CN202977391U

CN202977391U - Wafer conveying device

Info

Publication number: CN202977391U
Application number: CN 201220664199
Authority: CN
Inventors: 张吉智; 张孝勇; 凌复华
Original assignee: Piotech Shenyang Co Ltd
Current assignee: Piotech Inc
Priority date: 2012-12-05
Filing date: 2012-12-05
Publication date: 2013-06-05
Anticipated expiration: 2022-12-05

Abstract

A wafer conveying device aims at giving up a vacuum cavity and replacing the vacuum cavity with a work mode in an atmosphere environment. The wafer conveying device mainly comprises a front end module, a conveying module and reaction modules. The front end module mainly consists of air filters, a metal framework structure, wafer box loading ports equipped with wafer boxes, a front end module mechanical arm and a front end module slide rail. The conveying module consists of a metal framework, air filters, a slide rail and an atmosphere mechanical arm. Reaction module consist of vacuum loading cavities, atmosphere transition valves, reaction cavities, reaction cavity valves and vacuum mechanical arms. Reaction cavities and vacuum loading cavities form a reaction module. Each vacuum loading cavity is provided with a vacuum mechanical hand, thereby realizing conveying a wafer from an atmosphere environment to the reaction cavity in a vacuum state and conveying the wafer deposited with a thin film from the reaction cavity to the atmosphere environment. The wafer conveying device satisfies demand of transferring the wafer between a sheet transmission cavity and the reaction cavity, does not have complex high-cost parts such as vacuum valves and vacuum pumps, and is relatively low in price and high in production power.

Description

Wafer conveying device

Technical field

The utility model relates to a kind of wafer conveying device, can realize that by this mechanism wafer returns the transmission of wafer cassette from the wafer cassette to the reaction chamber, belongs to semiconductive thin film deposition technique and equipment manufacturing technology field.

Background technology

Existing semiconductor coated film equipment, especially 12 inches semiconductor coated film equipment, its wafer conveying device is generally vacuum structure.Its inner vacuum mechanical-arm that needs carries out the wafer transmission, and opening part need seal, and the floor space less can realize that front-end module is common to a plurality of reaction modules.This design needs the vacuum chamber of large volume to load the large-scale vacuum manipulator, and connects each reaction module and be connected front-end module with the vacuum load chamber and connect vacuum chamber by the vacuum load chamber).This large-scale vacuum chamber need to comprise that a whole set of vacuum plant of vacuum valve group, vacuum checking device and pump group etc. keeps vacuum degree, its design, manufacturing, operation, maintenance cost are high, and be subject to its volume and shape, the vacuum chamber that this design can connect is limited, and autgmentability is also not ideal enough for the semicon industry that the production capacity demand is maked rapid progress.

Summary of the invention

The utility model is for above-mentioned the deficiencies in the prior art, abandons vacuum chamber and replaces mode of operation under a kind of atmospheric environment, is that a kind of structure is relatively simple, cost is relatively cheap and possesses the Novel wafer transmitting device of autgmentability.

The utility model adopts following technical scheme for solving the problems of the technologies described above: wafer conveying device mainly comprises front-end module, transport module and reaction module.

Above-mentioned front-end module is mainly by air cleaner, and metal framework structure is equipped with the wafer cassette load port of wafer cassette, the front-end module manipulator, and the front-end module slide rail forms.

Above-mentioned transport module is by metal framework structure, air cleaner, and slide rail, the atmosphere manipulator forms.

Above-mentioned reaction module is by the vacuum load chamber, the atmosphere transition valving, and reaction chamber, the reaction chamber valve, vacuum mechanical-arm forms.

The annexation of the utility model each several part: reaction chamber and reaction module of vacuum load chamber composition, configuration vacuum mechanical-arm in the vacuum load chamber, can realize accepting wafer to the reaction chamber of vacuum state from atmospheric environment, also the wafer that deposited film can be delivered to atmospheric environment from reaction chamber.Each reaction module can synchronously carry out the deposition of 2 wafer.A plurality of reaction modules are connected with front-end module by metal framework structure, and the atmosphere manipulator moves by slide rail in framework, transmit wafer between front-end module and reaction module.Each reaction module is distributed in slide rail both sides, and front-end module is arranged on slide rail one end, and each wafer porch arranges calibrator and cooling stations.Calibrator is used for calibration wafer center and locating notch, and cooling stations is used for making the wafer cooling that deposited film.The metal framework structure top arranges air cleaner, and surrounding is surrounded by panel beating, only leaves the passage for wafer and the operation of atmosphere manipulator.This design purges the clean gas flow after filtration from top to bottom, guarantees the cleanliness factor of run duration.

The beneficial effects of the utility model are to realize fully that wafer is from passing the demand that shifts between sheet chamber and reaction chamber, and compare with the structure of equipment of the same type, its parts required precision is relatively not high, there is no the expensive parts such as complicated vacuum valve and vacuum pump, relative low price, the manipulator that moves under atmospheric environment, its efficient can be higher, thus production capacity improves.

Description of drawings

Fig. 1 is structural representation of the present utility model.

Fig. 2 is the vertical view of Fig. 1.

Embodiment

See figures.1.and.2, wafer conveying device mainly comprises front-end module, transport module and reaction module.

Above-mentioned front-end module 8 is mainly by air cleaner 1, and metal framework structure 19 is equipped with the wafer cassette load port 4 of wafer cassette 3, front-end module manipulator 5, and front-end module slide rail 18 forms.

Above-mentioned transport module is by metal framework structure 7, air cleaner 1, and slide rail 14, atmosphere manipulator 13 forms.

Above-mentioned reaction module 17 is by vacuum load chamber 11, atmosphere transition valving 12, and reaction chamber 9, reaction chamber valve 10, vacuum mechanical-arm 16 forms.

The annexation of each one of the utility model: reaction module of reaction chamber 9 and vacuum load chamber 11 compositions, the interior configuration vacuum mechanical-arm 16 in vacuum load chamber 11, can realize that conveyance wafer 15 to the reaction chamber 9 of vacuum state, also can be delivered to from reaction chamber 9 wafer 15 that deposited film atmospheric environment from atmospheric environment.Each reaction module 17 can synchronously carry out the deposition of 2 wafer 15.A plurality of reaction modules are connected with front-end module 8 by metal framework structure 7, and atmosphere manipulator 13 by slide rail 14 operations, transmits wafer 15 at front-end module 8 and 17 of reaction modules in framework.Each reaction module 17 is distributed in slide rail 14 both sides, and front root module 8 is arranged on slide rail 14 1 ends, and each wafer 15 porch arrange calibrator 6 and cooling stations 2.Calibrator 6 is used for calibration wafer center and locating notch, and cooling stations 2 is used for making wafer 15 coolings that deposited film.Metal framework structure 7 tops arrange air cleaner 1, and surrounding is surrounded by panel beating, only leave the passage for wafer 15 and 13 operations of atmosphere manipulator.This design purges the clean gas flow after filtration from top to bottom, guarantees the cleanliness factor of run duration.

Method of operation:

1, wafer 15 that will not do deposition is contained in wafer cassette 3, and wafer cassette 3 is installed on the wafer cassette load port 4 of front-end module 8;

2, when work, the manipulator 5 of front-end module 8 first is placed on wafer 15 on calibrator 6 and calibrates, and by the reaction module 17 of atmosphere manipulator 13 taking-up conveyances to appointment, and stretches into the vacuum load chamber 11 of reaction module completing after;

3, after atmosphere transition valving 12 was closed, the vacuum load chamber vacuumized, and after reaching the vacuum degree close with reaction chamber 9, reaction chamber valve 10 is opened, and by vacuum mechanical-arm 16, wafer 15 is sent into reaction chamber 9 and carries out thin film deposition;

4, after wafer 15 in reaction module 17 is completed thin film deposition, reaction chamber valve 10 is opened, vacuum mechanical-arm 16 in vacuum load chamber 11 with wafer 15 from reaction chamber get back to vacuum load chamber 11 and rotation to the direction of atmosphere manipulator 13 handing-over, reaction chamber valve 10 is closed final vacuum load chamber 11 and is boosted to atmospheric pressure, atmosphere transition valving 12 is opened, after atmosphere manipulator 13 takes out wafer 15, atmosphere transition valving 12 is closed, atmosphere manipulator 13 with wafer 15 conveyances to cooling stations 2, take out and send back in wafer cassette 3 by front-end module manipulator 5 after the time of standing cooling appointment, so far a work period finishes.

Claims

1. wafer conveying device, this device comprises front-end module, above-mentioned front-end module is comprised of air cleaner, metal framework structure, the wafer cassette load port that wafer cassette is housed, front-end module manipulator and front-end module slide rail, it is characterized in that: it also comprises transport module and reaction module, above-mentioned transport module is by metal framework structure, air cleaner, slide rail, the atmosphere manipulator forms, above-mentioned reaction module is by the vacuum load chamber, the atmosphere transition valving, reaction chamber, the reaction chamber valve, vacuum mechanical-arm forms, the annexation of each part mentioned above is: reaction chamber and reaction module of vacuum load chamber composition, configuration vacuum mechanical-arm in the vacuum load chamber, can realize that the conveyance wafer is to the reaction chamber of vacuum state from atmospheric environment, also the wafer that deposited film can be delivered to atmospheric environment from reaction chamber, each reaction module can synchronously carry out the deposition of 2 wafer, a plurality of reaction modules are connected with front-end module by metal framework structure, the atmosphere manipulator moves by slide rail in framework, transmit wafer between front-end module (8) and reaction module, each reaction module is distributed in slide rail both sides, front-end module is arranged on slide rail one end, each wafer porch arranges calibrator and cooling stations, calibrator is used for calibration wafer center and locating notch, cooling stations is used for making the wafer cooling that deposited film, the metal framework structure top arranges air cleaner, surrounding is surrounded by panel beating, only leave the passage for wafer and the operation of atmosphere manipulator.