CN203386737U - LED die bonder die sucking swing arm device - Google Patents
LED die bonder die sucking swing arm device Download PDFInfo
- Publication number
- CN203386737U CN203386737U CN201320413041.4U CN201320413041U CN203386737U CN 203386737 U CN203386737 U CN 203386737U CN 201320413041 U CN201320413041 U CN 201320413041U CN 203386737 U CN203386737 U CN 203386737U
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- Prior art keywords
- suction nozzle
- brilliant
- swing arm
- suction
- led die
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Abstract
The utility model relates to an LED die bonder die sucking swing arm device. The LED die bonder die sucking swing arm device comprises a die sucking swing arm, and an elastic suction nozzle assembly which is fixed on one end of the die sucking swing arm. The die sucking swing arm is made from a light material as a whole. The elastic suction nozzle assembly comprises a suction nozzle base, a suction nozzle sleeve which is slidably installed on the suction nozzle base and can be moved up and down vertically relative to the die sucking swing arm, a suction nozzle which is sleeved into the suction nozzle sleeve and can be moved along with the suction nozzle sleeve, and an elastic element which is sleeved onto the suction nozzle sleeve and is retractable elastically when the suction nozzle sleeve is moved. According to the LED die bonder die sucking swing arm device of the utility model, the integral part type die sucking swing arm can be used to ensure the rigidity of the structure so as to make the structure moved accurately and steadily in the moving process, and the elastic suction nozzle assembly can be used to ensure that the suction nozzle is always in the vertical state, is retractable flexibly, and has the advantage of balanced stress when being in contact with a die in the die sucking operation process.
Description
Technical field
The utility model embodiment relates to LED die bond machine, relates in particular to a kind of brilliant swinging arm device of suction of LED die bond machine.
Background technology
At present in the rear packaging process of light-emitting diode (LED) procedure for producing; often can adopt LED die bond machine to carry out wafer binding operation; its mainly move by: utilize thimble that wafer jack-up from being adsorbed blue film is left to blue film; then utilize to inhale the set suction nozzle of brilliant swing arm front end and hold wafer, the carrying by swing arm is put into wafer the assigned address of LED support.And the brilliant swing arm of traditional suction is two sections or above composition, middle for shell fragment connect, the swing arm front end is fixing suction nozzle directly, when inhaling brilliant operation, relies on the swing arm front end upspring and avoid damage wafers.Due to swing arm, length inertia in high-speed motion is larger, so the strength size of shell fragment is difficult to control, too great Yi weighs wafer wounded, and too little swing arm mechanical rigid is inadequate again, shake also can occur and the crushing wafer.And because swing arm front end integral body is upspring, suction nozzle tilts in theory, and the wafer discontinuity equalization is larger to the damage of wafer, and the wearing and tearing of thimble and suction nozzle are also more serious.
The utility model content
Technical problem to be solved in the utility model is, provides a kind of suction for LED die bond machine brilliant swinging arm device, vertically and flexible stress equalization during flexible, contact wafer all the time while making suction nozzle work.
For solving the problems of the technologies described above, the utility model provides following technical scheme: the brilliant swinging arm device of a kind of suction of LED die bond machine, for LED die bond machine, include the elastic suction nozzle assembly of inhaling brilliant swing arm and being fixed on brilliant swing arm one end of described suction, the brilliant swing arm of described suction forms with the light material integral manufacturing, described elastic suction nozzle assembly includes the suction nozzle seat, be slidably mounted on described suction nozzle seat and can the brilliant swing arm of relatively described suction do the suction nozzle sleeve of vertical up-or-down movement, be sleeved in the suction nozzle sleeve and the suction nozzle that can move with described suction nozzle sleeve, and be enclosed within on described suction nozzle sleeve and the elastic component of elastic telescopic when described suction nozzle sleeve motion.
Further, the brilliant swing arm of described suction offers to install the installing hole of described elastic suction nozzle assembly.
Further, the brilliant swing arm of described suction also offers the breach communicated with described installing hole and runs through the through hole of its two relative side, in the time of in the elastic suction nozzle assembly is arranged on described installing hole, hold-down screw is through described through hole and lock hold-down nut and described breach is diminished, thereby described elastic suction nozzle assembly is locked in the installing hole of the brilliant swing arm of described suction.
Further, described elastic suction nozzle assembly also includes the clamp nut be fixed on described suction nozzle seat, and an end of described elastic component is resisted against on described suction nozzle sleeve, and the other end is resisted against on described clamp nut.
Further, the described suction nozzle sleeve outside is provided with boss, and an end of described elastic component is resisted against on the upper surface of described boss.
Further, in described suction nozzle seat, be provided with inner face, the lower surface of described boss coordinates with described inner face, in order to the slip to described suction nozzle sleeve and described suction nozzle, carries out spacing.
Further, described suction nozzle seat is provided with draw-in groove, and described draw-in groove coordinates with described boss, in order to sliding up and down of described suction nozzle sleeve led and limit described suction nozzle sleeve and can not rotate relative to described suction nozzle seat.
Further, described elastic suction nozzle assembly is perpendicular to the brilliant swing arm of described suction.
Further, described elastic component is Compress Spring.
Further, described suction nozzle is to be set in described suction nozzle sleeve lower end, and locks with holding screw.
After adopting technique scheme, the utility model at least has following beneficial effect: the brilliant swinging arm device of the suction of the utility model LED die bond machine guarantees the rigidity of structure by the brilliant swing arm of the suction that utilizes the integral type part, can be accurate while making it to move, steadily action, the damage to wafers of eliminating mechanical shaking and bringing, and while by the elastic suction nozzle assembly, guaranteeing to inhale brilliant work, suction nozzle vertically and flexibly stretches all the time, stress equalization during contact wafer, avoid because the suction nozzle rotation makes wafer orientation inaccurate, and can avoid to greatest extent weighing wounded, the crushing wafer, improve product quality, the wearing and tearing of suction nozzle and thimble are reduced to minimum simultaneously, save consumptive material and reduce production costs.
The accompanying drawing explanation
Fig. 1 is the stereogram of a preferred embodiment of the brilliant swinging arm device of the suction of the utility model LED die bond machine.
Fig. 2 is the three-dimensional exploded view of the brilliant swing arm of the suction in Fig. 1 and elastic suction nozzle assembly.
Fig. 3 is the three-dimensional exploded view of the elastic suction nozzle assembly in Fig. 2.
Fig. 4 is the cutaway view of the brilliant swinging arm device of suction of Fig. 1.
Fig. 5 is the partial view of the brilliant swinging arm device of suction of Fig. 4.
Embodiment
The brilliant swinging arm device of the suction of the utility model LED die bond machine is to draw the also actuator of handling wafers for LED die bond machine, the brilliant swinging arm device of the suction of described LED die bond machine is under the driving of driving mechanism, draw wafer in the crystalline substance ring, after rotating to an angle, wafer is positioned over to the LED support assigned address.Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.It should be noted that, in the situation that do not conflict, embodiment and the technical characterictic in embodiment in the application can mutually combine.
Please refer to Fig. 1 and Fig. 2, inhale in a preferred embodiment of brilliant swinging arm device at the utility model, the brilliant swinging arm device of a kind of suction includes inhales brilliant swing arm 1 and elastic suction nozzle assembly 2.Brilliant swing arm 1 use light material (as the carbon fiber) integral manufacturing of described suction, and be provided with installing hole 11 at front end.Please in the lump with reference to figure 3 to Fig. 5, described elastic suction nozzle assembly 2 at right angle settings, in the installing hole 11 of the brilliant swing arm 1 of described suction, and include gas joint 21. suction nozzle sleeve 22. clamp nut 23. elastic component 24. suction nozzle seats 26. and suction nozzles 27.Described suction nozzle 27 is sleeved in described suction nozzle sleeve 22.Described suction nozzle sleeve 22 is slidably mounted in described suction nozzle seat 26, and can not rotate relative to described suction nozzle seat 26.Elastic component 24 and clamp nut 23 are enclosed within the periphery of described suction nozzle sleeve 22, and an end of described elastic component 24 is resisted against on described suction nozzle sleeve 22, and the other end is resisted against on described clamp nut 23.Described suction nozzle sleeve 22 tops connect described gas joint 21, and described gas joint 21 and described suction nozzle 27 conductings can make described suction nozzle 27 absorption wafers by the negative compression air.Described suction nozzle sleeve 22 can stretch flexibly under the effect of elastic component 24, and drives the slip vertically of described suction nozzle 27 dos and can not the brilliant swing arm 1 of relatively described suction rotate.
Particularly, be provided with boss 221 on described suction nozzle sleeve 22, the upper surface of described boss 221 is resisted against an end of described elastic component 24, Fig. 3 is seen towards the inner face 262(that is located at described suction nozzle seat 26 inboards in lower surface), the lower surface of described boss 221 coordinates with described inner face 262, in order to the slip to described suction nozzle sleeve 22 and described suction nozzle 27, carries out spacing.Described clamp nut 23 is the top at described suction nozzle seat 26 by screw-threaded coupling.When described suction nozzle sleeve 22 in its lower end during stressed and upward sliding, when the described suction nozzle 27 of described suction nozzle sleeve 22 drive moves upward, the upper surface of described boss 221 is pushed described elastic component 24 and is made its elastic shrinkage, the inner face 262 of described suction nozzle seat 26 is left in the lower surface of described boss 221, and when described suction nozzle sleeve 22 does not stress, the upper surface of described elastic component 24 elastic elongations the described boss 221 of downward extruding, to drive described suction nozzle sleeve 22 and described suction nozzle 27 down slidings, until the lower surface of described boss 221 is resisted against on the inner face 262 of described suction nozzle seat 26.Be provided with draw-in groove 261 on described suction nozzle seat 26, described draw-in groove 261 coordinates with described boss 221, in order to sliding up and down of described suction nozzle sleeve 22 led and limit described suction nozzle sleeve 22 and can not rotate relative to described suction nozzle seat 26.Described suction nozzle 27 is to be set in described suction nozzle sleeve 22, and with holding screw 25 locking, the upper end of suction nozzle 27 is sealed by O-ring seal 29 and the gap of the junction of suction nozzle sleeve 22, and the lower surface of stretching out described suction nozzle sleeve 22, described its lower end.
In above-mentioned illustrated embodiment, described elastic component 24 is Compress Spring, and described Compress Spring is elastic telescopic when described suction nozzle sleeve 22 motion.Those skilled in the art can adopt other elastic component that can realize identity function according to principle of the present utility model.
In addition, in embodiment shown in Fig. 2, the front end of the brilliant swing arm 1 of described suction offers the breach 12 communicated with described installing hole 11, and offer the through hole 13 that runs through its two relative side at front end, be arranged on described installing hole 11 when interior at elastic suction nozzle assembly 2, hold-down screw 3 is through described through hole 13 and lock hold-down nut 4 and described breach 12 is diminished, thereby described elastic suction nozzle assembly 2 is locked in the installing hole 11 of the brilliant swing arm 1 of described suction.
The brilliant swinging arm device of the suction of the utility model LED die bond machine utilizes the brilliant swing arm 1 of suction of integral type part to guarantee the rigidity of structure by utilization, can be accurately while making it to move, steadily action, the damage to wafers of eliminating mechanical shaking and bringing, and suction nozzle 27 vertically and flexible stress equalization during flexible, contact wafer all the time while by elastic suction nozzle assembly 2, guaranteeing to inhale brilliant work, avoid because the suction nozzle rotation makes wafer orientation inaccurate, and can avoid to greatest extent weighing wounded, crushing wafer, improve product quality; The wearing and tearing of suction nozzle and thimble are reduced to minimum simultaneously, save consumptive material and reduce production costs.
Although illustrated and described embodiment of the present utility model, for the ordinary skill in the art, be appreciated that in the situation that do not break away from principle of the present utility model and spirit can be carried out multiple variation, modification, replacement and modification to these embodiment, scope of the present utility model is limited by claims and equivalency range thereof.
Claims (10)
1. the brilliant swinging arm device of the suction of a LED die bond machine, include the elastic suction nozzle assembly of inhaling brilliant swing arm and being fixed on brilliant swing arm one end of described suction, it is characterized in that: the brilliant swing arm of described suction forms with the light material integral manufacturing, described elastic suction nozzle assembly includes the suction nozzle seat, be slidably mounted on described suction nozzle seat and can the brilliant swing arm of relatively described suction do vertical up-or-down movement the suction nozzle sleeve, be sleeved in the suction nozzle sleeve and the suction nozzle that can move with described suction nozzle sleeve and be enclosed within on described suction nozzle sleeve and the elastic component of elastic telescopic when described suction nozzle sleeve motion.
2. the brilliant swinging arm device of the suction of LED die bond machine as claimed in claim 1, it is characterized in that: the brilliant swing arm of described suction offers to install the installing hole of described elastic suction nozzle assembly.
3. the brilliant swinging arm device of the suction of LED die bond machine as claimed in claim 2, it is characterized in that: the brilliant swing arm of described suction also offers the breach communicated with described installing hole and runs through the through hole of its two relative side, in the time of in the elastic suction nozzle assembly is arranged on described installing hole, hold-down screw is through described through hole and lock hold-down nut and described breach is diminished, thereby described elastic suction nozzle assembly is locked in the installing hole of the brilliant swing arm of described suction.
4. the brilliant swinging arm device of the suction of LED die bond machine as claimed in claim 1, it is characterized in that: described elastic suction nozzle assembly also includes the clamp nut be fixed on described suction nozzle seat, one end of described elastic component is resisted against on described suction nozzle sleeve, and the other end is resisted against on described clamp nut.
5. the brilliant swinging arm device of the suction of LED die bond machine as claimed in claim 4, it is characterized in that: the described suction nozzle sleeve outside is provided with boss, and an end of described elastic component is resisted against on the upper surface of described boss.
6. the brilliant swinging arm device of the suction of LED die bond machine as claimed in claim 5, it is characterized in that: be provided with inner face in described suction nozzle seat, the lower surface of described boss coordinates with described inner face, in order to the slip to described suction nozzle sleeve and described suction nozzle, carries out spacing.
7. the brilliant swinging arm device of the suction of LED die bond machine as claimed in claim 5, it is characterized in that: described suction nozzle seat is provided with draw-in groove, described draw-in groove coordinates with described boss, in order to sliding up and down of described suction nozzle sleeve led and limit described suction nozzle sleeve and can not rotate relative to described suction nozzle seat.
8. the brilliant swinging arm device of the suction of LED die bond machine as claimed in claim 1, it is characterized in that: described elastic suction nozzle assembly is perpendicular to the brilliant swing arm of described suction.
9. the brilliant swinging arm device of the suction of LED die bond machine as claimed in claim 1, it is characterized in that: described elastic component is Compress Spring.
10. the brilliant swinging arm device of the suction of LED die bond machine as claimed in claim 1, it is characterized in that: described suction nozzle is to be set in described suction nozzle sleeve lower end, and locks with holding screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320413041.4U CN203386737U (en) | 2013-07-11 | 2013-07-11 | LED die bonder die sucking swing arm device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320413041.4U CN203386737U (en) | 2013-07-11 | 2013-07-11 | LED die bonder die sucking swing arm device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203386737U true CN203386737U (en) | 2014-01-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320413041.4U Expired - Fee Related CN203386737U (en) | 2013-07-11 | 2013-07-11 | LED die bonder die sucking swing arm device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203386737U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103872191A (en) * | 2014-02-26 | 2014-06-18 | 九江嘉远科技有限公司 | LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and manufacturing process thereof |
| CN108389828A (en) * | 2018-04-18 | 2018-08-10 | 湖南方彦电子有限公司 | 14B ceramics suction nozzles |
| CN108417514A (en) * | 2018-03-14 | 2018-08-17 | 深圳名飞远科技有限公司 | Welding head mechanism and LED bonders |
| CN108598037A (en) * | 2018-07-10 | 2018-09-28 | 上海赢朔电子科技股份有限公司 | A kind of bonder suction nozzle rapid-aligning mechanism |
| CN110034050A (en) * | 2019-04-17 | 2019-07-19 | 大族激光科技产业集团股份有限公司 | Solve bonding apparatus and its piercing mechanism |
| CN110459491A (en) * | 2019-08-12 | 2019-11-15 | 安徽龙芯微科技有限公司 | A kind of chip manufacture double-station bonder and its application method |
| CN111048644A (en) * | 2014-12-16 | 2020-04-21 | 晶元光电股份有限公司 | Light emitting element |
| CN112908906A (en) * | 2021-03-09 | 2021-06-04 | 深圳新益昌科技股份有限公司 | Automatic pressure switching type swing arm |
| CN114408565A (en) * | 2022-01-24 | 2022-04-29 | 广州诺顶智能科技有限公司 | Suction nozzle device and suction nozzle fixing structure |
-
2013
- 2013-07-11 CN CN201320413041.4U patent/CN203386737U/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103872191A (en) * | 2014-02-26 | 2014-06-18 | 九江嘉远科技有限公司 | LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and manufacturing process thereof |
| CN103872191B (en) * | 2014-02-26 | 2017-04-05 | 九江嘉远科技有限公司 | A kind of manufacture method of LED series SMT suction nozzles |
| CN111048644A (en) * | 2014-12-16 | 2020-04-21 | 晶元光电股份有限公司 | Light emitting element |
| CN108417514A (en) * | 2018-03-14 | 2018-08-17 | 深圳名飞远科技有限公司 | Welding head mechanism and LED bonders |
| CN108389828A (en) * | 2018-04-18 | 2018-08-10 | 湖南方彦电子有限公司 | 14B ceramics suction nozzles |
| CN108598037A (en) * | 2018-07-10 | 2018-09-28 | 上海赢朔电子科技股份有限公司 | A kind of bonder suction nozzle rapid-aligning mechanism |
| CN110034050A (en) * | 2019-04-17 | 2019-07-19 | 大族激光科技产业集团股份有限公司 | Solve bonding apparatus and its piercing mechanism |
| CN110034050B (en) * | 2019-04-17 | 2021-07-20 | 大族激光科技产业集团股份有限公司 | Bonding separating device and puncture mechanism thereof |
| CN110459491A (en) * | 2019-08-12 | 2019-11-15 | 安徽龙芯微科技有限公司 | A kind of chip manufacture double-station bonder and its application method |
| CN110459491B (en) * | 2019-08-12 | 2021-07-27 | 安徽龙芯微科技有限公司 | Double-station die bonder for chip processing and application method thereof |
| CN112908906A (en) * | 2021-03-09 | 2021-06-04 | 深圳新益昌科技股份有限公司 | Automatic pressure switching type swing arm |
| CN114408565A (en) * | 2022-01-24 | 2022-04-29 | 广州诺顶智能科技有限公司 | Suction nozzle device and suction nozzle fixing structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140108 Termination date: 20150711 |
|
| EXPY | Termination of patent right or utility model |