TW201349554A - Light emitting module - Google Patents

Light emitting module Download PDF

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Publication number
TW201349554A
TW201349554A TW101131572A TW101131572A TW201349554A TW 201349554 A TW201349554 A TW 201349554A TW 101131572 A TW101131572 A TW 101131572A TW 101131572 A TW101131572 A TW 101131572A TW 201349554 A TW201349554 A TW 201349554A
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TW
Taiwan
Prior art keywords
light
emitting element
emitting
light emitting
led
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Application number
TW101131572A
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Chinese (zh)
Inventor
Tsuyoshi Oyaizu
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Toshiba Lighting & Technology
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Publication of TW201349554A publication Critical patent/TW201349554A/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F21V3/0625Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics the material diffusing light, e.g. translucent plastics
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20Controlling the colour of the light
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00Combination of light sources
    • F21Y2113/10Combination of light sources of different colours
    • F21Y2113/13Combination of light sources of different colours comprising an assembly of point-like light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)

Abstract

A light emitting module is provided. The light emitting module includes a first light emitting element, and a plurality first light emitting element groups which are serial-connected. In addition, the light emitting module further includes a second light emitting element, and a second light emitting element group. Compared to the first light emitting element, a changing rate of a light emitting efficiency and a changing rate of the voltage of the second light emitting element relative to a variation of temperature are greater. The second light emitting element group includes a plurality of serial connected second light emitting elements, and the second light emitting element group is parallel connected to the first light emitting element group.

Description

發光模組 Light module

本發明涉及一種發光模組(module)及照明裝置。 The invention relates to a lighting module and a lighting device.

近年來,已使用了包括發光二極體(Light Emitting Diode,LED)等省電的發光元件的照明裝置作為照明裝置。包括發光元件的照明裝置例如與以往的白熾燈泡等相比較,可利用更少的消耗電力來獲得更高的亮度或照度。 In recent years, an illumination device including a light-emitting element such as a light-emitting diode (LED) has been used as an illumination device. A lighting device including a light-emitting element can obtain higher brightness or illuminance with less power consumption than, for example, a conventional incandescent light bulb.

此處,包括發光元件的照明裝置有時在發光模組上,搭載有發光色不同的多種發光元件。在此情況下,從照明裝置輸出的光成為如下的光,該光是由從搭載于發光模組的多種發光元件各自輸出的光混合而成。換句話說,從照明裝置輸出的光的發光色成為對多種發光元件各自的發光色進行混合而成的顏色。 Here, in the illumination device including the light-emitting element, a plurality of types of light-emitting elements having different light-emitting colors may be mounted on the light-emitting module. In this case, the light output from the illumination device is light which is obtained by mixing light output from each of a plurality of types of light-emitting elements mounted on the light-emitting module. In other words, the luminescent color of the light output from the illuminating device is a color obtained by mixing the luminescent colors of the plurality of illuminating elements.

然而,在所述先前技術中,多種發光元件各自所輸出的光的輸出平衡(balance)有時會發生變化。例如,若搭載于發光模組的發光元件的溫度特性或電流特性不同,則當利用驅動電流的變化來對明亮度進行調整時,或隨著環境溫度的變化,來自發光元件各自的光輸出的平衡會發生變化。 However, in the prior art, the output balance of the light outputted by each of the plurality of light-emitting elements sometimes changes. For example, when the temperature characteristics or current characteristics of the light-emitting elements mounted on the light-emitting module are different, when the brightness is adjusted by the change of the drive current, or the light output from the light-emitting elements is changed as the ambient temperature changes. The balance will change.

即,若多種發光元件各自的溫度特性或電流特性不同,則各發光元件的發光量的變化會隨著溫度上升而變得不同。結果,若發光元件的溫度上升,則發光元件各自的發光量會以各不相同的變化量而發生變化,結果,從發光 模組輸出的光輸出的平衡發生變化。 In other words, when the temperature characteristics or current characteristics of the plurality of light-emitting elements are different, the change in the amount of light emitted from each of the light-emitting elements becomes different as the temperature rises. As a result, when the temperature of the light-emitting element rises, the amount of light emitted by each of the light-emitting elements changes with a different amount of change, and as a result, the light is emitted. The balance of the light output of the module output changes.

實施方式的發光模組包括:第一發光元件群,具有第一發光元件,且串聯地連接有多個所述第一發光元件;以及第二發光元件群,具有第二發光元件,且串聯地連接有多個所述第二發光元件,而且與所述第一發光元件群並聯地連接,所述第二發光元件與所述第一發光元件相比較,相對於溫度變化的發光效率的變化率及電壓的變化率更大。 The light emitting module of the embodiment includes: a first light emitting element group having a first light emitting element, and a plurality of the first light emitting elements are connected in series; and a second light emitting element group having a second light emitting element, and connected in series a plurality of the second light-emitting elements are connected, and are connected in parallel with the first light-emitting element group, and the rate of change of the light-emitting efficiency with respect to temperature change of the second light-emitting element compared with the first light-emitting element And the rate of change of voltage is greater.

實施方式的一例的發光模組及照明裝置發揮了如下的有利的效果,即,能夠抑制多種發光元件各自所輸出的光的輸出平衡的變化。 The light-emitting module and the illumination device of an example of the embodiment have an advantageous effect of suppressing a change in the output balance of light outputted by each of the plurality of light-emitting elements.

以下,參照附圖來對實施方式的發光模組及照明裝置進行說明。在實施方式中,對具有相同功能的構成附上相同符號,且將重複的說明予以省略。再者,以下的實施方式中所說明的發光模組及照明裝置僅表示一例,並不對本發明進行限定。另外,以下的實施方式也可在不矛盾的範圍內,適當地加以組合。 Hereinafter, a light-emitting module and an illumination device according to an embodiment will be described with reference to the drawings. In the embodiments, the same reference numerals will be given to the components having the same functions, and the duplicated description will be omitted. In addition, the light-emitting module and the illumination device described in the following embodiments are merely examples, and the present invention is not limited. Further, the following embodiments may be combined as appropriate without departing from the scope of the invention.

實施方式的發光模組10a~發光模組10c例如包括第一發光元件,且包括多個第一發光元件串聯地連接而成的第一發光元件群。另外,發光模組10a~發光模組10c例如包括第二發光元件,且包括第二發光元件群,所述第二發光元件與第一發光元件相比較,相對於溫度變化的發光 效率的變化率及電壓的變化率更大,所述第二發光元件群串聯地連接有多個第二發光元件,且與第一發光元件群並聯地連接。 The light-emitting module 10a to the light-emitting module 10c of the embodiment include, for example, a first light-emitting element, and includes a first light-emitting element group in which a plurality of first light-emitting elements are connected in series. In addition, the light emitting module 10a to the light emitting module 10c includes, for example, a second light emitting element, and includes a second light emitting element group, and the second light emitting element is compared with the first light emitting element to emit light with respect to temperature change. The rate of change of the efficiency and the rate of change of the voltage are larger. The second group of light emitting elements are connected in series to the plurality of second light emitting elements, and are connected in parallel with the first group of light emitting elements.

另外,在實施方式的發光模組10a~發光模組10c中,例如,並聯地連接的第一發光元件群及第二發光元件群連接於共用的電力供給路徑。此處,在點燈時,即使在供給至各發光元件群的總電力量不發生變化的情況下,當各發光元件群的各發光元件的溫度因點燈而發生變化時,流入至各發光元件群的電流值也會發生變化。 Further, in the light-emitting module 10a to the light-emitting module 10c of the embodiment, for example, the first light-emitting element group and the second light-emitting element group connected in parallel are connected to a common power supply path. In the case of lighting, even when the total amount of electric power supplied to each of the light-emitting element groups does not change, when the temperature of each of the light-emitting elements of each of the light-emitting element groups changes due to lighting, the light flows into each of the light-emitting elements. The current value of the component group also changes.

另外,在實施方式的發光模組10a~發光模組10c中,例如,第一發光元件及第二發光元件的發光效率及電壓隨著溫度的上升而下降,且隨著溫度的下降而上升。 Further, in the light-emitting module 10a to the light-emitting module 10c of the embodiment, for example, the luminous efficiency and voltage of the first light-emitting element and the second light-emitting element decrease as the temperature rises, and rise as the temperature decreases.

另外,在實施方式的發光模組10a~發光模組10c中,例如,第一發光元件為藍色LED(Light Emitting Diodes)元件,第二發光元件為紅色LED元件。 Further, in the light-emitting module 10a to the light-emitting module 10c of the embodiment, for example, the first light-emitting element is a blue LED (Light Emitting Diodes) element, and the second light-emitting element is a red LED element.

另外,在實施方式的發光模組10a~發光模組10c中,例如,多個第一發光元件串聯地連接而成的第一發光元件群、與多個第二發光元件串聯地連接而成的第二發光元件群並聯地連接。另外,第一發光元件群的額定條件與第二發光元件群的額定條件相等。 Further, in the light-emitting module 10a to the light-emitting module 10c of the embodiment, for example, a first light-emitting element group in which a plurality of first light-emitting elements are connected in series and a plurality of second light-emitting elements are connected in series The second group of light emitting elements are connected in parallel. Further, the rated condition of the first light-emitting element group is equal to the rated condition of the second light-emitting element group.

另外,實施方式的發光模組10a~發光模組10c例如有多個第一發光元件群,且有多個第二發光元件群。另外,多個第一發光元件群與多個第二發光元件群並聯地連接。 Further, the light-emitting module 10a to the light-emitting module 10c of the embodiment include, for example, a plurality of first light-emitting element groups and a plurality of second light-emitting element groups. Further, the plurality of first light-emitting element groups are connected in parallel to the plurality of second light-emitting element groups.

另外,實施方式的照明裝置100a~照明裝置100c例 如包括:發光模組10a~發光模組10c、與將電力供給至發光模組10a~發光模組10c的點燈裝置。 Further, examples of the illumination device 100a to the illumination device 100c of the embodiment The lighting module 10a, the light-emitting module 10c, and the lighting device for supplying electric power to the light-emitting module 10a to the light-emitting module 10c are included.

再者,在以下的實施方式中,將發光元件作為LED(Light Emitting Diode)來進行說明,但並不限定於此。例如,所述發光元件可為有機EL(OLEDs,(Organic Light Emitting Diodes)),也可為半導體雷射器(laser)等因電流供給而發出規定顏色的光的其他發光元件。 In the following embodiments, the light-emitting element will be described as an LED (Light Emitting Diode), but the present invention is not limited thereto. For example, the light-emitting element may be an organic EL (OLED (Organic Light Emitting Diodes)), or may be another light-emitting element that emits light of a predetermined color due to current supply, such as a semiconductor laser.

另外,在以下的實施方式中,以如下的情況為例子來進行說明,該情況是指第一發光元件為藍色LED(Light Emitting Diodes)元件,第二發光元件為紅色LED元件,但並不限定於此。即,第二發光元件只要為如下的發光元件,該發光元件與第一發光元件並聯地連接,且與第一發光元件相比較,相對於溫度變化的發光效率的變化率及電壓的變化率更大,則可為任意的發光元件。例如,第一發光元件與第二發光元件可均為發出藍色光的發光元件,也可為任意的發光元件。 In the following embodiments, the following description will be given as an example. In this case, the first light-emitting element is a blue LED (Light Emitting Diodes) element, and the second light-emitting element is a red LED element, but Limited to this. In other words, the second light-emitting element is only a light-emitting element that is connected in parallel with the first light-emitting element, and has a rate of change in luminous efficiency and a rate of change in voltage with respect to temperature change as compared with the first light-emitting element. Large, it can be any light-emitting element. For example, the first light-emitting element and the second light-emitting element may both be light-emitting elements that emit blue light, or may be any light-emitting elements.

另外,在以下的實施方式中,LED例如由發光二極體晶片(diode chip)構成,該發光二極體晶片包含:發光色為藍色的氮化鎵(GaN)系半導體、或發光色為紅色的四元材料(Al/In/Ga/P)化合物系半導體。另外,LED例如是使用板載晶片(Chip On Board,COB)技術,將一部分或全部以固定的間隔,規則地排列為矩陣狀、鋸齒狀或放射狀等而安裝。或者,LED例如也可為以表面安裝器件(Surface Mount device,SMD)的形式而構成的LED。另 外,在以下的實施方式中,關於LED的數量,利用能夠根據照明用途而將設計予以變更的個數的同種LED來構成LED群。 Further, in the following embodiments, the LED is constituted, for example, by a diode chip including a gallium nitride (GaN) semiconductor having a blue illuminating color or an illuminating color. The red quaternary material (Al/In/Ga/P) compound is a semiconductor. Further, for example, the LEDs are mounted on a chip-on-board (COB) technology, and some or all of them are regularly arranged in a matrix, a zigzag shape, or a radial shape at regular intervals. Alternatively, the LED may be, for example, an LED constructed in the form of a surface mount device (SMD). another Further, in the following embodiments, the number of LEDs is configured by the same type of LEDs that can be changed in design according to the lighting use.

另外,在以下的實施方式中,將照明裝置的形狀設為氪(krypton)燈泡形,但不限於此,該照明裝置的形狀也可為普通燈泡形、炮彈形及其他形狀。 Further, in the following embodiments, the shape of the illumination device is a krypton bulb shape, but the shape of the illumination device may be a normal bulb shape, a bullet shape, or the like.

[第一實施方式] [First Embodiment]

(安裝有第一實施方式的發光模組的照明裝置的構成) (Configuration of illuminating device in which the light-emitting module of the first embodiment is mounted)

圖1是表示安裝有第一實施方式的發光模組的照明裝置的縱剖面圖。如圖1所示,第一實施方式的照明裝置100a包括發光模組10a。另外,照明裝置100a包括:本體11、燈頭構件12a、金屬眼部12b、外罩(cover)13、控制部14、電氣配線14a、電極接合部14a-1、電氣配線14b、以及電極接合部14b-1。 Fig. 1 is a longitudinal sectional view showing an illuminating device to which a light-emitting module of a first embodiment is attached. As shown in FIG. 1, the illumination device 100a of the first embodiment includes a light emitting module 10a. Further, the illumination device 100a includes a main body 11, a base member 12a, a metal eye portion 12b, a cover 13, a control portion 14, an electric wiring 14a, an electrode joint portion 14a-1, an electric wiring 14b, and an electrode joint portion 14b- 1.

發光模組10a配置於本體11的鉛垂方向的上表面。發光模組10a包括基板1。該基板1由低導熱率的陶瓷(ceramics)例如氧化鋁形成。例如在300[K]大氣環境下,基板1的導熱率為33[W/m‧K]。 The light emitting module 10a is disposed on the upper surface of the main body 11 in the vertical direction. The light emitting module 10a includes a substrate 1. The substrate 1 is formed of ceramics of low thermal conductivity such as alumina. For example, in a 300 [K] atmosphere, the thermal conductivity of the substrate 1 is 33 [W/m‧K].

若基板1由陶瓷形成,則機械強度、尺寸精度均高,因此,有助於使對發光模組10a進行量產時的成品率提高,使發光模組10a的製造成本減少,及使發光模組10a的壽命延長。另外,陶瓷對於可見光的反射率高,因此,會使LED模組的發光效率提高。 When the substrate 1 is made of ceramics, the mechanical strength and dimensional accuracy are high. Therefore, the yield of the light-emitting module 10a during mass production is improved, the manufacturing cost of the light-emitting module 10a is reduced, and the light-emitting mode is made. The life of group 10a is extended. In addition, since ceramics have a high reflectance for visible light, the luminous efficiency of the LED module is improved.

再者,不限於氧化鋁,也可使用氮化矽、氧化矽等來形成基板1。另外,基板1的導熱率較佳為20[W/m‧K]~70[W/m‧K]。若基板1的導熱率為20[W/m‧K]~70[W/m‧K],則可抑制製造成本、反射率及基板1上所安裝的發光元件之間的熱影響。另外,由具有較佳的導熱率的陶瓷形成的基板1與導熱率高的基板相比較,可抑制基板1上所安裝的發光元件之間的熱影響。因此,對於由具有較佳的導熱率的陶瓷形成的基板1而言,可使基板1上所安裝的發光元件之間的隔開距離縮短,從而能夠變得更小。 Further, the substrate 1 may be formed using tantalum nitride, ruthenium oxide or the like without being limited to alumina. Further, the thermal conductivity of the substrate 1 is preferably 20 [W/m‧K] to 70 [W/m‧K]. When the thermal conductivity of the substrate 1 is 20 [W/m‧K] to 70 [W/m‧K], the manufacturing cost, the reflectance, and the thermal influence between the light-emitting elements mounted on the substrate 1 can be suppressed. Further, the substrate 1 formed of ceramic having a preferable thermal conductivity can suppress the thermal influence between the light-emitting elements mounted on the substrate 1 as compared with the substrate having a high thermal conductivity. Therefore, for the substrate 1 formed of ceramic having a preferable thermal conductivity, the separation distance between the light-emitting elements mounted on the substrate 1 can be shortened, and thus can be made smaller.

再者,也可使用氮化鋁等鋁的氮化物來形成基板1。在此情況下,例如在300[K]大氣環境下,基板1的導熱率小於約99.5品質%的鋁的導熱率即225[W/m‧K]。 Further, the substrate 1 may be formed using a nitride of aluminum such as aluminum nitride. In this case, for example, in a 300 [K] atmosphere, the thermal conductivity of the substrate 1 is less than about 99.5% by mass of the thermal conductivity of aluminum, that is, 225 [W/m‧K].

發光模組10a例如在基板1的鉛垂方向的上表面的圓周上配置有藍色LED2a。另外,發光模組10a例如在基板1的鉛垂方向的上表面的中心附近配置有紅色LED4a。該紅色LED4a與藍色LED2a相比較,發光元件的發光量會隨著發光元件的溫度的上升而進一步下降。即,紅色LED4a與藍色LED2a相比較,在如下的方面,熱特性不佳,所述方面是指發光元件的發光量會隨著發光元件的溫度的上升而進一步下降。對於第一實施方式而言,由於基板1為低導熱率的陶瓷,因此,會抑制藍色LED2a所發出的熱經由基板1而向紅色LED4a傳導,從而抑制紅色LED4a的發光效率的惡化。 In the light-emitting module 10a, for example, a blue LED 2a is disposed on the circumference of the upper surface of the substrate 1 in the vertical direction. Further, in the light-emitting module 10a, for example, a red LED 4a is disposed in the vicinity of the center of the upper surface of the substrate 1 in the vertical direction. When the red LED 4a is compared with the blue LED 2a, the amount of light emitted from the light-emitting element further decreases as the temperature of the light-emitting element rises. That is, the red LED 4a is inferior in thermal characteristics in comparison with the blue LED 2a in that the amount of light emitted from the light-emitting element further decreases as the temperature of the light-emitting element rises. In the first embodiment, since the substrate 1 is a ceramic having a low thermal conductivity, heat emitted from the blue LED 2a is suppressed from being transmitted to the red LED 4a via the substrate 1, and deterioration of the luminous efficiency of the red LED 4a is suppressed.

再者,在圖1中,將數量予以省略地記載了藍色LED2a及紅色LED4a。即,多個藍色LED2a配置在基板1的鉛垂方向的上表面的圓周上作為第一發光元件群。另外,多個紅色LED4a配置在基板1的鉛垂方向的上表面的中心附近作為第二發光元件群。 In addition, in FIG. 1, the blue LED 2a and the red LED 4a are abbreviate|omitted. In other words, the plurality of blue LEDs 2a are arranged on the circumference of the upper surface of the substrate 1 in the vertical direction as the first light-emitting element group. Further, a plurality of red LEDs 4a are arranged in the vicinity of the center of the upper surface of the substrate 1 in the vertical direction as the second light-emitting element group.

包含多個藍色LED2a的第一發光元件群被密封部3a從上部包覆。密封部3a在基板1的鉛垂方向的上表面,剖面為大致半圓狀或大致梯形,且以將多個藍色LED2a予以包覆的方式而形成為圓環狀。另外,借由密封部5a,從上部將包含多個紅色LED4a的第二發光元件群的每個凹部予以包覆,所述凹部是由密封部3a所形成的圓環的內側的面與基板1形成。 The first light-emitting element group including the plurality of blue LEDs 2a is covered by the sealing portion 3a from the upper portion. The sealing portion 3a has a substantially semicircular or substantially trapezoidal cross section in the upper surface of the substrate 1 in the vertical direction, and is formed in an annular shape so as to cover the plurality of blue LEDs 2a. Further, each of the concave portions of the second light-emitting element group including the plurality of red LEDs 4a is covered by the sealing portion 5a, and the concave portion is the inner surface of the ring formed by the sealing portion 3a and the substrate 1 form.

密封部3a及密封部5a可將環氧樹脂、尿素樹脂、以及矽酮樹脂等各種樹脂形成為構件。密封部5a也可為不含有螢光體且擴散性高的透明樹脂。密封部3a及密封部5a是由不同種類的樹脂形成。而且,密封部3a的光的折射率n1、密封部5a的光的折射率n2、以及由本體11及外罩13形成的空間中所封入的氣體的光的折射率n3,例如具有n3<n1<n2的大小關係。以下,將由本體11及外罩13形成的空間中所封入的氣體稱為“封入氣體”。封入氣體例如為大氣。 The sealing portion 3a and the sealing portion 5a can be formed into various members of various resins such as an epoxy resin, a urea resin, and an anthrone resin. The sealing portion 5a may be a transparent resin that does not contain a phosphor and has high diffusibility. The sealing portion 3a and the sealing portion 5a are formed of different kinds of resins. Further, the refractive index n1 of the light of the sealing portion 3a, the refractive index n2 of the light of the sealing portion 5a, and the refractive index n3 of the light of the gas enclosed in the space formed by the main body 11 and the outer cover 13 have, for example, n3 < n1 < The size relationship of n2. Hereinafter, the gas enclosed in the space formed by the main body 11 and the outer cover 13 is referred to as "enclosed gas". The enclosed gas is, for example, an atmosphere.

另外,發光模組10a的後述的電極6a-1與電極接合部14a-1連接。另外,發光模組10a的後述的電極8a-1與電極接合部14b-1連接。 Further, an electrode 6a-1, which will be described later, of the light-emitting module 10a is connected to the electrode joint portion 14a-1. Further, an electrode 8a-1, which will be described later, of the light-emitting module 10a is connected to the electrode joint portion 14b-1.

本體11是由導熱性良好的金屬形成,例如由鋁形成。本體11的橫剖面呈大致圓的圓柱狀,在一端安裝有外罩13,且在另一端安裝有燈頭構件12a。另外,本體11是以使外周面呈大致圓錐狀的斜面的方式而形成,所述大致圓錐狀的斜面的直徑從一端向另一端逐漸變小。本體11的外觀構成為如下的形狀,該形狀近似於迷你氪燈泡中的頸部的輪廓(silhouette)。本體11在外周面一體地形成有從一端向另一端呈放射狀地突出且未圖示的多個散熱片。 The body 11 is formed of a metal having good thermal conductivity, for example, aluminum. The main body 11 has a substantially circular cylindrical cross section, and a cover 13 is attached to one end, and a cap member 12a is attached to the other end. Further, the main body 11 is formed such that the outer peripheral surface has a substantially conical inclined surface, and the diameter of the substantially conical inclined surface gradually decreases from one end to the other end. The appearance of the body 11 is configured as a shape that approximates the silhouette of the neck in the mini-tank bulb. The main body 11 is integrally formed with a plurality of fins that are radially protruded from one end to the other end on the outer peripheral surface and are not shown.

燈頭構件12a例如為愛迪生型(Edison type)的E形燈頭,且包括:具有螺紋的銅板制的筒狀的外殼(shell)、及經由電氣絕緣部而設置於外殼下端的頂部的導電性的金屬眼部12b。外殼的開口部是與本體11的另一端的開口部電氣絕緣地受到固定。外殼及金屬眼部12b連接著未圖示的輸入線,該未圖示的輸入線從控制部14中的未圖示的電路基板的電力輸入端子導出。 The cap member 12a is, for example, an Edison type E-shaped base, and includes a cylindrical casing made of a copper plate having a thread, and a conductive metal provided on the top of the lower end of the casing via an electrical insulating portion. Eye 12b. The opening of the outer casing is fixed electrically insulated from the opening of the other end of the body 11. An input line (not shown) is connected to the casing and the metal eye portion 12b, and the input line (not shown) is led out from a power input terminal of a circuit board (not shown) of the control unit 14.

外罩13構成燈罩(globe),且例如利用乳白色的聚碳酸酯而形成為平滑的曲面狀,該平滑的曲面狀近似於在一端具有開口的迷你氪燈泡的輪廓。外罩13是以將發光模組10a的發光面予以覆蓋的方式,將開口端部嵌入且固定於本體11。借此,構成照明裝置100a作為附燈頭的燈,該附燈頭的燈在一端包括外罩13即燈罩,在另一端設置有E形的燈頭構件12a,整體的外觀形狀近似於迷你氪燈泡的輪廓,且能夠代替迷你氪燈泡。再者,將外罩13固定於本體11的方法也可為粘接、嵌合、螺合、以及卡止等任何 方法。 The outer cover 13 constitutes a globe, and is formed, for example, by a milky white polycarbonate, and has a smooth curved shape similar to the outline of a mini-bright bulb having an opening at one end. The cover 13 is such that the light-emitting surface of the light-emitting module 10a is covered, and the opening end portion is fitted and fixed to the body 11. Thereby, the illuminating device 100a is configured as a lamp with a lamp cap, and the lamp with the cap includes an outer cover 13 or a lamp cover at one end, and an E-shaped cap member 12a at the other end, and the overall appearance shape is similar to that of the mini 氪 bulb. And can replace the mini light bulb. Furthermore, the method of fixing the outer cover 13 to the main body 11 may be any of bonding, fitting, screwing, and locking. method.

控制部14以使未圖示的點燈裝置與外部電氣絕緣的方式而收容著該未圖示的點燈裝置,該未圖示的點燈裝置對安裝於基板1的藍色LED2a及紅色LED4a的點燈進行控制。控制部14將交流電壓轉換為直流電壓,將該直流電壓供給至藍色LEDa2及紅色LED4a。另外,用以向藍色LED2a及紅色LED4a供電的電氣配線14a連接於控制部14的點燈裝置的輸出端子。另外,第二電氣配線14b連接於控制部14的點燈裝置的輸入端子。電氣配線14a及電氣配線14b被絕緣包覆。 The control unit 14 accommodates a lighting device (not shown) such that the lighting device (not shown) is electrically insulated from the outside, and the lighting device (not shown) pairs the blue LED 2a and the red LED 4a attached to the substrate 1. The lighting is controlled. The control unit 14 converts the AC voltage into a DC voltage, and supplies the DC voltage to the blue LED a2 and the red LED 4a. Further, the electric wiring 14a for supplying power to the blue LED 2a and the red LED 4a is connected to the output terminal of the lighting device of the control unit 14. Further, the second electric wiring 14b is connected to an input terminal of the lighting device of the control unit 14. The electric wiring 14a and the electric wiring 14b are insulated and covered.

此處,點燈裝置將電力供給至發光模組10a~發光模組10c。此處,在發光模組10a~發光模組10c上並聯地連接的第一發光元件群及第二發光元件群是借由共用的電力供給路徑,與點燈裝置連接。即使當點燈時,各發光元件群的溫度發生變化,點燈裝置對各發光元件群供給的總電力量也不會發生變化。另外,因點燈裝置而流入至各發光元件群的電流值在如下的情況下會發生變化,該情況是指當點燈時,各發光元件群的溫度發生變化。 Here, the lighting device supplies electric power to the light-emitting modules 10a to 10c. Here, the first light-emitting element group and the second light-emitting element group connected in parallel to the light-emitting module 10a to the light-emitting module 10c are connected to the lighting device via a common power supply path. Even when the lighting is performed, the temperature of each of the light-emitting element groups changes, and the total amount of electric power supplied from the lighting device to each of the light-emitting element groups does not change. Further, the current value flowing into each of the light-emitting element groups by the lighting device changes as follows. In this case, the temperature of each light-emitting element group changes when lighting.

電氣配線14a經由形成於本體11的未圖示的貫通孔及未圖示的引導槽而導出至本體11的一端的開口部。電氣配線14a的電極接合部14a-1與基板1上所配置的配線的電極6a-1接合,所述電極接合部14a-1是絕緣包覆已剝離的前端部分。將對電極6a-1後述。 The electric wiring 14a is led to an opening of one end of the main body 11 via a through hole (not shown) formed in the main body 11 and a guide groove (not shown). The electrode joint portion 14a-1 of the electric wiring 14a is joined to the electrode 6a-1 of the wiring disposed on the substrate 1, and the electrode joint portion 14a-1 is a tip end portion in which the insulating coating is peeled off. The counter electrode 6a-1 will be described later.

另外,電氣配線14b經由形成於本體11的未圖示的 貫通孔及未圖示的引導槽而導出至本體11的一端的開口部。電氣配線14b的電極接合部14b-1與基板1上所配置的配線的電極8a-1,所述電極接合部14b-1是絕緣包覆已剝離的前端部分。將對電極8a-1後述。 In addition, the electric wiring 14b is formed via a body (not shown) formed in the main body 11 The through hole and the guide groove (not shown) are led out to the opening of one end of the body 11. The electrode bonding portion 14b-1 of the electric wiring 14b and the electrode 8a-1 of the wiring disposed on the substrate 1 are the front end portions of the electrode bonding portion 14b-1 which are insulated and coated. The counter electrode 8a-1 will be described later.

如此,控制部14將電力經由電氣配線14a而供給至藍色LED2a及紅色LED4a,所述電力是經由外殼及金屬眼部12b而輸入的電力。而且,控制部14經由電氣配線14b,對供給至藍色LED2a及紅色LED4a的電力進行回收。 In this manner, the control unit 14 supplies electric power to the blue LED 2a and the red LED 4a via the electric wiring 14a, and the electric power is electric power input via the outer casing and the metal eye portion 12b. Further, the control unit 14 collects electric power supplied to the blue LED 2a and the red LED 4a via the electric wiring 14b.

(第一實施方式的發光模組的構成) (Configuration of Light Emitting Module of First Embodiment)

圖2是表示第一實施方式的發光模組的俯視圖。圖2是從圖1中的箭頭A的方向所見的發光模組10a的俯視圖。如圖2所示,在大致矩形的基板1的中心的圓周上,包含多個藍色LED2a的第一發光元件群規則地配置為圓環狀。而且,借由密封部3a,呈圓環狀且完全將包含多個藍色LED2a的第一發光元件群予以包覆。將基板1中的由密封部3a包覆的區域稱為第一區域。 Fig. 2 is a plan view showing a light-emitting module of the first embodiment. FIG. 2 is a plan view of the light-emitting module 10a as seen from the direction of the arrow A in FIG. 1. As shown in FIG. 2, the first light-emitting element group including the plurality of blue LEDs 2a is regularly arranged in an annular shape on the circumference of the center of the substantially rectangular substrate 1. Further, the sealing portion 3a is annularly shaped and completely covers the first light-emitting element group including the plurality of blue LEDs 2a. A region of the substrate 1 covered by the sealing portion 3a is referred to as a first region.

另外,如圖2所示,在大致矩形的基板1的中心附近,包含多個紅色LED4a的第二發光元件群規則地配置為格子狀。而且,借由密封部5a,將包含多個紅色LED4a的LED群完全予以包覆。另外,密封部5a將所述第一區域的圓環的內部完全予以包覆。將基板1中的由密封部5a包覆的區域稱為第二區域。 Further, as shown in FIG. 2, the second light-emitting element group including the plurality of red LEDs 4a is regularly arranged in a lattice shape in the vicinity of the center of the substantially rectangular substrate 1. Further, the LED group including the plurality of red LEDs 4a is completely covered by the sealing portion 5a. Further, the sealing portion 5a completely covers the inside of the ring of the first region. A region of the substrate 1 covered by the sealing portion 5a is referred to as a second region.

再者,由於使用圖4來對藍色LED2a及紅色LED4a的連接狀態的詳情進行後述,因此,此處省略說明。 In addition, since the details of the connection state of the blue LED 2a and the red LED 4a will be described later using FIG. 4, description thereof will be omitted.

另外,如圖2所示,將藍色LED2a與紅色LED4a的距離中的最短距離設為藍色LED2a及紅色LED4a的距離D1。再者,藍色LED2a及紅色LED4a的距離並不限於藍色LED2a與紅色LED4a的距離中的最短距離,也可為第一發光元件群的中心位置與第二發光元件群的中心位置的距離。在圖2所示的例子中,例如,第一發光元件群的中心位置是通過配置為圓環狀的藍色LED2a的各中心的圓周。另外,例如,第二發光元件群的中心位置是將紅色LED4a配置為格子狀時的中心。在此情況下,藍色LED2a及紅色LED4a的距離是將紅色LED4a配置為格子狀時的中心、與通過配置為圓環狀的藍色LED2a的各中心的圓周上的一個點之間的距離。 Further, as shown in FIG. 2, the shortest distance among the distances between the blue LED 2a and the red LED 4a is defined as the distance D1 between the blue LED 2a and the red LED 4a. Further, the distance between the blue LED 2a and the red LED 4a is not limited to the shortest distance among the distances between the blue LED 2a and the red LED 4a, and may be the distance between the center position of the first light-emitting element group and the center position of the second light-emitting element group. In the example shown in FIG. 2, for example, the center position of the first light-emitting element group is a circumference passing through the centers of the blue LEDs 2a arranged in a ring shape. Further, for example, the center position of the second light-emitting element group is the center when the red LEDs 4a are arranged in a lattice shape. In this case, the distance between the blue LED 2a and the red LED 4a is the distance between the center when the red LED 4a is arranged in a lattice shape and one point on the circumference of each of the centers of the blue LEDs 2a arranged in an annular shape.

對於發光模組10a而言,即使按照LED的種類,使區域分離地將熱特性大不相同的多種LED混載在陶瓷的基板1上,也可抑制紅色LED4a承受藍色LED2a所產生的熱時的影響。由此,發光模組10a容易獲得所期望的發光特性。 In the light-emitting module 10a, even if a plurality of types of LEDs having greatly different thermal characteristics are mixed and mixed on the ceramic substrate 1 in accordance with the type of the LED, the red LED 4a can be prevented from being subjected to the heat generated by the blue LED 2a. influences. Thereby, the light-emitting module 10a easily obtains desired light-emitting characteristics.

另外,發光模組10a例如使區域分離地配置有藍色LED2a及紅色LED4a。因此,發光模組10a例如會抑制藍色LED2a所產生的熱傳導至紅色LED4a,所以會使整個發光模組10a的熱特性提高。 Further, the light-emitting module 10a is provided with, for example, a blue LED 2a and a red LED 4a in a separate region. Therefore, the light-emitting module 10a suppresses the heat generated by the blue LED 2a to the red LED 4a, for example, so that the thermal characteristics of the entire light-emitting module 10a are improved.

再者,在圖2中,藍色LED2a及紅色LED4a的個數及位置僅表示一例,也可為任意的配置。 In addition, in FIG. 2, the number and position of the blue LED 2a and the red LED 4a are only an example, and may be arbitrary.

(第一實施方式的發光模組的裝著的詳情) (Details of mounting of the light-emitting module of the first embodiment)

圖3是表示安裝有第一實施方式的發光模組的照明裝置的橫剖面圖。圖3是圖2中的發光模組10a的B-B剖面圖。在圖3中,已將照明裝置100a的外罩13、或本體11的下部的記載予以省略。如圖3所示,照明裝置100a的本體11包括:收容著發光模組10a的基板1的凹部11a、以及對基板1進行固定的固定構件15a及固定構件15b。發光模組10a的基板1收容於本體11的凹部11a。 3 is a cross-sectional view showing an illumination device to which the light-emitting module of the first embodiment is mounted. 3 is a cross-sectional view taken along line B-B of the light-emitting module 10a of FIG. 2. In FIG. 3, the description of the outer cover 13 of the illuminating device 100a or the lower portion of the main body 11 has been omitted. As shown in FIG. 3, the main body 11 of the illuminating device 100a includes a concave portion 11a of the substrate 1 in which the light-emitting module 10a is housed, and a fixing member 15a and a fixing member 15b that fix the substrate 1. The substrate 1 of the light-emitting module 10a is housed in the recess 11a of the body 11.

而且,借由固定構件15a及固定構件15b的按壓力,將基板1的緣部向凹部11a的下方按壓,借此,將發光模組10a固定於本體11。借此,發光模組10a安裝於照明裝置100a。再者,將發光模組10a安裝於照明裝置100a的方法並不限定於圖3所示的方法,也可為粘接、嵌合、螺合、以及卡止等任何方法。 Then, the edge portion of the substrate 1 is pressed against the lower portion of the concave portion 11a by the pressing force of the fixing member 15a and the fixing member 15b, whereby the light-emitting module 10a is fixed to the main body 11. Thereby, the light emitting module 10a is attached to the lighting device 100a. Furthermore, the method of attaching the light-emitting module 10a to the illumination device 100a is not limited to the method shown in FIG. 3, and may be any method such as bonding, fitting, screwing, and locking.

如圖3所示,藍色LED2a及紅色LED4a的距離D1比基板1的鉛垂方向的厚度D2更長。在基板1上,與鉛垂方向相比較,藍色LED2a及紅色LED4a的因發光而產生的熱更容易向水準方向傳導。因此,例如,藍色LED2a所發出的熱會經由基板1的水準方向而向紅色LED4a傳導,使紅色LED4a的發光效率進一步惡化。然而,使藍色LED2a及紅色LED4a的距離D1比基板1的鉛垂方向的厚度D2更長,借此,抑制藍色LED2a所發出的熱經由基板1的水準方向而向紅色LED4a傳導。由此,抑制紅色LED4a的發光效率的惡化。然而,並不限定於此,距離D1也可為任意的值。 As shown in FIG. 3, the distance D1 between the blue LED 2a and the red LED 4a is longer than the thickness D2 of the substrate 1 in the vertical direction. On the substrate 1, the heat generated by the light emission of the blue LED 2a and the red LED 4a is more easily conducted in the horizontal direction than in the vertical direction. Therefore, for example, heat emitted from the blue LED 2a is conducted to the red LED 4a via the level direction of the substrate 1, and the luminous efficiency of the red LED 4a is further deteriorated. However, the distance D1 between the blue LED 2a and the red LED 4a is made longer than the thickness D2 of the substrate 1 in the vertical direction, whereby the heat generated by the blue LED 2a is suppressed from being transmitted to the red LED 4a via the level direction of the substrate 1. Thereby, the deterioration of the luminous efficiency of the red LED 4a is suppressed. However, the present invention is not limited thereto, and the distance D1 may be an arbitrary value.

另外,如圖3所示,密封部3a的高度H1高於密封部5a的高度H2。參照圖5來對該效果進行後述。再者,密封部3a的高度H1及密封部5a的高度H2也可相同。 Further, as shown in FIG. 3, the height H1 of the sealing portion 3a is higher than the height H2 of the sealing portion 5a. This effect will be described later with reference to Fig. 5 . Further, the height H1 of the sealing portion 3a and the height H2 of the sealing portion 5a may be the same.

(第一實施方式的發光模組的配線) (Wiring of the light-emitting module of the first embodiment)

圖4是表示第一實施方式的發光模組的電氣配線的圖。如圖4所示,發光模組10a包括:第一發光元件與第二發光元件,該第二發光元件是與第一發光元件並聯地連接的元件,且相對於溫度變化的發光效率的變化率及電壓的變化率比第一發光元件更大。具體而言,多個第一發光元件串聯地連接而成的第一發光元件群、與多個第二發光元件串聯地連接而成的第二發光元件群並聯地連接。另外,存在多個第一發光元件群,存在多個第二發光元件群,且多個第一發光元件群與多個第二發光元件群並聯地連接。另外,並聯地連接的第一發光元件群及第二發光元件群連接於共用的電力供給路徑。 4 is a view showing electrical wiring of the light-emitting module of the first embodiment. As shown in FIG. 4, the light emitting module 10a includes: a first light emitting element and a second light emitting element, wherein the second light emitting element is an element connected in parallel with the first light emitting element, and a rate of change of luminous efficiency with respect to temperature change And the rate of change of the voltage is larger than that of the first illuminating element. Specifically, a first light-emitting element group in which a plurality of first light-emitting elements are connected in series, and a second light-emitting element group in which a plurality of second light-emitting elements are connected in series are connected in parallel. Further, a plurality of first light-emitting element groups are present, and a plurality of second light-emitting element groups are present, and the plurality of first light-emitting element groups are connected in parallel to the plurality of second light-emitting element groups. Further, the first light-emitting element group and the second light-emitting element group connected in parallel are connected to a common power supply path.

在圖4所示的例子中,發光模組10a在基板1上包括:與照明裝置100a的電極接合部14a-1連接的電極6a-1、及從電極6a-1延伸出的配線6a。另外,發光模組10a在基板1上包括:與照明裝置100a的電極接合部14b-1連接的電極8a-1、及從電極8a-1延伸出的配線8a。 In the example shown in FIG. 4, the light-emitting module 10a includes on the substrate 1 an electrode 6a-1 connected to the electrode bonding portion 14a-1 of the illumination device 100a and a wiring 6a extending from the electrode 6a-1. Further, the light-emitting module 10a includes, on the substrate 1, an electrode 8a-1 connected to the electrode bonding portion 14b-1 of the illumination device 100a, and a wiring 8a extending from the electrode 8a-1.

此處,在發光模組10a中,在基板1上,借由接線(bonding wire)9a-1而被串聯地連接的多個藍色LED2a是連接於配線6a與配線8a。另外,在發光模組10a中,在基板1上,借由接線9a-2而被串聯地連接的多個紅色 LED4a是連接於配線6a與配線8a。結果,借由接線9a-1而被串聯地連接的多個藍色LED2a、與借由接線9a-2而被串聯地連接的多個紅色LED4a並聯地連接。 Here, in the light-emitting module 10a, a plurality of blue LEDs 2a connected in series by a bonding wire 9a-1 on the substrate 1 are connected to the wiring 6a and the wiring 8a. Further, in the light-emitting module 10a, a plurality of reds connected in series by the wiring 9a-2 on the substrate 1 The LED 4a is connected to the wiring 6a and the wiring 8a. As a result, the plurality of blue LEDs 2a connected in series by the wiring 9a-1 and the plurality of red LEDs 4a connected in series by the wiring 9a-2 are connected in parallel.

如此,將借由接線9a-1及接線9a-2而被串聯地連接的多個藍色LED2a及多個紅色LED4a並聯地連接,借此,流入至各藍色LED2a及各紅色LED4a的電流量會隨著發光元件的溫度變化而發生變化,從而能夠抑制多種發光元件各自所輸出的光的輸出平衡的變化。能夠抑制光的輸出平衡的變化這一方面的詳情將後述。 In this manner, the plurality of blue LEDs 2a and the plurality of red LEDs 4a connected in series by the wiring 9a-1 and the wiring 9a-2 are connected in parallel, whereby the amount of current flowing into each of the blue LEDs 2a and the red LEDs 4a The temperature changes with the change of the temperature of the light-emitting element, so that the change in the output balance of the light outputted by each of the plurality of light-emitting elements can be suppressed. Details of the aspect in which the change in the output balance of light can be suppressed will be described later.

(第一實施方式的各發光元件的發光色的反射) (Reflection of the luminescent color of each of the light-emitting elements of the first embodiment)

圖5是表示第一實施方式的發光模組中的各發光元件的發光色的反射的圖。作為圖5的前提,如上所述,密封部3a的光的折射率n1、密封部5a的光的折射率n2、以及由本體11及外罩13形成的空間中所封入的封入氣體的光的折射率n3,具有n3<n1<n2的大小關係。 FIG. 5 is a view showing reflection of an illuminating color of each light-emitting element in the light-emitting module of the first embodiment. As a premise of FIG. 5, as described above, the refractive index n1 of the light of the sealing portion 3a, the refractive index n2 of the light of the sealing portion 5a, and the refraction of the enclosed gas enclosed in the space formed by the main body 11 and the outer cover 13 The rate n3 has a magnitude relationship of n3 < n1 < n2.

如此,如圖5中的實線箭頭所示,根據所述折射率的大小關係,紅色LED4a所發出的光在密封部5a與封入氣體的介面上,大致發生全反射而向密封部3a的方向前進。另外,如圖5中的實線箭頭所示,由密封部5a與封入氣體的介面反射而向密封部3a的方向前進的光根據所述折射率的大小關係,在密封部5a與密封部3a的介面上發生折射,接著向密封部3a內部前進。 As described above, as indicated by the solid arrows in FIG. 5, according to the magnitude relationship of the refractive index, the light emitted by the red LED 4a is substantially totally reflected in the direction of the sealing portion 3a on the interface between the sealing portion 5a and the sealed gas. go ahead. Further, as indicated by the solid arrows in FIG. 5, the light which is reflected by the sealing portion 5a and the interface in which the gas is sealed and proceeds in the direction of the sealing portion 3a is in the sealing portion 5a and the sealing portion 3a in accordance with the magnitude relationship of the refractive index. Refraction occurs at the interface, and then proceeds to the inside of the sealing portion 3a.

另一方面,如圖5中的雙點劃線的箭頭所示,根據所述折射率的大小關係,藍色LED2a所發出的光在密封部 3a與封入氣體的介面上發生折射,接著向封入氣體方向前進。再者,根據所述折射率的大小關係,藍色LED2a所發出的大部分的光由密封部3a與密封部5a的介面反射。另外,密封部3a的高度H1高於密封部5a的高度H2。因此,可使密封部3a與密封部5a的介面的面積減小,另一方面,可使密封部3a與封入氣體的介面的面積進一步增大。 On the other hand, as indicated by the arrow of the two-dot chain line in FIG. 5, according to the magnitude relationship of the refractive index, the light emitted by the blue LED 2a is in the sealing portion. 3a is refracted with the interface of the enclosed gas, and then proceeds toward the enclosed gas. Further, most of the light emitted by the blue LED 2a is reflected by the interface between the sealing portion 3a and the sealing portion 5a in accordance with the magnitude relationship of the refractive index. Further, the height H1 of the sealing portion 3a is higher than the height H2 of the sealing portion 5a. Therefore, the area of the interface between the sealing portion 3a and the sealing portion 5a can be reduced, and on the other hand, the area of the sealing portion 3a and the interface in which the gas is sealed can be further increased.

如此,如圖5所示,藍色LED2a所發出的光、與紅色LED4a所發出的光的大部分在密封部3a與封入氣體的介面附近,適度地經合成而射出,因此,可使發光的均一性提高。另外,發光模組10a效率良好地使紅色LED4a所發出的光射出,且效率良好地使該光與藍色LED2a所發出的光合成,因此,還可使紅色LED4a的搭載個數減少。由此,發光模組10a會抑制由熱引起的紅色LED4a的發光特性的惡化所導致的整個發光特性的惡化。 As described above, as shown in FIG. 5, most of the light emitted by the blue LED 2a and the light emitted from the red LED 4a are appropriately combined and emitted in the vicinity of the interface between the sealing portion 3a and the sealed gas, so that the light can be emitted. Uniformity is improved. Further, the light-emitting module 10a efficiently emits light emitted from the red LED 4a, and efficiently combines the light with the light emitted from the blue LED 2a. Therefore, the number of mounted red LEDs 4a can be reduced. Thereby, the light-emitting module 10a suppresses deterioration of the entire light-emitting characteristics due to deterioration of the light-emitting characteristics of the red LEDs 4a due to heat.

另外,如圖5中的虛線箭頭所示,紅色LED4a所發出的光的一部分未由密封部5a與封入氣體的介面反射,而是折射之後,向密封部5a上方的封入氣體的方向前進。另一方面,如圖5中的點劃線的箭頭所示,藍色LED2a所發出的光的一部分在密封部3a與封入氣體的介面上發生折射,接著向密封部5a上方的封入氣體方向前進。如此,即使紅色LED4a所發出的光的一部分從密封部5a向上方射出,由於密封部3a的高度高於密封部5a的高度,因此,從密封部3a的處於密封部5a側的上方區域射出的藍色LED2a的光的顏色、與從密封部5a射出的紅色LED4a的 光的顏色容易更均一地混合。因此,即使將發光色不同的LED設置在不同的區域中,混合色的顏色不均也會進一步受到抑制。 Further, as indicated by a broken line arrow in FIG. 5, a part of the light emitted by the red LED 4a is not reflected by the sealing portion 5a and the interface of the sealed gas, but is refracted, and then proceeds in the direction of the enclosed gas above the sealing portion 5a. On the other hand, as indicated by the arrow of the chain line in FIG. 5, a part of the light emitted from the blue LED 2a is refracted on the interface between the sealing portion 3a and the sealed gas, and then proceeds in the direction of the enclosed gas above the sealing portion 5a. . In this manner, even if a part of the light emitted from the red LED 4a is emitted upward from the sealing portion 5a, since the height of the sealing portion 3a is higher than the height of the sealing portion 5a, it is emitted from the upper portion of the sealing portion 3a on the sealing portion 5a side. The color of the light of the blue LED 2a and the red LED 4a emitted from the sealing portion 5a The color of the light is easily mixed more uniformly. Therefore, even if LEDs having different luminescent colors are disposed in different regions, the color unevenness of the mixed colors is further suppressed.

發光模組10a利用不含有螢光體的透明樹脂,對發光光量小的例如配置有紅色LED4a的第二區域進行密封,借此,可避免螢光體對光進行吸收,發光效率提高。另外,若發光模組10a利用擴散性高的透明樹脂,對配置有規定個數的紅色LED的第二區域進行密封,則紅色光會有效果地擴散,因此,會抑制LED模組的顏色不均。即,發光模組10a可使發出的光的顯色性及發光效率的下降減少。 The light-emitting module 10a seals the second region in which the amount of light emission is small, for example, the red LED 4a, by using a transparent resin that does not contain a phosphor, thereby preventing the phosphor from absorbing light and improving luminous efficiency. Further, when the light-emitting module 10a uses a transparent resin having high diffusibility to seal a second region in which a predetermined number of red LEDs are disposed, the red light is effectively diffused, thereby suppressing the color of the LED module. All. That is, the light-emitting module 10a can reduce the color rendering property and the luminous efficiency of the emitted light.

再者,在以上的第一實施方式中,將藍色LED2a呈圓環狀地配置在基板1上,將紅色LED4a配置在該圓環狀的中心附近。然而,不限於圓環狀,只要為矩形、菱形及其他呈環狀的形狀,則可為任何形狀。 Furthermore, in the first embodiment described above, the blue LEDs 2a are arranged in an annular shape on the substrate 1, and the red LEDs 4a are arranged in the vicinity of the center of the annular shape. However, it is not limited to an annular shape, and may be any shape as long as it is a rectangle, a rhombus, and other annular shapes.

另外,在以上的第一實施方式中,將如下的情況表示為例子,該情況是指存在多個第一發光元件群,存在多個第二發光元件群,且多個第一發光元件群與多個第二發光元件群並聯地連接。換句話說,將如下的情況表示為例子,該情況是指借由接線9a-2而被串聯地連接的多個紅色LED4a、與借由接線9a-1而被串聯地連接的多個藍色LED2a並聯地連接。然而,並不限定於此。例如,也可將第一發光元件與第二發光元件並聯地連接。換句話說,也可將一個藍色LED2a與紅色LED4a並聯地連接。另外,例如可將一個第一發光元件群與一個第二發光元件群並聯 地連接,可將一個第一發光元件群與多個第二發光元件群並聯地連接,也可將多個第一發光元件群與一個第二發光元件群並聯地連接。 Further, in the first embodiment described above, the following case is shown as an example, in which case there are a plurality of first light-emitting element groups, a plurality of second light-emitting element groups exist, and a plurality of first light-emitting element groups and A plurality of second light emitting element groups are connected in parallel. In other words, the case where the plurality of red LEDs 4a connected in series by the wiring 9a-2 and the plurality of blues connected in series by the wiring 9a-1 are shown as an example The LEDs 2a are connected in parallel. However, it is not limited to this. For example, the first light-emitting element and the second light-emitting element may be connected in parallel. In other words, a blue LED 2a can also be connected in parallel with the red LED 4a. In addition, for example, a first group of light-emitting elements can be connected in parallel with a second group of light-emitting elements. The ground connection may be performed by connecting one first light-emitting element group in parallel with the plurality of second light-emitting element groups, or may connect a plurality of first light-emitting element groups in parallel with one second light-emitting element group.

(第一實施方式的效果) (Effect of the first embodiment)

根據第一實施方式,發光模組包括第一發光元件,且包括多個第一發光元件串聯地連接而成的第一發光元件群。另外,發光模組包括第二發光元件,且包括第二發光元件群,所述第二發光元件與第一發光元件相比較,相對於溫度變化的發光效率的變化率及電壓的變化率更大,所述第二發光元件群是多個第二發光元件串聯地連接而成,且與第一發光元件群並聯地連接。結果,能夠抑制多種發光元件各自所輸出的光的輸出平衡的變化。 According to the first embodiment, the light emitting module includes a first light emitting element, and includes a first light emitting element group in which a plurality of first light emitting elements are connected in series. In addition, the light emitting module includes a second light emitting element, and includes a second light emitting element group, and the second light emitting element has a larger rate of change of the luminous efficiency and a voltage change rate with respect to the temperature change than the first light emitting element. The second light-emitting element group is formed by connecting a plurality of second light-emitting elements in series and connected in parallel with the first light-emitting element group. As a result, it is possible to suppress a change in the output balance of light outputted by each of the plurality of light-emitting elements.

另外,根據第一實施方式,並聯地連接的第一發光元件群及第二發光元件群連接於共用的電力供給路徑,在點燈時,即使在供給至各發光元件群的總電力量不發生變化的情況下,當各發光元件群的各發光元件的溫度因點燈而發生變化時,流入至各發光元件群的電流值也會發生變化。結果,能夠抑制多種發光元件各自所輸出的光的輸出平衡的變化。 Further, according to the first embodiment, the first light-emitting element group and the second light-emitting element group connected in parallel are connected to the common power supply path, and the total power amount supplied to each of the light-emitting element groups does not occur at the time of lighting. In the case of a change, when the temperature of each of the light-emitting elements of each of the light-emitting element groups changes due to lighting, the current value flowing into each of the light-emitting element groups also changes. As a result, it is possible to suppress a change in the output balance of light outputted by each of the plurality of light-emitting elements.

即,根據第一實施方式,發光模組使用了如下的兩種發光元件,一種發光元件的相對於驅動溫度的發光效率與電壓的變化特性和另一種發光元件的相對於驅動溫度的發光效率與電壓的變化特性均急劇,而且,將各個種類的發光元件群電性地並聯配置。此處,對於相對於驅動溫度上 升的發光效率的下降幅度大的發光元件而言,同時其驅動電壓的下降幅度也大,因此,相對于另一種發光元件,電流量增大。結果,能夠抑制由驅動條件或環境的變化引起的各種LED元件的輸出的平衡的變化。 That is, according to the first embodiment, the light-emitting module uses two kinds of light-emitting elements, the light-emitting efficiency and voltage change characteristics of one light-emitting element with respect to the driving temperature, and the light-emitting efficiency of the other light-emitting element with respect to the driving temperature. The voltage change characteristics are all sharp, and each type of light-emitting element group is electrically arranged in parallel. Here, for the relative drive temperature In the case of a light-emitting element having a large decrease in luminous efficiency, the magnitude of the decrease in the driving voltage is large, and therefore, the amount of current increases with respect to the other type of light-emitting element. As a result, it is possible to suppress a change in balance of outputs of various LED elements caused by changes in driving conditions or environments.

圖6是表示發光元件中的溫度與發光效率的關係的一例的圖。圖7是表示發光元件中的驅動電壓與溫度的關係的一例的圖。圖6的R21、圖7的R23分別表示紅色LED的值,圖6的B22、圖7的B24表示藍色LED的值。如圖6及圖7所示,將紅色LED與藍色LED作比較,紅色LED與藍色LED相比較,相對於溫度變化的發光效率的變化率及驅動電壓的變化率更大。 6 is a view showing an example of a relationship between temperature and luminous efficiency in a light-emitting element. FIG. 7 is a view showing an example of a relationship between a driving voltage and a temperature in a light-emitting element. R21 of FIG. 6 and R23 of FIG. 7 respectively represent values of red LEDs, and B22 of FIG. 6 and B24 of FIG. 7 represent values of blue LEDs. As shown in FIGS. 6 and 7, the red LED is compared with the blue LED, and the rate of change of the luminous efficiency with respect to the temperature change and the rate of change of the driving voltage are larger as compared with the blue LED.

圖8是表示紅色LED與藍色LED並聯地連接時的電路圖的一例的圖。圖9是表示紅色LED與藍色LED串聯地連接時的電路圖的一例的圖。在圖8及圖9所示的例子中,將如下的情況表示為例子,該情況是指多個紅色LED4a串聯地連接,多個藍色LED2a串聯地連接。另外,將如下的情況表示為例子,該情況是指存在多個串聯地連接的多個紅色LED4a的群,存在多個串聯地連接的多個藍色LED2a的群。另外,在圖9所示的例子中,將如下的情況表示為例子,該情況是指多個藍色LED2a群並聯地連接,多個紅色LED4a群並聯地連接,且並聯地連接的多個藍色LED2a群、與並聯地連接的多個紅色LED4a群串聯地連接。此處,在圖8所示的電路圖中,與所述第一實施方式的發光模組同樣地,紅色LED4a與藍色LED2a並聯地連 接。圖9所示的電路圖是為了比較而表示的電路圖。 8 is a view showing an example of a circuit diagram when a red LED and a blue LED are connected in parallel. FIG. 9 is a view showing an example of a circuit diagram when a red LED and a blue LED are connected in series. In the example shown in FIGS. 8 and 9, the following case is shown as an example. In this case, a plurality of red LEDs 4a are connected in series, and a plurality of blue LEDs 2a are connected in series. In addition, the case where the plurality of red LEDs 4a connected in series are present is present, and a plurality of groups of the plurality of blue LEDs 2a connected in series are present. Further, in the example shown in FIG. 9, the following case is shown as an example, in which case a plurality of blue LEDs 2a are connected in parallel, a plurality of red LEDs 4a are connected in parallel, and a plurality of blues connected in parallel are connected. The color LED 2a group is connected in series to a plurality of red LEDs 4a connected in parallel. Here, in the circuit diagram shown in FIG. 8, the red LED 4a and the blue LED 2a are connected in parallel as in the light-emitting module of the first embodiment. Pick up. The circuit diagram shown in Fig. 9 is a circuit diagram for comparison.

此處,關於能夠抑制多種發光元件各自所輸出的光的輸出平衡的變化的方面,使用圖6~圖9,以溫度上升的情況為例來進行說明。若溫度上升,則如圖6所示,與藍色LED2a的發光效率相比較,紅色LED4a的發光效率會大幅度地下降。結果,在此狀態下,與溫度上升之前相比較,從發光模組輸出的光中的紅色LED4a所占的比例變小。即,光的輸出平衡發生變化。 Here, the case where the change in the output balance of the light outputted by each of the plurality of light-emitting elements can be suppressed will be described using an example in which the temperature rises as an example using FIGS. 6 to 9 . When the temperature rises, as shown in FIG. 6, the luminous efficiency of the red LED 4a is greatly lowered as compared with the luminous efficiency of the blue LED 2a. As a result, in this state, the proportion of the red LEDs 4a in the light output from the light-emitting module becomes smaller as compared with before the temperature rise. That is, the output balance of light changes.

若溫度上升,則如圖7所示,與藍色LED2a的驅動電壓相比較,紅色LED4a的驅動電壓大幅度地下降。另外,如圖8所示,在紅色LED4a與藍色LED2a並聯地連接的情況下,相同的電力供給至紅色LED4a與藍色LED2a。另外,電力是由電壓×電流來表示。結果,由於與藍色LED2a相比較,驅動電壓已大幅度地下降,因此,與溫度上升之前相比較,相對較大的電流流入至與藍色LED2a相比較,驅動電壓已大幅度地下降的紅色LED4a。如此,流入至紅色LED4a的電流變大,結果,紅色LED4a所發出的光的輸出變大,與溫度上升之前相比較,紅色LED4a的比例以變小的程度縮小,或輸出平衡不發生變化。換句話說,能夠抑制多種發光元件各自所輸出的光的輸出平衡的變化。 When the temperature rises, as shown in FIG. 7, the driving voltage of the red LED 4a is largely lowered as compared with the driving voltage of the blue LED 2a. Further, as shown in FIG. 8, when the red LED 4a and the blue LED 2a are connected in parallel, the same electric power is supplied to the red LED 4a and the blue LED 2a. In addition, the electric power is represented by voltage × current. As a result, since the driving voltage has been largely lowered as compared with the blue LED 2a, a relatively large current flows into the red which is drastically lowered in comparison with the blue LED 2a as compared with before the temperature rise. LED4a. As a result, the current flowing into the red LED 4a becomes large, and as a result, the output of the light emitted from the red LED 4a becomes large, and the ratio of the red LED 4a is reduced to a smaller extent than before the temperature rises, or the output balance does not change. In other words, it is possible to suppress a change in the output balance of light outputted by each of the plurality of light-emitting elements.

圖10是表示圖8所示的電路圖與圖9所示的電路圖中的溫度與色溫的關係的一例的圖。如圖10所示,表示圖8中的關係的關係25與表示圖9中的關係的關係26相比較,相對於溫度變化的色溫的變化率變小。換句話說,已 知:抑制了多種發光元件各自所輸出的光的輸出平衡的變化。 FIG. 10 is a view showing an example of the relationship between the temperature and the color temperature in the circuit diagram shown in FIG. 8 and the circuit diagram shown in FIG. 9. As shown in FIG. 10, the relationship 25 indicating the relationship in FIG. 8 is smaller than the relationship 26 indicating the relationship in FIG. 9, and the rate of change of the color temperature with respect to the temperature change becomes small. In other words, already It is known that the change in the output balance of the light outputted by each of the plurality of light-emitting elements is suppressed.

另外,根據第一實施方式,第一發光元件及第二發光元件的發光效率及電壓會隨著溫度的上升而下降,且會隨著溫度的下降而上升。結果,能夠確實地抑制多種發光元件各自所輸出的光的輸出平衡的變化。 Further, according to the first embodiment, the luminous efficiency and voltage of the first light-emitting element and the second light-emitting element decrease as the temperature rises, and rise as the temperature decreases. As a result, it is possible to surely suppress a change in the output balance of the light outputted by each of the plurality of light-emitting elements.

另外,根據第一實施方式,第一發光元件為藍色LED(Light Emitting Diodes)元件,第二發光元件為紅色LED元件。結果,能夠確實地抑制多種發光元件各自所輸出的光的輸出平衡的變化。 Further, according to the first embodiment, the first light-emitting element is a blue LED (Light Emitting Diodes) element, and the second light-emitting element is a red LED element. As a result, it is possible to surely suppress a change in the output balance of the light outputted by each of the plurality of light-emitting elements.

另外,根據第一實施方式,存在多個第一發光元件群,存在多個第二發光元件群,且多個第一發光元件群與多個第二發光元件群並聯地連接,所述第一發光元件群是多個第一發光元件串聯地連接而成,所述第二發光元件群是多個第二發光元件串聯地連接而成。結果,能夠確實地抑制多種發光元件各自所輸出的光的輸出平衡的變化。 Further, according to the first embodiment, there are a plurality of first light-emitting element groups, a plurality of second light-emitting element groups are present, and the plurality of first light-emitting element groups are connected in parallel with the plurality of second light-emitting element groups, the first The light-emitting element group is formed by connecting a plurality of first light-emitting elements in series, and the second light-emitting element group is formed by connecting a plurality of second light-emitting elements in series. As a result, it is possible to surely suppress a change in the output balance of the light outputted by each of the plurality of light-emitting elements.

另外,根據第一實施方式,多個第一發光元件串聯地連接而成的第一發光元件群、與多個第二發光元件串聯地連接而成的第二發光元件群並聯地連接,且第一發光元件群的額定條件與第二發光元件群的額定條件相等。結果,能夠進一步抑制多種發光元件各自所輸出的光的輸出平衡的變化。 Further, according to the first embodiment, the first light-emitting element group in which the plurality of first light-emitting elements are connected in series, and the second light-emitting element group in which the plurality of second light-emitting elements are connected in series are connected in parallel, and The rated condition of a group of light-emitting elements is equal to the rated condition of the second group of light-emitting elements. As a result, it is possible to further suppress the change in the output balance of the light outputted by each of the plurality of light-emitting elements.

[第二實施方式] [Second Embodiment]

第二實施方式與第一實施方式相比較,LED的配置形 態不同。其他方面與第一實施方式相同,因此,將說明予以省略。圖11是表示第二實施方式的發光模組的俯視圖。圖11是從圖1中的箭頭A方向所見的第二實施方式的發光模組10b的俯視圖。 Second Embodiment Compared with the first embodiment, the configuration of the LED Different states. The other points are the same as those of the first embodiment, and therefore, the description will be omitted. Fig. 11 is a plan view showing a light-emitting module of a second embodiment. Fig. 11 is a plan view of the light-emitting module 10b of the second embodiment as seen from the direction of the arrow A in Fig. 1 .

如圖11所示,發光模組10b在基板1上,將包含多個藍色LED2b的兩個第一發光元件群配置在對角線上。另外,發光模組10b在基板1上,將包含多個紅色LED4b的兩個第二發光元件群配置在如下的對角線上,該對角線是關於基板1的中心而與第一發光元件群的配置成對稱的對角線。 As shown in FIG. 11, the light-emitting module 10b has two first light-emitting element groups including a plurality of blue LEDs 2b disposed on a diagonal line on the substrate 1. Further, the light-emitting module 10b arranges two second light-emitting element groups including a plurality of red LEDs 4b on a diagonal line on the substrate 1, the diagonal line being related to the center of the substrate 1 and the first light-emitting element group The configuration is symmetrical diagonal.

發光模組10b在基板1上包括:與照明裝置100b的電極接合部14a-1連接的電極6b-1、及從電極6b-1延伸出的配線6b。另外,發光模組10b在基板1上包括配線8b,該配線8b經由藍色LED2b及紅色LED4b而與配線6b並聯地連接,所述藍色LED2b借由接線9b-1而串聯地連接,所述紅色LED4b借由接線9b-2而串聯地連接。配線8b在延伸的前端,包括與照明裝置100b的電極接合部14b-1連接的電極8b-1。再者,藍色LED2b具有與第一實施方式的藍色LED2a相同的熱特性。另外,紅色LED4b具有與第一實施方式的紅色LED4a相同的熱特性。 The light-emitting module 10b includes, on the substrate 1, an electrode 6b-1 connected to the electrode bonding portion 14a-1 of the illumination device 100b, and a wiring 6b extending from the electrode 6b-1. Further, the light-emitting module 10b includes a wiring 8b on the substrate 1, and the wiring 8b is connected in parallel to the wiring 6b via the blue LED 2b and the red LED 4b, and the blue LED 2b is connected in series by the wiring 9b-1. The red LEDs 4b are connected in series by the wiring 9b-2. The wiring 8b includes an electrode 8b-1 connected to the electrode joint portion 14b-1 of the illumination device 100b at the extended front end. Furthermore, the blue LED 2b has the same thermal characteristics as the blue LED 2a of the first embodiment. In addition, the red LED 4b has the same thermal characteristics as the red LED 4a of the first embodiment.

如圖11所示,若將藍色LED2b及紅色LED4b配置在基板1上,則由密封部3b密封的第一區域及由密封部5b密封的第二區域,位於關於基板1的中心成點對稱的位置。由此,發光模組10b可平衡地對藍色LED2b及紅色 LED4b各自所發出的光進行合成,從而可容易地獲得所期望的發光圖案(pattern)、亮度或色調的光。 As shown in FIG. 11, when the blue LED 2b and the red LED 4b are disposed on the substrate 1, the first region sealed by the sealing portion 3b and the second region sealed by the sealing portion 5b are located point-symmetric with respect to the center of the substrate 1. s position. Thereby, the light emitting module 10b can balance the blue LED 2b and the red color The light emitted by each of the LEDs 4b is synthesized, so that a desired pattern, brightness, or hue of light can be easily obtained.

[第三實施方式] [Third embodiment]

第三實施方式與第一實施方式及第二實施方式相比較,LED的配置形態不同。其他方面與第一實施方式及第二實施方式相同,因此,將說明予以省略。圖12是表示第三實施方式的發光模組的俯視圖。圖12是從圖1中的箭頭A方向所見的第三實施方式的發光模組10c的俯視圖。 In the third embodiment, the arrangement of the LEDs is different from that of the first embodiment and the second embodiment. The other points are the same as those of the first embodiment and the second embodiment, and therefore, the description will be omitted. Fig. 12 is a plan view showing a light-emitting module of a third embodiment. Fig. 12 is a plan view of the light-emitting module 10c of the third embodiment as seen from the direction of the arrow A in Fig. 1 .

如圖12所示,發光模組10c在基板1上,將包含多個藍色LED2c的第一發光元件群配置於對基板1進行等分所得的一個區域。另外,發光模組10c在基板1上,將包含多個紅色LED4c的第二發光元件群配置於如下的區域,該區域是對基板1進行等分所得的未配置有第一發光元件群的另一個區域。 As shown in FIG. 12, the light-emitting module 10c arranges the first light-emitting element group including the plurality of blue LEDs 2c on the substrate 1 in one region obtained by equally dividing the substrate 1. Further, in the light-emitting module 10c, the second light-emitting element group including the plurality of red LEDs 4c is disposed on the substrate 1 in a region in which the substrate 1 is equally divided and the first light-emitting element group is not disposed. An area.

發光模組10c在基板1上包括:與照明裝置100c的電極接合部14a-1連接的電極6c-1、及從電極6c-1延伸出的配線6c。另外,發光模組10c在基板1上包括配線8c,該配線8c經由多個藍色LED2c及多個紅色LED4c而與配線6c並聯地連接,所述多個藍色LED2c借由接線9c-1而串聯地連接,所述多個紅色LED4c借由接線9c-2而串聯地連接。配線8c在延伸的前端,包括與照明裝置100c的電極接合部14b-1連接的電極8c-1。再者,藍色LED2c具有與第一實施方式的藍色LED2a相同的熱特性。另外,紅色LED4c具有與第一實施方式的紅色LED4a相同的熱特 性。 The light-emitting module 10c includes, on the substrate 1, an electrode 6c-1 connected to the electrode joint portion 14a-1 of the illumination device 100c, and a wiring 6c extending from the electrode 6c-1. Further, the light-emitting module 10c includes a wiring 8c on the substrate 1, and the wiring 8c is connected in parallel to the wiring 6c via a plurality of blue LEDs 2c and a plurality of red LEDs 4c, and the plurality of blue LEDs 2c are connected by the wiring 9c-1. Connected in series, the plurality of red LEDs 4c are connected in series by a wire 9c-2. The wiring 8c includes an electrode 8c-1 connected to the electrode joint portion 14b-1 of the illumination device 100c at the extended front end. Furthermore, the blue LED 2c has the same thermal characteristics as the blue LED 2a of the first embodiment. In addition, the red LED 4c has the same heat as the red LED 4a of the first embodiment. Sex.

如圖12所示,將藍色LED2c及紅色LED4c集中在基板1上,分離地形成由密封部3c密封的第一區域及由密封部5c密封的第二區域。由此,照明裝置10c的控制部14容易分別對藍色LED2c及紅色LED4c進行驅動控制,且容易對熱進行管理。進而,發光模組10c會抑制由熱引起的紅色LED4c的發光特性的惡化所導致的整個發光特性的惡化。 As shown in FIG. 12, the blue LED 2c and the red LED 4c are concentrated on the substrate 1, and a first region sealed by the sealing portion 3c and a second region sealed by the sealing portion 5c are separately formed. Thereby, the control unit 14 of the illumination device 10c can easily drive and control the blue LED 2c and the red LED 4c, respectively, and can easily manage heat. Further, the light-emitting module 10c suppresses deterioration of the entire light-emitting characteristics due to deterioration of the light-emitting characteristics of the red LEDs 4c due to heat.

[其他實施方式] [Other embodiments]

例如,在以上的實施方式中,將藍色LED2a~藍色LED2c設為第一發光元件,將紅色LED4a~紅色LED4c設為第二發光元件。然而不限於此,只要為第一發光元件、與熱特性遜色于第一發光元件的熱特性的第二發光元件的組合,則無論發光色如何,可採用任何發光元件。另外,在以上的實施方式中,密封部3a~密封部3c及密封部5a~密封部5c的材質不同,且各自對於光的折射率不同。然而不限於此,密封部3a~密封部3c及密封部5a~密封部5c也可為相同的材質。另外,利用密封部3a~密封部3c及密封部5a~密封部5c的藍色LED2a~藍色LED2c及紅色LED4a~紅色LED4c的密封方法不限於實施方式中所說明的密封方法,也可使用各種方法。 For example, in the above embodiment, the blue LED 2a to the blue LED 2c are referred to as a first light-emitting element, and the red LED 4a to the red LED 4c are referred to as a second light-emitting element. However, it is not limited thereto, and any combination of the first light-emitting element and the second light-emitting element having thermal characteristics which are inferior to the thermal characteristics of the first light-emitting element may be employed regardless of the light-emitting color. Further, in the above embodiment, the sealing portions 3a to 3c and the sealing portions 5a to 5c have different materials, and each has a refractive index different from that of light. However, the sealing portion 3a to the sealing portion 3c and the sealing portion 5a to the sealing portion 5c may be made of the same material. Further, the sealing method of the blue LED 2a to the blue LED 2 c and the red LED 4 a to the red LED 4 c using the sealing portion 3 a to the sealing portion 3 c and the sealing portion 5 a to the sealing portion 5 c is not limited to the sealing method described in the embodiment, and various sealing methods may be used. method.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. this The scope of the invention is defined by the scope of the appended claims.

1‧‧‧基板 1‧‧‧Substrate

2a~2c‧‧‧藍色LED 2a~2c‧‧‧Blue LED

3a~3c、5a~5c‧‧‧密封部 3a~3c, 5a~5c‧‧‧ Sealing Department

4a~4c‧‧‧紅色LED 4a~4c‧‧‧Red LED

6a~6c、8a、8b、8c‧‧‧配線 6a~6c, 8a, 8b, 8c‧‧‧ wiring

6a-1、6b-1、6c-1、8a-1、8b-1、8c-1‧‧‧電極 6a-1, 6b-1, 6c-1, 8a-1, 8b-1, 8c-1‧‧‧ electrodes

9a-1、9a-2、9b-1、9b-2、9c-1、9c-2‧‧‧接線 9a-1, 9a-2, 9b-1, 9b-2, 9c-1, 9c-2‧‧‧ wiring

10a~10c‧‧‧發光模組 10a~10c‧‧‧Lighting Module

11‧‧‧本體 11‧‧‧Ontology

11a‧‧‧凹部 11a‧‧‧ recess

12a‧‧‧燈頭構件 12a‧‧‧Light head components

12b‧‧‧金屬眼部 12b‧‧‧Metal eye

13‧‧‧外罩 13‧‧‧ Cover

14‧‧‧控制部 14‧‧‧Control Department

14a、14b‧‧‧電氣配線 14a, 14b‧‧‧Electrical wiring

14a-1、14b-1‧‧‧電極接合部 14a-1, 14b-1‧‧‧electrode joint

15a、15b‧‧‧固定構件 15a, 15b‧‧‧Fixed components

25、26‧‧‧關係 25, 26‧‧ relationship

100a~100c‧‧‧照明裝置 100a~100c‧‧‧Lighting device

A‧‧‧箭頭 A‧‧‧ arrow

B-B‧‧‧剖面 B-B‧‧‧ profile

D1‧‧‧距離 D1‧‧‧ distance

D2‧‧‧厚度 D2‧‧‧ thickness

H1、H2‧‧‧高度 H1, H2‧‧‧ height

圖1是表示安裝有第一實施方式的發光模組的照明裝置的縱剖面圖。 Fig. 1 is a longitudinal sectional view showing an illuminating device to which a light-emitting module of a first embodiment is attached.

圖2是表示第一實施方式的發光模組的俯視圖。 Fig. 2 is a plan view showing a light-emitting module of the first embodiment.

圖3是表示安裝有第一實施方式的發光模組的照明裝置的橫剖面圖。 3 is a cross-sectional view showing an illumination device to which the light-emitting module of the first embodiment is mounted.

圖4是表示第一實施方式的發光模組的電氣配線的圖。 4 is a view showing electrical wiring of the light-emitting module of the first embodiment.

圖5是表示第一實施方式的發光模組中的各發光元件的發光色的反射的圖。 FIG. 5 is a view showing reflection of an illuminating color of each light-emitting element in the light-emitting module of the first embodiment.

圖6是表示發光元件的溫度與發光效率的關係的一例的圖。 FIG. 6 is a view showing an example of the relationship between the temperature of the light-emitting element and the luminous efficiency.

圖7是表示發光元件的驅動電壓與溫度的關係的一例的圖。 FIG. 7 is a view showing an example of a relationship between a driving voltage and a temperature of a light-emitting element.

圖8是表示紅色LED與藍色LED並聯地連接時的電路圖的一例的圖。 8 is a view showing an example of a circuit diagram when a red LED and a blue LED are connected in parallel.

圖9是表示紅色LED與藍色LED串聯地連接時的電路圖的一例的圖。 FIG. 9 is a view showing an example of a circuit diagram when a red LED and a blue LED are connected in series.

圖10是表示圖8所示的電路圖與圖9所示的電路圖中的溫度與色溫的關係的一例的圖。 FIG. 10 is a view showing an example of the relationship between the temperature and the color temperature in the circuit diagram shown in FIG. 8 and the circuit diagram shown in FIG. 9.

圖11是表示第二實施方式的發光模組的俯視圖。 Fig. 11 is a plan view showing a light-emitting module of a second embodiment.

圖12是表示第三實施方式的發光模組的俯視圖。 Fig. 12 is a plan view showing a light-emitting module of a third embodiment.

2a‧‧‧藍色LED 2a‧‧‧Blue LED

3a、5a‧‧‧密封部 3a, 5a‧‧‧ Sealing Department

4a‧‧‧紅色LED 4a‧‧‧Red LED

10a~10c‧‧‧發光模組 10a~10c‧‧‧Lighting Module

11‧‧‧本體 11‧‧‧Ontology

12a‧‧‧燈頭構件 12a‧‧‧Light head components

12b‧‧‧金屬眼部 12b‧‧‧Metal eye

13‧‧‧外罩 13‧‧‧ Cover

14a、14b‧‧‧電氣配線 14a, 14b‧‧‧Electrical wiring

14a-1、14b-1‧‧‧電極接合部 14a-1, 14b-1‧‧‧electrode joint

100a~100c‧‧‧照明裝置 100a~100c‧‧‧Lighting device

A‧‧‧箭頭 A‧‧‧ arrow

Claims (6)

一種發光模組,其特徵在於包括:第一發光元件群,具有第一發光元件,且串聯地連接有多個所述第一發光元件;以及第二發光元件群,具有第二發光元件,且串聯地連接有多個所述第二發光元件,而且與所述第一發光元件群並聯地連接,所述第二發光元件與所述第一發光元件相比較,相對於溫度變化的發光效率的變化率及電壓的變化率更大。 A light emitting module, comprising: a first light emitting element group having a first light emitting element, and a plurality of the first light emitting elements are connected in series; and a second light emitting element group having a second light emitting element, and a plurality of the second light-emitting elements are connected in series, and are connected in parallel with the first light-emitting element group, and the second light-emitting elements are compared with the first light-emitting elements, and the luminous efficiency is changed with respect to temperature The rate of change and the rate of change of voltage are greater. 根據權利要求1所述的發光模組,其特徵在於:並聯地連接的所述第一發光元件群及所述第二發光元件群連接於共用的電力供給路徑,即使在點燈時,各發光元件群的溫度發生變化,供給至各發光元件群的總電力量也不會發生變化,當點燈時,在各發光元件群的溫度發生變化的情況下,流入至各發光元件群的電流值發生變化。 The lighting module according to claim 1, wherein the first light-emitting element group and the second light-emitting element group connected in parallel are connected to a common power supply path, and each of the light is emitted even when lighting The temperature of the element group changes, and the total amount of electric power supplied to each of the light-emitting element groups does not change. When the temperature of each of the light-emitting element groups changes when lighting, the current value flowing into each of the light-emitting element groups A change has occurred. 根據權利要求1所述的發光模組,其特徵在於:所述第一發光元件及所述第二發光元件的發光效率及電壓隨著溫度的上升而下降,且隨著溫度的下降而上升。 The light-emitting module according to claim 1, wherein the luminous efficiency and the voltage of the first light-emitting element and the second light-emitting element decrease as the temperature rises, and rise as the temperature decreases. 根據權利要求1所述的發光模組,其特徵在於:所述第一發光元件為藍色LED(Light Emitting Diodes)元件,所述第二發光元件為紅色LED元件。 The lighting module according to claim 1, wherein the first light emitting element is a blue LED (Light Emitting Diodes) element, and the second light emitting element is a red LED element. 根據權利要求1所述的發光模組,其特徵在於:所述第一發光元件群的額定條件與所述第二發光元件群的額定條件相等。 The lighting module according to claim 1, wherein said first light-emitting element group has a rated condition equal to a rated condition of said second light-emitting element group. 根據權利要求1所述的發光模組,其特徵在於:存在多個所述第一發光元件群,存在多個所述第二發光元件群,多個所述第一發光元件群、與多個所述第二發光元件群並聯地連接。 The light emitting module according to claim 1, wherein a plurality of the first light emitting element groups are present, a plurality of the second light emitting element groups, a plurality of the first light emitting element groups, and a plurality of The second group of light emitting elements are connected in parallel.
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