CN202797083U - Novel SMD LED - Google Patents
Novel SMD LED Download PDFInfo
- Publication number
- CN202797083U CN202797083U CN2012201628940U CN201220162894U CN202797083U CN 202797083 U CN202797083 U CN 202797083U CN 2012201628940 U CN2012201628940 U CN 2012201628940U CN 201220162894 U CN201220162894 U CN 201220162894U CN 202797083 U CN202797083 U CN 202797083U
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- China
- Prior art keywords
- electrode
- interior electrode
- ceramic
- chip
- described interior
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The utility model discloses a novel SMD LED. The LED comprises a cover plate, a ceramic base seat, an inner electrode, a binding gold wire, a chip, a fluorescent powder, a side conducting electrode and a back electrode. The cover plate is arranged above the ceramic base seat. The inner electrode is arranged on an upper surface of the ceramic base seat. The chip is arranged on the upper surface of the inner electrode and is connected with one end of the binding gold wire. The other end of the binding gold wire is connected with the inner electrode. The side conducting electrode is arranged on a side end surface of the ceramic base seat. The inner electrode is completely or partially connected with the back electrode. The back electrode is arranged on a lower surface of the ceramic base seat. The LED possesses the following characteristics that cost is low; a luminance effect is high; reliability is high; performance is stable and so on. The LED is suitable for SMT industrialized mass production, manufacturing and applications.
Description
Technical field
The utility model relates to a kind of New type of S MD adopting surface mounted LED.
Background technology
In known LED technology already, the adopting surface mounted LED of various structures is extensively adopted by semiconductor lighting industry institute.Chinese patent CN201629346U has announced a kind of adopting surface mounted LED, and for effectively solving heat dissipation problem, this patented technology has adopted the copper coin electrode as source of heat release, because the metallic copper thermal conductivity is good, thermally conductive pathways is short, thereby has solved well heat dissipation problem.Yet also there are some apparent technical disadvantages in this technical scheme, the one, and cost is higher, and the 2nd, the electric poor reliability that causes because of coefficient of expansion problem, the 3rd, it is lower to make efficient.In addition, Chinese invention patent application 200810066253.3 has been announced a kind of high-power LED ceramic package base, this technical scheme has been announced a kind of LED pedestal based on ceramic substrate, its basic principle is to utilize LTCC technology plated metal on ceramic substrate, realize the electrical connection of LED and utilize the technical characterstic of electronic ceramic to prepare the led support with SMD structure, be conducive to LED manufacturer and be assembled into base of ceramic LED, but in this technical scheme, in order to realize high efficiency and heat radiation, this inventor chip position in the ceramic layer under technical scheme is provided with high heating column, need to LTCC punch and the hole in metalized, this scheme also exists the cost height, the problems such as consistency is poor.
Summary of the invention
The technical problems to be solved in the utility model provides the New type of S MD adopting surface mounted LED that a kind of with low cost, reliable in quality, radiating efficiency are high, be fit to SMT technique.
For solving the problems of the technologies described above, the utility model adopts following technical scheme: comprise cover plate, base of ceramic, interior electrode, binding spun gold, chip, fluorescent material, side conductive electrode and back electrode, described cover plate be arranged on described base of ceramic above, described interior electrode is arranged on the upper surface of described base of ceramic; Described chip is arranged on the upper surface of described interior electrode, and links to each other with an end of described binding spun gold, and the other end of binding spun gold is connected with described interior electrode; Described side conductive electrode is arranged on the side end face of described base of ceramic, and is connected with described interior electrode and all or part of of back electrode; Described back electrode is arranged on the lower surface of described base of ceramic.
Further, described interior electrode forms by the two-layer at least of mutual stack or mutual overlap joint or with upper electrode arrangement.
Further, described side conductive electrode is arranged on the side end face of described base of ceramic, and is connected with described interior electrode and all or part of of back electrode.
Further, be provided with mounting pad and for the routing pad of binding gold thread, perhaps, can also be provided with chip protection circuit on the described interior electrode, and described interior electrode being covered by described cover plate and fluorescent material of installation chip on the described interior electrode.
Further, described chip is at least one, and the bottom surface of described chip is arranged on the upper surface of described interior electrode paste welding equipment dish.
New type of S MD adopting surface mounted LED of the present utility model has with low cost, characteristics such as light efficiency is high, reliability is high, stable performance, is fit to SMT industrialized mass, manufacturing and application.
Description of drawings
Fig. 1 is the structural representation of the utility model New type of S MD adopting surface mounted LED;
Fig. 2 is the structural representation after removing fluorescent material, chip among Fig. 1 and binding spun gold;
Fig. 3 is the cross-sectional view after the utility model New type of S MD adopting surface mounted LED is removed fluorescent material;
Fig. 4 is the schematic diagram of base of ceramic and back electrode in the utility model New type of S MD adopting surface mounted LED.
Embodiment
In the present embodiment, referring to figs. 1 through Fig. 4, described New type of S MD adopting surface mounted LED comprises cover plate 1, base of ceramic 2, interior electrode 3, binding spun gold 4, chip 5, fluorescent material 6, side conductive electrode 7 and back electrode 8; Wherein, described cover plate 1 by high temperature heat conductive silica gel or epoxy bond be arranged on described base of ceramic 2 above; Described interior electrode 3 is arranged on the upper surface of described base of ceramic 2; Described chip 5 is arranged on the upper surface of described interior electrode 3, and links to each other with an end of described binding spun gold 4, and the other end of binding spun gold 4 is connected with described interior electrode 3; Described side conductive electrode 7 is arranged on the side end face of described base of ceramic 2, and is connected with all or part of of back electrode 8 with described interior electrode 3; Described back electrode 8 is arranged on the lower surface of described base of ceramic 2.Described fluorescent material 6 is configured to planar structure, and the thickness of the thickness of fluorescent material 6 and cover plate 1 is consistent, and can obtain chip SMDLED effect.Certainly, described fluorescent material 6 also can be set to cambered surface.
Wherein, described cover plate 1 adopts heat dissipation ceramic or insulating radiation material to consist of reflector, and described cover plate 1 angle can adjust arbitrarily, and preferred version is for adopting aluminium oxide ceramics, and the reflector angle is configured to toroidal; Described cover plate 1 is mainly used in providing heat radiation, light light harvesting and cremasteric reflex; Described base of ceramic adopts the precise electronics potteries such as aluminium oxide, aluminium nitride or beryllium oxide, and described base of ceramic 2 is arranged to the required given shape of SMD or structure in advance, and preferred version is for adopting aluminium nitride material, and is configured to rectangular configuration.Main Function provides electric matrix and high efficiency and heat radiation.Whole or one of them part of described interior electrode 3, one or several materials by materials such as silver, silver-colored palladium, silver-colored platinum, gold or copper base metals consist of, perhaps, described interior electrode 3 can be by mutual stack or at least 2 layers of overlap joint or form with upper electrode arrangement mutually.Described interior electrode 3 preferred silver-colored palladium or the copper base metals of adopting consist of, and interior electrode 3 is mainly chip 5 and electrical interconnection is provided and auxiliary heat dissipation is provided.Described side conductive electrode 7 is arranged on the side end face of described base of ceramic 2, and be connected with all or part of of back electrode 8 with described interior electrode 3, described side conductive electrode 7 adopts the materials such as silver, copper or nickel chromium triangle to consist of, perhaps, but described side conductive electrode 7 can also be included in the anti-weldering layer of electroplating on above-mentioned silver, copper or the nickel chromium triangle material.The major function of side conductive electrode 7 provides electrical interconnection, heat radiation and SMD assembling.Described back electrode 8 adopts the materials such as silver or copper base metal to consist of, two groups of back electrodes 81 and 82 about described back electrode can be divided into, and Main Function provides heat radiation and component mounter.Be provided with on the described interior electrode 3 mounting pad 9 and being used for the routing pad 10 of binding gold thread 4 of chip 5 is installed, and described interior electrode 3 is covered by described cover plate 1 and described fluorescent material 6.Chip 5 protective circuits can also be set on the described interior electrode 3, avoid unusual electrical impact in order to protect chip 5.Described chip 5 comprise at least 1 or more than, the bottom surface of described chip 5 is arranged on the upper surface that mounts pad 9 of described interior electrode 3, described chip 5 can adopt single monochromatic LED or 3 above color LED chips to form, in order to obtain different color output effects.
Below the utility model is described in detail, the above only is the preferred embodiment of the utility model, when not limiting the utility model practical range, be allly to do impartial change and modify according to the application's scope, all should still belong in the utility model covering scope.
Claims (5)
1. New type of S MD adopting surface mounted LED, it is characterized in that: comprise cover plate, base of ceramic, interior electrode, binding spun gold, chip, fluorescent material, side conductive electrode and back electrode, described cover plate be arranged on described base of ceramic above, described interior electrode is arranged on the upper surface of described base of ceramic; Described chip is arranged on the upper surface of described interior electrode, and links to each other with an end of described binding spun gold, and the other end of binding spun gold is connected with described interior electrode; Described side conductive electrode is arranged on the side end face of described base of ceramic, and is connected with described interior electrode and all or part of of back electrode; Described back electrode is arranged on the lower surface of described base of ceramic.
2. New type of S MD adopting surface mounted LED according to claim 1 is characterized in that: described interior electrode is by mutual stack or mutual overlap joint two-layer at least or form with upper electrode arrangement.
3. New type of S MD adopting surface mounted LED according to claim 1, it is characterized in that: described side conductive electrode is arranged on the side end face of described base of ceramic, and is connected with described interior electrode and all or part of of back electrode.
4. New type of S MD adopting surface mounted LED according to claim 1; it is characterized in that: be provided with on the described interior electrode mounting pad and being used for the routing pad of binding gold thread of chip is installed; perhaps; can also be provided with chip protection circuit on the described interior electrode, and described interior electrode is covered by described cover plate and fluorescent material.
5. New type of S MD adopting surface mounted LED according to claim 4, it is characterized in that: described chip is at least one, and the bottom surface of described chip is arranged on the upper surface of described interior electrode paste welding equipment dish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201628940U CN202797083U (en) | 2012-04-12 | 2012-04-12 | Novel SMD LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201628940U CN202797083U (en) | 2012-04-12 | 2012-04-12 | Novel SMD LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202797083U true CN202797083U (en) | 2013-03-13 |
Family
ID=47824283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201628940U Expired - Fee Related CN202797083U (en) | 2012-04-12 | 2012-04-12 | Novel SMD LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202797083U (en) |
-
2012
- 2012-04-12 CN CN2012201628940U patent/CN202797083U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20170412 |