontal adjusting component 4 is arranged in the Y direction; while the base 2 is provided with four hold-down assemblies 6 uniformly distributed at four orientations of the parts to be aligned.
In the horizontal alignment device disclosed in this embodiment, the base 2 is used as the center of alignment coordination, the component to be aligned, which needs to be aligned, is disposed at the positioning cavity 21, the horizontal abutting component 5 elastically abuts against the component in the X, Y two directions, and meanwhile, the horizontal adjusting component 4 adjusts in the X, Y two directions, so that the alignment of the upper substrate 13 with the upper and lower structures is realized after the upper substrate 13 is moved and adjusted. The length and width of the tile-type parts to be aligned in the embodiment are 50mm; the upper substrate 13 is an LTCC substrate, and has a thickness of 1.4mm; the cover plate 14 is made of silicon-aluminum material and has a thickness of 1.2mm.
The structure of the positioning cavity 21 is the same as that of the packaging box 11 of the component to be aligned, and the effect of arranging the cover plate 14 in the positioning cavity 21 is the same as that of arranging the cover plate 14 in the packaging box 11, so that the component to be aligned can be finally and accurately placed in the packaging box 11 after the positioning cavity 21 is used for position alignment; the positioning of the cover plate 14 in the positioning cavity 21 can be achieved by adopting various schemes, which are not limited to only, and the embodiment is optimized and adopts one of the possible options: as shown in fig. 7, the positioning cavity 21 is provided with a positioning structure and is matched with the component to be aligned, and the positioning structure at least comprises two positioning parts. With such a solution, two positioning portions may be symmetrically arranged in the positioning cavity 21, so as to facilitate better positioning of the positioning plate 3, and in some solutions a greater number of positioning portions may be provided. Meanwhile, the positioning structure can adopt a structure that the positioning pin 22 is matched with the positioning hole.
Preferably, in this embodiment, the base 2 is set to a square structure, the accommodating cavity on the base is also set to a square half-hole structure, and the positioning portion includes a pin shaft structure disposed at the edge of the accommodating cavity, and when the positioning plate 3 is placed on the base 2, the pin shaft structure is matched with a corresponding positioning slot or positioning hole on the positioning plate 3, so as to realize accurate positioning of the positioning plate 3. In this embodiment, the positioning pin 22 is integrally processed with the base 2, so that the positioning pin 22 and the positioning cavity 21 are guaranteed to have a position tolerance of ±0.01mm, and tolerance accumulation is reduced as much as possible. The locating plate 3 is provided with 2 first pin holes 32 which are matched with the locating pins 22, so that the accurate position relationship between the base 2 and the locating plate 3 is ensured.
In this embodiment, the horizontal abutting component 5 abuts against the component to be aligned, and simultaneously dynamic abutting during horizontal adjustment is satisfied, the structure of the horizontal abutting component 5 can be configured in various forms, the structure is not limited uniquely, and this embodiment is optimized and adopts one of the possible choices: as shown in fig. 8, the horizontal abutting component 5 includes a connecting portion 51 fixedly matched with the base 2, an ejector pin 53 is telescopically disposed in the connecting portion 51, an abutting elastic member 52 applying elastic force to the ejector pin 53 is further disposed in the connecting portion 51, the abutting elastic member 52 applies elastic force to the ejector pin 53 and enables the front end of the ejector pin 53 to extend out of the front end of the connecting portion 51, the ejector pin 53 supports and abuts against the component to be aligned, and the rear end of the ejector pin 53 extends out of the rear end of the connecting portion 51 and is provided with a limiting blocking member 54. With such a scheme, the connecting portion 51 forms a cylindrical structure to accommodate the ejector pin member 53, and the front end of the ejector pin member 53 can be configured to be spherical for easy contact and force application to the component to be aligned, so that damage to the component to be aligned caused by excessive force applied to the surface of the component to be aligned is reduced. The limit stopper 54 may have a stopper, a stopper head, or the like, and has an outer diameter larger than an inner diameter of the cylindrical structure of the connecting portion 51, so that the ejector pin 53 is prevented from falling off from the connecting portion 51.
Preferably, the limit stop member 54 is a nut, and is detachably disposed at the rear end of the ejector pin member 53 by a threaded engagement structure. Meanwhile, the elastic deformation of the abutting elastic piece 52 can be adjusted and changed by adjusting the position of the nut, so that the abutting force is changed; in the present embodiment, the abutting elastic member 52 employs a spring.
