KR100997172B1 - Led package and led radiant heat device, and led socket device using the same - Google Patents

Abstract

PURPOSE: An LED(Light Emitting Diode) element, an LED heat dissipation device, and an LED socket device are provided to prevent the degradation of the photonic efficiency of an LED and to maintain the lifespan of an LED by directly arraying the LED on a heat dissipation plate. CONSTITUTION: An LED mounting part is formed in the center of a heat dissipation slug(101). The LED mounting part has at least one penetration hole. An LED chip(103) is installed on the upper surface of the LED mounting part. An electrode pin(104) is inserted into the penetration hole of the LED mounting part. An insulating layer(105) is formed between the heat dissipation slug and the electrode pin. An insulating plate(108) is formed on the lower surface of the electrode pin. A bonding wire interlinks the LED chip and the electrode pin. An encapsulating material hermetically seals the upper part of the LED mounting part.

Description

LED element and LED heat dissipation device and LED socket device using LED for efficient heat dissipation of LED lighting and lamps {LED Package and LED Radiant Heat Device, and LED Socket Device Using The same}

The present invention relates to an LED element and an LED heat dissipation device for efficient heat dissipation of a light emitting diode (LED) light and a lamp, and more particularly, by efficiently dissipating heat generated from the LED element, thereby solving the problem of LED light efficiency degradation. The present invention relates to an LED device and an LED heat dissipation device capable of improving reliability.

In addition, the present invention relates to an LED socket device that can be installed and replaced easily, such as a street light by having an LED element and an LED heat dissipation device integrated with a driving circuit.

In general, a light emitting diode (LED) is a device in which electrons and holes meet and emit light at a PN junction by applying an electric current, and are generally manufactured in a package structure in which an LED chip is mounted. It is called "LED element." The LED device as described above is generally mounted on a printed circuit board (hereinafter referred to as 'PCB') and is configured to emit light by receiving a current from an electrode formed on the printed circuit board.

In the LED device, heat generated from the LED chip directly affects the light emitting performance and the lifetime of the LED device. The reason is that heat generated in an LED chip causes dislocations and mismatches in the crystal structure of the LED chip when the LED chip stays in the LED chip for a long time.

Accordingly, in the related art, techniques for promoting the emission of heat generated from the LED chip have been proposed. Among them, instead of mounting the LED chip on the lead frame, a heat sink slug made of a metal material having excellent thermal conductivity is inserted into the package body, and the LED chip is mounted on the heat slug. LED device. Such a conventional LED device is arranged so that the heat dissipation slug is in contact with the PCB, the heat of the LED chip is transferred to the PCB via the heat dissipation slug.

1 is a cross-sectional view showing a LED heat dissipation device according to the prior art.

In the conventional LED heat dissipation device, as shown in FIG. 1, an LED element 10 is arranged on a metal PCB 20, and a heat sink 30 is installed below the metal PCB 20. have.

Here, the LED element 10 has a heat sink (Seat-Slug) (1) formed with a partition wall 2 is formed along the outer circumferential surface and the lead frame (4) on the left and right sides, and the upper surface of the heat radiation slug (1) On the inside of the partition wall 2 of the heat dissipation slug 1 so that the LED chip 3 mounted and connected to the lead frame 4 and the bonding wire 5 and the LED chip 3 are completely embedded. It consists of the formed sealing material 6.

In the metal PCB 20, an insulation layer 22 is formed on a metal plate 21, and a solder pad 23 is formed on the insulation layer 22. .

The heat sink 30 is formed with a flat surface on one side, and a plurality of heat sink fins 31 are integrally formed on the other side.

In the conventional LED heat dissipation device having the above configuration, the heat resistance component involved in LED heat transfer can be expressed as in Equation 1, which is shown in FIG.

[Equation 1]

R _θJS + R _θSB + R _θBA

Here, R _θJS is a thermal resistance between the bottom of the heat dissipation slug 1 at the bottom (LED junction) of the LED chip 3 of the LED element 10, and R _θSB is the heat dissipation slug 1 The bottom is the thermal resistance between the bottom of the metal PCB 20, Bottom, the R _eBA is the bottom of the thermal resistance between the ambient temperature in the bottom of the metal PCB 20. In addition, in FIG. 2, T _J is an LED junction temperature, T _S is a heat radiation slug 1 temperature, T _B is a temperature below the metal PCB 20, and T _A is an ambient temperature.

As shown in Equation 1, the heat resistance component is expressed in three steps, in particular, the thermal conductivity of the insulating layer 22 inside the metal PCB 20 in R _θJS is the heat radiation slug 1 and the metal plate 21. It has a very small value compared to metallic aluminum (Al_190.5 Kcal / mh ° C.) or copper (Cu_338 Kcal / mh ° C.). This causes a thermal bottleneck in the insulating layer 22 and acts as an element that largely impedes heat transfer from the LED chip 3 to the heat sink 30, thereby between the temperature of the LED junction and the heat sink 30. This creates a difference in temperature, which eventually contributes to an increase in the LED junction temperature.

[example]

Aluminum (Al): 190.5 Kcal / mh ℃

Copper (Cu): 338 Kcal / mh ℃

Insulation layer 22 inside metal PCB: within about 7Kcal / mh ℃

In addition, in the conventional LED heat dissipation device, since the heat dissipation path is concentrated on the PCB having high heat resistance, there is a big limitation in increasing the heat dissipation efficiency.

Technical problem to be solved by the present invention to solve the above-mentioned problems, LED lighting that improves the light efficiency and reliability of the LED device by reducing the LED junction temperature by efficiently extracting the heat generated inside the LED device and The present invention provides an LED element and an LED heat dissipation device for efficient heat dissipation of a lamp.

In addition, another technical problem to be achieved by the present invention is to directly array the LED on the heat sink (Heat Sink) rather than the PCB substrate (Heat Sink) to eliminate the thermal resistance generated from the insulating layer of the PCB, thereby reducing the light efficiency of the LED due to heat generation and It is to provide LED devices and LED heat dissipation devices for efficient heat dissipation of LED lights and lamps that have improved lifespan degradation and maximized reliability and energy efficiency.

In addition, another technical problem to be achieved by the present invention is that by pressing the LED element from the top using the PCB substrate to be in close contact with the heat sink, heat transfer is not smooth due to the air gap generated between the LED element and the heat sink. The present invention provides LED devices and LED heat dissipation devices for efficient heat dissipation of LED lights and lamps.

In addition, another technical problem to be achieved by the present invention is to provide an LED socket device that reduces the manufacturing cost by configuring the LED element and the LED heat dissipation device integrally with the drive circuit.

In addition, another technical problem to be achieved by the present invention is to provide an LED socket device that is easy to install and replace, and improved brightness and life time by using a lamp or LED luminaire installed in the existing street light.

In addition, another technical problem to be achieved by the present invention is to provide an LED socket device that can be applied to any device or product using the LED, including a lamp of a street lamp, a lamp of a house or a building, a car, a signal lamp, and the like.

As a means for solving the above-described technical problem, the invention according to claim 1 includes: a heat dissipation slug formed with a recessed LED mounting portion in the center, and at least one through hole formed in the LED mounting portion; An LED chip installed on an upper surface of the LED mounting unit; The electrode is located at the top of the through hole of the LED mounting portion, the pin integrally connected with the head portion is bent in parallel to the outside of the heat dissipation slug through the through hole, and then again bent vertically parallel to the side of the heat dissipation slug Pins; An insulating film formed between the heat dissipating slug and the electrode pin; An insulating plate formed on a lower surface of the electrode pin disposed in parallel to a lower portion of the heat dissipating slug; A bonding wire connecting the LED chip to the head of the electrode pin; And a light-transmitting encapsulant for sealing the upper portion of the LED mounting portion.

The invention according to claim 2, wherein the insulating film and the insulating plate are: Low Temperature Co-fired Ceramic (LTCC) or High Temperature Co-fired Ceramic (HTCC). LED element characterized in that formed.

The invention according to claim 3 provides "The LED element according to claim 1, wherein the heat dissipation slug has a rectangular shape. ''

The invention according to claim 4 provides "The LED element according to claim 1, wherein the heat dissipation slug is composed of one of metal materials including copper (Cu) and aluminum (Al). ''

The invention according to claim 5 provides "The LED element according to claim 1, wherein the electrode pin is composed of one of metal materials including copper (Cu)."

In addition, as a means for solving the above-described technical problem, the invention according to claim 6, "In the LED heat dissipation device, a flat surface is formed on the upper surface and a plurality of heat dissipation fins formed on the lower surface; The LED element of any one of Claims 1-5 provided in the upper surface of the said heat sink; And a PCB board having an electrode pin of the LED device inserted into a pin insertion hole, and an end of the electrode pin connected to a printed circuit pattern and a solder point formed on an upper surface thereof and fastened and fixed to a screw with the heat sink to be spaced apart from the heat sink. LED heat radiation device. "

The invention according to claim 7 provides the LED heat dissipation device according to claim 6, wherein the heat dissipation plate is composed of one of metal materials including copper (Cu) and aluminum (Al).

In addition, as a means for solving the above-described technical problem, the invention according to claim 8, "In the LED socket, a body portion having a semi-cylindrical shape in which some surfaces are cut in the longitudinal direction; A socket part formed at one side of the body part; An LED substrate installed inside the body portion and having the LED element heat dissipation device according to claim 6; And a reflection shade installed on the cut surface of the body and extending in a length direction to expose the LED of the LED substrate to the outside through a plurality of holes.

Moreover, as a means for solving the above-mentioned technical subject, invention of Claim 9 is "the LED socket WHEREIN: The body part which has a cylindrical shape; A socket part formed at one side of the body part; An LED substrate installed in the body portion and having an LED heat dissipation device according to claim 6; And a reflection shade installed at the other side of the body and exposing the LED of the LED substrate to the outside through a plurality of holes.

In addition, as a means for solving the above-described technical problem, the invention according to claim 10, "In the LED socket, a light-transmitting body portion having a cylindrical shape in which part of the surface is cut in the longitudinal direction; Electrode terminals formed at one side and the other side of the body portion; And an LED substrate provided on the cut-out surface of the body portion such that an LED is positioned inside the body portion and a heat dissipation fin is located outside the body portion, and the LED heat dissipation device according to claim 6 is provided. to provide.

The invention according to claim 11 provides "The LED socket according to claim 8 or 9, wherein the reflection shade is formed in a plane.

The invention according to claim 12 provides "the LED socket according to claim 8 or 9, wherein the reflection shade is formed in an elliptical shape.

The invention according to claim 13, "The LED socket according to any one of claims 8 to 10, wherein the LED socket is configured in an LED luminaire or an apparatus including a street light, a light, an automobile, a signal lamp, and the like. To provide.

According to the present invention, by removing the PCB acting as a heat resistance component between the LED and the heat sink to efficiently transfer the heat generated when driving the LED to the outside, reducing the light efficiency caused by the LED heat generation and shortening the LED lifespan phenomenon It is possible to maximize the reliability and energy efficiency of the product.

In addition, by pressing the LED elements arrayed directly on the heat sink using a PCB to ensure that the heat sink (Seat-Slug) of the LED device is in close contact with the heat sink (Heat Sink), the lift generated between the LED element and the heat sink (Air Gap) due to the phenomenon that the heat transfer is not smooth it can improve the effect.

In addition, the LED element and the LED heat dissipation device may be integrated with the driving circuit to reduce the manufacturing cost.

In addition, by using in place of the lamp or LED luminaires existing in the street light, it is easy to install and replace, there is an effect that can improve the brightness and life time.

In addition, there is an effect that can be used for all devices and products that use LEDs, including lamps of street lights, lamps of houses and buildings, automobiles, traffic lights, and the like.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Hereinafter, with reference to the accompanying drawings for the specific technical content to be carried out in the present invention will be described in detail and clearly.

Example of LED Device (Package)

3 is a plan view, a side view, and a sectional view of an LED device according to a preferred embodiment of the present invention.

As shown in FIG. 3, the LED device 100 of the present invention includes a heat dissipating slug 101 having a concave LED mounting portion 102 formed at the center thereof, and at least one through hole formed at the LED mounting portion 102. In addition, the LED chip 103 installed on the upper surface of the LED mounting portion 102, and the head portion is located in the upper portion of the through hole of the LED mounting portion 102, the fins connected integrally with the head portion is the heat radiation through the through hole Between the electrode fins 104 bent in parallel to the outside of the slug 101 and then bent vertically in parallel to the side of the heat dissipation slug 101, between the heat dissipation slug 101 and the electrode pins 104. The insulating film 105 formed thereon, the insulating plate 108 formed on the lower surface of the electrode fin 104 provided in parallel with the heat dissipation slug 101, and the LED chip 103 and the electrode fin 104. Bonding wire 106 for connecting the head portion, and light-transmitting sealing the upper portion of the LED mounting portion 102 The sealing material 107 is included.

