CN203367364U - LED lamp bead for enhancing binding force between LED chip and lead wire - Google Patents
LED lamp bead for enhancing binding force between LED chip and lead wire Download PDFInfo
- Publication number
- CN203367364U CN203367364U CN2013204612953U CN201320461295U CN203367364U CN 203367364 U CN203367364 U CN 203367364U CN 2013204612953 U CN2013204612953 U CN 2013204612953U CN 201320461295 U CN201320461295 U CN 201320461295U CN 203367364 U CN203367364 U CN 203367364U
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- CN
- China
- Prior art keywords
- led
- lead
- wire
- led lamp
- lamp bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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Abstract
The utility model discloses an LED lamp bead for enhancing binding force between an LED chip and lead wires. The LED lamp bead comprises an LED support and is characterized in that the LED support is provided with an LED chip which is provided with several lead wires. The other end of each lead wire is connected on the LED support through several solder joints. The lead wires are welded on the LED support and the LED chip through solder joints. Pulse current can flow through the LED lamp bead. Under certain drive current, the LED lamp bead can continuously operate for a long time. In addition, the LED lamp bead has stable performance and long service life. Meanwhile, the lead wire and solder joint connection effect is guaranteed, yield of the LED lamp bead is guaranteed, manufacturing cost is reduced, and it is convenient for popularization.
Description
Technical field
The utility model belongs to the semiconductor die package processing technique field, specifically, relates to the LED lamp pearl of bonding force between a kind of LED of enhancing wafer and lead-in wire.
Background technology
The packaging technology of LED mainly comprises die bond, bonding wire, dot fluorescent powder, encapsulating and light splitting packing, at present, the solder joint be fixed on the LED support solder joint when in existing LED encapsulation bonding wire craft, gold thread is connected with LED support only has one, that is to say that the gold thread that only has a fish tail end is fixed on the LED support solder joint.The LED bonding wire that the method is made is insecure, solder joint and LED support solder joint bonding place be because the bonding force deficiency easily causes rosin joint, so that gold thread and solder joint form and badly contact, LED can't light, cause a large amount of LED failure weldings, yields is low, manufacturing cost improves.
Summary of the invention
The technical problems to be solved in the utility model is to overcome above-mentioned defect, the LED lamp pearl of bonding force between the enhancing LED wafer that provides a kind of reasonable in design, assurance lead-in wire to be connected effect, assurance yields and reduction manufacturing cost with solder joint and lead-in wire.
For addressing the above problem, the technical scheme that the utility model adopts is:
A kind of LED lamp pearl that strengthens bonding force between LED wafer and lead-in wire, comprise LED support, it is characterized in that: be provided with the LED wafer on described LED support, the LED wafer is provided with some lead-in wires, and the other end of each root lead-in wire is connected on LED support by some solder joints.
As a kind of improvement, described lead-in wire is welded on LED support and LED wafer by solder joint.
As a kind of improvement, an end of described lead-in wire is spheric end, and spheric end is welded on the LED wafer, and the other end of lead-in wire is the fish tail end, and the fish tail end is welded on LED support, and also is provided with some solder joints between lead-in wire and LED support
As a kind of improvement, the solder joint number between described lead-in wire and LED support is two.
As a kind of improvement, be provided with the insulation glue-line of high heat conduction between described LED wafer and LED support.
Owing to having adopted technique scheme, compared with prior art, the utility model can make electric current produce buffering when flowing through lead-in wire, and the electric current of reasonable distribution certain flow is given the lead-in wire of another fish tail end, therefore can reduce the impact of electric current to lead-in wire, effectively prevent the situation that the solder joint of lead-in wire blows because rush of current is excessive.But the utility model extra pulse electric current can work long hours continuously under certain drive-current condition, and stable performance, long service life, simultaneously, guaranteed that lead-in wire is connected effect with LED support, guaranteed the yields of LED lamp pearl, and reduced manufacturing cost, be convenient to promote.
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail simultaneously.
The accompanying drawing explanation
The structural representation that Fig. 1 is a kind of embodiment of the utility model.
In figure: the 1-LED support; The 2-LED wafer; The 3-lead-in wire; The 4-pin.
Embodiment
Embodiment:
As described in Figure 1, a kind of LED lamp pearl that strengthens bonding force between LED wafer and lead-in wire, comprise LED support 1, is provided with LED wafer 2 on LED support 1, LED wafer 2 is provided with some lead-in wires 3, and the other end of each root lead-in wire 3 is connected on LED support 2 by some pins 4.In the utility model, what lead-in wire adopted is the gold thread with conducting function.
In the present embodiment, described lead-in wire 3 is welded on LED support 1 and LED wafer 2 by solder joint 4.Like this, just formed the structure that can switch on.
Consider the needs of actual welding, an end of described lead-in wire 3 is spheric end, and spheric end is welded on LED wafer 2, and 3 the other end of going between is the fish tail end, and the fish tail end is welded on LED support 1, and go between 3 and LED support 1 between also be provided with some solder joints.The design of a plurality of solder joints, both increased the fastness be welded to connect, and effectively prevents again the situation that wire bonds bearing blows because rush of current is excessive.Consider actual processing, it is a kind of selection of the best that the number of solder joint is two.
In the present embodiment, be provided with the insulation glue-line of high heat conduction between described LED wafer 2 and LED support 1.The heat that the insulation glue-line of high heat conduction can produce wafer is delivered on LED support fast, and then passes to thermal component, guarantees that the temperature of wafer can be not too high.
The utility model can make electric current produce buffering when flowing through lead-in wire, and the electric current of reasonable distribution certain flow is given the lead-in wire of another fish tail end, therefore can reduce the impact of electric current to lead-in wire, effectively prevent the situation that the solder joint of lead-in wire blows because rush of current is excessive.But the utility model extra pulse electric current can work long hours continuously under certain drive-current condition, and stable performance, long service life, simultaneously, guaranteed that lead-in wire is connected effect with solder joint, guaranteed the yields of LED lamp pearl, and reduced manufacturing cost, be convenient to promote.
The utility model is not limited to above-mentioned preferred implementation, and anyone should learn the structural change of making under enlightenment of the present utility model, every with the utlity model has identical or akin technical scheme, all belong to protection range of the present utility model.
Claims (5)
1. one kind strengthens the LED lamp pearl of bonding force between LED wafer and lead-in wire, comprise LED support, it is characterized in that: be provided with the LED wafer on described LED support, the LED wafer is provided with some lead-in wires, and the other end of each root lead-in wire is connected on LED support by some solder joints.
2. according to the LED lamp pearl of bonding force between the enhancing LED wafer described in claim 1 and lead-in wire, it is characterized in that: described lead-in wire is welded on LED support and LED wafer by solder joint.
3. according to the LED lamp pearl of bonding force between the enhancing LED wafer described in claim 2 and lead-in wire, it is characterized in that: an end of described lead-in wire is spheric end, spheric end is welded on the LED wafer, the other end of lead-in wire is the fish tail end, the fish tail end is welded on LED support, and also is provided with some solder joints between lead-in wire and LED support.
4. according to the LED lamp pearl of bonding force between the enhancing LED wafer described in claim 3 and lead-in wire, it is characterized in that: the solder joint number between described lead-in wire and LED support is two.
5. according to the LED lamp pearl of bonding force between the enhancing LED wafer described in claim 4 and lead-in wire, it is characterized in that: the insulation glue-line that is provided with high heat conduction between described LED wafer and LED support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013204612953U CN203367364U (en) | 2013-07-31 | 2013-07-31 | LED lamp bead for enhancing binding force between LED chip and lead wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013204612953U CN203367364U (en) | 2013-07-31 | 2013-07-31 | LED lamp bead for enhancing binding force between LED chip and lead wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203367364U true CN203367364U (en) | 2013-12-25 |
Family
ID=49815084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013204612953U Expired - Fee Related CN203367364U (en) | 2013-07-31 | 2013-07-31 | LED lamp bead for enhancing binding force between LED chip and lead wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203367364U (en) |
-
2013
- 2013-07-31 CN CN2013204612953U patent/CN203367364U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 100095, 2, 1, unit 201-1, 10 building, No. 1, Gao Li Zhang Road, Haidian District, Beijing. Patentee after: Zhongke Haoding Science and Technology Co.,Ltd. Address before: Room 2503, Building 1, Courtyard 1, Shangdi Information Road, Haidian District, Beijing 100085 Patentee before: BEIJING TIMES HAODING TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20210731 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |