CN103872191A - LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and manufacturing process thereof - Google Patents
LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and manufacturing process thereof Download PDFInfo
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- CN103872191A CN103872191A CN201410064720.4A CN201410064720A CN103872191A CN 103872191 A CN103872191 A CN 103872191A CN 201410064720 A CN201410064720 A CN 201410064720A CN 103872191 A CN103872191 A CN 103872191A
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- suction nozzle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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Abstract
The invention discloses an LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and a manufacturing process thereof. The LED series SMT suction nozzle comprises a nozzle head, a nozzle seat, a core, a screw and a spring, wherein the nozzle head is made of anti-adhesive material, i.e. semi-rigidity composite material, and the semi-rigidity composite material comprises Teflon, polyethylene and polypropylene which are configured in a ratio of 65:25:10 in percentage by weight. The manufacturing process of the suction nozzle comprises the steps of manufacturing the nozzle head; burdening the semi-rigidity composite material: configuring the Teflon, the polyethylene and the polypropylene in the ratio of 65:25:10 in percentage by weight; adding the Teflon into a stirrer for baking and melting; adding the polyethylene and the polypropylene into the stirrer for uniformly stirring for forming the semi-rigidity composite material; injection molding, assembling and assembling the nozzle head and the nozzle seat of the suction nozzle in an interference manner. The LED series SMT suction nozzle solves the problem that the LED is easily adhered to the suction nozzle in the SMT process of the LED, has the characteristics of anti-adhesive property, low reject rate, stable mount quality and capability of effectively protecting the surface of the LED against scratch, and easily realizes industrial production.
Description
Technical field
The present invention relates to a kind of LED series SMT suction nozzle and manufacture craft thereof.
Background technology
Light-emitting diode (English: Light-Emitting Diode, LED is called for short) be the luminous semi-conductor electricity sub-element of a kind of energy.Paster LED is also called SMD LED, be affixed on PCB surface, be applicable to SMT processing, can Reflow Soldering, adopting surface mounted LED has well solved brightness, visual angle, evenness, reliability, the problems such as consistency, with respect to other packagings, it has vibration resistance strong, welding point defect rate is low, the advantages such as high frequency characteristics is good, it has encapsulated more LED chip on less area, adopt lighter PCB and reflector material, the epoxy resin that demonstration reflector need to be filled still less, by removing heavier carbon steel material pin, minification, can easily product weight be alleviated to half, volume and weight only has 1/10 left and right of traditional inserting element, adopt after paster type encapsulation, electronic product volume-diminished 40% one 60%, weight saving 60% one 80%, finally make application more perfect.At present paster LED (SMD LED) is mainly used in the fields such as illuminator, decoration, electronic equipment indicating device, backlight, mobile phone and display and apparatus.
SMD LED adopts PCB and reflector material, and what show reflector filling is epoxy resin, has certain viscosity, and arc-shaped surface can not have cut, to avoid surface tear to cause the luminous bad phenomenon such as shade that have.The transparent resin package dimension error on LED surface is larger, is (± 0.1MM) and expand with heat and contract with cold because considering that the luminous heat bringing causes under normal circumstances, and LED package surface is designed to have the characteristics such as flexible flexibility.The problems such as these features cause LED to mount and often occur in process that LED is bonded on suction nozzle, mounts skew, there is scuffing on surface at SMT, and the high and bulk cargo of equipment inefficiency, material casting rate is many, seriously restrict the industry development of SMD LED.
Summary of the invention
Its object of the present invention is just to provide a kind of LED series SMT suction nozzle and manufacture craft thereof; having solved LED mounts in process and easily to produce LED and be bonded at the problem on suction nozzle at SMT; have the advantages that resistance to bond, material casting rate are low, mount stay in grade and can effectively protect LED surface not to be scratched; and production technology is simple, safety; cost is lower; not high to equipment requirement, be easy to realize suitability for industrialized production.
The technical scheme that realizes above-mentioned purpose and take is,
A kind of LED series SMT suction nozzle, comprises mouth, mouth seat, fuse, screw, spring, and described mouth is resistance to bond material half rigidity composite material, and half rigidity composite material comprises
teflonteflon, polyethylene polyethylene, Polypropylene polypropylene, the by weight percentage proportional arrangement of 65:25:10; Described fuse connects mouth, fuse on described spring housing, and described mouth seat is screwed fuse.
A kind of LED series SMT suction nozzle manufacture craft, comprises step,
1) mouth is made
A) batching of half rigidity composite material, the proportional arrangement of 65:25:10 by weight percentage, will
teflonteflon adds mixer to toast melting; Again polyethylene polyethylene, Polypropylene polypropylene are joined to mixer and carry out uniform stirring, form semi-rigid composite material;
B) injection mo(u)lding, designs injection forming mold according to three elements, described key element one, and material structure size, utilizes Principle of Mechanical Designing to obtain A in design drawing, B, C, D, size through data analysis sample repeatedly; Described key element two, utilizes gas flow negative pressure analytical technology to calculate the degree of depth of B size, the technical requirement that while requiring to ensure suction nozzle work, negative pressure is 3.4Pa; Described key element three, the technical requirement that is 3.4Pa in conjunction with own wt and the gas flow negative pressure of LED calculates the through hole internal diameter of H, and then utilizes injection molding machine injection mo(u)lding;
C) precision optical machinery processing, causes being stuck on suction nozzle for preventing that LED overall dimension that LED face coat error causes is more greatly excessive, utilizes precision optical machinery process equipment, to mouth by 12 equal portions to E, F place carries out the processing of empty avoiding fluting;
D) sandblast processing, utilizes sand-blasting machine, carries out sandblast deburring processing to completing the mouth of cut;
E) nano-plating processing, carries out nano-plating processing by the mouth that completes blasting treatment, ensures that mouth inwall is bright and clean, and surface becomes black and resistance to bond;
2) mouth seat is made, and according to the model of SMT mounting device, specification and testing requirement, adopts stainless steel 303CU material, utilizes plant equipment processing suction nozzle mouth seat, then, through sandblast, polishing, electroplating technology processing, completes the making of suction nozzle mouth seat;
3) assembling, adopts assembly tool, and suction nozzle mouth and mouth seat are carried out to interference assembling.
Compared with prior art the present invention has the following advantages.
,suction nozzle mouth of the present invention has used the semi-rigid composite material of resistance to bond, has solved sticking contradiction between suction nozzle and LED components and parts, has effectively avoided LED to mount the easy LED of generation in process at SMT and has been bonded on suction nozzle;
2,suction nozzle mouth of the present invention configuration design, fully takes into account the overall dimension error in LED manufacturing process, draws standard in conjunction with negative pressure of vacuum value, and suitable strengthens 0.5 millimeter by mouth external diameter, has effectively avoided LED to be stuck on suction nozzle and surface tear;
3,cost-saving, enhance productivity, reduce fraction defective.
Brief description of the drawings
Below in conjunction with accompanying drawing, the invention will be further described.
Fig. 1 is nozzle structure schematic front view of the present invention;
Fig. 2 is nozzle structure diagrammatic top view of the present invention;
Fig. 3 is LED material structure sketch in the present invention;
Fig. 4 is mouth physical dimension schematic diagram in the present invention.
Embodiment
Described mouth seat 1 is stainless steel 303CU.
Suction nozzle manufacture craft, comprises step,
1) mouth is made
A) batching of half rigidity composite material, the proportional arrangement of 65:25:10 by weight percentage, will
teflonteflon adds mixer to toast melting; Again polyethylene polyethylene, Polypropylene polypropylene are joined to mixer and carry out uniform stirring, form semi-rigid composite material;
B) injection mo(u)lding, design injection forming mold according to three elements, described key element one, LED material structure size, size 1,2,3,4,5 as shown in Figure 3, utilize Principle of Mechanical Designing to obtain A, B, C, D size in mouth 2 design drawings through data analysis sample repeatedly, as shown in Figure 4; Described key element two, utilizes gas flow negative pressure analytical technology to calculate the degree of depth of B size, the technical requirement that while requiring to ensure suction nozzle work, negative pressure is 3.4Pa; Described key element three, the technical requirement that is 3.4Pa in conjunction with own wt and the gas flow negative pressure of LED calculates the through hole internal diameter of H, and then utilizes injection molding machine injection mo(u)lding;
C) precision optical machinery processing, causes being stuck on suction nozzle for preventing that LED overall dimension that LED face coat error causes is more greatly excessive, utilizes precision optical machinery process equipment, to mouth by 12 equal portions to E, F place carries out the processing of empty avoiding fluting;
D) sandblast processing, utilizes sand-blasting machine, carries out sandblast deburring processing to completing the mouth of cut;
E) nano-plating processing, carries out nano-plating processing by the mouth that completes blasting treatment, ensures that mouth inwall is bright and clean, and surface becomes black and resistance to bond;
2) mouth seat is made, and according to the model of SMT mounting device, specification and testing requirement, adopts stainless steel 303CU material, utilizes plant equipment processing suction nozzle mouth seat, then, through sandblast, polishing, electroplating technology processing, completes the making of suction nozzle mouth seat;
3) assembling, adopts assembly tool, and suction nozzle mouth and mouth seat are carried out to interference assembling.
Claims (2)
1. a LED series SMT suction nozzle, comprises mouth (2), mouth seat (1), fuse (3), screw (4), spring (5), it is characterized in that, described mouth (1) is resistance to bond material half rigidity composite material, and half rigidity composite material comprises
teflonteflon, polyethylene polyethylene, Polypropylene polypropylene, the by weight percentage proportional arrangement of 65:25:10; Described fuse (3) connects mouth (1), and described spring (5) puts fuse (3), and described mouth seat (1) is by the fixing fuse (3) of screw (4).
2. a kind of LED series SMT suction nozzle manufacture craft according to claim 1, is characterized in that, comprises step,
1) mouth is made:
A) batching of half rigidity composite material, half rigidity composite material comprises
teflonteflon, polyethylene polyethylene, Polypropylene polypropylene, the proportional arrangement of 65:25:10 by weight percentage, will
teflonteflon adds mixer to toast melting; Again polyethylene polyethylene, Polypropylene polypropylene are joined to mixer and carry out uniform stirring, form semi-rigid composite material;
B) injection mo(u)lding, designs injection forming mold according to three elements, described key element one, and LED material structure size, utilizes Principle of Mechanical Designing to obtain A in design drawing, B, C, D, size through data analysis sample repeatedly; Described key element two, utilizes gas flow negative pressure analytical technology to calculate the degree of depth of B size, the technical requirement that while requiring to ensure suction nozzle work, negative pressure is 3.4Pa; Described key element three, the technical requirement that is 3.4Pa in conjunction with own wt and the gas flow negative pressure of LED calculates the through hole internal diameter of H, and then utilizes injection molding machine injection mo(u)lding;
C) precision optical machinery processing, causes being stuck on suction nozzle for preventing that LED overall dimension that LED face coat error causes is more greatly excessive, utilizes precision optical machinery process equipment, to mouth by 12 equal portions to E, F place carries out the processing of empty avoiding fluting;
D) sandblast processing, utilizes sand-blasting machine, carries out sandblast deburring processing to completing the mouth of cut;
E) nano-plating processing, carries out nano-plating processing by the mouth that completes blasting treatment, ensures that mouth inwall is bright and clean, and surface becomes black and resistance to bond;
2) mouth seat is made, and according to the model of SMT mounting device, specification and testing requirement, adopts stainless steel 303CU material, utilizes plant equipment processing suction nozzle mouth seat, then, through sandblast, polishing, electroplating technology processing, completes the making of suction nozzle mouth seat;
3) fuse is made, and according to the model of SMT mounting device, specification and testing requirement, adopts stainless steel 303CU material, utilizes plant equipment processing suction nozzle mouth core, then, through polishing, plating, centreless grinding PROCESS FOR TREATMENT, completes the making of suction nozzle mouth core;
4) screw, spring outsourcing;
5) assembling, adopts assembly tool, and suction nozzle mouth and mouth seat are carried out to interference assembling
.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410064720.4A CN103872191B (en) | 2014-02-26 | 2014-02-26 | A kind of manufacture method of LED series SMT suction nozzles |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410064720.4A CN103872191B (en) | 2014-02-26 | 2014-02-26 | A kind of manufacture method of LED series SMT suction nozzles |
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| Publication Number | Publication Date |
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| CN103872191A true CN103872191A (en) | 2014-06-18 |
| CN103872191B CN103872191B (en) | 2017-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410064720.4A Expired - Fee Related CN103872191B (en) | 2014-02-26 | 2014-02-26 | A kind of manufacture method of LED series SMT suction nozzles |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106670775A (en) * | 2016-12-07 | 2017-05-17 | 广东天机工业智能系统有限公司 | Material taking pre-pressing mechanical arm |
| CN114290598A (en) * | 2021-12-20 | 2022-04-08 | 隆扬电子(昆山)股份有限公司 | Suction nozzle forming process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5979547A (en) * | 1982-10-28 | 1984-05-08 | Mitsubishi Electric Corp | Sucker for minute part |
| US4599037A (en) * | 1984-07-02 | 1986-07-08 | United Technologies Corporation | Method and apparatus for manipulating miniature parts |
| CN203386737U (en) * | 2013-07-11 | 2014-01-08 | 深圳市新益昌自动化设备有限公司 | LED die bonder die sucking swing arm device |
-
2014
- 2014-02-26 CN CN201410064720.4A patent/CN103872191B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5979547A (en) * | 1982-10-28 | 1984-05-08 | Mitsubishi Electric Corp | Sucker for minute part |
| US4599037A (en) * | 1984-07-02 | 1986-07-08 | United Technologies Corporation | Method and apparatus for manipulating miniature parts |
| CN203386737U (en) * | 2013-07-11 | 2014-01-08 | 深圳市新益昌自动化设备有限公司 | LED die bonder die sucking swing arm device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106670775A (en) * | 2016-12-07 | 2017-05-17 | 广东天机工业智能系统有限公司 | Material taking pre-pressing mechanical arm |
| CN114290598A (en) * | 2021-12-20 | 2022-04-08 | 隆扬电子(昆山)股份有限公司 | Suction nozzle forming process |
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| Publication number | Publication date |
|---|---|
| CN103872191B (en) | 2017-04-05 |
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