Here, the heat dissipation slug 101 has a rectangular shape, and the LED mounting portion 102 is formed in a circular concave shape at the center. In addition, at least one through hole penetrating the lower surface of the heat dissipation slug 101 is formed in the LED installation unit 102. In FIG. 3, the electrode pin 104 is inserted into two through holes.

The LED mounting portion 102 is formed to be concave with an oblique angle from an upper surface of the heat dissipation slug 101, and the bottom surface 102 is formed to be flat so that the LED chip 103 can be installed. Looking at the heat dissipation slug 101 in cross section, the LED mounting portion 102 has an inverted trapezoidal shape as shown in FIG.

The heat dissipation slug 121 is formed in the LED installation portion 102 is concave, so the outer edge portion of the LED cap does not need to form a separate partition or LED cap.

The heat dissipating slug 101 is preferably made of copper (Cu) or aluminum (Al), but may be configured using other metal materials. In addition, the heat dissipating slug 101 has a rectangular shape as shown in FIG. 3 but may be formed in a circular shape, and may be formed in other shapes besides a square and a circular shape. Likewise, the LED installation unit 102 also has a circular shape in FIG. 3 as an example, but may be formed in other shapes in addition to the circular shape.

The LED chip 103 is provided in the LED mounting portion 102 of the heat dissipating slug 101, and the head portion of the electrode pin 104 is provided on the through holes formed on both sides of the LED chip 103. . The electrode pin 104 is bent in parallel with the head portion is bent in parallel to the outside of the heat dissipation slug 101 through the through hole and then again bent vertically parallel to the side of the heat dissipation slug 101 again. It has a stylized shape. In this case, the electrode pin 104 is preferably formed of copper (Cu), but may be formed using a conductor material other than copper (Cu).

An insulating film 105 is formed between the heat dissipating slug 101 and the electrode fin 104 for insulation, and an insulating plate is formed on the bottom surface of the electrode fin 104 disposed in parallel to the lower part of the heat dissipating slug 101. 108 is formed. The insulating film 105 and the insulating plate 108 may be formed of an insulator material including a low temperature co-fired ceramic (LTCC) or a high temperature co-fired ceramic (HTCC). Each is formed.

A bonding wire 106 is connected between the LED chip 103 and the head of the electrode pin 104, and a light-transmissive encapsulant 107 is sealed on the LED mounting part 102. .

The encapsulant 107 is made of a light transmissive material that transmits light generated by the LED chip 103 to the outside, and emits light generated by the LED chip 103 to the outside. It acts as a lens.

Example of LED heat dissipation device

4 is a cross-sectional view of the LED heat dissipation device according to a preferred embodiment of the present invention, Figure 5 is a plan view and a cross-sectional view of the LED heat dissipation device shown in FIG.

As shown in FIGS. 4 and 5, the LED heat dissipation device includes a heat sink 120 having a top surface 121 formed on a flat surface and a plurality of heat sink fins 123 formed on the bottom surface 122. And, the LED element 100 shown in FIG. 3 and the electrode pin 104 of the LED element 100 is provided in the pin insertion hole 131 is installed on the top surface 121 of the heat sink 120 and the electrode pin An end of the 104 is connected to the printed circuit pattern (not shown) formed on the upper surface and the solder point 132 and fastened to the heat sink 120 by a screw (Screw: 133) and spaced apart from the heat sink 120. The substrate 130 is included.

Here, the heat dissipation plate 120 serves to radiate heat generated by the LED element 100 to the outside through the heat dissipation fin 123, and a plurality of heat dissipation fins 123 are formed vertically on the bottom surface 122. The upper surface is formed in the flat surface. At this time, the heat sink 120 is preferably made of copper (Cu) or aluminum (Al) material, but may be configured using another metal material.

The LED device 100 is directly installed on the top surface 121 of the heat sink 120.

As described with reference to FIG. 3, the LED element 100 includes a heat sink slug 101 having a recessed LED mounting portion 102, an LED chip 103, an electrode pin 104, and an insulating film. Isolator Layer: 105, Bonding Wire: 106, Encapsulant 107, and the like.

The PCB substrate 130 has a pin insertion hole 131 and a screw hole (not shown) through which the electrode pin 104 of the LED device 100 is inserted. In this case, the pin insertion hole 131 is preferably formed at the solder point of the printed circuit board formed on the upper surface of the substrate. In addition, the PCB substrate 140 includes both a conductive substrate and a non-conductive substrate such as a copper (Cu) substrate having a circuit pattern (not shown) formed on the top or both surfaces thereof.

The PCB substrate 130 installs the LED element 100 on the heat sink 120, and then installs a pin insertion hole 131 into the electrode pin 104 of the LED element 100, and then installs the screw hole ( The screw 133 is inserted into and fixed to the heat sink 120. At this time, the PCB substrate 130 is installed on the electrode pin 104 and the insulating plate 108 in the lower portion of the LED device 100, as shown in Figure 4, spaced apart from the heat dissipation fin 123 at a predetermined interval It is installed in a state.

The LED heat dissipation device of the present invention having the above configuration allows the heat generated from the LED chip 100 to be directly radiated to the heat dissipation plate 120 installed at the bottom, thereby improving the light efficiency degradation and the life deterioration phenomenon of the LED due to heat generation. .

That is, in the present invention, in order to reduce the thermal bottleneck of the insulating layer of the PCB, the LED device 100 is directly arrayed on the heat sink 120 and the PCB substrate 130 is disposed on the LED device 100. By installing on the electrode pin 104 and the insulating plate 108 of, the existing LED heat dissipation device to remove the PCB 20 existing between the LED element (10 in FIG. 1) and the heat sink 30. In addition, by pressing the LED device 100 in close contact with the PCB substrate 130 from above, heat transfer is not smooth due to the air gap generated between the LED device 100 and the heat sink 120. Improvements were made.

Heat resistance of the LED radiator

6 is a heat resistance configuration diagram of the LED heat dissipation device shown in FIG.

In the LED heat dissipation device of the present invention, the heat resistance component involved in LED heat transfer may be expressed as in Equation 2.

[Equation 2]

R _θJS + R _θSA

Here, R _θJS is a thermal resistance between the heat dissipation slug 121 at the LED junction (junction), R _θSA is a heat resistance between the ambient temperature in the heat dissipation slug 121. In addition, in FIG. 4, T _J is an LED junction temperature, T _S is a heat radiation slug temperature, and T _A is an ambient temperature.

As shown in Equation 2, unlike the conventional LED heat dissipation device, it can be seen that there is no R _{θ SB which} is a heat resistance component generated in the PCB (metal PCB).

Example of LED Socket

7 and 8 are a plan view and a side view of the LED socket according to the present invention.

As shown in FIG. 7 and FIG. 8, the LED socket 200 of the present invention includes an LED substrate (not shown) having the LED element heat dissipation device (FIG. 4), and a body portion in which the LED substrate is installed. 201, a socket 202 installed on one side of the body 201, and a reflection shade 204 installed on the body 201 to expose the LED 130 of the LED substrate to the outside. .

The body portion 201 has a semi-cylindrical shape in which some surfaces are cut in the longitudinal direction, the reflection shade 204 is installed on the cut surface, and the LED substrate is installed inside the reflection shade 204, The socket portion 202 is formed on one side of the body portion 201 in the longitudinal direction. At this time, the socket portion 202 has a male screw is formed on the outer peripheral surface and the connecting portion 203 for electrical connection is formed at the end.

The reflection shade 204 is for reflecting down the light generated by the LED, it is preferable to be composed of a metal material that reflects light well, such as stainless. The reflection shade 204 is formed with a plurality of holes for fitting the LED.

The reflection shade 204 is formed in a plane as shown in FIG. 8, but may be configured by forming the reflection shade 204 in an elliptical shape.

Another embodiment of an LED socket

The LED socket of the present invention includes a cylindrical body portion, a socket portion formed on one side of the body portion, a reflection shade provided on the other side of the body portion, and the LED heat dissipation device (FIG. 4) installed inside the reflection shade, It can also be shaped like a light bulb.

Another embodiment of an LED socket

LED socket of the present invention is a cylindrical body portion of the cut portion in the longitudinal direction, the electrode pad formed on one side and the other side of the body portion, the LED is located inside the body portion so that the heat radiation fin is located outside the body portion It is also provided with a LED substrate provided on the cut surface of the body portion, it may be configured in the shape of a fluorescent lamp.

Example of LED Street Light

9 and 10 are views showing the state of the street lamps with the LED sockets of the present invention viewed from the side and the bottom, respectively.

As shown in FIG. 9, the LED socket 200 of the present invention may be installed by inserting the socket into the lamp 300 of the street lamp. In FIG. 10, reference numeral 310 denotes a transparent cap.

LED Characteristics Comparison

11 is a view showing a comparison of the characteristics of the conventional LED lamp and the LED socket of the present invention installed in the street light.

As shown in Fig. 11, a conventional LED lamp (3rd party product) has a total circuit efficiency of 86% and an LED heat generation temperature of 104 ° C, whereas the LED socket (lamp) of the present invention has a total circuit efficiency of 90% and , LED exotherm temperature was found to be 55 ℃.

In addition, the conventional LED lamp has a LED lamp and the SMPS is composed of a separate type, and the circuit configuration is complicated, the manufacturing cost is expensive and the installation is complicated, but the LED socket of the present invention is composed of an LED lamp and a driving circuit integrally The simple circuit configuration has the advantages of low manufacturing cost and simple installation.

In addition, the conventional LED lamp has an LED life of 50,000 hours or more, a circuit life of 30,000 hours or less, and a real lamp life of 30,000 hours or less, but the LED socket of the present invention has an LED life of 80,000 hours or more (ultra precision blanket heat dissipation), and a circuit life. Over 80,000 hours, seal lamp life has been greatly improved to over 80,000 hours.

LED street light replacement

12 is a view for explaining a problem when replacing the conventional halogen street light and the conventional LED street light, Figure 13 is a view for explaining a method for replacing the conventional halogen street light with the LED socket of the present invention.

As shown in Figure 12, when replacing the existing halogen street light with a conventional LED street light, because the entire luminaire needs to be replaced, the manufacturing cost and installation cost is high, there is a complex and difficult installation.

However, the present invention is not only easy and easy to install, but also does not need to replace the entire luminaire as the LED socket is inserted into the luminaire 300 of the street lamp. In addition, the LED lamp and the driving circuit are integrally formed, and the heat dissipation of the LED is directly transmitted to the heat dissipation plate through the PCB, thereby greatly improving the life and efficiency of the LED (see FIG. 13).

As described above, the LED heat dissipation device according to the present invention arrays the LEDs directly on a heat sink rather than a PCB substrate to remove heat resistance components generated from the insulation layer of the PCB, thereby degrading the light efficiency of the LED due to heat generation and lifespan. By improving the fall phenomenon, the technical problem of the present invention can be solved.

In addition, the LED socket according to the present invention can solve the technical problem of the present invention by forming the LED element and its LED heat dissipation device integrally with the drive circuit and formed as a socket for easy installation and replacement.

Preferred embodiments of the present invention described above are disclosed to solve the technical problem, and those skilled in the art to which the present invention pertains (man skilled in the art) various modifications, changes, additions, etc. within the spirit and scope of the present invention. It will be possible to, and such modifications, changes, etc. will be considered to be within the scope of the following claims.

LED device of the present invention and its heat dissipation device can be applied to any device or product using the LED.

In addition, the LED element and the LED socket using the heat dissipation device of the present invention can be applied to any device or product using the LED, including a lamp of a street lamp, a lamp of a house or a building, a car, a signal lamp and the like.

1 is a cross-sectional configuration of a LED heat dissipation device according to the prior art

2 is a heat resistance configuration diagram of the LED heat dissipation device shown in FIG.

3 is a plan view, side view, and cross-sectional view of an LED device according to a preferred embodiment of the present invention;

Figure 4 is a cross-sectional view of the LED heat dissipation device according to a preferred embodiment of the present invention

5 is a plan view and a cross-sectional view of the LED heat dissipation device shown in FIG.

6 is a heat resistance configuration diagram of the LED heat dissipation device shown in FIG.

