CN203104962U - Sunken rigid-flexible printed circuit board - Google Patents
Sunken rigid-flexible printed circuit board Download PDFInfo
- Publication number
- CN203104962U CN203104962U CN 201320038235 CN201320038235U CN203104962U CN 203104962 U CN203104962 U CN 203104962U CN 201320038235 CN201320038235 CN 201320038235 CN 201320038235 U CN201320038235 U CN 201320038235U CN 203104962 U CN203104962 U CN 203104962U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- rigid flex
- rigid
- lower floor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A sunken rigid-flexible printed circuit board is at least formed by a printed circuit board and upper and lower flexible substrates which are all pressed and combined through a thermosetting adhesive, wherein a groove is disposed at a sensor position on the rigid-flexible printed circuit board; a lower printed circuit board is disposed below the lower flexible substrate; the printed circuit board, the upper and lower flexible substrates and the lower printed circuit board are pressed and combined through the thermosetting adhesive. According to the sunken rigid-flexible printed circuit board, through the design of the groove added to the rigid-flexible printed circuit board, a method for processing a conventional printed circuit board is changed, a module manufacturing process is reduced, flexibility of assembling is improved, and larger space is provided for development of the thin packaging field, and especially the field of consumption.
Description
Technical field
The utility model relates to a kind of sunk type Rigid Flex, belongs to the optoelectronic information technical field.
Background technology
At present traditional printed circuit board has the following disadvantages: 1. do not have flexibility, can not effectively utilize installing space in the product assembling; 2. need to be connected the increase cost of manufacture by what the conducting resinl pressing realized printed circuit board and flexible base, board; 3. the conducting resinl pressing needs certain thickness, hinders camera processing and develops to the littler direction of size.
The utility model content
The purpose of this utility model is to overcome deficiency of the prior art, and a kind of design of novel sunk type Rigid Flex is provided, and is intended to solve the deficiency of traditional printed circuit board in the product assembling.
The technical solution of the utility model is, a kind of sunk type Rigid Flex, it at least by printed circuit board and up and down the two sheets of flexible substrate pass through
Hot-setting adhesiveRigid Flex is made in pressing, and described Rigid Flex upper sensor position is provided with groove; Described lower floor flexible base, board below is provided with lower floor's printed circuit board, described printed circuit board, and two sheets of flexible substrate and lower floor's printed circuit board form by the hot-setting adhesive pressing up and down.
Described lower floor flexible base, board and lower floor's printed circuit board are provided with Copper Foil, prevent the wiring board distortion, guarantee evenness.
Described depth of groove is less than the height of transducer, and the height of transducer is higher than Rigid Flex like this, helps promoting the routing yield, and makes things convenient for the dust on cleaning sensor surface, and it is bad to reduce stain.
Described grooved area is provided with blind hole, avoids the bottom filler to overflow, and prevents the wiring board distortion; Other zones are provided with through hole, have solved the module heat dissipation problem simultaneously.
Described hot-setting adhesive adhesive strength height, thickness is little, and size is not had influence, and cost is low.
The utility model adopts the design of sunk type Rigid Flex, by in Rigid Flex, increasing the design of groove, changed the processing mode of traditional printed circuit board, reduced module manufacturing process, improved the flexibility of assembling, and bigger space is provided for the development of slimming encapsulation field, particularly consumer field.
Description of drawings
Fig. 1 is the utility model front view;
Fig. 2 is A shown in Figure 1-A1 face profile.
Embodiment
Shown in Fig. 1-2, it at least by printed circuit board 1 and up and down two sheets of flexible substrate 2,3 pass through
Hot-setting adhesiveRigid Flex is made in pressing, and described Rigid Flex upper sensor position is provided with groove 5; Described lower floor flexible base, board 3 belows are provided with lower floor's printed circuit board 4, described printed circuit board 1, and two sheets of flexible substrate 2,3 and lower floor's printed circuit board 4 form by the hot-setting adhesive pressing up and down.Described lower floor flexible base, board 3 and lower floor's printed circuit board 4 are provided with Copper Foil, prevent the wiring board distortion, guarantee evenness.
Described groove 5 degree of depth are less than the height of transducer, and the height of transducer is higher than Rigid Flex like this, helps promoting the routing yield, and make things convenient for the dust on cleaning sensor surface, and it is bad to reduce stain.
Described groove 5 zones are provided with blind hole 7, avoid the bottom filler to overflow, and prevent the wiring board distortion, and other zones are provided with through hole 6, have solved the module heat dissipation problem simultaneously.
Embodiment 1:
According to sensor thickness 0.2mm, Rigid Flex groove 5 degree of depth are controlled at 0.18mm, transducer is higher than Rigid Flex.
Claims (5)
1. sunk type Rigid Flex, it at least by printed circuit board and up and down the two sheets of flexible substrate pass through
Hot-setting adhesiveRigid Flex is made in pressing, and described Rigid Flex upper sensor position is provided with groove; Described lower floor flexible base, board below is provided with lower floor's printed circuit board, described printed circuit board, and two sheets of flexible substrate and lower floor's printed circuit board form by the hot-setting adhesive pressing up and down.
2. sunk type Rigid Flex according to claim 1 is characterized in that described lower floor flexible base, board and lower floor's printed circuit board are provided with Copper Foil.
3. sunk type Rigid Flex according to claim 1 is characterized in that the height of described depth of groove less than transducer.
4. sunk type Rigid Flex according to claim 1 is characterized in that the non-grooved area of described sunk type Rigid Flex is provided with through hole.
5. according to claim 1 or 3 described sunk type Rigid Flexs, it is characterized in that described grooved area is provided with blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320038235 CN203104962U (en) | 2013-01-24 | 2013-01-24 | Sunken rigid-flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320038235 CN203104962U (en) | 2013-01-24 | 2013-01-24 | Sunken rigid-flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203104962U true CN203104962U (en) | 2013-07-31 |
Family
ID=48856329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320038235 Expired - Fee Related CN203104962U (en) | 2013-01-24 | 2013-01-24 | Sunken rigid-flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203104962U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103118489A (en) * | 2013-01-24 | 2013-05-22 | 宁波舜宇光电信息有限公司 | Sunken soft and hard composite panel and manufacturing method thereof |
-
2013
- 2013-01-24 CN CN 201320038235 patent/CN203104962U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103118489A (en) * | 2013-01-24 | 2013-05-22 | 宁波舜宇光电信息有限公司 | Sunken soft and hard composite panel and manufacturing method thereof |
| CN103118489B (en) * | 2013-01-24 | 2015-12-23 | 宁波舜宇光电信息有限公司 | A kind of sunk type Rigid Flex and manufacture method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130731 Termination date: 20190124 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |