CN203407074U - Multilayer printed circuit board - Google Patents
Multilayer printed circuit board Download PDFInfo
- Publication number
- CN203407074U CN203407074U CN201320539362.9U CN201320539362U CN203407074U CN 203407074 U CN203407074 U CN 203407074U CN 201320539362 U CN201320539362 U CN 201320539362U CN 203407074 U CN203407074 U CN 203407074U
- Authority
- CN
- China
- Prior art keywords
- board
- printed circuit
- circuit board
- multilayer printed
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a multilayer printed circuit board and especially relates to the technical field of circuit board. The multilayer printed circuit board includes a board body, an installation hole and an integrated circuit working area. The board body includes a face board, a bottom board and a plurality of insulation boards provided with printed circuit lines. The insulation boards are disposed between the face board and the bottom board. The printed circuit lines of the insulation boards are connected with each other through buried holes. The face board and the bottom board are each provided with blind holes communicated with the printed circuit lines correspondingly. The multilayer printed circuit board provided by the utility model is reasonable in circuit layout and well-aligned in electronic component distribution. By utilizing both of the face board and the bottom board of the multilayer printed circuit board for mounting electronic components at the same time, circuit board area utilizing rate is increased substantially. By arranging reinforcing sleeves on the periphery of the board body, solidity of the board body is enhanced and integral safety performance of the multiplayer printed circuit board is improved.
Description
Technical field
The utility model relates to circuit board technology field, relates in particular to a kind of multilayer board.
Background technology
In various electronic equipments, all adopt printed circuit board (PCB) as the substrate of retaining element and connecting circuit at present.Some electronic equipment complex circuit, needed printed circuit lines is difficult to distribute on one layer circuit board, often need multilayer circuit board to carry out whole configuration, but conventionally all electronic components are arranged on to the same face of multilayer board, cause electronic component to distribute chaotic, fastness is poor, and usage safety performance is low.
Utility model content
The technical problem that the utility model solves is to overcome the deficiencies in the prior art, at multilayer board panel and base plate, integrated circuit service area is installed respectively, and in circuit board edge, reinforcing sleeve is set, make printed circuit integral layout reasonable, electronic component distributes in order, usage safety performance is strong, and has greatly improved the firm performance of circuit board and the utilance of area.
To achieve these goals, the utility model is taked following technical scheme:
A kind of multilayer board, it comprises plate body, installing hole and integrated circuit service area, described plate body comprises the insulation board of panel, base plate and polylith band printed circuit board wiring, described insulation board is between described panel and described base plate, printed circuit board wiring between every described insulation board is communicated with by buried via hole, and described panel and described base plate are respectively arranged with the blind hole with the corresponding connection of printed circuit board wiring of described insulation board.
Described panel and base plate are installed respectively integrated circuit service area simultaneously.
Described plate body edge arranges reinforcing sleeve, and described reinforcing sleeve is glass mat.
Beneficial effect
The utility model reasonable circuit layout, electronic component distributes in order, utilize multilayer board panel and base plate while installing electronic elements respectively, greatly improved the utilance of board area, in plate body edge, reinforcing sleeve is set, increase the firm performance of plate body, improved the general safety performance of circuit board.
Accompanying drawing explanation
Fig. 1 is vertical view of the present utility model.
Fig. 2 is upward view of the present utility model
Fig. 3 cross-sectional view of the present utility model
1-plate body, 11-panel, 12-base plate, 13-insulation board, 2-installing hole, 3-integrated circuit service area, 4-buried via hole, 5-blind hole, 6-reinforcing sleeve.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail:
As shown in Figure 1:
A kind of multilayer board, it comprises plate body 1, installing hole 2 and integrated circuit service area 3, described plate body comprises the insulation board 13 of panel 11, base plate 12 and polylith band printed circuit board wiring, described insulation board 13 is between described panel 11 and described base plate 12, printed circuit board wiring between every described insulation board 13 is communicated with by buried via hole 4, and described panel 11 and described base plate 12 are respectively arranged with the blind hole 5 with the corresponding connection of printed circuit board wiring of described insulation board 13.
Described panel 11 and base plate 12 are installed respectively integrated circuit service area 3 simultaneously.
Described plate body edge arranges reinforcing sleeve 6, and described reinforcing sleeve 6 is glass mat.
Certainly; above-mentioned explanation is not to restriction of the present utility model; the utility model is also not limited in above-mentioned giving an example, and the variation that those skilled in the art make in essential scope of the present utility model, remodeling, interpolation or replacement, also should belong to protection range of the present utility model.
Claims (2)
1. a multilayer board, it comprises plate body, installing hole and integrated circuit service area, described plate body comprises the insulation board of panel, base plate and polylith band printed circuit board wiring, described insulation board is between described panel and described base plate, printed circuit board wiring between every described insulation board is communicated with by buried via hole, described panel and described base plate are respectively arranged with the blind hole with the corresponding connection of printed circuit board wiring of described insulation board, it is characterized in that, described panel and base plate are installed respectively integrated circuit service area simultaneously.
2. a kind of multilayer board as claimed in claim 1, is characterized in that, described plate body edge arranges reinforcing sleeve, and described reinforcing sleeve is glass mat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320539362.9U CN203407074U (en) | 2013-08-30 | 2013-08-30 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320539362.9U CN203407074U (en) | 2013-08-30 | 2013-08-30 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203407074U true CN203407074U (en) | 2014-01-22 |
Family
ID=49942992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320539362.9U Expired - Fee Related CN203407074U (en) | 2013-08-30 | 2013-08-30 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203407074U (en) |
-
2013
- 2013-08-30 CN CN201320539362.9U patent/CN203407074U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN FUCHANGTAI PRECISION CIRCUIT CO., LTD. Free format text: FORMER OWNER: HAIYANG BIAIQI ELECTRONICS CO., LTD. Effective date: 20141219 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 265100 YANTAI, SHANDONG PROVINCE TO: 518104 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20141219 Address after: 518104, Shenzhen, Guangdong, Baoan District province manhole street, Wan An Road (West) Heng Changrong Industrial Park, C building on the first floor, A District Patentee after: Shenzhen fosunny Tai Precision circuit Co. Ltd. Address before: 265100 No. 12, Nanjing street, Haiyang Economic Development Zone, Yantai, Shandong Patentee before: Haiyang Bi Ai odd electron Co., Ltd |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140122 Termination date: 20160830 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |