CN221150065U - Light-transmitting lead frame LED packaging light source - Google Patents
Light-transmitting lead frame LED packaging light source Download PDFInfo
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- CN221150065U CN221150065U CN202322566969.2U CN202322566969U CN221150065U CN 221150065 U CN221150065 U CN 221150065U CN 202322566969 U CN202322566969 U CN 202322566969U CN 221150065 U CN221150065 U CN 221150065U
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- lead frame
- negative electrode
- positive electrode
- electrode terminal
- frame body
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 239000000084 colloidal system Substances 0.000 claims abstract description 19
- 238000005538 encapsulation Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000004744 fabric Substances 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims abstract description 4
- 239000003365 glass fiber Substances 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 7
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- 239000011324 bead Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
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- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses a light-transmitting lead frame LED packaging light source, which belongs to the technical field of LEDs and comprises the following components: the lead frame body is made of a light-permeable material; at least one positive electrode terminal, one negative electrode terminal, the positive electrode terminal and the negative electrode terminal exist in pairs and are not contacted with each other; at least one LED chip, each LED chip is electrically connected with a pair of positive electrode terminal and negative electrode terminal; the packaging colloid is used for packaging and fixing the LED chip on the lead frame body, and light of the LED chip is transmitted out from the packaging colloid and the lead frame body. Wherein the lead frame body is a planar plate-shaped body, and is made of glass or glass fiber cloth or resin adhesive or PC material. The positive electrode end and the negative electrode end are respectively arranged at the left end and the right end of the front face of the lead frame body, the LED chip is bonded with the positive electrode end and the negative electrode end through leads, and the lead bonding connection part and the LED chip are integrally encapsulated by the encapsulation colloid.
Description
Technical Field
The utility model relates to the technical field of LEDs, in particular to a light-transmitting lead frame LED packaging light source.
Background
LED (LightingEmittingDiode) lighting, namely light emitting diode lighting, is a semiconductor solid state light emitting device. The solid semiconductor chip is used as a luminescent material, and photon emission is caused by the fact that excessive energy is released through carrier recombination in the semiconductor, red, yellow, blue and green light is directly emitted, and on the basis, fluorescent powder is added by utilizing the principle of three primary colors, so that light with any color can be emitted. The semiconductor chip is a P-N junction that can directly convert electricity into light. The semiconductor chip is an LED wafer comprising a semiconductor, one end of the LED wafer is attached to a lead frame (substrate), the other end of the LED wafer is a negative electrode, the other end of the LED wafer is connected with a positive electrode of a power supply, and then the whole LED wafer is encapsulated by epoxy resin to form an LED encapsulation structure. The front and back sides of the lead frame of the conventional LED package structure are opaque, and the LED chip (semiconductor chip) packaged on one side of the lead frame can only emit light on the one side of the lead frame, while the light cannot be transmitted from the other side of the lead frame due to the blocking of the lead frame. Therefore, the existing solution is to package LED chips on both sides of the lead frame to form overall light emission, but this solution requires twice as many LED chips to be packaged, which increases the cost.
Disclosure of utility model
In view of this, the present disclosure provides a light-transmitting lead frame LED package light source to solve the problem of single-side light emission of the lead frame of the conventional LED package structure, and the problem of increased cost due to double-side light emission of the LED chips packaged by the lead frame.
The technical scheme adopted by the utility model is as follows: a light transmissive lead frame LED package light source, comprising:
The lead frame body is made of a light-permeable material;
At least one positive electrode terminal, one negative electrode terminal, the positive electrode terminal and the negative electrode terminal exist in pairs and are not contacted with each other;
at least one LED chip, each LED chip is electrically connected with a pair of positive electrode terminal and negative electrode terminal;
The packaging colloid is used for packaging and fixing the LED chip on the lead frame body, and light of the LED chip is transmitted out from the packaging colloid and the lead frame body.