7 and 8 are a plan view and a side view of the LED socket according to the present invention

9 and 10 are views showing a state in which the LED socket of the present invention is installed from the side and the side of the street lamp respectively;

11 is a view showing a comparison of the characteristics of the conventional LED lamp and the LED socket of the present invention installed on a street lamp

12 is a view for explaining a problem when replacing the conventional halogen street light and the conventional LED street light.

13 is a view for explaining a method of replacing the conventional halogen street light with the LED socket of the present invention.

[Description of Code for Major Parts of Drawing]

100: LED package (101): Heat dissipation slug (Heat Sink-Slug)

102: LED installation unit 103: LED chip

104: electrode pin 105: insulating film

106: bonding wire 107: sealing material

108: insulation plate 120: heat sink

121: upper surface 122: lower surface

123: Heat Sink Pin 130: PCB Board

131: screw hole 132: solder point

133: Screw 140: LED

200: LED socket 201: body

202: socket portion 203: connection portion

204: reflection shade 300: street lamp

310: transparent cap

Claims (13)

In the LED device, A heat dissipation slug having a concave LED mounting portion formed in the center thereof, and at least one through hole formed in the LED mounting portion; An LED chip installed on an upper surface of the LED mounting unit; The electrode is located at the top of the through hole of the LED mounting portion, the pin integrally connected with the head portion is bent in parallel to the outside of the heat dissipation slug through the through hole, and then again bent vertically parallel to the side of the heat dissipation slug Pins; An insulating film formed between the heat dissipating slug and the electrode pin; An insulating plate formed on a lower surface of the electrode pin disposed in parallel to a lower portion of the heat dissipating slug; A bonding wire connecting the LED chip to the head of the electrode pin; And A light-transmissive encapsulant sealing the upper portion of the LED mounting portion; LED device comprising a. The method of claim 1, wherein the insulating film and the insulating plate is: LED element characterized by being formed of Low Temperature Co-fired Ceramic (LTCC) or High Temperature Co-fired Ceramic (HTCC). The heat dissipation slug of claim 1 wherein: An LED device having a rectangular shape. The heat dissipation slug of claim 1 wherein: LED device, characterized in that composed of one of a metallic material including copper (Cu) and aluminum (Al). The method of claim 1, wherein the electrode pin is: LED device, characterized in that composed of one of a metallic material containing copper (Cu). In the LED radiator, A heat sink having a flat surface formed on an upper surface thereof and a plurality of heat dissipation fins formed on a lower surface thereof; The LED element of any one of Claims 1-5 provided in the upper surface of the said heat sink; And A PCB substrate in which an electrode pin of the LED device is inserted into a pin insertion hole and an end of the electrode pin is connected to a printed circuit pattern and a solder point formed on an upper surface thereof and fastened and fixed to a screw with the heat sink to be spaced apart from the heat sink; LED heat dissipation device comprising a. The heat sink of claim 6 wherein: LED heat dissipation device, characterized in that composed of one of the metal materials including copper (Cu) and aluminum (Al). LED socket, A body portion having a semi-cylindrical shape in which some surfaces are cut in the longitudinal direction; A socket part formed at one side of the body part; An LED substrate installed inside the body portion and having the LED element heat dissipation device according to claim 6; And A reflection shade installed on the cut surface of the body in a length direction and exposing the LED of the LED substrate to the outside through a plurality of holes; LED socket comprising a. LED socket, A body portion having a cylindrical shape; A socket part formed at one side of the body part; An LED substrate installed in the body portion and having an LED heat dissipation device according to claim 6; And A reflection shade installed at the other side of the body part to expose the LED of the LED substrate to the outside through a plurality of holes; LED socket comprising a. LED socket, A light-transmissive body portion having a cylindrical shape in which some surfaces are cut in the longitudinal direction; Electrode terminals formed at one side and the other side of the body portion; And An LED substrate disposed inside the body portion and installed on a cut surface of the body portion such that a heat dissipation fin is located outside the body portion, the LED substrate having an LED heat dissipation device according to claim 6; LED socket comprising a. 10. The method according to claim 8 or 9, The reflector is an LED socket, characterized in that formed in the plane. 10. The method according to claim 8 or 9, The reflector is an LED socket, characterized in that formed in the oval. The method according to any one of claims 8 to 10, The LED socket is an LED socket, characterized in that configured in the LED luminaire or device including a street light, electric light, automobile, traffic lights.

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