CN203190091U - Light-emitting diode (LED) area light source - Google Patents
Light-emitting diode (LED) area light source Download PDFInfo
- Publication number
- CN203190091U CN203190091U CN 201320043201 CN201320043201U CN203190091U CN 203190091 U CN203190091 U CN 203190091U CN 201320043201 CN201320043201 CN 201320043201 CN 201320043201 U CN201320043201 U CN 201320043201U CN 203190091 U CN203190091 U CN 203190091U
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- Prior art keywords
- light source
- crystal bonding
- bonding area
- substrate
- annular
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Abstract
The utility model relates to a light-emitting diode (LED) area light source. The LED area light source comprises a substrate and light sources arranged on the substrate, wherein the substrate is a panel, a crystal fixing region for installing the light sources is formed on the substrate, the crystal fixing region is annular, the light sources are distributed in the crystal fixing region on the substrate in an annular array mode, and the light sources are in electric connection to form an area light source. According to the LED area light source, the annular crystal fixing region where the light sources are arranged is formed on the substrate, an interval forms at the inner side of the crystal fixing region, so that the light sources do not affect each other, most of light emitted from the lateral faces of the light sources can be emitted to the outside, and therefore the light-emitting efficiency and the light-emitting brightness of the LED area light source are obviously improved.
Description
Technical field
The utility model relates to light emitting diode, relates in particular to a kind of LED surface light source as planar light source.
Background technology
(Light Emitting Diode LED) because it has characteristics such as life-span length, energy-saving and environmental protection, is expected to replace conventional lamp to light emitting diode, as fluorescent lamp, incandescent lamp, Halogen lamp LED etc., becomes the main stream light sources that normal lighting is used.
Now, integrated being fixed in of numerous led chips also unified the planar set accepted way of doing sth area source (COB that encapsulation forms on the substrate, chip on board) very popular, it is integrated by multicore, not only solved the problem such as emitting brightness, dazzle of led light source, also exempt the operation of downstream application manufacturer with single LEDs fabric swatch, welding, reduced the production cost of downstream manufacturers.Yet its led chip of planar set accepted way of doing sth area source of this kind structure is intensive being fixed on the substrate, gap ratio between the led chip is nearer, form each other and stop, and led chip is except its end face bright dipping, about 30% light is to be penetrated by its side in addition, this part light constantly reflects between led chip and finally consumes, and is difficult to penetrate to extraneous, has reduced light extraction efficiency to a certain extent.
The utility model content
In view of this, provide a kind of light extraction efficiency higher LED surface light source.
A kind of LED surface light source, comprise substrate and be arranged at light source on the substrate, described substrate is dull and stereotyped, be formed with crystal bonding area on the substrate light source is installed, described crystal bonding area ringwise, described light source circular array shape is arranged in the crystal bonding area of substrate, electrically connects between the light source, forms area source.
Further, be formed with a plurality of annular crystal bonding areas on the described substrate, form the gap between the adjacent annular crystal bonding area.
Further, described a plurality of annular crystal bonding area arranges with one heart.
Further, also be formed with circular crystal bonding area on the described substrate, described circular crystal bonding area arranges with annular crystal bonding area is concentric, described annular crystal bonding area be located on circular crystal bonding area outer and and circular crystal bonding area between form the gap.
Further, described annular crystal bonding area is annular, side's annular or oval ring.
Further, described substrate is FR4 plate, aluminium base, copper base, ceramic wafer or silicon substrate.
Further, described light source is LED.
Further, be coated with fluorescent material on the surface of described light source.
Further, also comprise the packaging body that is formed at the described light source of sealing in the described crystal bonding area.
Compared with prior art, the utility model LED surface light source forms annular on substrate crystal bonding area arranges light source, the inboard of crystal bonding area forms the space, therefore can not influence each other between the light source, the overwhelming majority of the light that the light source side is penetrated can penetrate to the external world, thereby effectively promotes light extraction efficiency and the emitting brightness of the utility model LED surface light source.
Description of drawings
Fig. 1 is the structural representation of the utility model LED surface light source one embodiment.
Fig. 2 is the structural representation of another embodiment of the utility model LED surface light source.
Fig. 3 is the utility model LED surface light source structural representation of an embodiment again.
The main element symbol description
| |
10、210、310 |
| |
12、312 |
| Circular |
212 |
| The |
213、313、315 |
| The annular |
214 |
| The first annular |
314 |
| The second annular |
316 |
| |
30 |
| |
50 |
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
See also Fig. 1, be depicted as an embodiment of the utility model LED surface light source, the packaging body 50 that described LED surface light source comprises substrate 10, is arranged at the some light sources 30 on the substrate 10 and seals described light source 30.
Described substrate 10 can be FR4 plate, aluminium base, copper base, ceramic wafer or silicon substrate, as the carrier of light source 30 and packaging body 50, can be formed with circuit on the substrate 10 and be connected with light source 30.In the present embodiment, described substrate 10 is the thin type flat board, is formed with the crystal bonding area 12 of annular on the substrate 10, is used for installing light source 30.In the present embodiment, described light source 30 is LED, and certain described light source 30 is not limited to LED, also can be other light source 30.Described light source 30 is centered by the central point of described crystal bonding area 12, and the even compartment of terrain of circular array shape is arranged in the crystal bonding area 12 of substrate 10.Light source 30 joins end to end, and forms the loop, constitutes the above high-power planar light source 30 of 3W.
Described packaging body 50 is formed in the crystal bonding area 12 and with described light source 30 sealings, avoids extraneous steam, dust to influence service life and the safety of light source 30.The transparent colloid of described packaging body 50 for solidifying as epoxy resin, is distributed with fluorescent material in the packaging body 50, described fluorescent material is decided according to the kind of light source 30 and the color of required bright dipping, be blue-light LED chip as light source 30, when the bright dipping of is white light, can select yellow fluorescent powder for use.Certainly, described fluorescent material also can directly be coated the surface of light source 30, perhaps is deposited on the top layer of packaging body 50, and is not limited to be distributed in the packaging body 50.
The utility model LED surface light source forms annular on substrate 10 crystal bonding area 12 arranges light source 30, the inboard of crystal bonding area 12 forms the space, light source 30 is not set, therefore can not influence each other between the light source 30, the overwhelming majority of the light that light source 30 sides are penetrated can penetrate to the external world, thereby effectively promotes light extraction efficiency and the emitting brightness of the utility model LED surface light source.In addition, because the lifting of light source 30 light extraction efficiencies can be selected the relatively low light source of power 30 for use, not only energy-conserving and environment-protective, and can effectively reduce the heating of light source 30, promote service life and the security of light source 30.
Figure 2 shows that another embodiment of the utility model LED surface light source, it is different from last embodiment part and is: the crystal bonding area 214 that is formed with circular crystal bonding area 212 and annular on the substrate 210, wherein, described annular crystal bonding area 214 and circular crystal bonding area 212 concentric settings, annular crystal bonding area 214 be located on outside the circular crystal bonding area 212 and and circular crystal bonding area 212 between form gap 216.Described light source 30 is arranged at respectively in annular crystal bonding area 214 and the circular crystal bonding area 212, owing to form gap 213 between two crystal bonding areas 214,212, has avoided the light sources 30 mutual formation in two crystal bonding areas 212,214 to stop, thereby promotes the light extraction efficiency of light source 30.
As shown in Figure 3, be the utility model embodiment again, its difference is: in the present embodiment, be formed with the circular crystal bonding area 312 of concentric setting on the described substrate 310, the first annular crystal bonding area 314, and the second annular crystal bonding area 316, wherein the first annular crystal bonding area 314 be located on outside the circular crystal bonding area 312 and with form gap 313, the second annular crystal bonding area 316 is located on outside the first annular crystal bonding area 314 and forms gap 315 with it, light source 30 is arranged at three crystal bonding areas 312,314, in 316, because adjacent crystal bonding area 312,314, form gap 313 between 316,315, can not form mutually between the light source 30 and stop, thereby promote the light extraction efficiency of light source 30.
The above only is preferable possible embodiments of the present utility model, in other embodiments, can form the annular crystal bonding area of a plurality of spaces according to the size of substrate etc. again on the described substrate, thereby the interior light source of each crystal bonding area can not influence each other.Described crystal bonding area also is not limited to annulus, also can be other shape, as elliptical ring, Fang Huan etc.
Claims (9)
1. LED surface light source, comprise substrate and be arranged at light source on the substrate, it is characterized in that: described substrate is for dull and stereotyped, be formed with crystal bonding area on the substrate light source is installed, described crystal bonding area ringwise, described light source circular array shape is arranged in the crystal bonding area of substrate, electrically connects between the light source, forms area source.
2. LED surface light source as claimed in claim 1 is characterized in that: be formed with a plurality of annular crystal bonding areas on the described substrate, form the gap between the adjacent annular crystal bonding area.
3. LED surface light source as claimed in claim 2, it is characterized in that: described a plurality of annular crystal bonding areas arrange with one heart.
4. LED surface light source as claimed in claim 1 or 2, it is characterized in that: also be formed with circular crystal bonding area on the described substrate, described circular crystal bonding area arranges with annular crystal bonding area is concentric, described annular crystal bonding area be located on circular crystal bonding area outer and and circular crystal bonding area between form the gap.
5. LED surface light source as claimed in claim 1 or 2 is characterized in that: described annular crystal bonding area is annular, side's annular or oval ring.
6. LED surface light source as claimed in claim 1, it is characterized in that: described substrate is FR4 plate, aluminium base, copper base, ceramic wafer or silicon substrate.
7. LED surface light source as claimed in claim 1, it is characterized in that: described light source is LED.
8. LED surface light source as claimed in claim 7 is characterized in that: be coated with fluorescent material on the surface of described light source.
9. LED surface light source as claimed in claim 1 is characterized in that: also comprise the packaging body that is formed at the described light source of sealing in the described crystal bonding area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320043201 CN203190091U (en) | 2013-01-24 | 2013-01-24 | Light-emitting diode (LED) area light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320043201 CN203190091U (en) | 2013-01-24 | 2013-01-24 | Light-emitting diode (LED) area light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203190091U true CN203190091U (en) | 2013-09-11 |
Family
ID=49106950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320043201 Expired - Fee Related CN203190091U (en) | 2013-01-24 | 2013-01-24 | Light-emitting diode (LED) area light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203190091U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108071954A (en) * | 2017-11-30 | 2018-05-25 | 易美芯光（北京）科技有限公司 | The LED light engine module of the tunable optical toning of annular, preparation method and application |
-
2013
- 2013-01-24 CN CN 201320043201 patent/CN203190091U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108071954A (en) * | 2017-11-30 | 2018-05-25 | 易美芯光（北京）科技有限公司 | The LED light engine module of the tunable optical toning of annular, preparation method and application |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Wang Maozhong Document name: Notification of Termination of Patent Right |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130911 Termination date: 20160124 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |