RU158959U1 - LED RADIATOR - Google Patents

Abstract

An LED emitter comprising a metal plate and at least two light-emitting diodes, moreover, the holes in the metal plate are arranged in a row to form a jumper between adjacent openings, each LED is fixed with a heat-conducting compound to its corresponding jumper to ensure electrical isolation from it, LEDs are interconnected electrically in series using conductors, and the extreme ones are connected using conductors with the corresponding to each of An additional layer containing a phosphor is deposited on the LEDs and the metal plate on the side of the LEDs and on the metal platinum on the opposite side of the LEDs by a contact pad located at the edge of the metal platinum and electrically isolated from the other contact pad.

Description

Technical field

The technical solution relates to the field of lighting technology, and more specifically to the implementation of the LED source, which is part of the lamp.

State of the art

The closest technical solution (prototype) is the LED emitter described in RF patent No. 2423803, publication date 07/10/2011.

The known device contains a heat-dissipating substrate; a metal plate; a light-emitting module mounted on the surface of a heat-dissipating substrate, and an external connection terminal that is located on a heat-dissipating substrate and which provides an electrical connection between the LEDs and an external power supply. A well heat-dissipating substrate has a predetermined pattern pattern formed on the upper surface of a metal plate with an insulating layer between them. The light emitting module consists of a plurality of LED elements arranged on a heat dissipating substrate and light transmitting resin, which covers the LED elements. The metal plate is made of an aluminum plate having good thermal conductivity. The terminal for external connection is formed from a material having lower thermal conductivity than the thermal conductivity of the metal plate, and has at least two external electrodes to which a wire electrical connection is soldered. Power is supplied externally via an output for external connection to LED elements through a circuit diagram.

A disadvantage of the known technical solutions is the limitation of the direction of propagation of light emitted by LED chips, due to the use of a heat sink from a solid metal plate and the application of a phosphor only from the installation side of single light emitting elements.

The technical result of the proposed technical solution is to improve the radiation pattern of light. This solution will improve the efficiency of existing LED lamps and fully replace the incandescent standard base (E14, E27, etc.).

The specified technical result is achieved in that in the LED emitter containing a metal plate and at least two LEDs, moreover, holes are arranged in a metal plate located in a row with the formation of a jumper between adjacent holes, each LED is fixed with a heat-conducting composition to its corresponding a jumper to ensure electrical isolation from it, the LEDs are interconnected electrically in series using conductors, and the extreme ones are connected They are coated with conductors with a contact pad corresponding to each of them located at the edge of a metal plate and electrically isolated from the other contact pad, an additional layer containing a phosphor is applied to the LEDs and the metal plate from the LEDs side and to the metal plate from the opposite side of the LEDs.

Brief Description of the Drawings

The light emitter is illustrated by drawings (FIGS. 1, 2, 3), where in FIG. 1 shows a visual isometric view of the emitter; FIG. 2 (top view) and FIG. 3 (remote section) are given for a more detailed examination of individual elements.

Utility Model Disclosure

The figures indicate: hole 1, contact pad 2, metal plate 3, jumper 4, conductive thread 5, LED 6, adhesive connection 7, additional layer 8, phosphor 9, substrate 10.

LED emitter consists of: metal plate 3; two or more two LEDs 6 connected to each other in series by a conductive thread 5 (i.e., conductors); and an additional layer 8. The metal plate 3 may be made of aluminum or copper. The metal plate 3 has a rectangular shape. On the metal plate 3 there are holes 1 of a square shape, located in one row and at an equal distance from each other and, thus, forming jumpers 4 between two adjacent holes 1. The number of holes 1 is one more than the number of LEDs of the emitter. On the jumpers 4, on one side of the metal plate 3, there are LEDs 6 on the dielectric substrates 10. An additional layer 8 covers each LED 6 on the dielectric substrate 10 together with the corresponding jumper 4. A similar additional layer 8 is located on the opposite side of the metal plate 3. Also on the surface of the metal plate 3 there are contact pads 2, electrically isolated from each other and from the metal plate 3. Extreme LEDs 6, one on each side of the metal Sky plate 3, have an electrical connection with a conductive thread 5 (conductor) with pads 2.

