CN203490615U - Computer CPU heat dissipation sheet - Google Patents
Computer CPU heat dissipation sheet Download PDFInfo
- Publication number
- CN203490615U CN203490615U CN201320471399.2U CN201320471399U CN203490615U CN 203490615 U CN203490615 U CN 203490615U CN 201320471399 U CN201320471399 U CN 201320471399U CN 203490615 U CN203490615 U CN 203490615U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dissipation sheet
- heat sink
- sink body
- computer cpu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a computer CPU heat dissipation sheet which comprises a square plate-shaped heat dissipation sheet body, and a plurality of heat dissipation fins are disposed on the upper surface of the heat dissipation sheet body. The computer CPU heat dissipation sheet is characterized in that two side surfaces of the heat dissipation sheet body extend downwardly to form bar-shaped clamping portions which are used for being clamped into a groove preset on a CPU mainboard, and the upper surface of the heat dissipation sheet body is further equipped with at least one through hole that vertically penetrates the heat dissipation sheet body. The two side surfaces extend downwardly to form the clamping portions, the clamping portions are clamped into the groove preset on the CPU mainboard to be positioned, and then the heat dissipation sheet is fixed to the mainboard via the through hole passing through the heat dissipation sheet body. The above positioning method is accurate in positioning, is not liable to be fault, and enables the production efficiency to be improved and a reworking rate to be reduced.
Description
Technical field
The utility model relates to a kind of cooling device, relates in particular to the heat radiator that a kind of computer CPU is used.
Background technology
In recent years, along with the transfer capability of power circuit constantly increases, power consumption increases thereupon, therefore various electronic components have also produced very huge heat, brought heat dissipation problem, produced heat abstractor thereupon, with regard to current CPU element, the raising of its integrated level and frequency of operation, also will improve the requirement of heat radiator.
Heat radiator of the prior art is to be fixed on cpu motherboard by securing members such as screws, therefore need on heat radiator, preset several through holes, then by the screw thread of this through-hole alignment securing member, this mode all needs to calibrate manually at every turn, work efficiency is very low, and often easily occur hole mistake, rework rate is high.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of heat radiator that can automatically position.
For addressing the above problem, the utility model provides a kind of computer CPU heat radiator, comprise square tabular heat sink body, the upper surface of described heat sink body is provided with some radiating fins, it is characterized in that, two sides of described heat sink body are extended with the holding section of strip downwards, and for being stuck in the groove defaulting on cpu motherboard, described heat sink body upper surface is also provided with at least one and vertically connects the through hole of described heat sink body.
As further improvement of the utility model, described through hole is two.
As further improvement of the utility model, described through hole is waist-shaped hole.
As further improvement of the utility model, described heat sink body comprises the first side, the second side, the 3rd side and the 4th side connecting successively, described holding section is located on the first side and the second side, two described through holes be located at the upper surface of described heat sink body and lay respectively at described the second side and the 4th side near.
As further improvement of the utility model, described holding section diminishes from top to bottom gradually.
As further improvement of the utility model, described heat sink body is that aluminum alloy materials is made.
The beneficial effects of the utility model are, two sides are to having holding section, this holding section is snapped onto in the groove being preset on mainboard, thereby position, finally through the through hole being arranged in heat sink body, this heat radiator is fixed on mainboard to this locator meams, registration, be not easy to produce mistake, improved production efficiency, reduced rework rate.
Accompanying drawing explanation
Fig. 1 is the structural representation of this valve;
Wherein: 2-radiating fin; 4-through hole; 6-heat sink body; 8-holding section.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further details.
As shown in Figure 1, the utility model comprises square tabular heat sink body, the upper surface of heat sink body is provided with some radiating fins 2, heat sink body 6 comprises the first side, the second side, the 3rd side and the 4th side connecting successively, to downward-extension and for the holding section 8 of strip, be located on the first side and the second side, for being stuck in the groove defaulting on cpu motherboard, holding section 8 diminishes from top to bottom gradually, is convenient to insert in groove.Heat sink body upper surface is also provided with two waist typed through hole 4 that vertically connect heat sink body.Be arranged to waist-shaped hole, prevent two through holes 4 and result from the unmatched situation of threaded fastener because of scale error accumulation, these two through holes 4 be located at the upper surface of heat sink body 6 and lay respectively at the second side and the 4th side near, make stressed evenly.Card heat sink body adopts the good aluminum alloy materials of heat-transfer effect to make, to improve radiating effect.
During use, this holding section 8 is snapped onto in the groove being preset on mainboard, thereby position, finally through the through hole 4 being arranged in heat sink body 6, this heat radiator is fixed on mainboard, this locator meams, registration, is not easy to produce mistake, improve production efficiency, reduced rework rate.
Above-described embodiment is preferably embodiment of the utility model; but embodiment of the present utility model is not limited by the examples; other any do not deviate from change, the modification done under Spirit Essence of the present utility model and principle, substitutes, combination, simplify and all should be equivalent substitute mode, within being included in protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the protection domain that claim was defined.
Claims (6)
1. a computer CPU heat radiator, comprise square tabular heat sink body, the upper surface of described heat sink body is provided with some radiating fins, it is characterized in that, two sides of described heat sink body are extended with the holding section of strip downwards, for being stuck in the groove defaulting on cpu motherboard, described heat sink body upper surface is also provided with at least one and vertically connects the through hole of described heat sink body.
2. a kind of computer CPU heat radiator as claimed in claim 1, is characterized in that, described through hole is two.
3. a kind of computer CPU heat radiator as claimed in claim 2, is characterized in that, described through hole is waist-shaped hole.
4. a kind of computer CPU heat radiator as claimed in claim 3, it is characterized in that, described heat sink body comprises the first side, the second side, the 3rd side and the 4th side connecting successively, described holding section is located on the first side and the second side, two described through holes be located at the upper surface of described heat sink body and lay respectively at described the second side and the 4th side near.
5. a kind of computer CPU heat radiator as claimed in claim 4, is characterized in that, described holding section diminishes from top to bottom gradually.
6. a kind of computer CPU heat radiator as claimed in claim 5, is characterized in that, described heat sink body is that aluminum alloy materials is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320471399.2U CN203490615U (en) | 2013-08-05 | 2013-08-05 | Computer CPU heat dissipation sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320471399.2U CN203490615U (en) | 2013-08-05 | 2013-08-05 | Computer CPU heat dissipation sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203490615U true CN203490615U (en) | 2014-03-19 |
Family
ID=50261433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320471399.2U Expired - Fee Related CN203490615U (en) | 2013-08-05 | 2013-08-05 | Computer CPU heat dissipation sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203490615U (en) |
-
2013
- 2013-08-05 CN CN201320471399.2U patent/CN203490615U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140319 Termination date: 20150805 |
|
| EXPY | Termination of patent right or utility model |