KR20160146238A - hexagon LED module - Google Patents

hexagon LED module

Info

Publication number
KR20160146238A
KR20160146238A KR1020150083228A KR20150083228A KR20160146238A KR 20160146238 A KR20160146238 A KR 20160146238A KR 1020150083228 A KR1020150083228 A KR 1020150083228A KR 20150083228 A KR20150083228 A KR 20150083228A KR 20160146238 A KR20160146238 A KR 20160146238A
Authority
KR
South Korea
Prior art keywords
led chip
led
electrode pattern
package
line
Prior art date
Application number
KR1020150083228A
Other languages
Korean (ko)
Other versions
KR101753120B1 (en
Inventor
최원희
Original Assignee
주식회사 트루스타
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 트루스타 filed Critical 주식회사 트루스타
Priority to KR1020150083228A priority Critical patent/KR101753120B1/en
Publication of KR20160146238A publication Critical patent/KR20160146238A/en
Application granted granted Critical
Publication of KR101753120B1 publication Critical patent/KR101753120B1/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Abstract

The present invention relates to a hexagonal LED module in which LED chips can be arranged in series or in parallel so that the desired number of LED chips can be cut and used in accordance with the output of the lamp, and radiance efficiency of LED chips is improved. The present invention relates to a hexagonal LED module applicable to various types of LED lamps ranging from a small bulb type lamp to a special large-sized factory LED lamp.

Description

Hexagon LED module {hexagon LED module}

The present invention not only improves heat dissipation characteristics of the LED chip, but also can arrange the LED chips in series or in parallel so that a desired number of LED chips can be cut and used according to the output of the lamp, To a hexagonal LED module.

The present invention also relates to a hexagonal LED module applicable to various types of LED lamps, such as a spherical lamp, because it can be bent and used according to the structure of a lamp.

LED lamps are lighting devices using LEDs that emit high-brightness light with low power. They are used in backlighting of TVs and various lighting means, and are attracting attention as next-generation lighting.

Fluorescent lamps contain fluorescent substances, and when they are disposed of, these fluorescent substances cause environmental pollution. Recently, the use of fluorescent lamps has been regulated. Accordingly, LED lamps in the form of fluorescent lamps are being developed.

When the forward voltage is applied to the LED for the lamp, the energy of the electrons generated by the electromagnetic induction is generated as the light energy and the thermal energy. At this time, the two are in inverse proportion to each other As a result, the generation of photons can be increased depending on how quickly the heat generated inside the LED is removed.

LEDs have characteristics that maximize light output and optical efficiency when maintaining an active temperature of about 25-55 degrees Celsius, and can maintain durability. That is, other than the heat required for proper electron activation, photon generation is reduced, and the excessive amount of current due to heat lowers the bonding force of the atomic structure, and the LED is destroyed. This heat generation problem occurs when a high-brightness, high-power LED is manufactured for use as an illumination, and it is necessary to design the LED so that heat other than the heat required for the electronic activity can be rapidly discharged.

Various technologies have been developed to solve such problems, and examples thereof are Patent Documents 1 to 3.

Most conventional LEDs are undergoing package design to solve the heat dissipation problem described above, and the high-wattage LED thus manufactured is referred to as a power LED.

Typically, LEDs are made up of LED chips or packages mounted on a PCB. In this conventional LED, a current is inputted to the positive electrode of the LED chip through the thin copper foil circuit layer of the PCB, and outputted to the minus (-) electrode through the LED chip to emit light. At this time, the thin copper-clad circuit layer of the PCB can not increase the current-carrying property of the copper foil, so that the current resistance generated from the LED chip and the circuit and the heat generated simultaneously with the generation of photons from the chip are transmitted to the heat sink In addition, since the heat radiation method is indirectly carried out to emit light, the heat dissipation can not be performed effectively compared to the generated heat, so there is a limit to implement the power LED.

In addition, a conventional LED module for a lamp (COB or PCB) is made by mounting a plurality of LEDs on a single PCB (PCB) through an SMT process. At this time, many heavy metals (lead) and pollutants (pollutants such as sulfuric acid generated during the corrosion process) are discharged. And it is difficult to control the output of the LED module. That is, since the shape and output of the LED module (PBA) made of the conventional PCB are already determined, it is necessary to fabricate the LED module (PBA) having the desired shape and output again in order to manufacture the lamp having different shapes and outputs, The development of modules (PBA) takes a lot of time and money. In addition, there is a disadvantage that the remaining LED module (PBA) which is left in the production discontinuance of the product is inevitably discarded.

In addition, the conventional LED module is formed by installing a plurality of LED chips on a rigid circuit board, and it has a disadvantage in that various types of lamps can not be manufactured when a lamp is manufactured due to insufficient bending properties.

Further, the conventional LED module (PBA) has a hard flat board shape, which makes it difficult to manufacture a lamp having a curvature such as a sphere or an ellipse.

1. Korea Patent No. 0997172 2. Korean Patent Registration No. 1060462 3. Korean Patent Publication No. 2011-0051071

SUMMARY OF THE INVENTION It is an object of the present invention to provide a hexagonal LED module capable of improving heat dissipation characteristics, stabilizing a light source, preventing a voltage drop, and obtaining a high output.

Further, according to the present invention, an LED chip unit may be repeatedly formed in a honeycomb shape, expanded in a honeycomb shape in accordance with the shape and purpose of a lamp to be produced, and disposed adjacently to each other to easily produce a lamp having a spherical or oval- And to provide a hexagonal-flip LED module.

Another object of the present invention is to provide a hexagonal LED module in which an electrode pattern (lead package) for supplying power to the LED chip can serve as a heat sink, thereby enhancing heat dissipation effect, thereby minimizing power consumption and maintaining maintenance. do.

According to an aspect of the present invention, there is provided a hexagonal LED module including: an electrode pattern made of a conductive material; an LED chip fixed to a plurality of LED chip fixing parts formed on the electrode pattern; and a reflector, Wherein the electrode pattern has a feed line formed at a center between a plurality of LED chip fixing portions, a ground line formed at an outer edge of the LED chip fixing portion, And a package coupling bend portion that is bent toward the front surface of the electrode pattern and buried in the package is formed, and at least one package coupling hole is formed in the package coupling bend portion and the LED chip mounting portion, The bottom surface of the package is prevented from protruding to the back surface of the electrode pattern, So that the heat dissipation can be performed quickly.

It is preferable that a virtual cutting line is formed across each of the feed lines and the ground line so that a part of the electrode pattern can be cut as necessary.

The LED chips may be connected in parallel or in series with neighboring LED chips.

The package may be made of an insulating material, and the electrode pattern and the package may be combined by an insert injection molding method.

The electrode pattern includes six LED chip fixing parts arranged in a radial fashion around a central power supply line so that a plurality of LED modules can be installed adjacent to each other, The LED modules are connected to each other in the manufacturing process and are connected to each other so that they can be separated. After the LED modules are mounted on the outer sides of the LED modules on both sides of the LED modules, A lead line is formed to allow the LED chip to be installed while pulling the electrode pattern.

As described above, the hexagonal LED module according to the present invention maximizes the cross-sectional area of the electrode pattern for mounting the LED chip, so that the voltage drop and the heat generated in the LED chip can be dissipated in the shortest time.

In addition, the present invention maximizes the cross-sectional area of the electrode and minimizes the resistance to smooth the flow of electrons flowing through the electrode pattern, thereby improving the flow of electrons and maximizing the surface resistance generated on the surface of the LED chip, There is an advantage that the descent can be minimized.

Further, according to the present invention, since the electrode pattern is in direct contact with the LED chip in a large area, the cross-sectional area of the positive electrode of the LED chip is increased, and the thermal balance between the LED chip and the positive electrode is rapidly performed, And the resistance of the LED chip is stabilized and the current is stabilized. Accordingly, it is possible to easily implement the driving by the constant current in the designing of the converter.

Further, according to the present invention, it is possible to form a virtual cut line in an electrode pattern, to separately use only a desired number of LED chip packages, and to form a coupling hole in an electrode pattern between a plurality of LED chips, The module can be expanded to a honeycomb shape, and an LED lamp of a desired shape and output can be manufactured as needed.

In addition, the hexagonal LED module has a structure that can be directly coupled to the PCB or the body of the lighting or the heat sink by soldering, bolt, or rivet, so that it is easy to assemble and simplify the process.

In addition, the hexagonal LED module according to the present invention utilizes a lead package necessary for a semiconductor manufacturing process as an electrode pattern and a heat sink, thereby achieving not only electrical stability but also excellent heat radiation effect. Because it can be assembled directly, it is more cost effective than conventional LED lighting, and is an eco-friendly method that does not emit pollutants.

1 is a perspective view of an example of a hexagonal LED module according to the present invention;
2 is a perspective view of another example of a hexagonal LED module according to the present invention.
3 is a perspective view of an example of an electrode pattern constituting a hexagonal LED module according to the present invention.
4 is a plan view of an example of a hexagonal LED module according to the present invention.
5 is an enlarged cross-sectional view of a part of a hexagonal LED module according to the present invention.
6 is a plan view showing a state in which LED chips of the hexagonal LED module according to the present invention are connected in parallel to each other
7 is a plan view showing a state in which LED chips of a hexagonal LED module according to the present invention are connected to each other in series;
8 is a plan view of another example of the hexagonal LED module according to the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Like reference numerals are used for like elements in describing each drawing. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The present invention not only improves heat dissipation characteristics of heat generated from the LED chip but also arranges the LED chips in series or parallel so that the desired number of LED chips can be cut and used according to the output of the lamp.

In addition, since the electrode pattern has a hexagonal shape, it is easy to manufacture spherical or circular lamps by assembling.

First, although the LED chip 20 described below is shown as a plurality of LED chips in the drawing, it may be one LED chip, hereinafter collectively referred to as an LED chip.

As shown in FIGS. 1 and 8, the hexagonal LED module 1 according to the present invention includes a plurality of LED chips 20 provided in a long strip-shaped hexagonal electrode pattern 10, A package 30 is provided so that the light emitting diode 20 and the LED chip are connected.

That is, as shown in FIG. 4, the electrode pattern 10 has a hexagonal shape in the plan view, six LED chips 20 are radially provided around the center of the hexagonal electrode pattern, A package 30 is provided to enclose the chip.

The package 30 is connected to a package installed on a neighboring LED chip, as shown in the figure.

As shown in FIGS. 1 and 8, the hexagonal LED module 1 can be assembled into a plurality of electrode patterns 10 in the manufacturing process. For this purpose, each of the electrode patterns 10 has a plurality of The hexagonal LED module 1 is formed in a multi-row structure so that the hexagonal LED module 1 can be installed adjacently. In the manufacturing process, the adjacent hexagonal LED module 1 is manufactured in a connected state, A continuous supply lead line 14 formed at a predetermined distance from the trailing hole 14h or outside of the LED module arranged at the center edge of the LED modules 1 in a plurality of rows, So that the LED chip can be installed while pulling the electrode pattern.

1 and 8, the electrode pattern 10 is made to be able to fabricate the multi-row LED module 1, and the electrode pattern 10 is extended in the longitudinal direction, and the continuous supply lead line 14 are pulled and pulled toward the side of the LED chip 20 by an interval at which the LED chip 20 is installed, thereby installing the LED chip.

As shown in Fig. 1, the LED module 1 thus formed is in a state in which multiple heaters are connected to each other, and by cutting the connecting portion 13 located between the LED modules, As described above, the LED module 1 having the LED chip 20 arranged in hexagonal shape is made.

1 and 8 show an example in which one hexagonal LED module 1 has LED chips 20 in six LED packages and six LED modules 1 are installed in one electrode pattern, The number of modules 1 may be further varied.

The electrode pattern 10 is made of a metal material having excellent electrical conductivity and thermal conductivity. The electrode pattern 10 is provided with six LED chip fixing portions 10f on which the LED chips are mounted, and the center between the LED chip fixing portions 10f A ground line 11 is formed on the outside of the LED chip fixing portion 10f and a cutting line 10c is formed between each LED module so that a part of the cutting line As shown in Fig.

That is, the ground lines 11 are integrally connected to the outside of the plurality of LED chip fixing portions 10f to form a hexagonal shape as a whole. The LED chip fixing portion 10f surrounds the feeding line 12 at the center, One or more of these will be installed.

6 and 7, the feeding line 12 is connected to the grounding line 11 in the connecting portion 13. When the LED module is completed, the connecting portion 13 is cut to form a feed line The ground line is electrically short-circuited.

As described above, the LED module according to the present invention includes the package 30.

The package 30 protects the LED chip and not only collects the light generated from the LED chip in one direction, but also reinforces the LED module itself.

The electrode pattern 10 of the present invention not only serves to supply power to the LED chip 20 but also functions as a heat sink for emitting heat generated from the LED chip 20, It is desirable to be able to emit heat absorbed by the electrode pattern 10 more quickly and efficiently.

Accordingly, it is preferable that the package 30 covers at least a part of the electrode pattern 10 as much as possible. When the electrode pattern 10 is installed in the lamp, the electrode pattern 10 is brought into direct contact with the heat dissipating means, so that the heat dissipation efficiency can be increased. A method of fixing the electrode pattern to the heat dissipating means may be a bolt tightening method or soldering (SMT).

As shown in FIG. 5, the package 30 may be formed to cover only the front surface of the electrode pattern 10. In order to allow the package 30 to cover only the front surface of the electrode pattern, a fixing means for fixing the package 30 to a part of the electrode pattern is required.

3 and 5, the fixing means is bent toward the front surface of the electrode pattern 10 at an end opposite to the LED chip fixing portion 10f of the feeding line 12, and is formed to be embedded in the package 30 And the package joint bent portion 12b.

As shown in FIG. 5, the package bonding bend portion 12b is embedded in the package 30 to prevent the package from being separated from the electrode pattern.

In addition, at least one package coupling hole 12h is formed in the package coupling bend portion 12b and the LED chip fixing portion 10f so that a part of the package 30 fits into the package coupling hole 12h and is buried So that the package is not removed.

Since the package 30 is fixed to the electrode pattern by the package coupling bend portion 12b and the package coupling hole 12h as described above, the back surface of the package does not protrude to the back surface of the electrode pattern, and the back surface of the electrode pattern contacts the heat sink So that the heat radiation efficiency is improved.

The package 30 may be integrated into the electrode pattern by various methods, but it is preferably combined with an insert injection molding method. That is, after the electrode pattern is inserted in the package forming process, the material of the package is supplied so that the electrode pattern is buried in the package.

The hexagonal LED module 1 according to the present invention configured as described above naturally requires wiring for supplying power to the LED chip 20.

A variety of wiring methods can be used, but it is preferable to connect the feed line and / or the ground line by wire bonding.

The hexagonal LED module 1 according to the present invention can be installed in one electrode pattern 10 as described above and can select and cut out one or more LED modules 1 so that a desired output can be obtained. Can be used.

The LED chips 20 installed in the respective LED modules 1 may be connected in parallel and / or in series through the LED chips 20 and the feeder lines.

FIG. 6 shows an example in which neighboring LED chips 20 are connected in parallel. One terminal of the LED chip 20 is connected to the feed line 12 and the other terminal is connected to the ground line 11 so that all of the LED chips 20 are connected to each other in series, When the terminals of the LED chip are connected to the ground line 11, the plurality of LED chips 20 are connected in parallel to each other between the feed line and the ground line.

FIG. 7 shows an example in which neighboring LED chips 20 are connected in series. As shown in the drawing, the two terminals of the LED chip 20 are connected to the two feeding lines 12 so that a plurality of LED chips are connected in series by the feeder line, When a power supply is connected between the lines 11, a plurality of LED chips are connected in parallel between the wiring made up of the feed line 12, the wire 40, and the feed line 12 and the wiring made up of the ground line 11 .

FIGS. 1 and 8 show the hexagonal LED modules 1 according to the present invention arranged in different shapes.

As shown in FIG. 1, a plurality of LED modules 1 are arranged adjacently to neighboring modules, and are arranged so that the corner portions of the hexagons are in contact with each other when viewed from a plane. FIG. .

When a plurality of LED modules are arranged, a cutting line 10c is formed between neighboring modules, and after the fabrication of the LED module is completed, the cutting lines can be cut and used as individual modules.

Further, as shown in Fig. 1, a coupling hole 12c can be further formed in each of the feed lines 12. Fig. The engaging hole 12c is a hole for engaging with a device such as a heat sink, a PCB, or a package of a lighting apparatus when the lamp is manufactured.

10: electrode pattern 10c: cutting line 10f: LED chip fixing portion
11: Ground line
12: Feed line 12c: Coupling hole
12b: package bonding bend portion 12h: package bonding hole
13: Connection
14: Continuous supply lead line 14h: Traction hole
20: LED chip
30: Package 30h: Reflector
40: wire

Claims (7)

