RU160075U1 - LED RADIATOR - Google Patents

Abstract

An LED emitter comprising a metal plate and at least two light-emitting diodes, moreover, the holes in the metal plate are arranged in a row with the formation of jumpers between adjacent holes, each LED is fixed with a heat-conducting compound to its corresponding jumper to ensure electrical isolation from it, the LEDs are interconnected electrically in series using conductors, and the extreme ones are connected using conductors with each corresponding They pad that is located at the edge of the metal plactiny and electrically insulated from the other contact pad on the LEDs and the metal plate from the LED suffered additional layer containing a phosphor and formed light transmitting.

Description

The invention relates to the field of lighting, namely: -to the implementation of the LED source, which is part of the lamp.

State of the art

The closest technical solution (prototype) is the LED emitter described in RF patent No. 2423803, publication date 10.07.2011.

The known device contains a heat-dissipating substrate; a metal plate; a light-emitting module mounted on the surface of a heat-dissipating substrate, and an external connection terminal that is located on a heat-dissipating substrate and which provides an electrical connection between the LEDs and an external power supply. A well heat-dissipating substrate has a predetermined pattern pattern formed on the upper surface of a metal plate with an insulating layer between them. The light emitting module consists of a plurality of LED elements arranged on a heat dissipating substrate and light transmitting resin, which covers the LED elements. The metal plate is made of a material having good thermal conductivity (aluminum plate). The terminal for external connection is formed from a material having lower thermal conductivity than the thermal conductivity of the metal plate, and has at least two external electrodes to which a wire electrical connection is soldered. Power is supplied externally via an output for external connection to LED elements through a circuit diagram.

A disadvantage of the known technical solutions is the limitation of the radiation pattern due to the use of a heat sink from a solid metal plate.

The technical result of the proposed technical solution is to improve the radiation pattern of light. This solution will improve the efficiency of existing LED lamps and fully replace the incandescent lamps of a standard base (E14, E27, etc.).

The specified technical result is achieved due to the fact that in the LED emitter containing a metal plate and at least two LEDs, moreover, holes are arranged in a metal plate located in a row with the formation of jumpers between adjacent holes, each LED is fixed using a heat-conducting compound to the corresponding jumper to ensure electrical isolation from it, the LEDs are interconnected electrically in series using conductors, and the extreme of they are connected by respective conductors with each of them a contact pad that is located at the edge of the metal plates and electrically insulated from the other contact pad on the LEDs and the metal plate from the LED suffered additional layer containing a phosphor and formed light transmitting.

Brief Description of the Drawings

The light emitter is illustrated by drawings (Fig. 1,2,3), where Fig. 1 shows a general view of the emitter with a conditional gap, Fig. 2 is a top view, Fig. 3 is a remote section.

Utility Model Disclosure

The figures indicate: hole 1, contact pad 2, metal plate 3, jumper 4, conductive thread 5, LED 6, adhesive connection 7, additional layer 8, phosphor 9, substrate 10.

LED emitter consists of: metal plate 3; two or more two LEDs 6 connected to each other in series by conductive threads 5 (i.e., conductors); and an additional layer 8. The metal plate 3 may be made of aluminum or copper. The metal plate 3 has a rectangular shape. On the metal plate 3 there are made through holes 1 of a square shape, located in one row and at an equal distance from each other and, thus, forming jumpers 4 between two adjacent holes 1. The number of holes 1 is one more than the number of emitter LEDs. On the jumpers 4, on one side of the metal plate 3, there is one LED 6 on the dielectric substrate 10. An additional layer 8 covers each LED 6 on the dielectric substrate 10 and, on the side of this LED, corresponding (i.e., the one on which it located) a jumper to this LED 4. Also on the surface of the metal plate 3 are located contact pads 2, electrically isolated from each other and from the metal plate 3. The LEDs 6, located extreme in a row, one on each side row, have an electrical connection with a conductive thread 5 (conductor) with the corresponding pads 2.

LED 6 is a semiconductor device with an electron-hole junction (p-n), which is attached to the dielectric substrate 10 by means of an adhesive joint 7. The adhesive joint 7 is made transparent and heat-resistant, for example, of a heat-conducting composition. The dielectric substrate 10 can be made of leucosapphire (aluminum oxide) or other heat-conducting composition that provides electrical insulation. Each dielectric substrate 10 is attached to a corresponding jumper 4 of the metal plate 3. The jumpers 4 are made so that the LED 6 on the dielectric substrate 10 is in close proximity to the holes 1.

Utility Model Implementation

In the case of using the above elements and means, the utility model is implemented as follows. From a single sheet of aluminum, copper or other material with high thermal conductivity, a rectangular or elongated plate with an elongated shape, with even or uneven edges, is made. The size and shape of the plate depends on the number and type of LEDs 6 of the emitter. On one surface of the metal plate 3, pads 2 are placed on both sides, electrically isolated from each other and from the metal plate 3. Electrical insulation can be carried out by applying an insulating material - dielectric (fiberglass; paper impregnated with paraffin, etc.) to the metal plate 3. ) with subsequent placement on the surface of the dielectric of the contact pads 2. The size of the dielectric and contact pads 2 is selected sufficient for soldering the conductors in eshnego power supply unit and the conductive yarns 5 LEDs 6. Furthermore, in the metal plate 3 are punched one square or rectangular shape by any method sufficient accuracy, thus obtaining, lintel 4.

Transparent dielectric substrates 10 are fixed on the jumpers 4, made of leucosapphire or other heat-conducting composition with electrical insulation, on which the LEDs 6 are subsequently fixed or, during the manufacturing of the LED emitter, the substrates 10 with the LEDs 6 pre-fixed on them are connected to the jumpers 4. Each jumper 4 corresponds to one LED 6. It should be noted that LED 6 can be understood as a device having more than one pn junction on one substrate or How many single LEDs are connected in parallel. Use blue-spectrum LEDs (glow color) with a wavelength of 450-475 nm. The LED 6 is attached to the substrate with a transparent heat-resistant adhesive 7, which has the property of high thermal conductivity, the substrate 10 can be attached to the jumper 4 by the method of extension or by using heat-resistant adhesive. The fixed LEDs 6 are sequentially interconnected by a conductive thread 5. The conductive thread 5 is made of gold to ensure high stability of electromechanical properties at elevated temperatures. The inclusion of LEDs 6 in the electric circuit is carried out by connecting a conductive thread 5 extreme, one on each side of the metal plate 3, LEDs 6 to the contact pads 2. At the final stage of manufacturing the LED emitter, the LEDs 6 together with the substrate 10 and the jumper 4 from the side of the LEDs 6 are covered with an additional layer 8 containing phosphor 9.

When you turn on the device, the voltage of the external DC power supply is supplied to the corresponding pads 2 of the LED emitter. The power supply converts the voltage of an external electric source into the operating voltage necessary for the correct operation of the LED emitter. When passing through the resulting electrical circuit electric current in the forward direction, the LEDs 6 generate optical radiation. An additional layer 8 with a phosphor 9 converts this radiation into light in a relatively wide spectral band with a maximum in the yellow region. The radiation of the LED 6 and the phosphor 9, mixing, give white light of various colors. Additional layers 8, which are a mixture of a light-transmitting epoxy compound and a phosphor 9, are applied to the LED 6 with the substrate 10 and to the jumper 4. This allows you to improve (expand) the radiation pattern of the light emitted by the LEDs 6. Moreover, the greater the thickness of the additional layer 8 with the phosphor, the greater the scattering in it. In addition, the application of an additional layer 8 on the surface of the jumper 4 increases the reliability of fastening the LED 6 to the metal plate 3 of the LED emitter.

Thus, the implementation of the device in the manner described above increases its reliability during operation and improves the radiation pattern due to the use of an additional layer 8 with a phosphor 9 from the side of the mounting of the LEDs 6.

Claims (1)

An LED emitter comprising a metal plate and at least two light-emitting diodes, moreover, the holes in the metal plate are arranged in a row with the formation of jumpers between adjacent openings, each LED is fixed with a heat-conducting compound to its corresponding jumper to ensure electrical isolation from it, LEDs are interconnected electrically in series using conductors, and the extreme ones are connected using conductors with a corresponding to each and They pad that is located at the edge of the metal plactiny and electrically insulated from the other contact pad on the LEDs and the metal plate from the LED suffered additional layer containing a phosphor and formed light transmitting.

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