CN203467058U - Heat radiator of power switch - Google Patents

Heat radiator of power switch Download PDF

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Publication number
CN203467058U
CN203467058U CN201320560791.4U CN201320560791U CN203467058U CN 203467058 U CN203467058 U CN 203467058U CN 201320560791 U CN201320560791 U CN 201320560791U CN 203467058 U CN203467058 U CN 203467058U
Authority
CN
China
Prior art keywords
power switch
radiator
heat
layer
tellite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320560791.4U
Other languages
Chinese (zh)
Inventor
张红申
卢向东
史本钊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to CN201320560791.4U priority Critical patent/CN203467058U/en
Application granted granted Critical
Publication of CN203467058U publication Critical patent/CN203467058U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

A heat radiator of a power switch comprises a printed circuit substrate (10), a thermal conductive layer (20) and an installation layer (40). The printed circuit substrate is provided with a connecting part (12) capable of being electrically connected with a pin of the power switch, an installation part (40) and a heat radiation part (16). The thermal conductive layer is attached to the printed circuit substrate, and extends from the installation part to the heat radiation part. The installation layer is disposed on the installation part and attached to the thermal conductive layer, and the power switch (50) can be installed on the installation layer. According to the heat radiator of the power switch, heat radiation of the power switch is good, the structure is simple, the size is small, and the assembly of the power switch and the radiator is simplified.

Description

The radiator of power switch
Technical field
The utility model relates to a kind of radiator, relates in particular to a kind of radiator for power switch.
Background technology
In earth leakage protective device, the radiator of power switch generally adopts metallic conductor at present, and the different radiator of the corresponding use of power switch encapsulating for difference.These radiators all need power switch to be fixed thereon by screw or jump ring, in addition, coated with thermally conductive silicone grease on the end face that also need to contact with radiator at power switch, or insertion heat-conducting pad strengthens the heat transmission between power switch and radiator.Whole assembling process wastes time and energy, and cost is high.In addition, radiator is metal material, need to consider electric clearance and creepage distance between it and miscellaneous part, and radiator takies very large space.
Utility model content
The purpose of this utility model is to provide a kind of radiator of power switch, to realize the heat radiation to power switch.
The utility model provides a kind of radiator of power switch, comprises a tellite, a heat-conducting layer and a mounting layer.Tellite has a connecting portion that can be electrically connected with the pin of described power switch, an installation portion and a radiating part.Heat-conducting layer is attached at described tellite, and it extends to described radiating part by described installation portion.Mounting layer is arranged at described installation portion and fits in described heat-conducting layer, and power switch can be installed on described mounting layer.
The radiator of power switch can be realized the good heat radiating to power switch, and simple in structure, and volume is little, and has simplified the assembling of power switch and radiator.
In another schematic execution mode of the radiator of power switch, radiator also has a plurality of louvres through described heat-conducting layer and described tellite.
In the schematic execution mode of another kind of the radiator of power switch, heat-conducting layer is for covering copper layer.
In another schematic execution mode of the radiator of power switch, along the edge of described installation portion and described radiating part, described tellite has an isolation strip.
In another schematic execution mode of the radiator of power switch, radiator is for surface-mount type power switch.
In another schematic execution mode of the radiator of power switch, power switch can be welded in described mounting layer.
Accompanying drawing explanation
The following drawings only schematically illustrates and explains the utility model, does not limit scope of the present utility model.
Fig. 1 is for illustrating the structural representation of a kind of exemplary embodiment of radiator of power switch.
Fig. 2 has shown the schematic diagram after the assembling radiator of power switch in Fig. 1.
Label declaration
10 tellites
12 connecting portions
14 installation portions
16 radiating parts
18 isolation strip
20 heat-conducting layers
30 louvres
40 mounting layers
50 power switchs.
Embodiment
For the technical characterictic of utility model, object and effect being had more clearly, understand, now contrast accompanying drawing embodiment of the present utility model is described, in each figure, identical label represents identical part.
In this article, " schematically " expression " is served as example, example or explanation ", any diagram, the execution mode that are described in this article " schematically " should be interpreted as a kind of preferred or have more the technical scheme of advantage.
For making drawing succinct, in each figure, only schematically shown the part relevant to the utility model, they do not represent that it is as the practical structures of product.In addition, so that drawing is succinctly convenient to understand, in some figure, there are the parts of same structure or function, only schematically illustrated one of them, or only marked one of them.
In this article, " one " not only represents " only this ", also can represent the situation of " more than one ".
Fig. 1 is for illustrating the structural representation of a kind of exemplary embodiment of radiator of power switch, and Fig. 2 has shown the schematic diagram after the assembling radiator of power switch in Fig. 1, dotted line sign power switch in figure.As depicted in figs. 1 and 2, the radiator of power switch comprises a tellite 10, heat-conducting layer 20 and a mounting layer 40.
Wherein, tellite 10 has a connecting portion 12, installation portion 14 and a radiating part 16.Connecting portion 12, for tellite 10 being connected to other printed circuit board (PCB), is connected and is electrically connected with the structure of other printed circuit board (PCB)s to realize tellite 10.The structure of the connecting portion 12 showing in the drawings, can realize tellite 10 and be connected with the plug of other printed circuit board (PCB)s, with ease of assembly.The shape of connecting portion 12, installation portion 14 and radiating part 16 is not limited to shown in figure, can adjust accordingly according to the shape of power switch and concrete needs their shape and area.
Heat-conducting layer 20 is attached at tellite 10, and heat-conducting layer 20 spreads on tellite 10.As shown in the figure, heat-conducting layer 20 extends to radiating part 16 by installation portion 14, and spreads on installation portion 14 and radiating part 16.Can adjust as required the area coverage of heat-conducting layer 20 on installation portion 14 and radiating part 16, and the area coverage of heat-conducting layer 20 is larger, radiating effect is better.
Mounting layer 40 correspondences are arranged at installation portion 14, and mounting layer 40 fits in heat-conducting layer 20.Power switch 50 can be installed on mounting layer 40, to realize power switch 50, is connected and is electrically connected with the structure of radiator.When power switch is worked, the heat of its generation can be passed to heat-conducting layer 20 via mounting layer 40, and is dispelled the heat by heat-conducting layer 20.The printed circuit pattern that does not show the electric connection of mounting layer and connecting portion in figure, as required this printed circuit pattern of specific design.
As depicted in figs. 1 and 2, in a kind of exemplary embodiment of radiator of power switch, radiator comprises a plurality of louvres 30.These louvres 30 are through heat-conducting layer 20 and tellite 10.Their correspondences are arranged at installation portion 14 and radiating part 16.By louvre 30 is set, can improve the radiating efficiency of radiator.The area that louvre is set on the quantity of louvre and tellite by increasing further improves the radiating efficiency of radiator.
In a kind of exemplary embodiment of radiator of power switch, heat-conducting layer 20, for covering copper layer, by the good heat conductive performance of metallic copper, can improve the heat-sinking capability of whole radiator.In addition, can also with other metal coating or nonmetallic coating, carry out heat conduction as required.
As depicted in figs. 1 and 2, in a kind of exemplary embodiment of radiator of power switch, along the edge of installation portion 14 and radiating part 16, tellite 10 has an isolation strip 18.On isolation strip 18, there is no printed conductive layer and heat-conducting layer, thereby can realize electrical isolation and the creepage distance of radiator and its peripheral devices.
As depicted in figs. 1 and 2, in a kind of exemplary embodiment of radiator of power switch, power switch 50 is surface-mount type, it can directly be welded on mounting layer 40, to realize power switch 50, be connected and be electrically connected with the structure of radiator, and the transferring heat that power switch 50 and contacting of mounting layer 40 can be good.In addition, can also be between power switch and mounting layer coated with thermally conductive silicone grease and pad establish conducting strip, greatly simplified the assembling of power switch and radiator.Power switch can be IGBT, MOSFET etc.
Be to be understood that, although this specification is described according to each embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should make specification as a whole, technical scheme in each embodiment also can, through appropriately combined, form other execution modes that it will be appreciated by those skilled in the art that.
Listed a series of detailed description is above only illustrating for feasibility embodiment of the present utility model; they are not in order to limit protection range of the present utility model; allly do not depart from equivalent embodiment or the change that the utility model skill spirit is done; as the combination of feature, cut apart or repeat, within all should being included in protection range of the present utility model.

Claims (6)

1. the radiator of power switch, is characterized in that described radiator comprises:
A tellite (10), it has connecting portion (12), an installation portion (14) and a radiating part (16) that can be electrically connected with the pin of described power switch (50);
A heat-conducting layer (20) that is attached at described tellite (10), it extends to described radiating part (16) by described installation portion (14); With
A mounting layer (40) that is arranged at described installation portion (14) and fits in described heat-conducting layer (20), described power switch (50) can be installed on described mounting layer (40).
2. the radiator of power switch as claimed in claim 1, wherein also has a plurality of louvres (30) through described heat-conducting layer (20) and described tellite (10).
3. the radiator of power switch as claimed in claim 1, wherein said heat-conducting layer (20) is for covering copper layer.
4. the radiator of power switch as claimed in claim 1, wherein, along the edge of described installation portion (14) and described radiating part (16), described tellite (10) has an isolation strip (18).
5. the radiator of power switch as claimed in claim 1, wherein said radiator is for surface-mount type power switch.
6. the radiator of power switch as claimed in claim 5, wherein said power switch (50) can be welded in described mounting layer (40).
CN201320560791.4U 2013-09-10 2013-09-10 Heat radiator of power switch Expired - Fee Related CN203467058U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320560791.4U CN203467058U (en) 2013-09-10 2013-09-10 Heat radiator of power switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320560791.4U CN203467058U (en) 2013-09-10 2013-09-10 Heat radiator of power switch

Publications (1)

Publication Number Publication Date
CN203467058U true CN203467058U (en) 2014-03-05

Family

ID=50179393

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320560791.4U Expired - Fee Related CN203467058U (en) 2013-09-10 2013-09-10 Heat radiator of power switch

Country Status (1)

Country Link
CN (1) CN203467058U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108107055A (en) * 2017-11-20 2018-06-01 珠海格力电器股份有限公司 Control method, device, storage medium and the processor of intelligent power module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108107055A (en) * 2017-11-20 2018-06-01 珠海格力电器股份有限公司 Control method, device, storage medium and the processor of intelligent power module
CN108107055B (en) * 2017-11-20 2019-11-15 珠海格力电器股份有限公司 Control method, device, storage medium and the processor of intelligent power module

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140305

Termination date: 20200910