Optionally, the lead frame body is a planar plate-shaped body, and the lead frame body is made of glass or glass fiber cloth or resin adhesive or PC material.
Optionally, the positive electrode terminal and the negative electrode terminal are respectively disposed at the left and right ends of the front surface of the lead frame body, the LED chip is bonded with the positive electrode terminal and the negative electrode terminal through wires, and the wire bonding connection part and the LED chip are integrally encapsulated by an encapsulation colloid.
Optionally, the positive electrode terminal and the negative electrode terminal are correspondingly provided with a positive electrode pad and a negative electrode pad at the back side of the lead frame body, and the positive electrode pad is electrically conducted with the positive electrode terminal and the negative electrode pad is electrically conducted with the negative electrode terminal.
Optionally, the outsides of the positive electrode terminal and the negative electrode terminal are respectively provided with a notch terminal, the side wall of the notch terminal is provided with copper, and the positive electrode terminal is electrically conducted with the positive electrode bonding pad and the negative electrode terminal is electrically conducted with the negative electrode bonding pad through the copper.
Optionally, the middle area of the front of the lead frame body is provided with a positive electrode conductive connection area connected with the positive electrode end and a negative electrode conductive connection area connected with the negative electrode end, a space is arranged between the negative electrode conductive connection area and the positive electrode conductive connection area, the LED wafer is arranged on the negative electrode conductive connection area, the LED wafer is bonded with the positive electrode conductive connection area through a lead, and the LED wafer, the positive electrode conductive connection area and the negative electrode conductive connection area are fixed through packaging colloid.
The LED packaging light source structure designed by the technical scheme has the advantages that the lead frame body is made of the light-permeable material, and light can be transmitted from the front side of the lead frame body through the packaging colloid only by packaging the LED chip on one side of the lead frame body (the substrate), and meanwhile, the light can be transmitted from the back side of the lead frame body, so that the light-emitting dead angle is improved, and the overall light emission is achieved. Compared with the traditional LED packaging, the LED packaging has the advantages that double-sided light emission is required, the LED chip is required to be packaged on the back of the substrate, and the cost is high. The double-sided light emission of the substrate can be realized on the basis of not increasing the cost. If the LED is arranged in some light-transmitting decorative props in the baking atmosphere, the positions of the LED lamp beads are reached, and the LED lamp beads can be shown to be bright on all sides of the props. The traditional LED has the advantages that one surface of the prop is bright, and the other surface of the prop is dark, so that the LED packaging light source has higher ornamental value in a use scene.
Drawings
Fig. 1 is a schematic view of an LED package structure according to an embodiment of the utility model.
Fig. 2 is a schematic bottom view of an LED package structure according to an embodiment of the utility model.
Fig. 3 is a cross-sectional view of an LED package structure according to an embodiment of the present utility model.
FIG. 4 is a schematic view of the utility model applied to a light-transmitting decorative prop product.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1 to 4, a light-transmitting lead frame LED package light source includes a lead frame body 1, a positive terminal 2, a negative terminal 3, an LED chip 4, and a package colloid 6, wherein the lead frame body 1 is made of a light-transmitting material, such as glass or glass fiber cloth, resin glue, or PC material. The positive electrode terminal 2 and the negative electrode terminal 3 are present in pairs and do not contact each other; each LED chip 4 is electrically connected to a pair of the positive electrode terminal 2 and the negative electrode terminal 3.
And then the LED chip 4 is packaged and fixed on the lead frame body 1 through the packaging colloid 6, and the light of the LED chip 4 is transmitted out from the packaging colloid 6 and the lead frame body 1.
Preferably, the lead frame body 1 is a planar plate-shaped body, and the planar plate-shaped body is adopted, so that after the encapsulation colloid 6 is encapsulated and solidified, the light of the LED can be completely projected from the peripheral side wall and the top surface of the encapsulation colloid 6, the light transmission is free, and the transmission surface is wide.
Preferably, the positive electrode terminal 2 and the negative electrode terminal 3 are respectively disposed at left and right ends of the front surface of the lead frame body 1, the LED chip 4 is bonded with the positive electrode terminal 2 and the negative electrode terminal 3 through a lead 5, and the bonding connection part of the lead 5 and the LED chip 4 are integrally encapsulated by an encapsulation colloid 6.
Further, a positive electrode pad 21 and a negative electrode pad 31 are disposed at positions of the positive electrode terminal 2 and the negative electrode terminal 3 corresponding to the back surface of the lead frame body 1, and the positive electrode pad 21 is electrically connected to the positive electrode terminal 2, and the negative electrode pad 31 is electrically connected to the negative electrode terminal 3. Through set up anodal pad 21 and negative pole pad 31 at the both ends of the back of lead frame body 1 be used for on LED encapsulation light source welding and the lamp plate circuit board of this scheme, and the lamp plate goes wrong in the later stage, can dismantle, detect, rewelding to every LED encapsulation light source, can not destroy LED packaging structure. In addition, the lamp using the LED packaging light source in the scheme is damaged, and the LED packaging light source can be disassembled, recycled and reused.
Preferably, the outer sides of the positive electrode terminal 2 and the negative electrode terminal 3 are respectively provided with a notch terminal 201, the side wall of the notch terminal 201 is provided with copper, and the positive electrode terminal 2 and the positive electrode bonding pad 21 are electrically conducted, and the negative electrode terminal 3 and the negative electrode bonding pad 31 are electrically conducted through the copper. The lead frame body 1, the positive electrode end 2, the negative electrode end 3, the positive electrode bonding pad 21, the negative electrode bonding pad 31, the notch end 201 and copper on the side wall of the notch end 201 can be manufactured by adopting the existing manufacturing process of a PCB printed circuit board, a plurality of lead frame body units form a PCB jointed board for manufacturing, the notch end 201 is preferably a semicircular notch, a round through hole is formed between the notch end 201 and the adjacent lead frame body units, and copper can be coated on the hole wall by a copper deposition process in the manufacturing process of the PCB printed circuit board.
Preferably, the middle area of the front surface of the lead frame body 1 is provided with a positive electrode conductive connection area 20 connected with the positive electrode terminal 2 and a negative electrode conductive connection area 30 connected with the negative electrode terminal 3, a space is arranged between the negative electrode conductive connection area 30 and the positive electrode conductive connection area 20, the LED chip 4 is arranged on the negative electrode conductive connection area 30, the LED chip 4 is bonded with the positive electrode conductive connection area 20 through a lead 5, and the LED chip 4, the positive electrode conductive connection area 20 and the negative electrode conductive connection area 30 are fixed through encapsulation colloid 6. The heat dissipation is facilitated by the positive conductive connection region 20 and the negative conductive connection region 30.
It should be noted that, the positive electrode conductive connection area 20 and the negative electrode conductive connection area 30 occupy only a partial area on the upper surface of the leadframe body 1, and an area where light is transmitted from the upper surface to the bottom surface of the leadframe body 1 should be reserved, and the positive electrode conductive connection area 20 and the negative electrode conductive connection area 30 are filled with copper or aluminum conductive materials.
Through the technical scheme, only the LED chip 4 needs to be packaged on one side of the lead frame body 1, so that light can be transmitted out from the front side of the lead frame body 1 (the substrate) through the packaging colloid 6, and meanwhile, the light can be transmitted out from the back side of the lead frame body 1, so that the light-emitting dead angle is improved, and the overall light emission is achieved. Compared with the traditional LED packaging, the LED packaging has the advantages that double-sided light emission is required, the LED chip is required to be packaged on the back of the substrate, and the cost is high. The double-sided light emission of the substrate can be realized on the basis of not increasing the cost.
Referring to fig. 4, if the LED of the present embodiment is disposed in some light-transmitting decorative props under a baking atmosphere, the LED lamp beads are disposed at positions where the LED lamp beads can be shown to be bright on all sides of the props. Fig. 4 shows a five-pointed star ornament made of transparent plastic shell or acrylic, in which LED beads are arranged, whereas conventional LEDs are shown with the five-pointed star ornament being bright on one side and dark on the other side. The LED packaging light source designed by the scheme can realize that light can be transmitted out from the front side and the back side of each corresponding light source, so that the two sides of the five-pointed star ornament are bright. Therefore, the LED packaging light source of the scheme has more ornamental value in a use scene.
The foregoing has shown and described the basic principles, main features and advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.
Claims (6)
1. A light transmissive lead frame LED package light source, comprising:
The lead frame comprises a lead frame body (1), wherein the lead frame body (1) is made of a light-permeable material;
At least one positive electrode end (2) and one negative electrode end (3), wherein the positive electrode end (2) and the negative electrode end (3) are in pairs and are not in contact with each other;
at least one LED chip (4), each LED chip (4) is electrically connected with a pair of positive electrode ends (2) and negative electrode ends (3);
And the packaging colloid (6) is used for packaging and fixing the LED chip (4) on the lead frame body (1), and light of the LED chip (4) is transmitted out from the packaging colloid (6) and the lead frame body (1).
2. The light-transmitting lead frame LED package light source according to claim 1, wherein the lead frame body (1) is a planar plate-shaped body, and the lead frame body (1) is made of glass or glass fiber cloth or resin glue or PC material.
3. The LED package light source of claim 1, wherein the positive electrode terminal (2) and the negative electrode terminal (3) are respectively disposed at left and right ends of the front surface of the lead frame body (1), the LED chip (4) is bonded with the positive electrode terminal (2) and the negative electrode terminal (3) through leads (5), and the bonding connection portion of the leads (5) and the LED chip (4) are integrally encapsulated by an encapsulation body (6).
4. The LED package light source of the light transmissive lead frame according to claim 3, wherein the positive electrode terminal (2) and the negative electrode terminal (3) are correspondingly provided with a positive electrode pad (21) and a negative electrode pad (31) at the back surface of the lead frame body (1), the positive electrode pad (21) is electrically connected to the positive electrode terminal (2), and the negative electrode pad (31) is electrically connected to the negative electrode terminal (3).
5. The LED package light source of claim 4, wherein the outer sides of said positive electrode terminal (2) and said negative electrode terminal (3) are respectively provided with a notch terminal (201), the side wall of said notch terminal (201) is provided with copper, and the electrical conduction between said positive electrode terminal (2) and said positive electrode pad (21) and the electrical conduction between said negative electrode terminal (3) and said negative electrode pad (31) are realized by copper.
6. The LED package light source of the light transmissive lead frame according to claim 3, wherein the middle area of the front surface of the lead frame body (1) is provided with a positive conductive connection area (20) connected with the positive terminal (2) and a negative conductive connection area (30) connected with the negative terminal (3), a space is provided between the negative conductive connection area (30) and the positive conductive connection area (20), the LED chip (4) is arranged on the negative conductive connection area (30), the LED chip (4) is bonded with the positive conductive connection area (20) through a lead (5), and the LED chip (4) and the positive conductive connection area (20) and the negative conductive connection area (30) are fixed by encapsulation colloid (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322566969.2U CN221150065U (en) | 2023-09-21 | 2023-09-21 | Light-transmitting lead frame LED packaging light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322566969.2U CN221150065U (en) | 2023-09-21 | 2023-09-21 | Light-transmitting lead frame LED packaging light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221150065U true CN221150065U (en) | 2024-06-14 |
Family
ID=91428668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322566969.2U Active CN221150065U (en) | 2023-09-21 | 2023-09-21 | Light-transmitting lead frame LED packaging light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221150065U (en) |
-
2023
- 2023-09-21 CN CN202322566969.2U patent/CN221150065U/en active Active
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