CN203312364U - 一种方形陶瓷cob封装结构 - Google Patents

一种方形陶瓷cob封装结构 Download PDF

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CN203312364U
CN203312364U CN2013203394114U CN201320339411U CN203312364U CN 203312364 U CN203312364 U CN 203312364U CN 2013203394114 U CN2013203394114 U CN 2013203394114U CN 201320339411 U CN201320339411 U CN 201320339411U CN 203312364 U CN203312364 U CN 203312364U
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龚文
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Shenzhen Jingtai Co ltd
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Shenzhen Jingtai Optoelectronics Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

本实用新型公开了一种方形陶瓷COB封装结构,包括表面电镀亮银的陶瓷基板及通过固定晶片的固晶胶固定在所述陶瓷基板上的发光晶片,所述陶瓷基板两侧设有两个表面电极,所述发光晶片通过金线连接到所述表面电极,所述金线和发光晶片上封装有用于密封保护的封装胶体,所述多个陶瓷基板组合形成一个矩形陶瓷整体板。本实用新型所述方形陶瓷COB封装结构,结构简单,具有高光效、低热阻、高散热、耐电压、出光均匀、无眩光、无色斑、低成本、高寿命的优点。

Description

一种方形陶瓷COB封装结构
技术领域
本实用新型涉及LED制造技术领域,尤其涉及一种高光效、低热阻、高散热、耐电压、出光均匀、无眩光、无色斑、低成本的方形陶瓷COB封装结构。
背景技术
LED(发光二极管)应用非常广泛,作为半导体光源,相比传统照明光源,具有节能、寿命长、绿色环保、使用电压低等优点,当前技术提供的白光SMD(表面贴装型,Surface Mounted Devices)集成封装技术,是将发光二极管安装在铝基板上制作LED球泡灯,从而使器件结构热阻和器件与铝基板的接触热阻比较大,从而造成PN结温度比较高,热量不容易及时地导出,散热性差,长期如此会造成LED灯寿命的降低,只能应用于对产品性能要求不高的照明领域,单颗大功率LED光源大多使用透镜改善光效,即增加成本又使光视角变小,而使用多颗LED灯珠的灯具会出现出光不均匀以及鬼影现象;此外在进行贴片的时候,SMD集成封装需要过回流焊,其高温会对晶片造成很大伤害,从而使整个集成结构次品率高,容易损坏。此外普通的铝基板耐高压一般在600V以下,从而较难实现高电压低电流输出,使用驱动电源的配置和电源效率变低。
实用新型内容
本实用新型的目的是针对现有技术的不足,提供一种高光效、低热阻、高散热、耐电压、出光均匀、无眩光、无色斑、低成本的方形陶瓷COB封装结构。
为了实现上述目的,本实用新型提供的技术方案为:一种方形陶瓷COB封装结构,包括表面电镀亮银的陶瓷基板及通过固定晶片的固晶胶固定在所述陶瓷基板上的发光晶片,所述陶瓷基板两侧设有两个表面电极,所述发光晶片通过金线连接到所述表面电极,所述金线和发光晶片上封装有用于密封保护的封装胶体,所述多个陶瓷基板组合形成一个矩形陶瓷整体板,所述矩形陶瓷整体板长度为13.5毫米,宽度为13.5毫米。
所述矩形陶瓷整体板上设有焊线嫁接的绝缘层,用于避免芯片串联时导致的芯片损伤,所述绝缘层设于串联的陶瓷基板之间。
所述表面亮银的陶瓷基板形状为长方形。
与现有技术相比,本实用新型的有益效果至少包括如下几个方面:
(1)采用具有优良电绝缘性能的陶瓷基板,具有高导热性和耐高压性,易于实现高电压低电流,便于驱动电源的配置及电源效率的提升;
(2)陶瓷基板表面按光学设计采用高折射率的材料,表面电镀亮银,提高出光效率,获得较高的光通量和光电转换效率;
(3)陶瓷COB封装不需要回流焊,也不需要购买贴片机和焊接等设备,由于省去了器件工序,不仅降低了应用企业的门槛,同时可大幅度下降成本;
(4)陶瓷COB封装结构,将芯片直接安装到陶瓷基板上,比之发光二极管安装在铝基板上制作LED灯可免去器件结构热阻和器件与铝基板的接触热阻,有利于降低PN结温度,把热量及时地导出来并延长寿命。
(5)表面采用特殊的焊线嫁接的方式设有绝缘层,有效地避免串联时芯片焊接时造成芯片损伤,延长材料的寿命。
(6)COB面光源是整面封装,先进的工艺较好地解决了led灯珠色光不均、眩光的问题,整面出光,光照均匀,光效好。
由此可见,本实用新型所述方形陶瓷COB封装结构,结构简单,具有高光效、低热阻、高散热、耐电压、出光均匀、无眩光、无色斑、低成本、高寿命的优点,应用于照明行业,可以填补国内外有此类需求的市场空白。
附图说明
下面利用附图来对本实用新型进行进一步的说明,但是附图中的实施例不构成对本实用新型的任何限制。
图1为本实用新型所述方形陶瓷COB封装结构的结构示意图。
图2为本实用新型所述矩形陶瓷整体板的结构示意图。
具体实施方式
为了更好的理解本实用新型的技术方案,下面结合附图详细描述本实用新型提供的实施例。
如图1和图2所示,本实用新型实施例提供一种高光效、低热阻、高散热、耐电压、出光均匀、无眩光、无色斑、低成本的方形陶瓷COB封装结构。包括表面电镀亮银的陶瓷基板105及通过固定晶片103的固晶胶固定在所述陶瓷基板105上的发光晶片101,所述陶瓷基板105两侧设有两个表面电极107,所述发光晶片101通过金线102连接到所述表面电极107,所述金线102和发光晶片101上封装有用于密封保护的封装胶体104,所述多个陶瓷基板100组合形成一个矩形陶瓷整体板200,所述矩形陶瓷整体板200长度为13.5毫米,宽度为13.5毫米。
所述矩形陶瓷整体板200上设有焊线嫁接的绝缘层106,用于避免芯片串联时导致的芯片损伤,所述绝缘层106设于串联的陶瓷基板100之间。
所述表面亮银的陶瓷基板100形状为长方形。
所述陶瓷基板是指铜箔在高温下直接键合到氧化铝(AL2Q3)或氮化铝(ALN)陶瓷基片表面上的特殊工艺板。所制成的超薄复合基板具有优良电绝缘性能,高导热特性,优异的软钎焊性和高的附着强度,陶瓷基板耐高压4000V,易实现高电压低电流,便于驱动电源的配置及电源效率的提升。
陶瓷基板表面按光学设计采用高折射率的材料,表面电镀亮银,提高出光效率,获得较高的光通量和光电转换效率,出光均匀,无色斑,无鬼影。表面采用特殊的焊线嫁接的方式,有效地避免串联时芯片焊接造成芯片损伤,延长材料的寿命。
相比贴片SMD的LED灯,SMD封装在进行贴片的时候,需要过回流焊,其高温对晶片造成很大伤害,然而陶瓷COB封装不需要回流焊,也不需要购买贴片机和焊接等设备,由于省去了器件工序,不仅降低了应用企业的门槛,同时可大幅度下降成本。
陶瓷COB封装结构,将芯片直接安装到陶瓷基板上,比之发光二极管安装在铝基板上制作LED灯可免去器件结构热阻和器件与铝基板的接触热阻,有利于降低PN结温度,把热量及时地导出来并延长寿命。
总体上来讲,本实用新型所述方形陶瓷COB封装结构,结构简单,具有高光效、低热阻、高散热、耐电压、出光均匀、无眩光、无色斑、低成本、高寿命的优点,应用于照明行业,可以填补国内外有此类需求的市场空白。
以上内容仅为本实用新型的较佳实施例,对于本领域的普通技术人员,依据本实用新型的思想,在具体实施方式及应用范围上均会有改变之处,本说明书内容不应理解为对本实用新型的限制。

Claims (3)

1.一种方形陶瓷COB封装结构,其特征在于:包括表面电镀亮银的陶瓷基板及通过固定晶片的固晶胶固定在所述陶瓷基板上的发光晶片,所述陶瓷基板两侧设有两个表面电极,所述发光晶片通过金线连接到所述表面电极,所述金线和发光晶片上封装有用于密封保护的封装胶体,所述多个陶瓷基板组合形成一个矩形陶瓷整体板,所述矩形陶瓷整体板长度为13.5毫米,宽度为13.5毫米。
2.如权利要求1所述的方形陶瓷COB封装结构,其特征在于:所述矩形陶瓷整体板上设有焊线嫁接的绝缘层,用于避免芯片串联时导致的芯片损伤,所述绝缘层设于串联的陶瓷基板之间。
3.如权利要求1所述的方形陶瓷COB封装结构,其特征在于:所述表面亮银的陶瓷基板形状为长方形。
CN2013203394114U 2013-06-07 2013-06-07 一种方形陶瓷cob封装结构 Expired - Lifetime CN203312364U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104934517A (zh) * 2015-04-28 2015-09-23 江苏稳润光电有限公司 一种低热阻贴片发光二极管封装结构及封装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104934517A (zh) * 2015-04-28 2015-09-23 江苏稳润光电有限公司 一种低热阻贴片发光二极管封装结构及封装方法

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Granted publication date: 20131127