CN203036591U - Power light emitting diode (LED) heat dissipation structure - Google Patents

Power light emitting diode (LED) heat dissipation structure Download PDF

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Publication number
CN203036591U
CN203036591U CN2012203914576U CN201220391457U CN203036591U CN 203036591 U CN203036591 U CN 203036591U CN 2012203914576 U CN2012203914576 U CN 2012203914576U CN 201220391457 U CN201220391457 U CN 201220391457U CN 203036591 U CN203036591 U CN 203036591U
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China
Prior art keywords
heat
power led
radiator
container
led element
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Expired - Fee Related
Application number
CN2012203914576U
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Chinese (zh)
Inventor
陈建伟
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Individual
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Individual
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Priority to CN2012203914576U priority Critical patent/CN203036591U/en
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Abstract

The utility model discloses a novel power light emitting diode (LED) heat dissipation structure which is efficient and low in cost. The power LED heat dissipation structure is characterized in that a container is arranged on a heat radiator, the size of the container can enable a pin of a large-power LED element and a welding spot after welding is finished not to form a short circuit with the heat radiator, heat-conducting glue or heat-conducting silicon grease is fully filled inside the container, and an epoxy glass fiber printed circuit board (PCB) with the large-power LED element welded is fixedly installed on the heat radiator.

Description

The power LED radiator structure
Technical field
The utility model relates to a kind of LED radiator structure, relates in particular to a kind of radiator structure for power-type LED.
Background technology
Power LED can produce heat in the course of the work, heat and the not good heat accumulation that causes of heat conduction that it produces, can directly cause the LED optical attenuation, can cause LED to damage when serious, assess from LED lighting source cost angle, the LED radiator structure is to constitute one of LED lighting source three big prime cost, efficiently, the solution of power LED heat radiation cheaply, not only can improve the LED life-span, and can also reduce the cost of LED lighting source, therefore efficiently, power LED radiator structure cheaply, to LED element and significant concerning the LED illuminating industry.
Existing power LED radiator structure is mainly and adopts aluminum-based circuit board to add heat-conducting glue or heat-conducting silicone grease adds radiator, their heat dissipation all be still waiting to improve and cost higher.
The utility model content
Be to solve the deficiencies in the prior art, the present invention be intended to from efficiently, angle cheaply, a kind of novel power LED radiator structure is proposed.
The present invention program is for achieving the above object: a kind of power LED radiator structure comprises high-power LED element, epoxy glass pcb board, radiator, described high-power LED element is welded on the epoxy glass pcb board, its special feature is to be provided with a container at radiator, solder joint after this container size can make the pin of high-power LED element and finish welding can not form short circuit with radiator, fill full heat-conducting glue or heat-conducting silicone grease in this container, the epoxy glass pcb board that will be welded with high-power LED element again is mounted and fixed on this radiator.
Further: the solder joint of high-power LED element and the welding of epoxy glass pcb board is at the back side of epoxy glass pcb board;
Further: solder joint is coated fully by heat-conducting glue or heat-conducting silicone grease in the container on the radiator.
This patent solution has been abandoned the thermally conductive pathways of prior art, that is, and and led chip---support---heat-conducting glue or heat-conducting silicone grease---aluminum-based circuit board---heat-conducting glue or heat-conducting silicone grease---technical scheme of radiator.
This patent thermally conductive pathways is: high-power LED element---support------heat-conducting glue or heat-conducting silicone grease---radiator that is welded on the solder joint on the epoxy glass pcb board.Path from the heat conduction, it comes down to from high-power LED element, and---the terminal pin solder joint of the support weld part of epoxy glass pcb board (namely with)---heat-conducting glue or heat-conducting silicone grease---radiator, the major function of epoxy glass pcb board are to realize that circuit is connected, fixes, supports high-power LED element with effect.
Take the usefulness after the art of this patent scheme specifically to be:
1, compared with prior art, this patent has simple in structure, and implementing process is convenient, fast, production efficiency is high.
2, with traditional epoxy glass pcb board substitution of Al base circuit board, can reduce cost.
3, heat eliminating medium reduces, and it is fast to conduct heat, heat transfer efficiency height, radiating efficiency height.
Therefore by contrast this patent heat radiation solution and prior art solutions, we can be clearly seen that this patent solution is simple in structure, and cost is low, the characteristics that radiating efficiency is high.With traditional epoxy glass pcb board substitution of Al base circuit board, can realize fully that LED is environmentally friendly as the illumination of the 4th generation, the location of the lighting source of resource-conserving.
By reference to the accompanying drawings characteristics of the present invention and advantage are described further by the following examples:
Description of drawings
Fig. 1: the power LED radiator structure schematic diagram of prior art.
Fig. 2: the power LED radiator structure schematic diagram of this patent.
Fig. 3: this patent preferred embodiment cross-sectional schematic.
Fig. 4: this patent preferred embodiment schematic side view.
Among the figure: 1, led chip, 2, heat-conducting glue or heat-conducting silicone grease, 3, aluminum-based circuit board, 4, heat-conducting glue or heat-conducting silicone grease, 5, radiator, 6, high-power LED element, 7, the high-power LED element support, 8, epoxy glass pcb board, 9, solder joint, 10, screw, 11 heat-conducting glues or heat-conducting silicone grease, 12, container.
Specific embodiment
---heat-conducting glue or heat-conducting silicone grease 2---aluminum-based circuit board 3---heat-conducting glue or heat-conducting silicone grease 4---technical scheme of radiator 5 that referring to Fig. 1, representational radiator structure and mode are from led chip 1 under the prior art as shown in the figure.
Referring to Fig. 2, as shown in the figure, in the specific embodiment of this patent be: high-power LED element 6, be welded on the epoxy glass pcb board 8 by high-power LED element support 7, form solder joint 9.Radiator 5 surfaces are produced the container 12 of heat-conducting glue or heat-conducting silicone grease, and in the container 12 of heat-conducting glue or heat-conducting silicone grease, fill and expire heat-conducting glue or heat-conducting silicone grease 11, the epoxy glass pcb board 8 usefulness screws 10 that high-power LED element 6 is installed are fixed on the radiator 5, make it to form the installation effect of Fig. 2.So both can finish this patent specific embodiment.
Other sees also Fig. 3,4, and Fig. 3 Fig. 4 is the preferred embodiment that this patent power LED radiator structure is used for the LED fluorescent lamp.
Above-described embodiment only is the usefulness of explanation technical solution of the present invention, but not limitation of the present invention, all non-creativeness on this patent basis change all because belonging to protection domain of the present invention.

Claims (3)

1. power LED radiator structure, comprise high-power LED element, epoxy glass pcb board, radiator, described high-power LED element is welded on the epoxy glass pcb board, it is characterized in that: described radiator is provided with a container, solder joint after this container size can make the pin of high-power LED element and finish welding can not form short circuit with radiator, and fill full heat-conducting glue or heat-conducting silicone grease in this container, the described epoxy glass pcb board that is welded with high-power LED element is mounted and fixed on this radiator.
2. power LED radiator structure according to claim 1 is characterized in that: the solder joint of described high-power LED element and the welding of epoxy glass pcb board is at the back side of epoxy glass pcb board.
3. power LED radiator structure according to claim 2, it is characterized in that: described solder joint is coated fully by heat-conducting glue or heat-conducting silicone grease in the container on the radiator.
CN2012203914576U 2012-08-09 2012-08-09 Power light emitting diode (LED) heat dissipation structure Expired - Fee Related CN203036591U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012203914576U CN203036591U (en) 2012-08-09 2012-08-09 Power light emitting diode (LED) heat dissipation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012203914576U CN203036591U (en) 2012-08-09 2012-08-09 Power light emitting diode (LED) heat dissipation structure

Publications (1)

Publication Number Publication Date
CN203036591U true CN203036591U (en) 2013-07-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012203914576U Expired - Fee Related CN203036591U (en) 2012-08-09 2012-08-09 Power light emitting diode (LED) heat dissipation structure

Country Status (1)

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CN (1) CN203036591U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109373205A (en) * 2018-09-11 2019-02-22 天台天宇光电股份有限公司 A kind of high efficiency LED light source radiator structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109373205A (en) * 2018-09-11 2019-02-22 天台天宇光电股份有限公司 A kind of high efficiency LED light source radiator structure

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130703

Termination date: 20140809

EXPY Termination of patent right or utility model