CN202855801U - Eutectic substrate - Google Patents
Eutectic substrate Download PDFInfo
- Publication number
- CN202855801U CN202855801U CN 201220270738 CN201220270738U CN202855801U CN 202855801 U CN202855801 U CN 202855801U CN 201220270738 CN201220270738 CN 201220270738 CN 201220270738 U CN201220270738 U CN 201220270738U CN 202855801 U CN202855801 U CN 202855801U
- Authority
- CN
- China
- Prior art keywords
- eutectic
- pcb board
- led chip
- substrate
- baseboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a eutectic substrate which comprises a metal baseboard and a PCB board fixed on the baseboard. The PCB board is ringwise. The central portion of the baseboard is provided with several raised eutectic positions. Further, the interior bottom of the PCB board is provided with a chamfered or rounded reflective surface. Further, a welding spot and a conductor layer are arranged over the PCB board. Further, the eutectic positions are arranged on the surface of the eutectic substrate in a rectangular shape. Further, a production material of the baseboard is copper or aluminum. The upper surface of the eutectic positions can be silver-plated. The utility model has beneficial effects as follows: the technical problem that a LED chip is wrapped by a solder during the eutectic process and rotation and excursion occur to the LED chip position when the LED chip is fixed is solved; glowing effect of side faces of the LED chip is guaranteed; and quality of the product is raised.
Description
[technical field]
The utility model relates to a kind of eutectic substrate.
[background technology]
In the prior art, led chip can be fixed in the mode of eutectic or die bond on the substrate, when using the eutectic mode fixedly, paste scolder on substrate is put at first, led chip is placed on the scolder, the substrate of then heating can be welded in led chip on the substrate after the scolder dissolving again; The another kind of welding method of eutectic is the molten point that substrate is warmed to solid-state scolder, and then scolder on molten on the substrate is placed on led chip on the substrate at last and welds.When using the die bond mode fixedly, fixed form is take the glue stickup as main, and glue mainly adopts silica gel or elargol, at first silica gel or elargol on substrate is put in the time of fixedly, again led chip is placed on the colloid, thereby then heat colloid curing is fixed on led chip on the substrate.
Existing substrate generally adopts flat board, thereby exists glue or scolder can wrap up led chip in eutectic and die bond production process, affects the problem of the illumination effect of led chip.Because all there are the character of shading and extinction in glue and scolder, the parcel of scolder or glue all can have influence on the illumination effect of led chip side.Simultaneously, in fixation procedure, the position that scolder or glue solidify front led chip fully may produce slip or rotation offset, affects product quality.
[utility model content]
The purpose of this utility model is to overcome the deficiency that led chip in the prior art produces position skew and lateral emitting poor effect, a kind of novel eutectic substrate of proposition.
The utility model is achieved through the following technical solutions:
Described eutectic substrate comprises that a metal base plate and is fixed in the pcb board on the described base plate, and described pcb board is provided with the eutectic position of some projections ringwise in the middle part of the described base plate.
Further, described pcb board inside bottom is provided with chamfering or fillet reflective surface.
Further, be provided with solder joint and conductor layer above the described pcb board.
Further, the rectangular and array in described eutectic position is in described eutectic substrate surface.
Further, it is copper or aluminium that described base plate is made material, and described eutectic position upper surface can be silver-plated.
The beneficial effects of the utility model are: solved that led chip in the eutectic process is wrapped up by scolder and the led chip position produces the technical problem of rotation offset fixedly the time, guaranteed the lateral emitting effect of led chip, improved product quality.
[description of drawings]
Fig. 1 is the utility model structural representation
Reference numeral: 1, eutectic substrate; 2, pcb board; 3, eutectic position; 4, reflective surface; 5, solder joint; 6, conductor layer.
[embodiment]
Below in conjunction with the drawings and the specific embodiments the utility model is described further:
In a preferred embodiment, described eutectic substrate 1 comprises that a metal base plate and is fixed in the pcb board 2 on the described base plate, and described pcb board 2 is provided with the eutectic position 3 of some projections ringwise in the middle part of the described base plate.Led chip was positioned on the eutectic position 3 of projection when the utility model used, because eutectic position 3 projections, led chip only has when being positioned on the eutectic position 3 near the base and can contact with scolder, and the phenomenon of having avoided led chip to be wrapped up by scolder has fully guaranteed the illumination effect of led chip side; Simultaneously, place the led chip on the eutectic position 3 to be difficult for sliding, thereby avoided the problem of led chip position skew.
In a preferred embodiment, described pcb board 2 inside bottom are provided with chamfering or fillet reflective surface 4.The light that this design can more effectively utilize the led chip side to send improves illuminating effect.
In a preferred embodiment, described pcb board 2 tops are provided with solder joint 5 and conductor layer 6.Described solder joint 5 is convenient to the utility model and other structure welding are fixed.
In a preferred embodiment, the rectangular and array in described eutectic position 3 is in described eutectic substrate 1 surface.Height and the area of described eutectic position 3 all can be regulated in process of production, and described production process includes but not limited to die sinking casting, punching press, etching and machinery automation processing mode.
In a preferred embodiment, it is copper or aluminium that described base plate is made material, and described eutectic position 3 upper surfaces can be silver-plated.
The according to the above description announcement of book and instruction, the utility model those skilled in the art can also carry out suitable change and modification to above-mentioned execution mode.Therefore, the embodiment that discloses and describe above the utility model is not limited to also should fall in the protection range of claim of the present utility model modifications and changes more of the present utility model.In addition, although used some specific terms in this specification, these terms do not consist of any restriction to the utility model just for convenience of description.
Claims (5)
1. eutectic substrate comprises that a metal base plate and is fixed in the pcb board on the described base plate, is characterized in that: described pcb board ringwise, described base plate middle part is provided with the eutectic position of some projections.
2. eutectic substrate according to claim 1, it is characterized in that: described pcb board inside bottom is provided with chamfering or fillet reflective surface.
3. eutectic substrate according to claim 1 is characterized in that: be provided with solder joint and conductor layer above the described pcb board.
4. eutectic substrate according to claim 1 is characterized in that: the rectangular and array in described eutectic position is in described eutectic substrate surface.
5. eutectic substrate according to claim 1 is characterized in that: it is copper or aluminium that described base plate is made material, and described plate upper surface can be silver-plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220270738 CN202855801U (en) | 2012-06-08 | 2012-06-08 | Eutectic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220270738 CN202855801U (en) | 2012-06-08 | 2012-06-08 | Eutectic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202855801U true CN202855801U (en) | 2013-04-03 |
Family
ID=47986967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220270738 Expired - Fee Related CN202855801U (en) | 2012-06-08 | 2012-06-08 | Eutectic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202855801U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105895540A (en) * | 2015-01-09 | 2016-08-24 | 特科芯有限公司 | Die back surface silicone printing encapsulation method |
-
2012
- 2012-06-08 CN CN 201220270738 patent/CN202855801U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105895540A (en) * | 2015-01-09 | 2016-08-24 | 特科芯有限公司 | Die back surface silicone printing encapsulation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: Chen Liesheng Document name: Notice of termination of patent |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130403 Termination date: 20200608 |