An LED chip 20 fixed to a plurality of LED chip fixing portions 10f formed on the electrode pattern and a reflector 30h to which the LED chip is exposed, And a package (30) having a light emitting diode
The electrode pattern 10 includes a feed line 12 at the center between the plurality of LED chip fixing portions 10f and a ground line 11 at the outer edge of the LED chip fixing portion 10f, The end of the feeding line 12 opposed to the LED chip fixing portion 10f is bent toward the front of the electrode pattern 10 to form a package bonding bend portion 12b buried in the package 30, 12b and the LED chip fixing portion 10f are formed with at least one package coupling hole 12h so that the package 30 is fixed by the package coupling bend portion 12b and the package coupling hole 12h, So that the electrode pattern is prevented from protruding from the back surface of the pattern (10), so that the electrode pattern is interposed in the heat dissipating means of the lamp so that the heat radiation can be performed quickly. The method according to claim 1,
And a virtual cutting line (10c) is formed across each of the feed lines and the ground line so that a part of the electrode pattern can be cut as necessary. The method according to claim 1,
Wherein the LED chip (20) is connected in parallel with the neighboring LED chip (20). The method according to claim 1,
Wherein the LED chip (20) is connected in series with a neighboring LED chip (20). The method according to claim 1,
Wherein the package (30) is made of an insulating material, and the electrode pattern and the package are coupled by an insert injection molding method. The method according to claim 1,
Wherein the LED chip (20) is connected to a feed line and / or a ground line by wire bonding. The method according to claim 1,
The electrode pattern 10 includes six LED chip fixing portions 10f formed radially around a central feed line so that a plurality of hexagonal LED modules 1 can be installed adjacently, The LED modules are connected to each other in a manufacturing process and are connected to each other so that they can be separated after the LED module is completed. Wherein a continuous supply lead line (14) formed at a trailing hole or a trailing groove constant interval is formed to allow the LED chip to be installed while pulling the electrode pattern.
KR1020150083228A 2015-06-12 2015-06-12 hexagon LED module KR101753120B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150083228A KR101753120B1 (en) 2015-06-12 2015-06-12 hexagon LED module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150083228A KR101753120B1 (en) 2015-06-12 2015-06-12 hexagon LED module

Publications (2)

Publication Number Publication Date
KR20160146238A true KR20160146238A (en) 2016-12-21
KR101753120B1 KR101753120B1 (en) 2017-08-17

Family

ID=57735104

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150083228A KR101753120B1 (en) 2015-06-12 2015-06-12 hexagon LED module

Country Status (1)

Country Link
KR (1) KR101753120B1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100997172B1 (en) 2009-06-02 2010-11-29 주식회사 인성전자 Led package and led radiant heat device, and led socket device using the same
KR20110051071A (en) 2009-11-09 2011-05-17 주식회사 렉스모바일 Heat emission unit for led fluorescent lamp

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100254119A1 (en) 2007-11-20 2010-10-07 Showa Denko K.K. Light source connection member, light emitting device and display device
JP5757169B2 (en) 2011-06-10 2015-07-29 東芝ライテック株式会社 LED lighting fixtures
KR101301719B1 (en) 2013-01-24 2013-09-10 주식회사 트루스타 Electrode module for led lamp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100997172B1 (en) 2009-06-02 2010-11-29 주식회사 인성전자 Led package and led radiant heat device, and led socket device using the same
KR20110051071A (en) 2009-11-09 2011-05-17 주식회사 렉스모바일 Heat emission unit for led fluorescent lamp

Also Published As

Publication number Publication date
KR101753120B1 (en) 2017-08-17

Similar Documents

Publication Publication Date Title
JP4241658B2 (en) Light emitting diode light source unit and light emitting diode light source formed using the same
US10145522B2 (en) Linear LED module
KR102010099B1 (en) Assembly and interconnection method for high-power led devices
US9349930B2 (en) LED module and lighting assembly
JPH07106634A (en) Light emitting diode module and light emitting diode light source
KR20110056306A (en) Efficient led array
JP5873598B2 (en) LED lamp electrode module
US20160102852A1 (en) Led lighting assembly having electrically conductive heat sink for providing power directly to an led light source
CN103201863B (en) For the island carrier of luminescent device
KR20160123133A (en) flexible LED module
KR101753120B1 (en) hexagon LED module
KR101425939B1 (en) Structure of LED lighting apparatus for street lamp with radiating heat function
KR101059071B1 (en) Printed circuit board for LED mounting
KR20110000868A (en) Pcb patern structure for heat radiation of led module
EP3410501B1 (en) Light-emitting diode module and light apparatus
KR101786500B1 (en) flexible electrode module for LED lamp
KR200483284Y1 (en) LED module structure of LED tubular light
US20150070881A1 (en) Led light tube of module type
KR102290269B1 (en) LED PCB and method for manufacturing the same
JP2012155872A (en) Led lamp
JP5255725B1 (en) LED module using sleeve joining method and lamp fixture using the same
KR100990423B1 (en) Led module of surface mount devices type
CN201289009Y (en) Oval-shaped LED module with lamp cup
JP2018507566A (en) Lead frame and semiconductor package including the same
KR101080697B1 (en) Lighting device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant