CN202626284U - Thin film deposition equipment - Google Patents
Thin film deposition equipment Download PDFInfo
- Publication number
- CN202626284U CN202626284U CN 201220061414 CN201220061414U CN202626284U CN 202626284 U CN202626284 U CN 202626284U CN 201220061414 CN201220061414 CN 201220061414 CN 201220061414 U CN201220061414 U CN 201220061414U CN 202626284 U CN202626284 U CN 202626284U
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- Prior art keywords
- chamber
- substrate
- film deposition
- thin film
- preheating cavity
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- Withdrawn - After Issue
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Abstract
The utility model relates to thin film deposition equipment, which comprises a substrate pretreatment part and a thin film deposition part. A transmission device transmits a substrate hanger with substrates between a substrate loading chamber, a surface treatment chamber and a drying chamber in the substrate pretreatment part. A high-vacuum gate valve is arranged between a preheating cavity and a transmission cavity in the thin film deposition part. The drying chamber is communicated with the preheating cavity. A high-vacuum gate valve is arranged between the drying chamber and the preheating cavity. The substrate hanger is arranged in the preheating cavity. A mechanical hand for hanging the substrates on the substrate hanger in the preheating cavity is arranged in the drying chamber. A three-dimensional rotating mechanical hand for feeding the substrates in the preheating cavity into the thin film deposition chamber is arranged in the transmission cavity. The preheating cavity is connected with a nitrogen charging device and a vacuumizing device respectively. Performance reduction caused by external contaminations can be avoided, and the stability and repeatability of a process are improved.
Description
Technical field
The utility model relates to the vacuum coating film equipment field, particularly relates to a kind of film deposition equipment.
Background technology
The wide model of the use of vacuum coating film equipment is distributed in all trades and professions, and required film plating substrate is of a great variety.In the sun power industry, the use of vacuum coating technology spreads all over each link, and the substrate of use comprises glass, metal, plastics and silicon chip etc.; The thin-film material that plates also is varied, like antireflective film, conducting film, insulating film, silica-base film etc.; Employed device category has nothing in common with each other, and like tubular type, board-like, group's bunch formula or the like, method has plasma body, molecular beam, magnetron sputtering, thermal evaporation etc.Therefore thin film deposition processes is more stable needs a kind of stable film deposition equipment badly in order to make.
The utility model content
The utility model technical problem to be solved provides a kind of film deposition equipment, can avoid having improved the stable and repeated of technology owing to the degradation that reason causes is stain in the outside.
The utility model solves the technical scheme that its technical problem adopted: a kind of film deposition equipment is provided; Comprise substrate preprocessing part and thin film deposition part, said substrate preprocessing part comprises successively and to be communicated with and by the substrate that pneumatic door separates pack into chamber, surface treatment chamber and oven dry chamber; Said substrate is packed into and by transfer device the substrate hanger that substrate is housed is transmitted between chamber, surface treatment chamber and oven dry chamber; Said thin film deposition partly comprises preheating cavity, transmission chamber and the thin film deposition chamber that is communicated with successively, is provided with the high vacuum push-pull valve between said preheating cavity and the transmission chamber; Said oven dry chamber is connected with preheating cavity, is provided with the high vacuum push-pull valve between said oven dry chamber and the preheating cavity; Be provided with the substrate hanger in the said preheating cavity, indoor being provided with of said drying cavity is suspended to the mechanical manipulator on the substrate hanger in the preheating cavity with substrate; Be provided with the three-dimensional rotation mechanical manipulator that is used for the substrate in the preheating cavity is sent into the thin film deposition chamber in the said transmission chamber; Said preheating cavity also links to each other with vacuum extractor with nitrogen charging device respectively.
Said thin film deposition part also comprise be communicated with the transmission chamber get the sheet chamber.
Said surface treatment chamber comprises a dilute acid bath and a treatment trough.
Said drying cavity is indoor to be provided with hot high pure nitrogen air knife; Be provided with partition door between said Re Gaore high pure nitrogen air knife and the mechanical manipulator.
Said thin film deposition is equipped with the substrate heating unit in the chamber, has the slot that is used for fixing substrate on the said substrate heating unit.
Said thin film deposition chamber using plasma method, magnetron sputtering method or inductance method product film.
Said thin film deposition chamber adopts stainless material or aluminum to process.
Said substrate hanger top is provided with T type web member; Said T type web member links to each other with said transfer device.
Beneficial effect
Owing to adopted above-mentioned technical scheme; The utility model compared with prior art has following advantage and positively effect: the utility model can be realized the successive sedimentation of thin-film material, can in the different chamber of same equipment, be coated with dissimilar thin-film materials continuously; Can plated film not carried out under the vacuum breaker situation in the substrate two sides; A whole set of battery process is accomplished in airtight or vacuum environment, avoids having improved the stable and repeated of technology owing to the degradation that reason causes is stain in the outside.
Description of drawings
Fig. 1 is a substrate preprocessing part schematic top plan view in the utility model;
Fig. 2 is a film successive sedimentation part schematic top plan view in the utility model;
Fig. 3 is a substrate hanger schematic side view in the utility model.
Embodiment
Below in conjunction with specific embodiment, further set forth the utility model.Should be understood that these embodiment only to be used to the utility model is described and be not used in the restriction the utility model scope.Should be understood that in addition those skilled in the art can do various changes or modification to the utility model after the content of having read the utility model instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
The embodiment of the utility model relates to a kind of film deposition equipment, comprises substrate preprocessing part and thin film deposition part.The substrate preprocessing part is made up of three chambers: substrate is packed into and by transfer device the substrate hanger that substrate is housed is transmitted between chamber 1, surface treatment chamber 2,3, three chambers of oven dry chamber, is separated by pneumatic door between chamber and the chamber; Thin film deposition partly is mainly used in thin film deposition, is made up of preheating cavity 6, transmission chamber 7, thin film deposition chamber 8 etc.
As shown in Figure 1, said substrate preprocessing part comprises successively and to be communicated with and by the substrate that pneumatic door separates pack into chamber 1, surface treatment chamber 2 and oven dry chamber 3; Pack into 3 of chamber 1, surface treatment chamber 2 and oven dry chambers of said substrate transmitted the substrate hanger 10 that substrate is housed by transfer device.Wherein, surface treatment chamber 2 also is provided with access hole 4 with oven dry chamber 3, so that easy to maintenance.
Substrate chamber 1 be used to pack into the substrate and being isolated from the outside of packing into; Substrate is positioned on the substrate hanger 10, can place the multi-disc substrate on the substrate hanger 10, and substrate quantity is decided according to the equipment situation; Substrate material can be glass, silicon chip, plastics or sheet metal, and sizes of substrate is decided with actual demand; Substrate hanger 10 is connected with transport unit through T type web member 11 (see figure 3)s on its top, and through transport unit substrate hanger 10 is sent to next process procedure.Surface treatment chamber 2 is used for the substrate surface pre-treatment, comprises a dilute acid bath, a warm water tank or other treatment trough because of process requirements.Oven dry chamber 3 is used for the substrate surface oven dry, adopts hot blast cutter mode, and this chamber also is furnished with a mechanical manipulator and is used for the substrate handover between preheating cavity.
As shown in Figure 2, said thin film deposition partly comprises preheating cavity 6, transmission chamber 7 and the thin film deposition chamber 8 that is communicated with successively.Be provided with the high vacuum push-pull valve between said preheating cavity 6 and the transmission chamber 7; Said oven dry chamber 3 is connected through interface 5 with preheating cavity 6, is provided with the high vacuum push-pull valve between said oven dry chamber 3 and the preheating cavity 6; Be provided with substrate hanger 10 in the said preheating cavity 6, be provided with in the said oven dry chamber 3 substrate is suspended to the mechanical manipulator on the substrate hanger 10 in the preheating cavity 6; Be provided with the three-dimensional rotation mechanical manipulator that is used for the substrate in the preheating cavity 6 is sent into thin film deposition chamber 8 in the said transmission chamber 7; Said preheating cavity 6 also links to each other with vacuum extractor with nitrogen charging device respectively.Said thin film deposition part also comprise be communicated with transmission chamber 7 get sheet chamber 9.
Preheating cavity 6 is used for preheating to substrate, and main purpose is to remove the steam of substrate surface absorption.Transmitting chamber 7 is used for substrate taken out to send into the thin film deposition chamber or to substrate from preheating cavity carrying out turn-over; Substrate transmits by the three-dimensional rotation mechanical manipulator that transmits in the chamber 7 and accomplishes; This three-dimensional rotation mechanical manipulator can carry out three-dimensional rotation, and the rotation purpose is for realizing the selection of substrate coating face.Thin film deposition chamber 8 is used for thin film deposition, and the substrate heating unit is housed in the thin film deposition chamber 8, has slot on the substrate heating unit, and slot is used to insert substrate and fixed substrate, deposit film method using plasma or magnetron sputtering or inductance method.Thin film deposition chamber 8 can adopt stainless material or aluminum to process.
The process step of the utility model is following:
At first, the substrate transfer device that substrate hanger that substrate is housed and substrate are packed in the chamber is connected, and the substrate hanger that the substrate transfer device will be equipped with substrate is passed to after the surface treatment chamber handles, and is delivered to the oven dry of oven dry chamber again; Import substrate a slice a slice into preheating cavity through oven dry chamber mechanical manipulator and carry out preheating, import the thin film deposition chamber into and carry out thin film deposition through transmitting the chamber mechanical manipulator again, import into after deposition is accomplished and get the sheet chamber, treat to take out after substrate temperature is reduced to room temperature through the substrate of preheating.
The utility model practical implementation process, except that pack into chamber and substrate of substrate that the substrate hanger is packed into takes out the step, other process step all can be by the program control completion of computer interface.
The utility model practical implementation is following:
1. open the substrate chamber door of packing into; The substrate transfer device that substrate hanger that substrate is housed and substrate are packed in the chamber is connected; Close and open the substrate chamber door of packing into,, confirm errorless back start-up routine through the program control selection of computer interface programsegment required or that readjust.
2. program control following, before the substrate hanger arrived the surface treatment chamber with transfer device, partition door was opened; The substrate hanger gets into the surface treatment chamber; Partition door is closed, and the surface treatment chamber interior is provided with acid tank and spray warm water tank, and substrates of different is carried out selectable surface treatment.
3. after surface treatment is accomplished; Automatically open surface treatment chamber and oven dry chamber partition door, the substrate hanger gets into the oven dry chamber, and the surface treatment chamber is closed with oven dry chamber partition door; The oven dry chamber is provided with hot high pure nitrogen air knife and mechanical manipulator; Be provided with partition door between air knife and mechanical manipulator, make moist to prevent mechanical manipulator, air knife dries up substrate surface.
4. partition door is opened between air knife and mechanical manipulator, and the substrate hanger gets into the mechanical manipulator position, and partition door is closed; Pour drying nitrogen to preheating cavity; After pressure reached normal atmosphere, the high vacuum push-pull valve was opened between oven dry chamber and preheating cavity, by the mechanical manipulator of oven dry chamber substrate was imported in the preheating cavity on the substrate hanger; After treating that all substrate transmission are accomplished, the high vacuum push-pull valve cuts out between oven dry chamber and preheating cavity.
5. give the preheating cavity pumping high vacuum and begin heating, after waiting to reach requirement, the high vacuum push-pull valve is opened between preheating cavity and transmission chamber; Three-dimensional mechanical hand takes out substrate in the transmission chamber from preheating cavity; Any one that puts into four thin film deposition chambeies is carried out thin film deposition, and mechanical manipulator takes out substrate in the chamber by transmitting to have deposited the back, perhaps in transmitting the chamber, puts back to behind the turn-over again and carries out thin film deposition in the thin film deposition chamber; Also can substrate be put into and get the sheet chamber, treat to take out after temperature drops to room temperature according to processing requirement.
Be not difficult to find; The utility model can be realized the successive sedimentation of thin-film material; Can in the different chamber of same equipment, be coated with dissimilar thin-film materials continuously, can plated film not carried out under the vacuum breaker situation in the substrate two sides, a whole set of battery process is accomplished in airtight or vacuum environment; Avoid having improved the stable and repeated of technology owing to the degradation that reason causes is stain in the outside.
Claims (8)
1. a film deposition equipment comprises substrate preprocessing part and thin film deposition part, it is characterized in that, said substrate preprocessing part comprises successively and to be communicated with and by the substrate that pneumatic door separates pack into chamber (1), surface treatment chamber (2) and dry chamber (3); Said substrate pack between chamber (1), surface treatment chamber (2) and oven dry chamber (3) by transfer device the substrate hanger (10) that substrate is housed is transmitted; Said thin film deposition partly comprises successively the preheating cavity (6) that is communicated with, transmits chamber (7) and thin film deposition chamber (8), is provided with the high vacuum push-pull valve between said preheating cavity (6) and the transmission chamber (7); Said oven dry chamber (3) is connected with preheating cavity (6), is provided with the high vacuum push-pull valve between said oven dry chamber (3) and the preheating cavity (6); Be provided with substrate hanger (10) in the said preheating cavity (6), be provided with in the said oven dry chamber (3) substrate is suspended to the mechanical manipulator on the substrate hanger (10) in the preheating cavity (6); Be provided with the three-dimensional rotation mechanical manipulator that is used for the substrate in the preheating cavity (6) is sent into the thin film deposition chamber in the said transmission chamber (7); Said preheating cavity (6) also links to each other with vacuum extractor with nitrogen charging device respectively.
2. film deposition equipment according to claim 1 is characterized in that, said thin film deposition part also comprise be communicated with transmission chamber (7) get sheet chamber (9).
3. film deposition equipment according to claim 1 is characterized in that, said surface treatment chamber (2) comprises a dilute acid bath and a treatment trough.
4. film deposition equipment according to claim 1 is characterized in that, is provided with hot high pure nitrogen air knife in the said oven dry chamber (3); Be provided with partition door between said Re Gaore high pure nitrogen air knife and the mechanical manipulator.
5. film deposition equipment according to claim 1 is characterized in that, in the said thin film deposition chamber (8) the substrate heating unit is housed, and has the slot that is used for fixing substrate on the said substrate heating unit.
6. film deposition equipment according to claim 1 is characterized in that, said thin film deposition chamber (8) using plasma method, magnetron sputtering method or inductance method product film.
7. film deposition equipment according to claim 1 is characterized in that, said thin film deposition chamber (8) adopts stainless material or aluminum to process.
8. film deposition equipment according to claim 1 is characterized in that, said substrate hanger (10) top is provided with T type web member (11); Said T type web member (11) links to each other with said transfer device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220061414 CN202626284U (en) | 2012-02-23 | 2012-02-23 | Thin film deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220061414 CN202626284U (en) | 2012-02-23 | 2012-02-23 | Thin film deposition equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202626284U true CN202626284U (en) | 2012-12-26 |
Family
ID=47379502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220061414 Withdrawn - After Issue CN202626284U (en) | 2012-02-23 | 2012-02-23 | Thin film deposition equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202626284U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560375A (en) * | 2012-02-23 | 2012-07-11 | 上海中智光纤通讯有限公司 | Thin film deposition equipment |
| CN109797373A (en) * | 2019-03-04 | 2019-05-24 | 苏州华杨赛斯真空设备有限公司 | Satellite-type vacuum film deposition system |
-
2012
- 2012-02-23 CN CN 201220061414 patent/CN202626284U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560375A (en) * | 2012-02-23 | 2012-07-11 | 上海中智光纤通讯有限公司 | Thin film deposition equipment |
| CN102560375B (en) * | 2012-02-23 | 2014-01-29 | 上海中智光纤通讯有限公司 | Thin film deposition equipment |
| CN109797373A (en) * | 2019-03-04 | 2019-05-24 | 苏州华杨赛斯真空设备有限公司 | Satellite-type vacuum film deposition system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20121226 Effective date of abandoning: 20140129 |
|
| RGAV | Abandon patent right to avoid regrant |