CN203435226U - Etching-free aluminum substrate - Google Patents
Etching-free aluminum substrate Download PDFInfo
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- CN203435226U CN203435226U CN201320243169.0U CN201320243169U CN203435226U CN 203435226 U CN203435226 U CN 203435226U CN 201320243169 U CN201320243169 U CN 201320243169U CN 203435226 U CN203435226 U CN 203435226U
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Abstract
The utility model relates to an etching-free aluminum substrate. The etching-free aluminum substrate comprises an insulating layer, a front-surface circuit which is distributed on the front surface of the insulating layer, and an aluminum plate which is laminated on the back surface of the insulating layer. The utility model also discloses an LED lamp comprising the etching-free aluminum substrate. The etching-free aluminum substrate of the utility model is advantageous in greatly reduced material cost and production cost, greatly improved heat dissipation performance, improved reliability and qualified rate, avoidance of a seriously-polluting etching process of a whole manufacturing process, and great environmentally-friendly property.
Description
Technical field
The utility model relates to the field of LED wiring board, be specifically related to a kind of without etching aluminium base and manufacture method, and the LED light fixture of being made by this aluminium base.
Background technology
No matter the flexible circuit board of prior art, be single sided board, double sided board or multi-panel, generally all adopts copper material or Cu alloy material as wiring material layer.In some technology of latest developments, also have and adopt Copper Foil as the example of line layer.The defect of the flexible circuit board of these prior aries is many-sided.
Copper Foil is very high as its material cost of wiring material layer, and the cost of raw material of copper material will be more and more higher, so the cost of traditional circuit plate is very high.Even some manufacturer is in order to save material cost, copper thickness is reduced, but material cost is still high, do like this service behaviour that can make copper thickness excessively reduce and cause affecting wiring board, for example reliability, intensity, conductivity, thermal diffusivity etc.
In addition, the solder joint on the line layer of this flexible circuit board is also obviously brazing point.If being exposed in air ambient, this brazing point can within very short time, be oxidized, make to affect its solderability in the technique of follow-up welding electronic component, for example can cause solder joint sealing-off, welding after poorly conductive, solder bond intensity low, even do not weld, etc.For this reason; in the prior art; manufacturer conventionally understands butt welding point and carries out Passivation Treatment by chemical method; but; the effect of this Passivation Treatment is still bad; brazing point after passivation still can severe oxidation after the long period in being exposed to air, solderability and the soldering reliability of impact welding procedure subsequently.In the practice of prior art, because the brazing point solderability of flexible circuit board is poor, causing application product as the problems of welded quality of LED light fixture, LED module etc., and then affect the situation in rate of finished products, reliability and the useful life of application product, is very general.
And the LED wiring board of prior art is still not too superior aspect heat dispersion, some application scenario of the good heat dissipation that cannot meet the demands.
The frequent LED circuit base plate of prior art is usually directed to etch process, therefore seriously polluted, does not meet national industry developing direction.
Therefore, in this area, in the urgent need to a kind of, there is novel circuit base plate, to alleviate or even to avoid above-mentioned defect, and reduce product cost.
Utility model content
In view of the above, the utility model has been proposed.The utility model is intended to solve the above technical problem with other.
According to the utility model, provide a kind of without etching aluminium base, comprising: insulating barrier; Be arranged in the front circuit on the front of described insulating barrier; With the aluminium sheet being pressed together on the back side of described insulating barrier.
According to an embodiment of the present utility model, described front circuit is the plain conductor of sheet or strip.
According to an embodiment of the present utility model, described plain conductor is the aluminum conductor being formed by aluminum sheet or aluminium plate cross cutting.
According to an embodiment of the present utility model, described aluminium sheet is by bonding and be pressed together on the back side of described insulating barrier.
According to an embodiment of the present utility model, the thickness of described aluminium sheet is 0.1-2 millimeter.
According to an embodiment of the present utility model, described aluminum conductor is provided with the coat of metal.
According to an embodiment of the present utility model, on described aluminum conductor, be coated with nickel coating.
According to an embodiment of the present utility model, described positive trace arrangements is also fixed on by heat-conducting glue on the front of described insulating barrier.
