CN211170851U

CN211170851U - Vertical evaporation coating device capable of reducing water vapor and stabilizing evaporation pressure

Info

Publication number: CN211170851U
Application number: CN201922245717.3U
Authority: CN
Inventors: 刘林; 张宽翔; 蒋继文; 王宝玉
Original assignee: Triumph Photovoltaic Material Co ltd
Current assignee: Triumph Photovoltaic Material Co ltd
Priority date: 2019-12-16
Filing date: 2019-12-16
Publication date: 2020-08-04
Anticipated expiration: 2029-12-16

Abstract

The utility model discloses a vertical evaporation coating device capable of reducing water vapor and stabilizing evaporation pressure, which is sequentially communicated with a feeding cavity, a first buffer cavity, a heating cavity, a first slit cavity, a first evaporation cavity, a second slit cavity, a second buffer cavity and a discharging cavity along the conveying direction of a substrate; conveying rollers for conveying the substrate frames are arranged at the bottoms in all the cavities; the width of the slit cavity is smaller than that of other cavities, the center of the slit cavity shell is provided with a substrate frame channel, the periphery of the substrate frame channel is surrounded with a water vapor catcher, and the two sides of the water vapor catcher are sequentially provided with an inner vapor chamber, a middle vapor chamber and an outer vapor chamber at intervals from inside to outside; the device can adsorb the steam on substrate surface to guarantee the stability of process gas pressure among the evaporation process in the evaporation chamber, guarantee the growth quality of film.

Description

Vertical evaporation coating device capable of reducing water vapor and stabilizing evaporation pressure

Technical Field

The utility model relates to a thin-film solar cell production facility technical field specifically is a can reduce steam and stabilize evaporating pressure's vertical evaporation coating device.

Background

The copper indium selenide solar thin film battery is formed by depositing a plurality of layers of metal compound semiconductor thin films on a glass or other cheap substrates, wherein the total thickness of the thin films is about 2-3 mm, and the solar light is utilized to generate electricity. The copper indium selenium battery has the characteristics of low cost, stable performance, strong radiation resistance and the like, the photoelectric conversion efficiency is the first of various thin film solar batteries at present, and the excellent performance of the copper indium selenium battery is internationally called as a cheap solar battery in the next era, so that the copper indium selenium battery attracts a plurality of organizations and experts to research and develop.

In the actual production process, a very large number of devices adopt an evaporation coating mode to deposit a film layer required by a CIGS battery, but in the production process, due to continuous production, the time from the outside of a substrate entering a cavity to the deposition of a film is short, a large amount of water vapor exists on the surface of the substrate, the growth quality of the film is influenced, and the evaporation environment pressure in the evaporation cavity is influenced in the transmission process from the substrate to the evaporation cavity, so that the deposition rate and uniformity are influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a can reduce steam and stabilize evaporating pressure's vertical evaporation coating device, the device can adsorb the steam on substrate surface to guarantee evaporating intracavity evaporation process in-process gas pressure's stability, guarantee the growth quality of film.

The utility model provides a technical scheme that its technical problem adopted is:

a vertical evaporation coating device capable of reducing water vapor and stabilizing evaporation pressure is characterized in that a feeding cavity, a first buffer cavity, a heating cavity, a first slit cavity, a first evaporation cavity, a second slit cavity, a second buffer cavity and a discharging cavity are sequentially communicated along the conveying direction of a substrate; conveying rollers for conveying the substrate frames are arranged at the bottoms in all the cavities;

a feeding valve is arranged at the inlet of the feeding cavity, a first buffer valve is arranged between the feeding cavity and the first buffer cavity, and a heating valve is arranged between the first buffer cavity and the heating cavity; a discharge valve is arranged at the outlet of the discharge chamber, and a second buffer valve is arranged between the discharge chamber and the second buffer chamber;

the feeding chamber and the discharging chamber keep 5Pa vacuum degrees in work, and the first buffer chamber and the second buffer chamber keep 5 x 10 vacuum degrees in work^-4Vacuum degree of Pa;

the width of the slit cavity is smaller than that of other cavities, the center of the slit cavity shell is provided with a substrate frame channel, the periphery of the substrate frame channel is surrounded with a water vapor catcher, and the two sides of the water vapor catcher are sequentially provided with an inner vapor chamber, a middle vapor chamber and an outer vapor chamber at intervals from inside to outside;

the heating chamber is used for heating the substrate on the substrate frame to the evaporation process temperature, and the first evaporation chamber and the second evaporation chamber are mutually standby and used for carrying out evaporation coating on the substrate.

The utility model has the advantages that:

firstly, the design of double evaporation chambers is adopted, one use and one standby are realized, and the stability and the continuity of the evaporation process are met.

Secondly, adopt the slit cavity around the evaporation cavity respectively, the base plate frame passageway of slit cavity just can allow the base plate frame to pass through, makes the steam trap can collect the steam through heating substrate surface, guarantees the evaporation coating quality.

And thirdly, the uniformity of the temperature of the substrate in the evaporation chamber can be ensured through the three layers of soaking plates, and the stability of the pressure of the process gas in the evaporation chamber is also ensured.

And fourthly, the slit chamber can also deposit the escaping materials in the evaporation chamber, so that the pollution to other chambers is avoided.

Drawings

The invention will be further described with reference to the following figures and examples:

fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is an enlarged schematic structural view of the first slit chamber of the present invention;

fig. 3 is a schematic view of a single-sided partial enlargement of fig. 2.

Detailed Description

As shown in fig. 1, the utility model provides a vertical evaporation coating device capable of reducing water vapor and stabilizing evaporation pressure, which is sequentially communicated with a feeding chamber 1, a first buffer chamber 2, a heating chamber 3, a first slit chamber 4, a first evaporation chamber 5, a second evaporation chamber 6, a second slit chamber 7, a second buffer chamber 8 and a discharging chamber 9 along the substrate conveying direction; the bottom of all the chambers is provided with transfer rollers 10 for transporting substrate holders.

A feeding valve 11 is arranged at the inlet of the feeding chamber 1, a first buffer valve 12 is arranged between the feeding chamber 1 and the first buffer chamber 2, and a heating valve 13 is arranged between the first buffer chamber 2 and the heating chamber 3; the outlet of the discharging chamber 9 is provided with a discharging valve 14, and a second buffer valve 15 is arranged between the discharging chamber 9 and the second buffer chamber 9.

The feeding chamber 1 and the discharging chamber 9 are used as chambers with medium vacuum degrees when working, and the vacuum degree of 5Pa is kept; the first buffer chamber 2 and the second buffer chamber 8 are operated as chambers having a high degree of vacuum, and are held at 5 x 10^-4Pa vacuum degree.

Referring to fig. 2 and 3, the first slit chamber 4 and the second slit chamber 7 have the same structure, and the width of the slit chamber is smaller than that of the other chambers, taking the first slit chamber 4 as an illustration, the center of the slit chamber housing 16 is a substrate holder channel 17, and the substrate holder channel 17 is adapted to the substrate holder and allows the substrate holder to pass through just before; the outer periphery of the substrate frame channel 17 is surrounded with a vapor catcher 18, two sides of the vapor catcher 18 are sequentially provided with an inner vapor chamber 19, a middle vapor chamber 20 and an outer vapor chamber 21 at intervals from inside to outside, and the slit chamber shell 16, the inner vapor chamber 19, the middle vapor chamber 20 and the outer vapor chamber 21 are fixedly connected through a pin 22.

A substrate frame bearing a substrate enters the feeding cavity 1 from the inlet of the feeding cavity 1, the feeding valve 11 is closed, the feeding cavity 1 is vacuumized, when the vacuum degree reaches 5Pa, the first buffer valve 12 is opened, and the substrate frame enters the first buffer valveThe buffer chamber 2 is closed, the first buffer valve 12 is closed, the first buffer chamber 2 is vacuumized, and when the vacuum degree reaches 5 x 10^-4When Pa is needed, the heating valve 13 is opened, the substrate frame enters the heating chamber 3, the substrate is heated to a process temperature suitable for evaporation and sputtering by the heater in the heating chamber 3, then the substrate frame enters the first slit chamber 4, the vapor catcher 18 of the first slit chamber 4 catches and collects vapor on the surface of the substrate, and the three layers of vapor plates ensure the uniformity of the temperature of the substrate in the evaporation chamber; then the substrate frame enters a first evaporation chamber 5, evaporation coating is carried out on the surface of the substrate in the first evaporation chamber 5, the first evaporation chamber and a second evaporation chamber are mutually standby, and when one chamber has a fault, the other chamber is used; after the film is coated, the substrate frame sequentially passes through the second slit chamber 7, the second buffer chamber 8 and the discharge chamber 9, and is finally conveyed out from an outlet of the discharge chamber 9.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way; the invention is not limited to the embodiments described herein, but is capable of other embodiments according to the invention, and may be used in various other applications, including, but not limited to, industrial. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments by the technical entity of the present invention all still belong to the protection scope of the technical solution of the present invention.

Claims

1. A vertical evaporation coating device capable of reducing water vapor and stabilizing evaporation pressure is characterized in that the device is sequentially communicated with a feeding chamber, a first buffer chamber, a heating chamber, a first slit chamber, a first evaporation chamber, a second slit chamber, a second buffer chamber and a discharging chamber along a substrate conveying direction; conveying rollers for conveying the substrate frames are arranged at the bottoms in all the cavities;