CN106405164B - Turnover straight-falling type optical chip module test socket - Google Patents
Turnover straight-falling type optical chip module test socket Download PDFInfo
- Publication number
- CN106405164B CN106405164B CN201610996927.4A CN201610996927A CN106405164B CN 106405164 B CN106405164 B CN 106405164B CN 201610996927 A CN201610996927 A CN 201610996927A CN 106405164 B CN106405164 B CN 106405164B
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- Prior art keywords
- pin shaft
- base
- upper cover
- hole
- plate
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The technical aim is to provide a turnover straight-falling type optical chip module test socket which can avoid the relative sliding of a pressing plate and a chip and improve the positioning precision of the chip, and the turnover straight-falling type optical chip module test socket comprises a base, an upper cover and a probe; the probe comprises a needle rod and a needle head; fixing a main board and a retaining board positioned below the main board on a base; the floating plate above the main plate is arranged on the base in a vertically floating manner, a chip groove is formed in the upper part of the floating plate, and a needle head hole is formed in the bottom of the chip groove; the needle bar of the probe is fixed by the retaining plate and the main plate, the needle head at the upper end penetrates through the main plate and extends upwards into the needle head hole, and the needle head at the lower end penetrates through the retaining plate and extends downwards; the upper cover is connected with a spiral cover, and the pressing plate is fixed below the spiral cover; the upper cover is connected with a pin shaft, and the base is provided with a waist-shaped pin shaft hole; the bottom of the pin shaft hole is provided with an upper ejection spring, and the side wall of the kidney-shaped hole is provided with a limit reed; when downward external force is applied to the pin shaft and the pin shaft passes over the limit reed, the limit reed returns to the normal state, and the pin shaft is kept at the position below the kidney-shaped hole.
Description
Technical Field
The technology is a socket used for testing an optical chip module.
Background
An optical image pickup Chip (CIS) and an image pickup module (CMOS) thereof are widely applied to the fields of industry, medical treatment, consumption and the like. With the end user's demands for image processing, and the development of high-pixel image acquisition and analysis technology, the product is gradually replacing the original glass optical lens in many fields.
The tens of millions of optical chip modules are a great development trend in the CIS and CMOS industries, and the chip is mainly applied to the aspects of satellites, high-altitude reconnaissance cameras and high-pixel intelligent cameras at present. Along with the packaging of the product, the trend of the testing process applied to high-definition cameras, monitoring cameras, mobile phone cameras and computer cameras is not blocked.
In China, although 1200 ten thousand-pixel optical chip modules are appeared as early as 2004, so far tens of millions of pixel modules cannot be well marketed due to the mismatch of matched packaging, testing and assembly. The main reason is that the high-precision optical chip module testing technology and the testing fixture thereof are not available.
The testing of optical chip modules involves a lot of things, such as high-precision positioning of chips on contact pads, probes, lenses, light boxes, etc. At present, the test of the optical chip module mainly comprises two modes of manual test and automatic machine table test.
The base principle adopted in the current market is as follows: first, the product contacting the base must transmit the signals of the optical image sensor (CIS) and its image sensor module (CMOS), which requires the use of a micro probe (POGO PIN) to derive the product signals. The test socket based on the structure has higher requirements on the degree of the matching position between the upper cover and the base.
At present, a socket used when a manual optical chip module is tested comprises a base, an upper cover hinged on the base, a pressing plate fixed on the upper cover, a probe fixed on the base, a tested chip directly placed on the probe, and the pressing plate is driven to press down the chip through the overturning of the upper cover. However, since the turnover plate is turned over, when the pressing plate and the chip just start to contact, only a part of the side part of the chip can be contacted, so that the relative sliding of the pressing plate and the chip can possibly cause the displacement of the chip, the position degree between the chip and the lens hole fixed above the upper cover is influenced, and the test result of the high-pixel optical chip is directly influenced.
Disclosure of Invention
The technical purpose is to provide a turnover straight-falling type optical chip module test socket which can avoid the relative sliding of a pressing plate and a chip and improve the positioning accuracy of the chip.
The turnover straight-falling type optical chip module test socket comprises a base, an upper cover and a probe, wherein the upper cover and the probe are connected to the base in a turnover manner; the probe comprises a needle rod and needle heads which are connected with the two ends of the needle rod in a floating manner; a main board is fixed on the base, and a retaining board fixed on the base is arranged below the main board; the floating plate is arranged on the base in a vertically floating way through a floating spring, the floating plate is positioned above the main plate, a chip groove for placing the optical chip module is formed in the upper part of the floating plate, and a needle head hole is formed in the bottom of the chip groove; the needle bar of the probe is fixed by the retaining plate and the main plate, and the needle head at the upper end of the needle bar penetrates through the main plate and extends upwards into the needle head hole; the needle head at the lower end of the needle bar penetrates through the retaining plate to extend downwards; the upper cover is connected with a spiral cover, and the pressing plate is fixed below the spiral cover; when the upper cover is turned over to be parallel to the base, the pressing plate is positioned above the chip groove on the floating plate; one side of the upper cover is connected with a pin shaft, one side of the base is provided with a pin shaft hole, and the pin shaft hole is a kidney-shaped hole; the bottom of the pin shaft hole is provided with an upper top spring for applying force upwards to the pin shaft passing through the pin shaft hole, and the side wall of the kidney-shaped hole is provided with a limit reed protruding towards the inner side of the kidney-shaped hole; in a normal state, the pin shaft is positioned at the upper part of the kidney-shaped hole under the action of the upper top spring; when a downward external force is applied to the pin shaft, the pin shaft moves downwards against the elastic force of the upper ejection spring and the elastic force of the limiting reed, when the pin shaft passes over the limiting reed, the limiting reed returns to a normal state, and the pin shaft is kept at the position below the kidney-shaped hole.
The turnover straight-falling type optical chip module testing socket is characterized in that the bottom of the upper cover is connected with the guide pin, the upper part of the base is provided with the guide pin hole for the guide pin to extend in, and one side of the upper part of the guide pin hole far away from the pin shaft is provided with the inclined downward guide groove.
The turnover straight-falling type optical chip module test socket is characterized in that a reset spring which enables the upper cover to turn upwards around the pin shaft is arranged between the upper cover and the base.
The turnover straight-falling type optical chip module test socket is characterized in that a buckling device which enables the upper cover and the base to be kept in a closed state is arranged between the upper cover and the base. The buckling device comprises a clasp which is connected on the upper cover in a turnover way, and a lug which is arranged on the base and matched with the clasp.
The beneficial effects of the technology are that: the technology adopts a waist-shaped pin shaft hole, and the pin shaft at the upper end can move up and down in the pin shaft hole, so that the upper cover can move up and down. When the upper cover needs to be closed, an external force of a directional force needs to be applied to the pin shaft or the upper cover, and the pin shaft overcomes the elasticity of the upper top spring and the elasticity of the limit reed to move downwards; when the pin shaft passes through the limit reed downwards, the limit reed returns to the normal state, so that the pin shaft is kept at the position below the kidney-shaped hole. When the upper cover is required to be opened, an upward external force can be applied to the pin shaft or the upper cover, so that the pin shaft moves upwards against the elastic force of the limit reed until the pin shaft is positioned at the upper part of the kidney-shaped hole.
When the probe is used, the chip is placed in the chip groove, then the upper cover is turned over, the lower upper cover is pressed down basically parallel to the base, the pressing plate vertically presses down the chip, the chip and the floating plate vertically downwards, and the needle head at the upper end of the probe is contacted with the chip. Therefore, when the upper cover is closed, the pressing plate basically moves in the vertical direction, so that the pressing plate and the chip are prevented from sliding relatively during pressing, and the deviation of the relative positions of the pressing plate and the chip is small.
The cooperation of guide pin and guide pinhole has further guaranteed the vertical pushing down of upper cover. The return spring can reduce the external force required when opening the upper cover. The buckling device ensures that the upper cover and the base are kept in the state when the upper cover and the base are closed. The fastening means are prior art.
Drawings
Fig. 1 is a front view (closed state) of a flip-flop manual optical chip module test socket.
Fig. 2 is a schematic diagram of a flip-flop manual optical chip module test socket (pre-close state).
Fig. 3 is a perspective view (closed state) of the flip-flop type manual optical chip module test socket.
Fig. 4 is an enlarged schematic view of the limit reed, the pin shaft hole, etc. in the closed state.
Fig. 5 is an exploded view of a flip-flop manual optical chip module test socket.
Fig. 6 is a schematic diagram of the flip-flop manual optical chip module test socket with the upper cover and base separated (with the clasp removed, etc.).
In the drawing, a base 1, an upper cover 2, an upper cover hole 21, a screw cover 3, a pressing plate 4, a step 51, a base hole 52, a pin hole 53, a guide pin hole 54, a guide groove 55, a lug 56, a main plate 6, a holding plate 7, a floating plate 8, a chip groove 81, a needle hole 82, a probe 10, a needle bar 101, an upper needle 102, a lower needle 103, a limit screw 11, a floating spring 12, a pin shaft 13, an upper top spring 14, an adjustment screw 15, a limit spring 16, an elastic protrusion 161, an upper side 162, a guide pin 17, a return spring 18, a fastening device 19, a clasp 191, and an optical chip module 20 are illustrated.
Detailed Description
Referring to fig. 1, 2 and 5, the turnover straight-falling type manual optical chip module test socket mainly comprises a base 1, an upper cover 2, a spiral cover 3, a pressing plate 4, a main plate 6, a retaining plate 7, a floating plate 8 and a probe 10, wherein the upper cover 2 is connected to the base in a turnover manner.
The probe 10 is of the prior art and comprises a needle shaft 101, and an upper needle 102 and a lower needle 103 which are connected with the two ends of the needle shaft in a floating manner.
A base hole 52 with a step 51 is formed in the base 1, a main board 6 is fixed below the base hole 52, and a retaining plate 7 fixed on the base is fixed below the main board. The upper part of the base hole 52 is internally provided with a floating plate 8. The periphery of the bottom of the floating plate 8 is arranged at the upper part of the step 51 in a vertically floating way through four floating springs 12, the floating plate is positioned above the main board, a chip groove 81 for placing the optical chip module 20 is formed at the upper part of the floating plate, and a needle hole 82 is formed at the bottom of the chip groove.
Four limit screws 11 are also fixed on the base, and the limit screws 11 limit the highest position of the floating plate which moves upwards under the action of the floating spring 12.
The needle bar 101 of the probe is positioned between the holding plate 7 and the main plate 6, and is clamped and fixed by the holding plate and the main plate, and the upper needle 102 at the upper end of the needle bar penetrates through the main plate and extends upwards into the needle hole; the lower needle 102 at the lower end of the needle shaft protrudes downward through the retaining plate.
One side of the upper cover is connected with a pin shaft 13, one side of the base is provided with a pin shaft hole 53 which is a waist-shaped hole.
An upper top spring 14 for applying force upwards to the pin shaft passing through the pin shaft hole is arranged at the bottom of the pin shaft hole, and the lower end of the upper top spring 14 is contacted with an adjusting screw 15 screwed on the base. By turning the adjusting screw 15, the elastic force of the upper top spring 14 can be adjusted. The elastic force of the upper top spring 14 is required to reach the maximum value, but at the same time, when the pin shaft passes over the limit reed and is located at the position below the kidney-shaped hole downwards, and the limit reed returns to the normal state, the elastic force of the upper top spring 14 can enable the pin shaft to be kept at the position below the kidney-shaped hole.
Referring to fig. 4, a stopper reed 16 protruding inward of the kidney-shaped hole is provided on the side wall of the kidney-shaped hole. The middle of the limit reed 16 is an elastic protrusion 161 which protrudes elastically to the upper and lower sides. Only the upper or lower side of the stopper reed 16 is fixed to the inner wall of the kidney-shaped hole (for convenience of explanation, the upper side 162 of the stopper reed 16 is fixed to the inner wall of the kidney-shaped hole).
In a normal state, the pin shaft is positioned at the upper part of the kidney-shaped hole under the action of the upper top spring; when a downward external force is applied to the pin shaft or the upper cover, the pin shaft moves downward against the elastic force of the upper top spring and the elastic force of the limit reed, and at this time, the elastic projection 161 is pressed to a state of being substantially flush with the upper and lower sides (or, the elastic projection 161 is substantially attached to the inner wall of the kidney-shaped hole), so that the downward movement of the pin shaft is not hindered. When the pin shaft passes over the limit reed, the limit reed returns to the state that the elastic protrusion 161 protrudes towards the inner side of the kidney-shaped hole, and the pin shaft is prevented from moving upwards, so that the pin shaft is kept at the position under the kidney-shaped hole.
The upper cover is provided with an upper cover hole 21, and two side walls of the spiral cover 3 are rotatably arranged on the inner wall of the upper cover hole through two rotating shafts (not shown) which are parallel to the pin shafts. The pressing plate is fixed below the spiral cover through bolts. Therefore, when the rotary cover and the pressing plate are closed, the rotary cover and the pressing plate can slightly rotate around the rotary shaft, and the pressing plate is further ensured to move in the vertical direction, so that the relative position deviation between the pressing plate and the chip is small.
Referring to fig. 2, when the upper cover is turned over to be parallel to the base, the pressing plate is located above the chip groove on the floating plate.
Two guide pins 17 are connected to the bottom of the upper cover, a guide pin hole 54 into which the guide pins extend is formed in the upper portion of the base, and a guide groove 55 which is inclined downwards is formed in one side of the upper portion of the guide pin hole away from the pin shaft.
A reset spring 18 which enables the upper cover to turn upwards around the pin shaft is arranged in the two counter bores at the upper part of the base.
The buckling device 19 comprises a clasp 191 connected to the upper cover in a turnover manner, and the clasp 191 is positioned on one side of the upper cover far away from the pin shaft. Lugs 56 which can be hooked by the clasp when the cover and base are in the closed condition are provided on the base.
In this embodiment, in order to achieve the purpose of vertically pressing the chip to be tested, the waist-shaped pin shaft hole and the special-shaped guide groove for guiding and positioning the guide pin are adopted to simultaneously restrict the movement of the upper cover, so that the upper cover and the chip to be tested only move in an up-down single direction in the final pressing process. In order to facilitate opening, a reset spring is arranged between the upper cover and the base respectively, so that the upper cover can be conveniently unfolded.