According to an embodiment of the present utility model, described insulating barrier is glass plate or sheet glass.
According to an embodiment of the present utility model, on the back side of described glass plate or sheet glass, be coated with aluminium coated or silver coating.
The utility model also provides a kind of LED light fixture, and it comprises of the present utility model without etching aluminium base, and is welded on the components and parts that at least comprise LED on the corresponding solder joint of described front circuit.
According to an embodiment of the present utility model, described aluminum conductor is fine aluminium or aluminium alloy circuit layer.
According to an embodiment of the present utility model, the described coat of metal is nickel coating, nickel plating alloy layer, silver coating, zinc coat or tin coating.
According to an embodiment of the present utility model, the described coat of metal is composite deposite.
According to an embodiment of the present utility model, described composite deposite is copper facing internal layer and the outer field combination of nickel plating, or zinc-plated internal layer and the outer field combination of nickel plating.
According to an embodiment of the present utility model, described is flexible circuit board or rigidity wiring board without etching aluminium base.
The utility model has also disclosed a kind of without etching aluminium base, comprising: glass dielectric layer; Be arranged in the front circuit on the front of described glass dielectric layer; Be printed on the transparent welding resistance ink on the front of described glass dielectric layer; With stick on the reflective membrane on the back side of described glass dielectric layer or be coated on the reflecting metal coating on the described back side.
The utility model has also disclosed a kind of method of manufacturing without etching aluminium base, comprising: insulating barrier is provided; By aluminum sheet or aluminium plate cross cutting, die-cut or be laser-cut into predetermined front circuit; According to predetermined circuit design, by described positive trace arrangements and be fixed on the front of described insulating barrier; Backsizing at described insulating barrier; The back side of described insulating barrier is pressed together on aluminium sheet.
Of the present utility modelly without etching aluminium base, be particularly useful for installing LED, that is, be applicable to make LED light fixture, lamp bar or lamp band.
Of the present utility modelly without its material cost of etching aluminium base and cost of manufacture, can greatly reduce; and thermal diffusivity improves greatly; thereby the reliability and the yields that have improved aluminium base product, whole manufacturing process does not relate to serious pollution etching work procedure, therefore very environmental protection.
In below to the description of the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Accompanying drawing explanation
By reading in conjunction with the following drawings this specification, it is more apparent that feature of the present utility model, object and advantage will become, in the accompanying drawings:
Fig. 1 has shown according to the partial section without etching aluminium base of the utility model one embodiment.
Fig. 2 has shown the front schematic view without etching aluminium base for the manufacture of LED light fixture according to the utility model one embodiment, has shown coverlay and the solder joint exposing.
Embodiment
To be described in more detail the utility model below.
Before describing the utility model in detail, those skilled in the art are to be understood that, " components and parts " should do the understanding in the most wide in range connotation in this application, the components and parts that comprise all types of electronic devices and components for circuit, electric components or other type, various resistance for example, the components and parts of various surface mount (SMT) type, the components and parts of support rack type, various high power devices etc., comprise great power LED, etc.
Below in conjunction with drawings and Examples, the manufacturing process without etching aluminium base of the present utility model and structure are described in further detail.
The related materials of flexible circuit board
The raw material volume of traditional LED flexible circuit board is also referred to as the coiled material of copper-clad plate.In this flexible circuit board, for example, in the structure of double-sided wiring board, typical structure is five layers, that is, and and two-layer copper foil circuit layer, and be bonded in the insulating barrier between this two-layer copper foil circuit layer.Insulating barrier has formed the basal layer of flexible circuit.At the covering rete of bonding protective action of the outside of this two-layer line layer difference, this covering rete for example can be made by CVL.
The material of insulating barrier has many kinds, and wherein the most conventional is polytetrafluoroethylene, polyimides, polyester and PI (PI) material.Polyimide material has non-flammable, physical dimension is stable, there is higher tensile strength, and the ability with the welding temperature of bearing, polyester, also referred to as PETG (being called for short PET), its physical property is similar to polyimides, have lower dielectric constant, the humidity of absorption is very little, but non-refractory.Polyester presents rigidity in cryogenic applications.These materials all can be used for forming insulating barrier.
In traditional prior art, generally all adopt Copper Foil as the line layer in flexible circuit.It can adopt the mode of electro-deposition (ED), forging (RA).Copper Foil is the material with compliance, can be made into be permitted multi-thickness and width.The Copper Foil of forging, except having pliability, also has the feature that hard is level and smooth, and it is suitable for being applied among the occasion that requires dynamic deflection.
In the prior art, adoptable material is fine copper or copper alloy aborning at present, zinc yellow copper for example, and the thickness of Copper Foil is more than 10Z.If employing fine copper, the General Requirements of fine copper is T2 copper.The requirement of copper alloy is generally Tp2 or copper content more than 20%, and remaining composition can be zinc (Zn) or other trace additives.
Fig. 1 has shown according to the partial section without etching aluminium base of the utility model one embodiment, has shown this interlayer structure without etching aluminium base.
As shown in Figure 1, the basic conception of this embodiment of the present utility model is: insulating barrier 8 is provided, by aluminum sheet or aluminium plate cross cutting, die-cut or be laser-cut into predetermined front circuit 5, according to predetermined circuit design, front circuit 5 is arranged and be fixed on the front of insulating barrier 8, at the backsizing of insulating barrier 8, and the back side of insulating barrier 8 is pressed together on aluminium sheet 6.Like this, can greatly save the cost of manufacture of wiring board, and do not relate to serious pollution etching work procedure at all in whole manufacturing process, therefore very environmental protection, also meets country in the development of this industry and helps strategy.Due to the good conductive thermal conductivity of aluminium and the thermal diffusivity of aluminium sheet, therefore the heat radiation of the LED light fixture without etching aluminium base of the present utility model will be conducive to adopt.
According to one preferably but do not have restrictive execution mode, the detailed manufacturing process of the above-mentioned Fig. 1 embodiment without etching aluminium base of the present utility model is as follows:
Insulating barrier 8 is provided, and this insulating barrier can be insulating barrier conventional in this area, certain thickness insulating trip or the dielectric film for example by polytetrafluoroethylene, polyimides, polyester and PI (PI), made.
According to a particularly preferred embodiment, due to the thermal conductive resin of glass, superior insulating properties and irreplaceable light transmission, also can adopt sheet glass to manufacture insulating barrier 8.
According to another embodiment particularly preferably of the present utility model, adopt sheet glass to manufacture insulating barrier 8, front circuit 5 is arranged on the front of glass dielectric layer 8, reflective for the ease of the back side, the welding resistance ink of printing transparent on the front of glass dielectric layer 8, and can on the back side of glass dielectric layer 8, paste reflective membrane or coating reflecting metal coating.
By aluminum sheet or aluminium plate cross cutting, die-cut or be laser-cut into predetermined front circuit 5, then, according to predetermined circuit design, this front circuit 5 is arranged and be fixed on the front of insulating barrier 8, meanwhile, according to circuit needs, can on front circuit 5, carry out cross cutting or die-cut, form a plurality of otch (example is otch as shown in Figure 2), thereby form corresponding a plurality of part of path, so just between adjacent part of path, formed the disconnection of circuit.Like this, by between adjacent part of path at pad locations burn-on LED and/or other components and parts, just can form the coupled in series of circuit.
At the backsizing of arranging by the insulating barrier 8 of this front circuit 5, and the back side of insulating barrier 8 is pressed together on aluminium sheet 6.
According to a particularly preferred embodiment, when adopting sheet glass to manufacture insulating barrier 8, in order to be convenient to that when for LED light fixture the bright dipping that sees through the sheet glass 8 arrival back sides is reflexed to front light direction, thereby improve light emission rate or luminous efficiency and further improve thermal diffusivity, can plate one deck aluminium lamination or silver layer at the back side of the sheet glass 8 as insulating barrier.Furthermore, optionally on this aluminium coated or silver coating, stick again aluminium sheet 6.
According to the specific needs of the application scenario for LED light fixture, as shown in Figure 2, the front coverlay 7 of windowing at pad 2 places also can be provided, then at the positive contraposition laminating front of line layer coverlay 7 and carry out pressing, so just can obtain exposed pad 2 without etching aluminium base.
As a preferred implementation, with aluminium sheet 5 or aluminium foil, as line material, substitute Copper Foil as baseplate material, not only can guarantee the satisfactory electrical conductivity of circuit, more crucial is a bit greatly to reduce the material cost of wiring board.For example, without the material cost of etching aluminium base by be copper foil plate 1/4th or even lower.
Certainly, according to general inventive concept of the present utility model, those skilled in the art are obviously appreciated that, on front circuit 5 and/or solder joint 2, coat of metal material can be set, this coat of metal, except being nickel metal, also can select other can improve the material of solderability, for example, nickel alloy, silver, zinc, tin, or their combination, etc.
This coating can be also composite deposite, first copper plate nickel coating then for example, or first zinc-plated then nickel coating, etc.
This structure of the present utility model and manufacture craft make greatly to reduce material cost and production cost, improve thermal diffusivity, improve reliability and conductivity.
According to a preferred embodiment of the present utility model, of the present utility model, mount on without etching aluminium base product or the components and parts of welded and installed can comprise all kinds of LED, resistance and electric capacity, etc.
Obviously, this area designer is appreciated that completely according to different application scenarios and customer requirement, of the present utility modelly without etching aluminium base product, can comprise various types of LED, resistance and other components and parts etc.
Above by the agency of specific embodiment of the utility model.Yet should be appreciated that and do not departing under the prerequisite of spirit and scope of the present utility model, can carry out various modifications.Therefore, other embodiment also belongs to the protection range of claim of the present utility model.Therefore the utility model is not limited to disclosed the drawings and specific embodiments, and scope of the present utility model is limited by claim.
Claims (10)
1. without an etching aluminium base, it is characterized in that, comprising:
Insulating barrier;
Be arranged in the front circuit on the front of described insulating barrier; With
Be pressed together on the aluminium sheet on the back side of described insulating barrier.
2. according to claim 1ly without etching aluminium base, it is characterized in that, described front circuit is the plain conductor of sheet or strip.
3. according to claim 2ly without etching aluminium base, it is characterized in that, described plain conductor is the aluminum conductor being formed by aluminum sheet or aluminium plate cross cutting.
4. according to claim 3ly without etching aluminium base, it is characterized in that, on described aluminum conductor, be coated with nickel coating.
5. according to claim 1ly without etching aluminium base, it is characterized in that, described aluminium sheet is by bonding and be pressed together on the back side of described insulating barrier.
6. according to claim 1ly without etching aluminium base, it is characterized in that, the thickness of described aluminium sheet is 0.1-2 millimeter.
7. according to claim 1ly without etching aluminium base, it is characterized in that, described positive trace arrangements is also fixed on by heat-conducting glue on the front of described insulating barrier.
8. according to claim 1ly without etching aluminium base, it is characterized in that, described insulating barrier is glass plate or sheet glass.
9. according to claim 8ly without etching aluminium base, it is characterized in that, on the back side of described glass plate or sheet glass, be coated with aluminium coated or silver coating.
10. without an etching aluminium base, it is characterized in that, comprising:
Glass dielectric layer;
Be arranged in the front circuit on the front of described glass dielectric layer;
Be printed on the transparent welding resistance ink on the front of described glass dielectric layer; With
Stick on the reflective membrane on the back side of described glass dielectric layer or be coated on the reflecting metal coating on the described back side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320243169.0U CN203435226U (en) | 2013-05-06 | 2013-05-06 | Etching-free aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320243169.0U CN203435226U (en) | 2013-05-06 | 2013-05-06 | Etching-free aluminum substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203435226U true CN203435226U (en) | 2014-02-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320243169.0U Expired - Fee Related CN203435226U (en) | 2013-05-06 | 2013-05-06 | Etching-free aluminum substrate |
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| Country | Link |
|---|---|
| CN (1) | CN203435226U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103237410A (en) * | 2013-05-06 | 2013-08-07 | 田茂福 | Non-etched aluminum substrate and manufacturing method thereof |
-
2013
- 2013-05-06 CN CN201320243169.0U patent/CN203435226U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103237410A (en) * | 2013-05-06 | 2013-08-07 | 田茂福 | Non-etched aluminum substrate and manufacturing method thereof |
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| EXPY | Termination of patent right or utility model |