CN203455450U - Switching-type IC chip testing device - Google Patents
Switching-type IC chip testing device Download PDFInfo
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- CN203455450U CN203455450U CN201320506379.4U CN201320506379U CN203455450U CN 203455450 U CN203455450 U CN 203455450U CN 201320506379 U CN201320506379 U CN 201320506379U CN 203455450 U CN203455450 U CN 203455450U
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- chip
- testing
- main substrate
- test
- rotary
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Abstract
The utility model discloses a switching-type IC chip testing device. The switching-type IC chip testing device includes a main substrate provided with at least a testing unit, wherein each testing unit includes a testing line which is disposed on the surface of the main substrate, a work bench which is disposed on a front surface of the main substrate and which is used fixing a to be tested chip, and a testing chip which is disposed at the rear surface of the main substrate, each testing unit also includes a testing substrate; the testing chip is disposed on the testing substrate, a set of inserting pins is disposed on each testing substrate, at least a set of insertion grooves is correspondingly disposed on the rear surface of the main substrate, and the testing chip is connected with the main substrate through pluggable connection of the insertion pins and the insertion grooves. With the switching-type IC chip testing device, testing chips can be replaced conveniently, so that the problem that an entire testing unit can be scrapped due to the damage of the testing chip is solved.
Description
Technical field
The utility model relates to IC measuring technology, relates in particular to a kind of rotary-connecting IC apparatus for testing chip.
Background technology
Integrated circuit (Integrated Circuit, IC) chip is the monolithic module designing for completing certain electrical characteristics function, due to the manufacturing process at IC chip or use procedure defect that bring and that material itself more or less has, cause product to occur bad individuality, thereby IC chip testing also just becomes one of indispensable operation in integrated circuit manufacture, the undesirable defective products causing due to physical imperfection in manufacture process to detect those.
The IC apparatus for testing chip of prior art generally includes the substrate that is provided with one or more test cells, each test cell include be located at substrate surface measurement circuit, be located at the positive worktable for fixing chip to be detected of substrate and be located at the test chip of substrate reverse side.
Yet inventor finds in implementing process of the present utility model, in use, test chip there will be the situation of damage.And because test chip is directly welded on main substrate, be difficult to change, therefore, after test chip damages, whole test cell just can only be scrapped.
Utility model content
Technical problem to be solved in the utility model is: a kind of rotary-connecting IC apparatus for testing chip is provided, and this device can be changed test chip easily, efficiently solves because test chip damages the problem that causes whole test cell to be scrapped.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of rotary-connecting IC apparatus for testing chip, comprise the main substrate that is provided with at least one test cell, each test cell includes the measurement circuit of being located at described main substrate surface, be located at the worktable for fixing chip to be tested in described main substrate front, with the test chip of being located at the described main substrate back side, each test cell also includes test base, described test chip is located on described test base, and each test base is provided with one group of inserting foot, and on the back side of described main substrate, be provided with at least one group of corresponding inserting groove, described test chip can be connected with corresponding inserting groove by described inserting foot with described main substrate with plugging.
Preferably, at the described main substrate back side, be also provided with some support columns, the length of every support column be more than or equal to described inserting groove height and test base thickness and.
Preferably, described test chip and described inserting foot are located at the homonymy of described test base.
Preferably, the quantity of described test cell is 2-4.
Preferably, the quantity of described support column is 6-10 root.
Preferably, be provided with somely for the mounting hole site of support column is installed at the edge of described main substrate, the quantity of this mounting hole site is more than or equal to the quantity of described support column.
Preferably, the close test base position on described main substrate is also provided with at least one preformed hole position.
Preferably, described support column is metal material.
Preferably, described inserting foot and inserting groove are for laterally or vertically arranging.
The beneficial effects of the utility model are:
Embodiment of the present utility model is by arranging the test base that can be connected with motherboard plug-in, test chip is located on test base, thereby when test chip damages, only need extract test base just can change test chip easily, efficiently solves because test chip damages the problem that causes whole test cell to be scrapped.
Below in conjunction with accompanying drawing, the utility model is described in further detail.
Accompanying drawing explanation
Fig. 1 is the side schematic view of an embodiment of rotary-connecting IC apparatus for testing chip of the present utility model.
Fig. 2 is the structure schematic diagram of main substrate in embodiment of rotary-connecting IC apparatus for testing chip of the present utility model.
Fig. 3 is a side schematic view of test base in embodiment of rotary-connecting IC apparatus for testing chip of the present utility model.
Embodiment
Below with reference to Fig. 1-Fig. 3, describe an embodiment of the rotary-connecting IC apparatus for testing chip that the utility model provides in detail, as shown in the figure, the present embodiment mainly comprises the main substrate 1 that is provided with at least one test cell 2, each test cell 2 includes the measurement circuit (not shown) of being located at described main substrate 1 surface, be located at the worktable 21 for fixing chip to be tested in described main substrate 1 front, with the test chip 22 of being located at described main substrate 1 back side, in addition, each test cell 2 also includes test base 23, described test chip 22 is located on described test base 23, and each test base 23 is provided with one group of inserting foot 24, and on the back side of described main substrate 1, be provided with corresponding at least one group of inserting groove 3, described test chip 22 can be connected with corresponding inserting groove 3 by described inserting foot 24 with described main substrate 1 with plugging.
In addition, on described main substrate 1, be also provided with for connecting the interface 101 of power supply or data line, and pushbutton switch 102.
During specific implementation, described test chip 22 and described inserting foot 24 can be located at the homonymy of described test base 23.
Further, at described main substrate 1 back side, also can be provided with some support columns 4, the length of every support column 4 be more than or equal to described inserting groove 4 height and test base 23 thickness and.
During specific implementation, the quantity of test cell 2 can be according to actual needs at 2-8, concrete setting in even more scope.In the present embodiment, the quantity of test cell 2 is 4; The quantity of support column 4 can be according to concrete test cell 2 quantity relative set.When the quantity of test cell 2 is 4, the quantity of support column 4 can be made as 6-10 root.Described support column is metal material.
Further, at the edge of described main substrate 1, can be provided with that some the quantity of this mounting hole site 5 is more than or equal to the quantity of described support column 4 for the mounting hole site 5 of support column 5 is installed, thereby reach the effect that increases and decreases easily according to actual needs support column 4.
In addition, close test base 23 positions on described main substrate 1 also can be provided with at least one preformed hole position 6.
As a preferred implementation of the present embodiment, described inserting foot 24 and inserting groove 3 can be laterally or vertically arrange.
The above is preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection domain of the present utility model.
Claims (9)
1. a rotary-connecting IC apparatus for testing chip, comprise the main substrate that is provided with at least one test cell, each test cell includes the measurement circuit of being located at described main substrate surface, be located at the worktable for fixing chip to be tested in described main substrate front, with the test chip of being located at the described main substrate back side, it is characterized in that: each test cell also includes test base, described test chip is located on described test base, and each test base is provided with one group of inserting foot, and on the back side of described main substrate, be provided with at least one group of corresponding inserting groove, described test chip can be connected with corresponding inserting groove by described inserting foot with described main substrate with plugging.
2. rotary-connecting IC apparatus for testing chip as claimed in claim 1, is characterized in that: at the described main substrate back side, be also provided with some support columns, the length of every support column be more than or equal to described inserting groove height and test base thickness and.
3. rotary-connecting IC apparatus for testing chip as claimed in claim 1 or 2, is characterized in that: described test chip and described inserting foot are located at the homonymy of described test base.
4. rotary-connecting IC apparatus for testing chip as claimed in claim 3, is characterized in that: the quantity of described test cell is 2-4.
5. rotary-connecting IC apparatus for testing chip as claimed in claim 4, is characterized in that: the quantity of described support column is 6-10 root.
6. rotary-connecting IC apparatus for testing chip as claimed in claim 5, is characterized in that: at the edge of described main substrate, be provided with somely for the mounting hole site of support column is installed, the quantity of this mounting hole site is more than or equal to the quantity of described support column.
7. rotary-connecting IC apparatus for testing chip as claimed in claim 6, is characterized in that: the close test base position on described main substrate is also provided with at least one preformed hole position.
8. rotary-connecting IC apparatus for testing chip as claimed in claim 7, is characterized in that: described support column is metal material.
9. rotary-connecting IC apparatus for testing chip as claimed in claim 8, is characterized in that: described inserting foot and inserting groove are for laterally or vertically arranging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320506379.4U CN203455450U (en) | 2013-08-19 | 2013-08-19 | Switching-type IC chip testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320506379.4U CN203455450U (en) | 2013-08-19 | 2013-08-19 | Switching-type IC chip testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203455450U true CN203455450U (en) | 2014-02-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320506379.4U Expired - Fee Related CN203455450U (en) | 2013-08-19 | 2013-08-19 | Switching-type IC chip testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203455450U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104181459A (en) * | 2014-08-28 | 2014-12-03 | 永济新时速电机电器有限责任公司 | Testing device for protective adapter boards |
-
2013
- 2013-08-19 CN CN201320506379.4U patent/CN203455450U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104181459A (en) * | 2014-08-28 | 2014-12-03 | 永济新时速电机电器有限责任公司 | Testing device for protective adapter boards |
| CN104181459B (en) * | 2014-08-28 | 2017-01-25 | 永济新时速电机电器有限责任公司 | Testing device for protective adapter boards |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140226 |