In the embodiment, the horizontal position of the component to be aligned is pushed and adjusted through the horizontal adjusting component 4, so that the alignment of the upper substrate 13 in the component to be aligned is realized, and the machining accuracy is finally ensured; as shown in fig. 10, the level adjustment assembly 4 may be configured in a variety of configurations, particularly but not exclusively, and the present embodiment is optimized and employs one of the possible options: the horizontal adjusting assembly 4 comprises an adjusting rod which is rotationally matched with an adjusting seat 41 and rotationally pushes the part to be aligned to move along the X direction or the Y direction, and an adjusting head 42 for holding operation is further arranged on the adjusting rod. With such a solution, the adjustment lever and the adjustment seat 41 may be screw-fitted, with the adjustment lever axially approaching or moving away from the component to be aligned during rotation. In order to improve the accuracy of adjustment, fine threads may be provided, and an indication scale may be provided on the adjustment lever to indicate the amount of feed.
Preferably, in this embodiment, since the cover plate 14 is not moved, the relative positional relationship between the upper substrate 13 and the cover plate 14 can be arbitrarily adjusted until the first positioning hole 31 is completely aligned with the bonding pad. The alignment precision is ensured to be better than +/-0.1 mm, and the assembly requirement of the tile type component to be aligned is met.
In this embodiment, the component to be aligned is compressed from the longitudinal direction by the compressing component 6, in order to improve the convenience of compressing operation and ensure the compressing effect, multiple structures of compressing components 6 may be adopted, and this embodiment is optimized and adopts one of the possible choices: as shown in fig. 9, the pressing assembly 6 includes a rotating shaft 61 connected to the base 2, the rotating shaft 61 drives a pressing sleeve to synchronously deflect, a pressing rod 62 and a pressing elastic member 63 applying elastic force to the pressing rod 62 are disposed in the pressing sleeve, the front end of the pressing rod 62 is pressed by the pressing elastic member 63 and extends out from the lower port of the pressing sleeve, the rear end of the pressing rod 62 extends out from the upper port of the pressing sleeve, and a limiting anti-falling member 64 is disposed at the rear end of the pressing rod 62. With such a solution, the spacing anti-drop member 64 may have an anti-drop block, an anti-drop head, or the like, and has an outer diameter greater than the inner diameter of the compression sleeve, so as to prevent the compression rod 62 from falling off the compression sleeve.
The solution that can be adopted in the setting of the rotation shaft 61 is not limited only, but the present embodiment is optimized and adopts one of the possible choices: the base 2 is provided with a mounting hole 23 for mounting the rotating shaft 61, and is also provided with a fixing hole 24 for receiving the pressing rod 62, when the pressing assembly 6 is not matched with the component to be aligned, the rotating shaft 61 is rotated and the front end of the pressing rod 62 is matched with the fixing hole 24. When the scheme is adopted, the bearing can be arranged in the mounting hole 23 and used for connecting the rotating shaft 61, so that the rotating shaft 61 can rotate, and in order to improve the compression reliability of the compression assembly 6 on the parts to be aligned, the damping bearing can be adopted, so that the rotating shaft 61 can deflect to a set angle and then can maintain the deflection angle.
As shown in fig. 1 and 2, the radio frequency assembly 1 generally includes a closed box body, wherein a lower substrate 12, a button, an upper substrate 13 and a cover plate 14 are arranged in the closed box body from bottom to top, wherein the upper substrate 13 and the lower substrate 12 are connected through the button 15; because the alignment requirements of the upper substrate, the lower substrate and the cover plate and the airtight connection requirement of the cover plate and the closed box body need to be met, the upper substrate 13 and the cover plate 14 are usually connected in advance to form an integral structure, and the cover plate 14 and the upper substrate 13 are independently detached for the earlier alignment operation and optimized to provide the following structure convenient for positioning: the component to be aligned comprises a cover plate 14 and an upper substrate 13 which are arranged from bottom to top, an annular limiting baffle is arranged on the outer side of the upper substrate 13 in a surrounding mode, a plurality of positioning pads 131 are arranged on the upper substrate 13, a plurality of first positioning holes 31 corresponding to the positioning pads 131 are arranged on the positioning plate 3, a plurality of second positioning holes 26 corresponding to the positioning pads 131 are arranged at the bottom in the accommodating cavity, and when the component to be aligned is aligned in the positioning cavity 21, the first positioning holes 31 and the second positioning holes 26 are aligned with the positioning pads 131. When adopting this scheme, set up apron 14 in the below of upper substrate 13 to set up locating plate 3 in the top of upper substrate 13, adopted the structure of inversion, can improve the convenience when carrying out location alignment and follow-up processing connection through this kind of setting.
Preferably, the limit baffle 7 is provided with 2 second pin holes 71, which are matched with the positioning pins 22, so as to realize coarse positioning of the base 2 and the limit baffle 7. For installation convenience, the positioning pin 22 and the second pin hole 71 are designed to be in clearance fit, and the single-side clearance is 0.05mm. In the embodiment, the single-side gap between the inner cavity contour of the limit baffle 7 and the outer contour of the upper substrate 13 is 0.25mm, so that not only is enough adjustment allowance ensured, but also the adjustment range is controlled, and the adjustment time is saved.
Preferably, in this embodiment, 4 sets of first positioning holes 31 are provided on the positioning plate 3, the first positioning holes 31 are used for simulating the positions of the button hair 15 in the tile-type radio frequency assembly 1, and the tolerance between the first positioning holes 31 and the first pin holes 32 on the positioning plate 3 is ±0.01mm, so as to minimize tolerance accumulation. In this embodiment, the positioning plate 3 is made of duralumin LY12, and the first positioning hole 31 having a diameter Φ0.8mm is precision-machined by laser. For the convenience of observation, the upper edge of the first positioning hole 31 is chamfered by C0.3, so that poor vision caused by too deep hole is avoided.
In this embodiment, after the alignment of the component to be aligned is completed, the base 2 and the aligned component are taken as a whole, the base 2 assists in fixing the aligned component and performs post-butt-joint processing, and after the processing is completed, the processed component is detached from the base 2, and this embodiment is optimized and adopts one of possible choices: the positioning cavity 21 is internally provided with a plurality of dismounting holes 25, and the dismounting holes 25 are used for dismounting the processed parts from the positioning cavity 21 after alignment. With such a scheme, the number of the dismounting holes 25 may be set to be plural, and distributed on the base 2 according to the dismounting requirements.
The embodiment realizes that the horizontal alignment precision of the electrical interconnection structure of the tile-type radio frequency assembly 1 is better than +/-0.1 mm, ensures good electrical interconnection between the upper layer of substrate and the lower layer of substrate inside the tile-type radio frequency assembly 1 and between the tile-type radio frequency assembly 1 and an external radio frequency motherboard, and achieves the yield of more than 95%.
Example 2
The above-described content of embodiment 1 discloses a composition structure of a horizontal alignment device, and this embodiment also provides a horizontal alignment method, which is described below.
A method for horizontally aligning electrical interconnections of a tiled radio frequency assembly using the horizontal alignment apparatus of embodiment 1, comprising:
s01: and arranging a part to be aligned in the positioning cavity, wherein a welding lug is arranged between the cover plate and the upper substrate, and the limit baffle plate surrounds the periphery of the upper substrate.
S02: and setting a positioning plate and enabling the positioning plate to be matched with the positioning structure of the base.
S03: and observing the alignment condition of the positioning pad of the upper substrate and the first positioning hole of the positioning plate, and adjusting the position of the upper substrate through the horizontal adjusting assembly to realize alignment.
At least two capture pads are selected to determine alignment, and two capture pads symmetrically arranged at the upper left corner and the lower right corner can be selected.
If there is a deviation along the X direction, 1 horizontal adjusting component positioned on the Y side is adjusted; if there is a deviation in the Y direction, 2 horizontal adjustment assemblies located on the X side are adjusted simultaneously.
S05: through observing the alignment condition of the locating bonding pad of the upper substrate and the second locating hole of the base, the alignment adjustment is completed when the locating bonding pad is aligned with the first locating hole and the second locating hole, and the upper substrate structure is wrong when the locating bonding pad cannot be aligned.
The alignment method mentioned in this embodiment can adjust the upper substrate in the horizontal direction, so that the upper substrate and the positioning plate are aligned, and simultaneously, the upper substrate can be aligned with the cover plate due to the position limitation of the upper substrate by the limiting baffle and the position limitation of the cover plate by the accommodating cavity, so that the alignment of the upper substrate and the cover plate is realized as a whole.
After the alignment adjustment of the upper substrate is completed, a pressing assembly is arranged to press the positioning plate, and the whole alignment device and the aligned parts are integrally transferred into welding equipment for welding; and disassembling the parts subjected to alignment processing through the disassembly holes after welding.
In some embodiments, automatic transformation is supported, the alignment of the bonding pad and the positioning hole can be completed through machine vision by driving the horizontal adjusting component through a motor, the efficiency can be further improved, and the advantages are obvious in mass production.