LED 6 is a semiconductor device with an electron-hole junction (pn), which is attached to a dielectric substrate using an adhesive joint 7. The adhesive joint 7 is transparent and heat-resistant, for example, of a heat-conducting composition. The dielectric substrate 10 may be made of leucosapphire (aluminum oxide) or other heat-conducting composition with electrical insulation. Each dielectric substrate 10 is fastened to a corresponding jumper 4 of the metal plate 3. The jumpers 4 are made so that the LED 6 on the dielectric substrate 10 is in close proximity to the holes 1.

Utility Model Implementation

In the case of using the above elements and means, the utility model is implemented as follows. A rectangular plate is made from a single sheet of aluminum or copper. The size of the plate depends on the number and type of LEDs 6 of the emitter. On the finished metal plate 3, pads 2 are applied on both sides, electrically isolated from each other and from the metal plate 3. Electrical insulation can be achieved by applying an insulating material to the metal plate 3 - dielectric (fiberglass; paper impregnated with paraffin, etc.) followed by drawing on the dielectric surface of the contact pads 2. The size of the dielectric and contact pads 2 is selected sufficient to solder the conductors of the external unit and the power and the conductive threads 5 LEDs. In addition, in the metal plate 3, square holes 1 are made by any of the methods of sufficient accuracy, thereby obtaining jumpers 4.

Transparent dielectric substrates 10 are mounted on the jumpers 4, made of leucosapphire or other heat-conducting composition with electrical insulation, on which the LEDs 6 are subsequently fixed or, during the manufacturing of the LED emitter, the substrates 10 are fixed on the jumpers 4 with the LEDs b pre-mounted on them b. Each jumper 4 corresponds to one LED 6. It should be noted that LED 6 can be understood as a device having more than one pn junction on one substrate or several individual LEDs connected in parallel. Use blue-spectrum LEDs (glow color) with a wavelength of 450-475 nm. The LED 6 is attached to the substrate by a transparent heat-resistant adhesive 7, which has the property of high thermal conductivity; fastening the substrate 10 to the jumper can be carried out by the method of building or using heat-resistant glue. The fixed LEDs 6 are connected in series with each other by a conductive thread 5. The conductive thread 5 is made of gold to ensure high stability of electromechanical properties at elevated temperatures. The inclusion of LEDs 6 in the electrical circuit is carried out by connecting a conductive thread 5 extreme, one on each side of the metal plate 3, LEDs 6 to the contact pads 2. At the final stage of manufacturing the LED emitter, the LEDs 6 together with the substrate 10 and the jumper 4 are covered with additional layers 8 containing phosphor 9.

When you turn on the device, the voltage of the external DC power supply is supplied to the corresponding pads 2 of the LED emitter. The power supply converts the voltage of an external electric source into the operating voltage necessary for the correct operation of the LED emitter. When passing through the resulting electrical circuit electric current in the forward direction, the LEDs 6 generate optical radiation. An additional layer 8 with a phosphor 9 converts this radiation into light in a relatively wide spectral band with a maximum in the yellow region. The radiation of the LED 6 and the phosphor 9, mixing, give white light of various colors. Additional layers 8, which are a mixture of an epoxy compound and a phosphor 9, are applied to the LED 6 with the substrate 10 and to the jumper 4, as well as from the back of the metal plate 3, thus covering it from the back of the LEDs b. This makes it possible to improve the radiation pattern of the light emitted by the LEDs 6 due to the scattering process. Moreover, the greater the thickness of the additional layer 8 with the phosphor, the greater the scattering in it.

Thus, the implementation of the device in the manner described above provides an improvement in the radiation pattern due to the use of an additional layer 8 with a phosphor 9 both from the mounting side of the LEDs 6 and from the back of the metal plate 3.

Claims (1)

An LED emitter comprising a metal plate and at least two light-emitting diodes, moreover, the holes in the metal plate are arranged in a row to form a jumper between adjacent openings, each LED is fixed with a heat-conducting compound to its corresponding jumper to ensure electrical isolation from it, LEDs are interconnected electrically in series using conductors, and the extreme ones are connected using conductors with the corresponding to each of An additional layer containing a phosphor is deposited on the LEDs and the metal plate on the side of the LEDs and on the metal platinum on the opposite side of the LEDs by a contact pad located at the edge of the metal platinum and electrically isolated from the other contact pad.

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