CN215734999U

CN215734999U - Printed PCB (printed circuit board) capable of quickly radiating

Info

Publication number: CN215734999U
Application number: CN202121648010.8U
Authority: CN
Inventors: 叶皓轩
Original assignee: Shenzhen Xinlongye Electronic Technology Co ltd
Current assignee: Shenzhen Xinlongye Electronic Technology Co ltd
Priority date: 2021-07-20
Filing date: 2021-07-20
Publication date: 2022-02-01
Anticipated expiration: 2031-07-20

Abstract

The utility model discloses a printed PCB (printed Circuit Board) capable of quickly dissipating heat, which comprises a device main body; the device main body comprises more than one PCB circuit main board; fixing components are arranged at two ends of more than one PCB circuit main board; a first heat dissipation assembly and a second heat dissipation assembly are arranged between more than one circuit main board; the first heat dissipation assembly comprises more than one metal water pipe; metal water pipes are arranged on two sides between more than one PCB circuit main boards; the first heat dissipation assembly and the second heat dissipation assembly are arranged between more than one circuit main board, the first heat dissipation assembly adopts a metal water pipe and a backflow water pump, and the metal water pipe is arranged on the more than one circuit main board; the metal water pipe is connected with a return water pump, so that the return water pump can control water in the metal water pipe and take away heat on the circuit main board; the second radiating assembly comprises metal heat conducting fins, and the upper end and the lower end of more than one metal heat conducting fin are connected with the PCB circuit main board, so that the quick heat dissipation of the circuit main board is realized.

Description

Printed PCB (printed circuit board) capable of quickly radiating

Technical Field

The utility model relates to the technical field of PCB (printed circuit board), in particular to a printed PCB capable of quickly dissipating heat.

Background

The carrier for connection is made up of insulating plate as basic material through cutting to a certain size, attaching at least one conducting pattern on it, and arranging holes (such as element holes, fastening holes and metallized holes) for replacing the chassis of electronic elements and connecting them.

The disadvantages of the prior multilayer printed PCB circuit board are that: the existing multilayer printed PCB generates a large amount of heat in the using process and is easy to damage the circuit board.

Disclosure of Invention

The technical problem to be solved by the utility model is to provide a printed PCB circuit board capable of quickly radiating heat; the method comprises the following steps that a first radiating assembly and a second radiating assembly are arranged between more than one circuit main board, the first radiating assembly adopts a metal water pipe and a backflow water pump, and the metal water pipe is arranged on the more than one circuit main board; the metal water pipe is connected with a return water pump, so that the return water pump can control water in the metal water pipe and take away heat on the circuit main board; the second radiating assembly comprises metal heat conducting fins, and the upper end and the lower end of more than one metal heat conducting fin are connected with the PCB circuit main board, so that the quick heat dissipation of the circuit main board is realized.

The printed PCB capable of quickly dissipating heat is realized by the following technical scheme: comprises a device main body; the device main body comprises more than one PCB circuit main board; fixing components are arranged at two ends of more than one PCB circuit main board; a first heat dissipation assembly and a second heat dissipation assembly are arranged between more than one circuit main board;

the first heat dissipation assembly comprises more than one metal water pipe; metal water pipes are arranged on two sides between more than one PCB circuit main boards; two ends of the metal water pipe are provided with a return water pump; more than one return water pipe is arranged between more than one return water pump.

As a preferred technical solution, the fixing assembly includes a fixing bracket and a first fixing plate and a second fixing plate; more than one sliding rod is arranged in the fixed bracket; the first fixing plate is arranged on one side of the fixing support and is connected with more than one sliding rod; the first fixing plate is arranged at the upper end of more than one PCB circuit main board; more than one through hole for fixing is formed in the surface of the second fixing plate;

limiting grooves are formed in the end faces of the two sides of the more than one PCB circuit main board; limiting blocks are arranged on the end faces of the two sides of the fixed support; the limiting block is arranged in the limiting groove.

As a preferred technical scheme, locking blocks are arranged on two opposite sides of two ends of the metal water pipe; more than one threaded through hole is formed in the surface of the locking block; the height of the backflow water pump is equal to the height of more than one PCB circuit main board; more than one screw is arranged on the surface of the reflux water pump; more than one screw is oppositely connected with more than one threaded through hole; a temperature sensor is arranged in the reflux water pump; a display device is embedded outside the reflux water pump; the display device is connected with the temperature sensor.

As a preferable technical solution, the second heat dissipation assembly includes more than one metal heat conduction sheet; the upper end and the lower end of more than one metal heat conducting fin and the upper end and the lower end of the metal water pipe are both connected with the PCB circuit main board.

The utility model has the beneficial effects that: the method comprises the following steps that a first radiating assembly and a second radiating assembly are arranged between more than one circuit main board, the first radiating assembly adopts a metal water pipe and a backflow water pump, and the metal water pipe is arranged on the more than one circuit main board; the metal water pipe is connected with a return water pump, so that the return water pump can control water in the metal water pipe and take away heat on the circuit main board; the second radiating assembly comprises metal heat conducting fins, and the upper end and the lower end of more than one metal heat conducting fin are connected with the PCB circuit main board, so that the quick heat dissipation of the circuit main board is realized.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a first schematic view of a PCB capable of dissipating heat rapidly according to the present invention;

FIG. 2 is a second schematic view of the PCB with fast heat dissipation according to the present invention;

fig. 3 is a schematic view of the internal structure of the printed PCB capable of dissipating heat rapidly according to the present invention.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

In the description of the present invention, it is to be understood that the terms "one end", "the other end", "outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.

Further, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The use of terms such as "upper," "above," "lower," "below," and the like in describing relative spatial positions herein is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "sleeved," "connected," "penetrating," "plugged," and the like are to be construed broadly, e.g., as a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

As shown in fig. 1 to 3, a printed PCB capable of dissipating heat rapidly according to the present invention includes a device body; the device main body comprises more than one PCB circuit main board 1; fixing components are arranged at two ends of more than one PCB circuit main board 1; a first heat dissipation assembly and a second heat dissipation assembly are arranged between more than one circuit main board;

the first heat dissipation assembly comprises more than one metal water pipe 6; metal water pipes 6 are arranged on two sides between more than one PCB circuit main boards 1; two ends of the metal water pipe 6 are provided with a return water pump 11; more than one return water pipe 15 is installed between more than one return water pump 11.

In this embodiment, the fixing assembly includes a fixing bracket 9 and first and

second fixing plates

4 and 10; more than one sliding rod 17 is arranged in the fixed bracket 9; the first fixing plate 4 is arranged on one side of the fixing bracket 9 and is connected with more than one sliding rod 17; the first fixing plate 4 is arranged at the upper end of more than one PCB circuit main board 1; the surface of the second fixing plate 10 is provided with more than one through hole 16 for fixing;

the end surfaces of two sides of more than one PCB circuit main board 1 are provided with limiting grooves 2; the end surfaces of two sides of the fixed bracket 9 are provided with limit blocks 8; the limiting block 8 is arranged in the limiting groove 2.

In the embodiment, the two opposite sides of the two ends of the metal water pipe 6 are provided with the locking blocks 5; more than one threaded through hole 7 is formed in the surface of the locking block 5; the height of the return water pump 11 is equal to the height of more than one PCB circuit main board 1; more than one screw 11 is arranged on the surface of the reflux water pump 11; more than one screw 11 is oppositely connected with more than one thread through hole 7; a temperature sensor (not shown) is provided in the reflux water pump 11; a display device 14 is embedded outside the reflux water pump 11; the display device 14 is connected to a temperature sensor.

In this embodiment, the second heat dissipation assembly includes more than one metal heat conduction sheet 13; the upper end and the lower end of more than one metal heat conducting strip 13 and the upper end and the lower end of the metal water pipe 6 are both connected with the PCB circuit main board 1.

The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.

Claims

1. The utility model provides a can quick radiating printed PCB circuit board which characterized in that: comprises a device main body; the device main body comprises more than one PCB circuit main board (1); both ends of the more than one PCB circuit main board (1) are provided with fixing components; a first heat dissipation assembly and a second heat dissipation assembly are arranged between the more than one circuit main boards;

the first heat dissipation assembly comprises more than one metal water pipe (6); metal water pipes (6) are arranged on two sides between the more than one PCB circuit main boards (1); two ends of the metal water pipe (6) are provided with a reflux water pump (12); more than one return water pipe (15) is arranged between the more than one return water pump (12).

2. The printed PCB board capable of rapidly dissipating heat of claim 1, wherein: the fixing assembly comprises a fixing bracket (9), a first fixing plate (4) and a second fixing plate (10); more than one sliding rod (17) is arranged in the fixed bracket (9); the first fixing plate (4) is arranged on one side of the fixing support (9) and is connected with more than one sliding rod (17); the first fixing plate (4) is arranged at the upper end of more than one PCB circuit main board (1); more than one through hole (16) for fixing is formed in the surface of the second fixing plate (10);

the end surfaces of two sides of the more than one PCB circuit main board (1) are respectively provided with a limiting groove (2); the end surfaces of two sides of the fixed support (9) are provided with limit blocks (8); the limiting block (8) is arranged in the limiting groove (2).

3. The printed PCB board capable of rapidly dissipating heat of claim 1, wherein: locking blocks (5) are arranged on two opposite sides of two ends of the metal water pipe (6); more than one threaded through hole (7) is formed in the surface of the locking block (5); the height of the backflow water pump (12) is equal to the height of more than one PCB circuit main board (1); more than one screw (11) is arranged on the surface of the reflux water pump (12); the more than one screw (11) is oppositely connected with the more than one threaded through hole (7); a temperature sensor is arranged in the reflux water pump (12); a display device (14) is embedded and installed on the outer side of the backflow water pump (12); the display device (14) is connected with a temperature sensor.

4. The printed PCB board capable of rapidly dissipating heat of claim 1, wherein: the second heat dissipation assembly comprises more than one metal heat conduction sheet (13); the upper end and the lower end of the more than one metal heat conducting fins (13) and the upper end and the lower end of the metal water pipe (6) are connected with the PCB circuit main board (1).