CN203300689U - Light-emitting diode support structure - Google Patents
Light-emitting diode support structure Download PDFInfo
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- CN203300689U CN203300689U CN2013200453464U CN201320045346U CN203300689U CN 203300689 U CN203300689 U CN 203300689U CN 2013200453464 U CN2013200453464 U CN 2013200453464U CN 201320045346 U CN201320045346 U CN 201320045346U CN 203300689 U CN203300689 U CN 203300689U
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- cup
- rubber base
- light
- emitting diode
- metallic support
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Abstract
A light-emitting diode support structure includes a rubber seat which is recessedly provided with an accommodating space which has an inverted cone-shaped cup opening, and at least two metal supports which are not connected with each other and are oppositely arranged inside the accommodating space of the rubber seat; the peripheries of the metal supports are wrapped and positioned by the rubber seat and partially extend out from the rubber seat; one of the metal supports is recessedly provided with a cup-shaped wafer bearing seat used for bearing a light-emitting diode wafer; the cup-shaped wafer bearing seat is a long-structured body; the length of the long-structured body is at least 2 times greater than the width of the long-structured body; the inverted cone-shaped cup opening of the rubber seat is larger than the cup-shaped wafer bearing seat; the bottom edge of the cup-shaped wafer bearing seat is exposed on the bottom of the rubber seat; and the area of the cup-shaped wafer bearing seat is at least 40% of the area of the inverted cone-shaped cup opening of the rubber seat, such that the heat dissipation area of the metal supports can be increased relatively. With the light-emitting diode support structure of the utility model adopted light-emitting diodes with different powers can share the support structures with the same specification, and therefore, mold cost required by metal support supporting can be decreased.
Description
Technical field
The utility model is relevant a kind of light-emitting diode support structure, and espespecially a kind of area of dissipation of metallic support that makes becomes large relatively, promotes the light-emitting diode support structure of integral heat sink benefit.
Background technology
LED (Light Emitting Diode), namely light-emitting diode, be a kind of semiconductor solid luminescence device, it is mainly to utilize the solid semiconductor wafer as luminescent material.Due to LED have high energy-conservation, the life-span long, be beneficial to the advantage such as environmental protection, so the application surface of LED is more and more extensive, the characteristic of its environmental protection and energy saving makes LED be regarded as replacing conventional bulb and as main light illumination.And therefore light-emitting diode all needs by LED support in the manufacturing process major part due to suitable little of its volume, for wire, configures and connects the LED wafer.
Shown in Figure 1, that United States Patent (USP) discloses No. 2010/0001306A1, it is applied for by SAMSUNG, disclose a kind of LED support 100, it comprises the rubber base 102 with hollow functional areas 101, in hollow functional areas 101, extends to the several metal pins 103,104,105 outside rubber base 102, and a recessed cup-shaped wafer holder 106 that is arranged at 101 bottoms, hollow functional areas, the bottom-exposed of recessed cup-shaped wafer holder 106 is in the bottom of rubber base 102, to promote radiating effect.Angle (θ due to these hollow functional areas 101 inwalls
1) less than the angle (θ of recessed cup-shaped wafer holder 106 inwalls
2), light path increases through upper functional areas reverberation quantity, is unfavorable for improving luminous height.
Shown in Fig. 2 A, an existing light-emitting diode support structure 110, its structure is approximately identical to Fig. 1 and discloses, and comprises the rubber base 112 of its hollow functional areas 111, several golden pin 113,114,115.But the degree of depth of its recessed cup-shaped wafer holder 116 (d1) is darker and thin, can cause light extraction efficiency poor by shaded portions light, and its wafer holder 116 is thinner, and easily causing breaks reduces reliability.
Shown in Fig. 2 B, the novel M376909 patent of TaiWan, China of being applied for by multiple Sheng company, its be on take off front case and propose to improve, it discloses a light-emitting diode support structure 120, before its structure is roughly the same, take off existing light-emitting diode 110, its improved characteristics is: the margin of optic cup horizontal level of this recessed cup-shaped wafer holder 126 is lower than the past rubber base 122 extension place horizontal levels of metal pin 124,125, that is h<H.By the whole sinking of recessed cup-shaped wafer holder 126 is arranged in rubber base 122, reduces the degree of depth (d2) of recessed cup and remain suitable wall thickness and structural strength.
It shown in Fig. 3 A, Fig. 3 B, is the novel M408793 patent of TaiWan, China that Hon Hai Precision Industry company applies for, it discloses a kind of LED conducting wire frame 130, it is mainly the 2010/0001306A1 patent proposition improvement of applying for for front taking off SAMSUNG, it comprises: rubber base 132, it is provided with the upper functional areas 131 that are positioned at top, and described upper functional areas 131 have the inwall that is obliquely installed; And metallic support 133,134,135, that part is embedded in described rubber base 132, the cup-shaped wafer holder 136 that comprises a bearing wafer, described wafer holder 136 forms the lower functional areas 137 that are positioned at 111 belows, functional areas, and lower functional areas 137 have the inwall that is obliquely installed; Wherein, the top light emitting region area of the upper functional areas 131 of described rubber base 132 is 5.5 to 6.5 times of bottom retroreflective regions area of lower functional areas 137, the angle (B1) of corresponding two opposed inner walls in upper functional areas 131 is not less than the angle (B2) of corresponding two opposed inner walls in lower functional areas 137, and all between 75 degree are spent to 105.Whereby, the light quantity of functional areas 131 inwall reflections is reduced, improve light extraction efficiency.
Therefore above-mentioned disclosed existing light-emitting diode, though its function is respectively arranged; Yet, its LED support is in the process of making, it is all the wattage number according to the LED wafer, with mould punching, going out can be in response to the LED support of its radiating requirements of LED wafer, namely the LED wafer of less wattage, the specification of its LED support of arranging in pairs or groups less (area of dissipation less), otherwise, the LED wafer of larger wattage, the specification of its LED support of arranging in pairs or groups relatively large (area of dissipation is relatively large); If therefore LED wafer that will larger gas, while being disposed at than the LED support of small dimension size, the LED wafer tends to produce superheating phenomenon, cause the decay of LED luminous efficiency, even produce the aberration situation.When also therefore the LED manufacturer is for different wattage LED wafer, must open the LED support of different specification size, cause die cost to increase and use the problem points of upper inconvenience.
The utility model content
Technical problem underlying to be solved in the utility model is, overcome the above-mentioned defect that prior art exists, and provide a kind of light-emitting diode support structure, its rim of a cup of inverted cone shape by rubber base inside contracts, so as to increase, be positioned at the area of the metallic support of rubber base bottom, make area of dissipation relatively become large, promote the integral heat sink benefit, the metallic support that provides the light-emitting diode of different wattages can share the same size size, reach to reduce and open the required die cost of metallic support; Wafer holder is set as to predetermined type body and area, after the inverted cone shape rim of a cup of rubber base is inside contracted, still can remains the bond strength of the two, have and be difficult for breaking, and can reach enough area of dissipations, the convenience that provides the light-emitting diode of different wattages to share.
The technical scheme that its technical problem that solves the utility model adopts is:
Plant light-emitting diode support structure, comprising: a rubber base, it is concaved with accommodation space, and this accommodation space has the inverted cone shape rim of a cup; And at least two metallic support, it is and does not connect and relatively be located in the accommodation space of this rubber base, around it, by location that rubber base coats, and partly extends this rubber base, moreover, this wherein a metallic support be concaved with one in order to carry the cup-shaped wafer holder of LED wafer; It is characterized in that:
This cup-shaped wafer holder is the elongated body, and the length of this elongated body (L2) is greater than at least 2 times of its width (W2); The inverted cone shape rim of a cup of this rubber base is greater than this cup-shaped wafer holder, and this cup-shaped wafer holder root edge is exposed to this rubber base bottom, moreover the area (A2) that makes this cup-shaped wafer holder be not less than this rubber base inverted cone shape rim of a cup area (A1) 40%, relatively to increase the area of dissipation of this metallic support, make the light-emitting diode of different wattages can share the supporting structure of same size.
By on take off technological means, the utility model is with in the constant situation of rubber base form factors, utilize the structure of clamping clad metal support, make the inverted cone shape rim of a cup of rubber base to inside contract, not affect its whole bond strength, to increase the area of cup-shaped wafer holder, if while so as to solving LED wafer that existing framework construction will larger wattage, being placed in the support of reduced size, easily cause LED luminous efficiency attenuation problem point, make supporting structure of the present utility model can provide the LED of different wattages to share, have easy to use, and the effect that can reduce costs.
The beneficial effects of the utility model are, its rim of a cup of inverted cone shape by rubber base inside contracts, so as to increase, be positioned at the area of the metallic support of rubber base bottom, make area of dissipation relatively become large, promote the integral heat sink benefit, the metallic support that provides the light-emitting diode of different wattages can share the same size size, reach to reduce and open the required die cost of metallic support; Wafer holder is set as to predetermined type body and area, after the inverted cone shape rim of a cup of rubber base is inside contracted, still can remains the bond strength of the two, have and be difficult for breaking, and can reach enough area of dissipations, the convenience that provides the light-emitting diode of different wattages to share.
The accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the cutaway view that the U.S. and profit disclose the 2010/0001306A1 LED package.
Fig. 2 A is the cutaway view of existing a kind of light-emitting diode support structure.
Fig. 2 B is the cutaway view of TaiWan, China bulletin M376909 new patent.
Fig. 3 A is the vertical view of TaiWan, China bulletin M408793 new patent.
Fig. 3 B is the cutaway view of TaiWan, China bulletin M408793 new patent.
Fig. 4 is metallic support structural representation of the present utility model.
Fig. 5 is vertical view of the present utility model.
Fig. 6 is 6-6 cross-section cutaway view in Fig. 5.
Fig. 7 is 7-7 cross-section cutaway view in Fig. 5.
Fig. 8 is the Area Ratio schematic diagram of the utility model wafer holder and rubber base rim of a cup.
The number in the figure explanation:
20 light-emitting diode support structures
30 rubber bases
31 accommodation spaces
32 inverted cone shape cups
At the bottom of 33 first glue
At the bottom of 34 second glue
35 2 type clampings
40 first metallic supports
41 first protruding pin
42 cup-shaped wafer holders
43 first recesses
44 second recesses
45 Shang type gaps
46 the 4th recesses
47 the 5th recesses
50 second metallic supports
51 second protruding pin
52 the 3rd recesses
Embodiment
At first, please coordinate Fig. 4 to shown in Figure 7, the light-emitting diode support structure 20 of the utility model preferred embodiment comprises: a rubber base 30, and it is concaved with accommodation space 31, and this accommodation space 31 has inverted cone shape rim of a cup 32; And
At least two metallic supports, in the present embodiment, this metallic support is consisted of the first metallic support 40 and the second metallic support 50, but be not limited to this, its also can such as in prior art announcement, by three metallic supports, formed, in the present embodiment, this first metallic support 40 and the second metallic support 50 are and do not connect and relatively be located in the accommodation space 31 of this rubber base 30, it is on every side by rubber base 20 location that coats, and part is extended this rubber base 20, moreover the first metallic support 40 is concaved with one in order to carry the cup-shaped wafer holder 42 of LED wafer; For above-mentioned formation belongs to prior art (poior art), hold and do not repeat.And principal character of the present utility model is:
This cup-shaped wafer holder 42 is the elongated body, and the length of this elongated body (L2) is greater than at least 2 times of its width (W2); The inverted cone shape rim of a cup 32 of this rubber base 30 is greater than this cup-shaped wafer holder 42, and these cup-shaped wafer holder 42 root edges are exposed to this rubber base 30 bottoms, and the area (A2) that makes this cup-shaped wafer holder 42 be not less than this rubber base 30 inverted cone shape rim of a cup 32 area (A1) 40%, relatively to increase the area of dissipation of this cup-shaped wafer holder 42, make the light-emitting diode of different wattages can share the supporting structure of same size.
According to before taking off feature, in a preferred embodiment, this first metallic support 40 and the second metallic support 50, it is respectively equipped with the first protruding pin 41 and the second protruding pin 51 that extends this rubber base, and the root edge of this first protruding pin 41 and the second protruding pin 51 is exposed to this rubber base 30 bottoms, and concordant with these cup-shaped wafer holder 42 root edges.
Hold, as shown in Figure 7, these the first metallic support 40 root edges, between these cup-shaped wafer holder 42 bottom surfaces and this first protruding pin 41, be provided with one first recess 43, this first recess 43 by 33 location that coat at the bottom of the first glue that belongs to these rubber base 30 parts, and at the bottom of this first glue, 33 not protruding dew exceed this first recess 43 bottom surfaces.
Further, the relative edge of this first metallic support 40 and this second metallic support 50, one second recess 44 and the 3rd recess 52 are formed respectively on its bottom, so that Gai Shang type gap 45 of Xing Cheng mono-Shang type gap 45 by 34 location that coat at the bottom of the second glue that belongs to these rubber base 30 parts between this first metallic support 40 and the second metallic support 50, and at the bottom of this second glue, 34 not protruding dew exceed Gai 45 bottom surfaces, Shang type gap.
Moreover, as shown in Figure 6, this first metallic support 40 and the second metallic support 50 are in the front side that there is no protruding pin and rear side, its bottom is respectively equipped with one the 4th recess 46 and the 5th recess 47, so that this first metallic support 40 and the forward and backward lateral edges of the second metallic support 50, be in opposite directions by this rubber base 30 that inwardly ㄈ type clamping 35 coats the 4th recess 46 and the 5th recess 47 makes its strong fix.
by on take off technological means, the utility model is with in the constant situation of rubber base 30 form factors, utilize ㄈ type clamping 35 clad metal supports 40, 50 structure, make the inverted cone shape rim of a cup 32 of rubber base 30 to inside contract, not affect its whole bond strength, to increase the area of this cup-shaped wafer holder 42, hereby illustrate as rear: in a possible embodiments, the height of this rubber base 30 (H) is between 0.8mm to 1.2mm, length and width be visual gauge lattice and determining, the length of rubber base 30 is that 3.3mm and width are 1.5mm, this moment, inverted cone shape rim of a cup 32 length was about 2.9mm and width is 1.1mm, that area (A1) take this inverted cone shape rim of a cup 32 is as 3.19mm2, and the length of this cup-shaped wafer holder 42 (L2) is about 2.4mm and width (W2) is 0.6mm, present length (L2) greater than the elongated body of width (W2) more than two times, and the area of this cup-shaped wafer holder 42 (A2) is 2.4mm * 0.6mm=1.44mm
2, be area (A1) 3.19mm of the inverted cone shape rim of a cup 32 of this rubber base 30
245%, as shown in Figure 8.Therefore on area (A2) overall ratio of this cup-shaped wafer holder 42 40% of the area (A1) of not little inverted cone shape rim of a cup 32, and because cup-shaped wafer holder 42 is the elongated body, and limit, elongated side is provided with the protruding pin that extends rubber base, and bottom surface is large-area exposed; So with increase, be positioned at the relative area of dissipation of these metallic supports of accommodation space 31 bottoms, and can promote the integral heat sink benefit.If while so as to solving LED wafer that existing framework construction will larger wattage, being placed in the support of reduced size, easily cause LED luminous efficiency attenuation problem point, make supporting structure of the present utility model can provide the LED of different wattages to share, have easy to use, and the effect that can reduce costs.
The above, it is only preferred embodiment of the present utility model, not the utility model is done to any pro forma restriction, every foundation technical spirit of the present utility model, to any simple modification, equivalent variations and modification that above embodiment does, all still belongs in the scope of technical solutions of the utility model.
In sum, the utility model is on structural design, use practicality and cost benefit, meet industry development fully required, and the structure that discloses is also to have unprecedented innovative structure, have novelty, creativeness, practicality, the regulation that meets relevant new patent important document, therefore mention application in accordance with the law.
Claims (6)
1. light-emitting diode support structure comprises:
One rubber base, it is concaved with accommodation space, and this accommodation space has the inverted cone shape rim of a cup; And
At least two metallic supports, it is and does not connect and relatively be located in the accommodation space of this rubber base, around it, by location that rubber base coats, and partly extends this rubber base, moreover wherein a metallic support is concaved with one in order to carry the cup-shaped wafer holder of LED wafer; It is characterized in that:
This cup-shaped wafer supporting seat is the elongated body, and the length of this elongated body (L2) is greater than at least 2 times of its width (W2);
The inverted cone shape rim of a cup of this rubber base is greater than this cup-shaped wafer holder, and this cup-shaped wafer holder root edge is revealed in this rubber base bottom, moreover the area that makes this cup-shaped wafer holder be not less than this rubber base the inverted cone shape rim of a cup area 40%, relatively to increase the area of dissipation of this metallic support, make the light-emitting diode of different wattages can share the supporting structure of same size.
2. light-emitting diode support structure according to claim 1, it is characterized in that, described metallic support is consisted of the first metallic support and the second metallic support, it is respectively equipped with the first protruding pin and the second protruding pin that extends this rubber base, and the root edge of this first protruding pin and the second protruding pin is revealed in this rubber base bottom, and concordant with this cup-shaped wafer holder root edge.
3. light-emitting diode support structure according to claim 2, it is characterized in that, described the first metallic support root edge, between this cup-shaped wafer holder bottom surface and this first protruding pin, be provided with one first recess, in this first recess and by the location that coats at the bottom of the first glue that belongs to this rubber base part, and at the bottom of this first glue, not protruding dew exceeds this first recess bottom surface.
4. light-emitting diode support structure according to claim 3, it is characterized in that, the relative edge of described the first metallic support and this second metallic support, one second recess and the 3rd recess are formed respectively on its bottom, so that between this first metallic support and the second metallic support in Gai Shang type gap of Xing Cheng mono-Shang type gap and by the location that coats at the bottom of the second glue that belongs to this rubber base part, and at the bottom of this second glue, not protruding dew exceeds Gai bottom surface, Shang type gap.
5. light-emitting diode support structure according to claim 4, it is characterized in that, described first and second metallic support is in the front side that there is no protruding pin and rear side, its bottom is respectively equipped with one the 4th recess and the 5th recess, so that this first metallic support and the forward and backward lateral edges of the second metallic support, be above the internal orifice word removes by this rubber base that a horizontal type clamping coats the 4th recess and the 5th recess makes its strong fix.
6. light-emitting diode support structure according to claim 1, is characterized in that, the height of described rubber base (H) is between 0.8mm to 1.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200453464U CN203300689U (en) | 2013-01-28 | 2013-01-28 | Light-emitting diode support structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200453464U CN203300689U (en) | 2013-01-28 | 2013-01-28 | Light-emitting diode support structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203300689U true CN203300689U (en) | 2013-11-20 |
Family
ID=49576680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013200453464U Expired - Fee Related CN203300689U (en) | 2013-01-28 | 2013-01-28 | Light-emitting diode support structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203300689U (en) |
-
2013
- 2013-01-28 CN CN2013200453464U patent/CN203300689U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131120 Termination date: 20150128 |
|
| EXPY | Termination of patent right or utility model |