Claims (4)
1. The turnover straight-falling type optical chip module test socket comprises a base, an upper cover and a probe, wherein the upper cover and the probe are connected to the base in a turnover manner; the probe comprises a needle rod and needle heads which are connected with the two ends of the needle rod in a floating manner; a main board is fixed on the base, and a retaining board fixed on the base is arranged below the main board; the floating plate is arranged on the base in a vertically floating way through a floating spring, the floating plate is positioned above the main plate, a chip groove for placing the optical chip module is formed in the upper part of the floating plate, and a needle head hole is formed in the bottom of the chip groove; the needle bar of the probe is fixed by the retaining plate and the main plate, and the needle head at the upper end of the needle bar penetrates through the main plate and extends upwards into the needle head hole; the needle head at the lower end of the needle bar penetrates through the retaining plate to extend downwards; the upper cover is connected with a spiral cover, and the pressing plate is fixed below the spiral cover; when the upper cover is turned over to be parallel to the base, the pressing plate is positioned above the chip groove on the floating plate; the method is characterized in that: one side of the upper cover is connected with a pin shaft, one side of the base is provided with a pin shaft hole, and the pin shaft hole is a kidney-shaped hole; the bottom of the pin shaft hole is provided with an upper top spring for applying force upwards to the pin shaft passing through the pin shaft hole, and the side wall of the kidney-shaped hole is provided with a limit reed protruding towards the inner side of the kidney-shaped hole; in a normal state, the pin shaft is positioned at the upper part of the kidney-shaped hole under the action of the upper top spring; when a downward external force is applied to the pin shaft, the pin shaft moves downwards against the elastic force of the upper ejection spring and the elastic force of the limiting reed, when the pin shaft passes over the limiting reed, the limiting reed returns to a normal state, and the pin shaft is kept at the position at the lower part of the kidney-shaped hole;
the bottom of the upper cover is connected with a guide pin, the upper part of the base is provided with a guide pin hole into which the guide pin extends, and one side of the upper part of the guide pin hole far away from the pin shaft is provided with a guide groove which is inclined downwards;
a reset spring which enables the upper cover to turn upwards around the pin shaft is arranged between the upper cover and the base.
2. The flip-flop type optical chip module test socket of claim 1, wherein: a buckling device which enables the upper cover and the base to keep a closed state is arranged between the upper cover and the base.
3. The flip-flop type optical chip module test socket of claim 2, wherein: the buckling device comprises a clasp which is connected on the upper cover in a turnover way, and a lug which is arranged on the base and matched with the clasp.
4. The flip-flop type optical chip module test socket of claim 1, wherein: the upper top spring is positioned between the pin shaft and the adjusting screw screwed on the base, and the elastic force of the upper top spring can be changed by rotating the adjusting screw; the elastic force of the upper top spring reaches the maximum value, but simultaneously when the pin shaft passes over the limit reed and is positioned at the lower part of the kidney-shaped hole downwards, and the limit reed returns to the normal state, the elastic force of the upper top spring can enable the pin shaft to be kept at the lower part of the kidney-shaped hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996927.4A CN106405164B (en) | 2016-11-10 | 2016-11-10 | Turnover straight-falling type optical chip module test socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996927.4A CN106405164B (en) | 2016-11-10 | 2016-11-10 | Turnover straight-falling type optical chip module test socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106405164A CN106405164A (en) | 2017-02-15 |
| CN106405164B true CN106405164B (en) | 2023-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610996927.4A Active CN106405164B (en) | 2016-11-10 | 2016-11-10 | Turnover straight-falling type optical chip module test socket |
Country Status (1)
| Country | Link |
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| CN (1) | CN106405164B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101926690B1 (en) * | 2017-03-27 | 2018-12-07 | 주식회사 엔티에스 | Test socket |
| CN106896315B (en) * | 2017-04-28 | 2023-12-08 | 上海捷策创电子科技有限公司 | Photosensitive chip test equipment |
| CN108181489A (en) * | 2018-01-05 | 2018-06-19 | 郑州信大捷安信息技术股份有限公司 | TF card test bench |
| CN111398790B (en) * | 2020-04-29 | 2024-09-13 | 苏州创瑞机电科技有限公司 | Optical chip module testing device |
| CN112261819A (en) * | 2020-10-20 | 2021-01-22 | 吉林工程技术师范学院 | Fixing device for vehicle detection chip |
| CN113899700B (en) * | 2021-12-08 | 2022-04-15 | 深圳市伟盛丰科技有限公司 | Cell-phone module circuit board tool of lighting a lamp that charges |
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| CN106405164A (en) | 2017-02-15 |
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