CN202871858U - 一种用于显示屏上的led光源 - Google Patents

一种用于显示屏上的led光源 Download PDF

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Publication number
CN202871858U
CN202871858U CN2012205859893U CN201220585989U CN202871858U CN 202871858 U CN202871858 U CN 202871858U CN 2012205859893 U CN2012205859893 U CN 2012205859893U CN 201220585989 U CN201220585989 U CN 201220585989U CN 202871858 U CN202871858 U CN 202871858U
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China
Prior art keywords
chip
metallic support
light source
led light
display screen
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Expired - Fee Related
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CN2012205859893U
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English (en)
Inventor
张赞勇
李利敏
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ZHEJIANG LIPU OPTOELECTRONIC TECHNOLOGY Co Ltd
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ZHEJIANG LIPU OPTOELECTRONIC TECHNOLOGY Co Ltd
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Priority to CN2012205859893U priority Critical patent/CN202871858U/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)

Abstract

本实用新型涉及一种用于显示屏上的LED光源,主要解决现有用于显示屏上的LED光源在使用时存在光源刺眼、荧光粉易受热衰减的问题。所述芯片与所述荧光胶之间设置有覆盖所述芯片的透明封装硅胶层,所述透明封装硅胶层将所述荧光胶和所述芯片相互隔离。具有光源均匀柔和、使用寿命长的特点。

Description

一种用于显示屏上的LED光源
技术领域
本实用新型涉及一种用于显示屏上的LED光源。
背景技术
随着节能环保意识的逐渐加强及光电技术的日趋成熟, LED光源逐渐成为业界的研究热点。现有白色LED光源通常使用蓝色LED芯片来激发黄色荧光粉,由LED芯片发出的蓝光和荧光粉的黄绿光合成白光。在实际生产中,将LED芯片设置于基座的底部,使用固晶焊接, LED芯片上方设置一层荧光胶。此结构的LED光源中,荧光粉之间覆盖芯片,由此使得荧光粉离热源LED芯片较近,造成荧光粉在长期使用中受热衰减的程度较大,影响LED光源的稳定性及使用寿命。
实用新型内容
为了克服背景技术中的不足与缺陷,本实用新型提供一种用于显示屏上的LED光源,主要解决现有显示屏上的LED光源在使用时存在光源刺眼、荧光粉易受热衰减的问题。
本实用新型的技术方案是:一种用于显示屏上的LED光源,包括基座、左金属支架、中金属支架、右金属支架、芯片以及荧光胶,所述左金属支架、中金属支架及右金属支架依次镶嵌在基座底部外表面上,所述芯片设在基座内,并与中金属支架相贴合,所述荧光胶设在芯片的上方,所述芯片左导丝与左金属支架相连接,所述芯片右导丝与右金属支架相连接,其特征在于:所述芯片与所述荧光胶之间设置有覆盖所述芯片的透明封装硅胶层,所述透明封装硅胶层将所述荧光胶和所述芯片相互隔离。
本实用新型的有益效果:由于采取上述方案,本实用新型的用于显示屏上的LED光源,设置的透明封装硅胶层,有效的隔离荧光粉层和芯片,避免直接接触导热,有效的对光源进行漫反射,具有光源均匀柔和、使用寿命长的特点。
附图说明
图1为本实用新型的结构示意图。  
图中,基座1,右金属支架2,右导丝3,芯片4,左导丝5,左金属支架6,荧光胶7,透明封装硅胶层8,中金属支架9。
具体实施方式
下面针对附图对本实用新型的实施例作进一步说明:
由图所示,一种用于显示屏上的LED光源,包括基座1、左金属支架6、中金属支架9,右金属支架2、芯片4以及荧光胶7,所述左金属支架6、中金属支架9及右金属支架2依次镶嵌在基座1底部外表面上,所述芯片4设在基座1内,并与中金属支架9相贴合,所述荧光胶7设在芯片6的上方,所述芯片4左导丝5与左金属支架6相连接,所述芯片4右导丝3与右金属支架2相连接。所述左导丝5与右导丝3均为导电材质制成,如金丝,银丝及合金导线等。左金属支架6和右金属支架2延伸出基座1,与支架板线路层电连接,与芯片4形成一个串联电路,给芯片4提供电流,并传递芯片4发光散发出来的热量,有效延长使用寿命。
所述芯片4与所述荧光胶7之间设置有覆盖所述芯片4的透明封装硅胶层8,所述透明封装硅胶层8将所述荧光胶7和所述芯片4相互隔离,有效的避免荧光粉与芯片4直接接触导热,透明封装硅胶层8对芯片4光源漫反射,使得光源均匀柔和。
实施例不应视为对实用新型的限制,但任何基于本实用新型的精神所作的改进,都应在本实用新型的保护范围之内。

Claims (1)

1.一种用于显示屏上的LED光源,包括基座、左金属支架、中金属支架、右金属支架、芯片以及荧光胶,所述左金属支架、中金属支架及右金属支架依次镶嵌在基座底部外表面上,所述芯片设在基座内,并与中金属支架相贴合,所述荧光胶设在芯片的上方,所述芯片左导丝与左金属支架相连接,所述芯片右导丝与右金属支架相连接,其特征在于:所述芯片与所述荧光胶之间设置有覆盖所述芯片的透明封装硅胶层,所述透明封装硅胶层将所述荧光胶和所述芯片相互隔离。
CN2012205859893U 2012-11-08 2012-11-08 一种用于显示屏上的led光源 Expired - Fee Related CN202871858U (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104218141A (zh) * 2014-09-17 2014-12-17 深圳市晶台股份有限公司 一种倒装led芯片的封装结构
CN104600179A (zh) * 2015-01-21 2015-05-06 电子科技大学 一种具有conformal-remote结构的LED荧光粉层及制备方法
CN104713035A (zh) * 2015-02-03 2015-06-17 深圳市光峰光电技术有限公司 波长转换装置、其制作方法及发光装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104218141A (zh) * 2014-09-17 2014-12-17 深圳市晶台股份有限公司 一种倒装led芯片的封装结构
CN104600179A (zh) * 2015-01-21 2015-05-06 电子科技大学 一种具有conformal-remote结构的LED荧光粉层及制备方法
CN104713035A (zh) * 2015-02-03 2015-06-17 深圳市光峰光电技术有限公司 波长转换装置、其制作方法及发光装置
CN104713035B (zh) * 2015-02-03 2016-06-29 深圳市光峰光电技术有限公司 波长转换装置、其制作方法及发光装置

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