The above is an embodiment exemplified in this example, but this example is not limited to the above-described alternative embodiments, and a person skilled in the art may obtain various other embodiments by any combination of the above-described embodiments, and any person may obtain various other embodiments in the light of this example. The above detailed description should not be construed as limiting the scope of the present embodiments, which is defined in the appended claims.
Claims (10)
1. A horizontal alignment device of tile formula radio frequency subassembly electrical interconnection structure, its characterized in that: the alignment device comprises a base (2) for placing a part to be aligned, wherein the base (2) accommodates the part to be aligned through a positioning cavity (21), and a positioning plate (3) is arranged at the positioning cavity (21); the base (2) is provided with a plurality of horizontal propping assemblies (5) for elastically propping the parts to be aligned along the X direction and the Y direction, a plurality of horizontal adjusting assemblies (4) for adjusting the parts to be aligned and keeping the parts to be aligned along the X direction and the Y direction, and a plurality of compressing assemblies (6) for compressing the parts to be aligned.
2. The horizontal alignment device of electrical interconnects of a tiled radio frequency assembly of claim 1, wherein: the positioning cavity (21) is provided with a positioning structure and is matched with the component to be aligned, and the positioning structure at least comprises two positioning parts.
3. The horizontal alignment device of electrical interconnects of a tiled radio frequency assembly of claim 1, wherein: the horizontal abutting assembly (5) comprises a connecting portion (51) fixedly matched with the base (2), an ejector pin (53) is arranged in the connecting portion (51) in a telescopic mode, an abutting elastic piece (52) applying elastic force to the ejector pin (53) is further arranged in the connecting portion (51), the abutting elastic piece (52) applies elastic force to the ejector pin (53) and enables the front end of the ejector pin (53) to extend out of the front end of the connecting portion (51), the ejector pin (53) supports and abuts against a component to be aligned, and the rear end of the ejector pin (53) extends out of the rear end of the connecting portion (51) and is provided with a limiting blocking piece (54).
4. The horizontal alignment device of electrical interconnects of a tiled radio frequency assembly of claim 1, wherein: the horizontal adjusting assembly (4) comprises an adjusting rod which is rotationally matched with an adjusting seat (41) and rotationally pushes the part to be aligned to move along the X direction or the Y direction, and an adjusting head (42) for holding operation is further arranged on the adjusting rod.
5. The horizontal alignment device of electrical interconnects of a tiled radio frequency assembly of claim 1, wherein: the compression assembly (6) comprises a rotating shaft (61) connected to the base (2), the rotating shaft (61) drives a compression sleeve to synchronously deflect, a compression rod (62) and a compression elastic piece (63) applying elasticity to the compression rod (62) are arranged in the compression sleeve, the front end of the compression rod (62) is compressed by the compression elastic piece (63) and extends out of the lower port of the compression sleeve, the rear end of the compression rod (62) extends out of the upper port of the compression sleeve, and a limiting anti-falling piece (64) is arranged at the rear end of the compression rod (62).
6. The horizontal alignment device of electrical interconnects of a tiled radio frequency assembly of claim 5, wherein: the base (2) is provided with a mounting hole (23) for mounting the rotating shaft (61), and is also provided with a fixing hole (24) for receiving the pressing rod (62), and when the pressing assembly (6) is not matched with a part to be aligned, the rotating shaft (61) is rotated and the front end of the pressing rod (62) is matched with the fixing hole (24).
7. The horizontal alignment device of electrical interconnects of a tiled radio frequency assembly of claim 1, wherein: the component to be aligned comprises a cover plate (14) and an upper substrate (13) which are arranged from bottom to top, an annular limiting baffle is arranged on the outer side of the upper substrate (13) in a surrounding mode, a plurality of positioning pads (131) are arranged on the upper substrate (13), a plurality of first positioning holes (31) corresponding to the positioning pads (131) are arranged on the positioning plate (3), a plurality of second positioning holes (26) corresponding to the positioning pads (131) are arranged in the accommodating cavity, and after the component to be aligned is aligned in the positioning cavity (21), the first positioning holes (31) and the second positioning holes (26) are aligned with the positioning pads (131).
8. The horizontal alignment device for electrical interconnect structures of tiled radio frequency assembly according to claim 1, wherein: a plurality of dismounting holes (25) are formed in the positioning cavity (21), and the dismounting holes (25) are used for dismounting the parts to be aligned from the positioning cavity (21) after alignment is finished.
9. A method for horizontally aligning an electrical interconnection structure of a tile-type radio frequency assembly, using the horizontal alignment device as claimed in any one of claims 1 to 8, comprising:
setting a part to be aligned in the positioning cavity (21), wherein a soldering lug is arranged between the cover plate (14) and the upper substrate (13), and the limit baffle (7) is made to surround the periphery of the upper substrate (13);
setting a positioning plate (3) and enabling the positioning plate (3) to be matched with a positioning structure of the base (2);
observing the alignment condition of the positioning pad (131) of the upper substrate (13) and the first positioning hole (31) of the positioning plate (3), and adjusting the position of the upper substrate (13) through the horizontal adjusting component (4) to realize alignment;
by observing the alignment condition of the positioning pad (131) of the upper substrate (13) and the second positioning hole (26) of the base (2), the alignment adjustment is completed when the positioning pad (131) is aligned with the first positioning hole (31) and the second positioning hole (26), and the structural error of the upper substrate (13) is indicated when the positioning pad (131) cannot be aligned.
10. The method of horizontal alignment of electrical interconnects of a tiled radio frequency assembly of claim 9, wherein: after the alignment adjustment of the upper substrate (13) is finished, a pressing assembly (6) is arranged to press the positioning plate (3), and the whole alignment device and the parts to be aligned are integrally transferred into welding equipment for welding; after the welding is finished, the parts to be aligned are disassembled through the disassembly holes (25).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310895800.3A CN117015169A (en) | 2023-07-20 | 2023-07-20 | Horizontal alignment device and method for tile type radio frequency assembly electrical interconnection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310895800.3A CN117015169A (en) | 2023-07-20 | 2023-07-20 | Horizontal alignment device and method for tile type radio frequency assembly electrical interconnection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117015169A true CN117015169A (en) | 2023-11-07 |
Family
ID=88575587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310895800.3A Pending CN117015169A (en) | 2023-07-20 | 2023-07-20 | Horizontal alignment device and method for tile type radio frequency assembly electrical interconnection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117015169A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118174059A (en) * | 2024-02-22 | 2024-06-11 | 中国电子科技集团公司第二十九研究所 | Two-dimensional bidirectional radio frequency blind-plug chassis structure |
-
2023
- 2023-07-20 CN CN202310895800.3A patent/CN117015169A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118174059A (en) * | 2024-02-22 | 2024-06-11 | 中国电子科技集团公司第二十九研究所 | Two-dimensional bidirectional radio frequency blind-plug chassis structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7791361B2 (en) | Planarizing probe card | |
| KR100795493B1 (en) | Contactor for electronic parts and a contact method | |
| CN108028211B (en) | Interface device, interface unit, probe device, and connection method | |
| US5731708A (en) | Unpackaged semiconductor testing using an improved probe and precision X-Y table | |
| TW200905202A (en) | Probe card assembly with a mechanically decoupled wiring substrate | |
| US6998858B2 (en) | Probe head, its assembly method and probe card | |
| JP2004505281A (en) | Test system for wireless communication equipment | |
| CN117015169A (en) | Horizontal alignment device and method for tile type radio frequency assembly electrical interconnection structure | |
| US6636057B1 (en) | Electric part testing apparatus with movable adapter | |
| US7301358B2 (en) | Contactor assembly for testing electrical circuits | |
| CN101496156A (en) | Parallelism adjusting mechanism of probe card | |
| CN111217130B (en) | Automatic blanking machine, blanking method and corresponding jig | |
| KR102308418B1 (en) | connection device for Inspection to be capable of automatic alignment of the subject through vision-based recognition | |
| JP2003078059A (en) | Integrated circuit package and method for providing the same with alignment mechanism | |
| WO2004008163A2 (en) | Assembly for connecting a test device to an object to be tested | |
| KR100860944B1 (en) | Solder ball reballing device for bga type sub-strate | |
| KR20110031410A (en) | Current carrying component, connecting component, test apparatus and method of mending a connecting component | |
| JP2013130459A (en) | Positioning method of plate-like member and method for manufacturing electric connection device | |
| KR20210058641A (en) | Probe array and Probe head manufacturing method of the probe card using the same | |
| JP2005251813A (en) | Wafer level burn in alignment device and method | |
| JP3381692B2 (en) | Semiconductor adsorption collet and die bonding equipment | |
| JP6830715B1 (en) | Measurement socket | |
| JP2002181887A (en) | Testing device for electronic component | |
| US5211325A (en) | Method and apparatus for soldering surface-mountable components to a printed circuit board | |
| US20240201249A1 (en) | Systems and methods for testing optical communication devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |