CN203092352U - Chemical mechanical polishing grinding fluid supply system with automatic cleaning device - Google Patents
Chemical mechanical polishing grinding fluid supply system with automatic cleaning device Download PDFInfo
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- CN203092352U CN203092352U CN 201320071078 CN201320071078U CN203092352U CN 203092352 U CN203092352 U CN 203092352U CN 201320071078 CN201320071078 CN 201320071078 CN 201320071078 U CN201320071078 U CN 201320071078U CN 203092352 U CN203092352 U CN 203092352U
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- supplying
- cassette
- supply system
- mechanical polishing
- chemical mechanical
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model provides a chemical mechanical polishing grinding fluid supply system with an automatic cleaning device. The supply system at least comprises at least one supply box, mega sound wave generators, a cleaning fluid supply system, a circulation pump and a valve connected with the circulation pump, wherein each supply box comprises at least one fluid inlet and at least one fluid outlet, the mega sound wave generators are arranged on the outer walls of the supply boxes and contacted with the outer walls of the supply boxes, the cleaning fluid supply system is used for providing cleaning fluid for the supply boxes and connected with fluid inlets of the supply boxes, and the fluid outlets of the supply boxes are connected with the circulation pump. The mega sound wave generators are arranged on the outer walls of the grinding fluid supply boxes, so that when grinding fluid supply finishes, deionized water is added into the grinding fluid supply boxes, the mega sound wave generators are started to completely clean residual grinding fluid crystalline solid on the inner walls of the supply boxes and the inner walls of pipelines. Thus, crystalline grinding fluid is prevented from entering a polishing interface through pipelines to scratch wafers to generate defects.
Description
Technical field
The utility model relates to field of semiconductor technology, particularly relates to a kind of chemical mechanical polishing liquid supply system that has automatic flushing device.
Background technology
In semiconductor process flow, chemically mechanical polishing (Chemical Mechanical Polishing CMP) is a very important procedure, also be referred to as sometimes chemical-mechanical planarization (Chemical Mechanical Planarization, CMP).So-called chemically mechanical polishing, it is to adopt chemistry and mechanical integrated effect to remove excess stock from semi-conductor silicon chip, and makes it obtain the technical process of flat surfaces.Specifically, this finishing method normally is pressed on chip on one polishing pad that rotates at a high speed, and reaches the purpose of planarization under the effect of the polishing slurries that includes chemical polishing agent and abrasive grains by the polishing pad and the mutual friction mutually of wafer.In view of this, lapping liquid is the running stores of a key in the chemically mechanical polishing, plays an important role in the chip chemically mechanical polishing.When needing the lapping liquid supply in CMP process, lapping liquid will pass through original liquid box handling module and lapping liquid supply module, finally could arrive on the board of polishing.
As shown in Figure 1, lapping liquid among the original liquid box 6A is delivered among the premixed groove 7A through circulating pump 3A, is contained among the cassette for supplying 1A by pipeline after the premixed, when chemically mechanical polishing, open the circulating pump 3A and the valve 4A that are connected with cassette for supplying, lapping liquid then can be used for the polishing of wafer.When chemically mechanical polishing finished, lapping liquid can reflux and enter cassette for supplying once more.In said process, the pipeline of lapping liquid process is longer, valve in the pipeline is also more, wherein will form a lot of pipeline dead angles, the gathering and the crystallization of lapping liquid probably caused at these pipeline dead angles, except pipeline inner wall, this gathering and crystallization also can occur on the inwall of cassette for supplying, be difficult to wash, if untimely these crystallization dirts are cleaned out, these dirts might be discharged and are used for glossing, cause the crystal column surface scratch, cause defective, and then will influence the performance of whole wafer, be illustrated in figure 2 as cassette for supplying inwall and pipeline with crystalline solid 8A.
Therefore, providing a kind of lapping liquid supply system that has automatic flushing device is the problem that those skilled in the art need solve.
The utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of chemical mechanical polishing liquid supply system that has automatic flushing device, and the crystallization that is used for solving lapping liquid in prior art lapping liquid cassette for supplying and the pipeline causes the problem of scratch defective when causing polishing.
Reach other relevant purposes for achieving the above object, the utility model provides a kind of chemical mechanical polishing liquid supply system that has automatic flushing device, described lapping liquid supply system comprises at least: at least one cassette for supplying, and each cassette for supplying comprises at least one liquid inlet and liquid outlet; The mega sonic wave generator of being located at described cassette for supplying outer wall and contacting with outer wall; Be used to provide the cleaning fluid supply system of cassette for supplying cleaning fluid, be connected with described cassette for supplying liquid inlet; Be used for extracting the circulating pump of described cassette for supplying cleaning fluid, be connected with described cassette for supplying liquid outlet.
Preferably, be V-shape bottom the described cassette for supplying.
Preferably, described cassette for supplying is two, and each cassette for supplying outer wall is provided with two mega sonic wave generators.
Preferably, described mega sonic wave generator is positioned at the cassette for supplying bottom outer wall.
Preferably, described mega sonic wave generator comprises that output frequency is the mega sonic wave generating means of 100 ~ 900 KHz.
Preferably, described cleaning fluid is a deionized water.
As mentioned above, the chemical mechanical polishing liquid supply system that has automatic flushing device of the present utility model, has following beneficial effect: by the mega sonic wave generator being set at lapping liquid cassette for supplying outer wall, when finishing, the supply lapping liquid in the lapping liquid cassette for supplying, adds deionized water, opening the mega sonic wave generator afterwards thoroughly cleans cassette for supplying and the residual lapping liquid crystalline solid of pipeline inner wall, the lapping liquid that can prevent crystallization like this enters the polishing interface by pipeline, the scratch wafer causes defective, has also further strengthened the board utilization rate by the cleaning to cassette for supplying.
Description of drawings
Fig. 1 is shown as chemical mechanical polishing liquid supply system schematic diagram of the prior art.
Fig. 2 is shown as lapping liquid cassette for supplying schematic diagram in the prior art.
Fig. 3 is shown as the chemical mechanical polishing liquid supply system schematic diagram that has automatic flushing device of the present utility model.
Fig. 4 is shown as lapping liquid cassette for supplying cleaning performance schematic diagram of the present utility model.
The element numbers explanation
1, the 1A cassette for supplying
2 mega sonic wave generators
21 power modules
3, the 3A circulating pump
4, the 4A valve
5 cleaning fluid supply systems
The 6A original liquid box
7A premixed groove
8, the 8A crystalline solid
The specific embodiment
Below by particular specific embodiment embodiment of the present utility model is described, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this specification.
See also accompanying drawing.Notice, the appended graphic structure that illustrates of this specification, ratio, size etc., all only in order to cooperate the content that specification disclosed, understand and reading for person skilled in the art scholar, be not in order to limit the enforceable qualifications of the utility model, event is the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not influencing under effect that the utility model can produce and the purpose that can reach, the technology contents that all should still drop on the utility model and disclosed gets in the scope that can contain.Simultaneously, quoted in this specification as " on ", D score, " left side ", " right side ", " centre " reach the term of " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under no essence change technology contents, when also being considered as the enforceable category of the utility model.
As shown in Figure 3, the utility model provides a kind of chemical mechanical polishing liquid supply system that has automatic flushing device, and this lapping liquid supply system comprises at least: cassette for supplying 1, mega sonic wave generator 2, cleaning fluid supply system 5, circulating pump 3.
In normal CMP process, described cassette for supplying 1 is used to hold the lapping liquid after the premixed, can guarantee the supply of lapping liquid the CMP process from the lapping liquid of cassette for supplying 1 output.After lapping liquid used up, cassette for supplying then needed to add cleaning fluid and cleans, and the number of this cassette for supplying 1 is at least one, and in the present embodiment, the number of cassette for supplying 1 is two.If cassette for supplying 1 is one, in case using, lapping liquid may have little time to change, influence the progress of technology; And if cassette for supplying 1 is three or more, then can cause floor space bigger, therefore use two cassette for supplying 1 preferable.Described each cassette for supplying comprises at least one liquid inlet and liquid outlet.And the structure of optimizing as the utility model, the bottom of cassette for supplying 1 is V-shape.
Described mega sonic wave generator 2 is located at the outer wall of described cassette for supplying 1, and closely contacts with cassette for supplying 1 outer wall, and the vibration frequency of mega sonic wave generator 2 passes to lapping liquid crystalline solid or the dirt that adheres on cassette for supplying 1 inwall by cassette for supplying 1, and it is peeled off.Further, the outer wall of described each cassette for supplying 1 is provided with two mega sonic wave generators 2, and the attachment of cassette for supplying 1 inwall and cassette for supplying 1 are peeled off, and thoroughly cleans cassette for supplying 1.Further, described mega sonic wave generator 2 is arranged on the outer wall of cassette for supplying 1 bottom, and promptly two mega sonic wave generators 2 lay respectively at the both sides of the V-shape bottom of cassette for supplying 1.Preferably, described mega sonic wave generator 2 comprises that output frequency is the mega sonic wave generating means of 100 ~ 900KHz.In addition, described mega sonic wave generator 2 includes power module 21, is used to provide mega sonic wave generator 2 required operating voltage.
In addition, the chemical mechanical polishing liquid supply system that has automatic flushing device also comprises cleaning fluid supply system 5, and this cleaning fluid supply system 5 is connected with the liquid inlet of cassette for supplying 1, is used to provide the cleaning fluid that cleans cassette for supplying 1.In the present embodiment, the cassette for supplying cleaning fluid is preferably deionized water.
Described circulating pump 3 is connected with cassette for supplying 1 liquid outlet, and each cassette for supplying 1 liquid outlet all is connected with circulating pump 3, can extract the deionized water in the cassette for supplying 1 that has cleaned with this circulating pump 3.And if cassette for supplying is when being in the lapping liquid supply stage, 3 of circulating pumps are used for extracting the lapping liquid in the cassette for supplying 1.All be connected with valve 4 in each circulating pump 3 back, be used for controlling the Kai Heguan of corresponding pipeline.
Need to prove, the connection usefulness between cassette for supplying 1, mega sonic wave generator 2, circulating pump 3, valve 4 and the cleaning fluid supply system 5 be pipeline, what mega sonic wave generator 2 and power module 21 were connected usefulness is lead.
The use flow process of the chemical mechanical polishing liquid supply system that has automatic flushing device in actual process that the utility model provides is as follows:
At first, under the state of lapping liquid supply end and cassette for supplying 1 emptying, the deionized water supply system joins deionized water in the empty cassette for supplying automatically;
Then, open mega sonic wave generator 2, make mega sonic wave generator 2 few minutes of operation to dozens of minutes;
At last, close mega sonic wave generator 2, open circulating pump 3 and valve 4, get rid of the deionized water after cleaning,, can repeat above cleaning step until thoroughly cassette for supplying being cleaned up if find that cassette for supplying does not clean up yet fully.
As the crystalline solid 8 effect schematic diagrames of Fig. 4 for cleaning cassette for supplying 1 and pipeline.
After above-mentioned cassette for supplying 1 cleaning step is finished, continue from original liquid box, to carry lapping liquid in cassette for supplying 1,, make after lapping liquid fully mixes, wait for the supply requirement of board lapping liquid at specific time circulation primary lapping liquid.
In sum, the chemical mechanical polishing liquid supply system that has automatic flushing device that the utility model provides, by the mega sonic wave generator being set at lapping liquid cassette for supplying outer wall, when finishing, the supply lapping liquid in the lapping liquid cassette for supplying, adds deionized water, opening the mega sonic wave generator afterwards thoroughly cleans cassette for supplying and the residual lapping liquid crystalline solid of pipeline inner wall, the lapping liquid that can prevent crystallization like this enters the polishing interface by pipeline, the scratch wafer causes defective, has also further strengthened the board utilization rate by the cleaning to cassette for supplying.
So the utility model has effectively overcome various shortcoming of the prior art and the tool high industrial utilization.
The foregoing description is illustrative principle of the present utility model and effect thereof only, but not is used to limit the utility model.Any person skilled in the art scholar all can be under spirit of the present utility model and category, and the foregoing description is modified or changed.Therefore, have in the technical field under such as and know that usually the knowledgeable modifies or changes not breaking away from all equivalences of being finished under spirit that the utility model discloses and the technological thought, must be contained by claim of the present utility model.
Claims (6)
1. a chemical mechanical polishing liquid supply system that has automatic flushing device is characterized in that, described lapping liquid supply system comprises at least:
At least one cassette for supplying, each cassette for supplying comprises at least one liquid inlet and liquid outlet;
The mega sonic wave generator of being located at described cassette for supplying outer wall and contacting with outer wall;
Be used to provide the cleaning fluid supply system of cassette for supplying cleaning fluid, be connected with described cassette for supplying liquid inlet;
Be used for extracting the circulating pump of described cassette for supplying cleaning fluid, be connected with described cassette for supplying liquid outlet.
2. a kind of chemical mechanical polishing liquid supply system that has automatic flushing device according to claim 1 is characterized in that: described cassette for supplying bottom is V-shape.
3. a kind of chemical mechanical polishing liquid supply system that has automatic flushing device according to claim 2, it is characterized in that: described cassette for supplying is two, each cassette for supplying outer wall is provided with two mega sonic wave generators.
4. a kind of chemical mechanical polishing liquid supply system that has automatic flushing device according to claim 3, it is characterized in that: described mega sonic wave generator is positioned at the cassette for supplying bottom outer wall.
5. a kind of chemical mechanical polishing liquid supply system that has automatic flushing device according to claim 4 is characterized in that: described mega sonic wave generator comprises that output frequency is the mega sonic wave generating means of 100 ~ 900KHz.
6. a kind of chemical mechanical polishing liquid supply system that has automatic flushing device according to claim 1, it is characterized in that: described cleaning fluid is a deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320071078 CN203092352U (en) | 2013-02-07 | 2013-02-07 | Chemical mechanical polishing grinding fluid supply system with automatic cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320071078 CN203092352U (en) | 2013-02-07 | 2013-02-07 | Chemical mechanical polishing grinding fluid supply system with automatic cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203092352U true CN203092352U (en) | 2013-07-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320071078 Expired - Fee Related CN203092352U (en) | 2013-02-07 | 2013-02-07 | Chemical mechanical polishing grinding fluid supply system with automatic cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203092352U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107962491A (en) * | 2017-12-27 | 2018-04-27 | 山东中佳电子科技有限公司 | A kind of copper pipe inner wall polishing cleaning systems and its method |
| CN109940516A (en) * | 2019-03-12 | 2019-06-28 | 上海新昇半导体科技有限公司 | Slurry recovery system and its clean method |
| CN110293481A (en) * | 2019-06-26 | 2019-10-01 | 西安奕斯伟硅片技术有限公司 | A kind of clean method of milling apparatus and milling apparatus |
| CN112658982A (en) * | 2020-12-16 | 2021-04-16 | 西安奕斯伟硅片技术有限公司 | Polishing solution supply device |
-
2013
- 2013-02-07 CN CN 201320071078 patent/CN203092352U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107962491A (en) * | 2017-12-27 | 2018-04-27 | 山东中佳电子科技有限公司 | A kind of copper pipe inner wall polishing cleaning systems and its method |
| CN109940516A (en) * | 2019-03-12 | 2019-06-28 | 上海新昇半导体科技有限公司 | Slurry recovery system and its clean method |
| CN110293481A (en) * | 2019-06-26 | 2019-10-01 | 西安奕斯伟硅片技术有限公司 | A kind of clean method of milling apparatus and milling apparatus |
| CN112658982A (en) * | 2020-12-16 | 2021-04-16 | 西安奕斯伟硅片技术有限公司 | Polishing solution supply device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130731 Termination date: 20190207 |